半导体集成电路产业在整个电子行业中占的比重越来越高，对整个世界的经济发展起着非常重要的作用。本课程的主要目的就是学习集成电路的制造技术。通过本课程的学习，学生能够了解掌握集成电路的制造的基本原理，对整个工艺过程有一定的了解。为今后在具体的工作岗位当中从事相关的工作打下深厚的基础。本课程是微电子学与固体电子学专业的基础课，为学生进一步学习其他相关课程提供有利的支持。通过本课程的学习，能够加深对集成电路设计和具体应用等相关知识的理解，为他们提供最深层次的支持。是半导体器件物理与集成电路设计两门课之间的桥梁。本课程从绪论开始，介绍集成电路的历史和发展，以及所面临的挑战。接着从最基本的单晶硅的生长开始，介绍硅材料的基本特性和硅片的制造，以及对硅片的表征和测量。然后介绍氧化等相关热处理过程，包括各种氧化的方式，影响氧化薄膜质量的各种因素和氧化薄膜在器件中所起的作用；同时介绍退火的基本原理与具体应用。接下来是离子注入的相关知识，包括杂质的分布形式与常用元素的介绍。还有各种刻蚀和清洗技术的基本原理和应用背景。光刻是非常重要的工艺步骤，会比较详细地介绍光刻的原理，包括光刻胶的种类和使用方法，提高光刻精度的各种方案。然后是薄膜淀积技术，其中主要介绍化学气相淀积，包括各种化学气相方法与薄膜质量评价方法。接着是金属以及金属硅化物的学习，包括金属的淀积方法和比较先进的金属硅化物技术。然后是化学机械抛光技术的介绍，主要说明其基本原理以及具体应用方法。最后是工艺集成技术，把各种单步工艺集成起来，完成电路从头到尾的制造过程。在工艺集成中，将介绍当前比较先进的工艺制造技术。在本课程中还有一次工艺模拟技术，通过计算机的模拟，使学生加深对整个工艺流程的认识。

Semiconductor integrated circuits industry occupies a large part of electronics field and plays a more important role in the world economy. The purpose of this course is to introduce the semiconductor manufacturing technologies. Students can grasp basic of principles of semiconductor manufacturing and get an overview the whole process. It also serves as the basis for student's future work. The course acts as a bridge between semiconductor device physics and circuits design and also help students to understand other related classes better. The course starts with a brief introduction to semiconductor manufacturing technologies, including history development and challenges. Then growth of single crystal will be introduced and followed by explanation of silicon material and wafer characterization technologies. Oxidation process will be discussed thereafter, including dry oxidation, wet oxidation and application of oxide in the devices. After that, ion implantation will be explained in details, such as distribution function of dopant and frequently used atoms. Then etching and cleaning technologies will be introduced. The next part is photolithography, which is a critical step in process integration. Application of photo resists and photo resolution will be discussed. After that, film deposition technologies will be introduced, including various chemical vapor deposition methods and evaluation of the quality of deposited films. The next is introduction of metal and metal silicidation technologies. Advanced silicide process will be discussed too. CMP technology will be also explained. The last part is process integration. All unit process technologies will be integrated organically to fabricate a full circuit. Advanced process technologies will be introduced finally. There is also an opportunity for students to master the process integration by using Silvao's process simulation.