| 课程内容简介 今天，集成电路芯片含有上亿个半导体元器件。为了加工这种高集成度和复杂性的芯片，半导体制造使用了许多关键的工艺技术和相关设备，并需在高级别的净化室内进行。本课程在介绍了单晶硅的制备和等离子体的原理后，着重介绍了集成电路制造中关键工艺技术的理论与应用知识，包括热工艺（热氧化、退火、扩散、RTP、外延等）、离子注入、光刻、湿法/干法清洗与刻蚀、DCVD、金属化（PVD、金属CVD和ECP）、化学机械抛光等。本课程再从工艺集成和器件设计等角度，介绍了先进Bipolar和CMOS工艺流程。 | | 课程内容简介（英文） The VLSI chip of today contains 100 million components. To fabricate such chips with higher complexity, most sophisticated process equipments are to be used, precise process steps are to be followed and stringent clean room specifications are to be adopted. All these aspects are the contents of the `VLSI Technology' course. The course describes the theoretical and practical aspects of the most advanced state of the art VLSI process technology, e.g., oxidation, diffusion, epitaxy, ion implantation, RTP, dielectric CVD, metallization, lithography, dry and wet etching, planarization, etc.. The basic science underlying the individual process steps in achieving the best device/circuit performance and the tradeoffs in optimizing device performance and manufacturability have been discussed in the course. Advanced process flows and integrations of bipolar and CMOS VLSI have also been included in this course. At last the fudamentals and principles of process tools, metrologies and failure analysi, SPC and DOE, WAT/yield and reliability in VLSI fabrication are addressed. | | 教学大纲 ① 课程的性质和任务 This course is intended for senior undergraduate or first year postgraduate students of electronics/ electrical/ computer engineering, applied physics and material science. As this course elaborates on IC processing in a detail and comprehensive manner, it will also help those actively involved in IC fabrication and process developments in VLSI Industry.Understand semiconductor processing technology and trend in semiconductor industry. Learn about semiconductor process integration and apply them in fabrication of simple devices. Learn how to use process simulation software and semiconductor fabrication equipment. Write a term paper discussing fabrication processes or submit a project report.② 课程的教学内容和基本要求 Part I: VLSI fabrication technologyChapter 1. IntroductionChapter 2. Preparation of single-crystal silicon waferChapter 3. Cleanroom and facility Chapter 4. Thermal processChapter 5. Fundamentals of Plasma technologyChapter 6. Ion implantationChapter 7. MicrolithographyChapter 8. Cleaning and EtchingChapter 9. Dielectric chemical vapour depositionChapter 10. MetallizationChapter 11. Planarization1)Introduction of planarization in VLSI fabrication2)Planarization methods: thermal reflow, SOG, Sputtering etch back, SOG etch back, CMP3)Fundamental of CMP: history, basic concepts, application, equipmentsPart II Process IntegrationChapter 12. Device and process simulationsChapter 13. Process Integration.Part III: Other technology in VLSI fabricationChapter 14. Fudamentals and principles of process tool.Chapter 15. Metrology in VLSI fabricationChapter 16. Failure Analysis in VLSI fabricationChapter 17. Introduction to SPC and DOEChapter 18. WAT,yield and reliabilityChapter 19. Introduction to packaging and testing | | 课程进度计划 (无) | | 课程考核要求 ① 考试目的To evaluate the mastering degree of students on this course.② 考试方式与内容Homework: 15%Present: 10%;Little paper and presentation: 10%Midterm exam: 30%Final exam: 35% | 参 考 文 献
- 1. Semiconductor Manufacturing Technology, Michael Quirk, Julian Serda, Pearson Education Asia Limited, 2001.2. Silicon VLSI Technology Fundamental, Practice and Modeling, James D. Plummer, Michael D. Deal, Pearson Education, Inc, 2000.3. The Science and Engineering of Microelectronics Fabrication, Stephen A. Campbell,Ox Univ. Press, 1996.
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