1.Overview on microelectronics packaging and testing (3hr)1)Role of packaging and testing in microelectronic packaging2)Overview on microelectronic packaging3)Overview on microelectronic testing2.Designs of microelectronic packaging (6hr)1)System concepts - partitioning: role of packaging in electrical and thermal performance enhancement.2)Physical design3)Electrical design and characterization : 4)Thermal management and characterization.: 5)Mechanical design and stress analysis. 6)Design tools -materials selection.3.Materials in microelectronic packaging. (6hr)1)Interconnect materials: solder, solder paste, flux, wire…2)Encapsulant materials: underfill, molding compound.3)Thermals: TIM, sealant, heat spreader;4)Characterization of packaging materials5)Substrate technology: FC-BGA, PBGA.6)Challenges in packaging materials.4.Process flow and typical techniques of microelectronic packaging (9hr)1)Overview on packaging technologies and process flows2)Typical packaging process flow (including the main issues and challenges in every step)3)Typical styles of single chip packaging4)Advanced packaging techniques5)Applications of various microelectronic packaging technology in electronic products5.Introduction to Integrated Circuit Testing (6hr)1)Fundamentals of chip testing2)Chip testing items3)Introduction on Chip testing systems (e.g., Advantest tool)； introduction on hardware and software.6. Reliability of microelectronic packaging (Reliability concepts and reliability mathematics) (3hr)1)Introduction to failure analysis and reliability study;2)Concepts of quality and reliability;3)Measurement parameters and testing methods of reliability: failure rate, FIT, MTTF.4)Concepts of activation energy;5)Statistical analysis of the data;6)Failure distribution: exponential distribution, normal distribution, log-normal distribution, Rayleigh distribution, and Weibull distribution.7)Reliability assurance7.Failure Analysis of microelectronic packaging (3hr)1)Failure mode type2)Failure terms and methodology.3)Failure analysis methodologies and methods4)Failure analysis through the application of various analytical techniques.8.Introduction on PCB assembly (3hr)1)Overview of PCB assembly2)Typical PCB assembly process flow and related technologies3)High density substrate technologies, microvias, built-up technologies.4)Next board assembly technology challenges: smaller form factor board, lead free solder conversion.9.Examination (3hr)LabLab1: DIP packaging lab;(3hr)Lab2: Advantest testing lab (3hr)Lab3: Visit Intel packaging and testing factory. (3hr)

(无)

Assessment: (state % contribution to final grade) Attendance: 20%Homework: 20%Final examination: 60%

• 1.《电子封装工程》，田民波，清华大学出版社，20032. Microelectronics Packaging Handbook, R.R. Tummala, E.J. Rymaszewski, and A.G. Klopfenstein3. "Electronic Packaging & Interconnections Handbook", Charles A. Harper, McGraw Hill Publications.4. "Flip Chip Technologies", J. Lau, McGraw Hill Publications；5. Fundamentals of Microsystems Packaging", Rao R. Tummala, McGraw-Hill, New York, NY U.S.A.