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Acta Materialia: “3D柔性打印可低温钎焊金属间化合物纳米材料”
Acta Materialia 162 (2019) 163-175 doi:10.1016/j.actamat.2018.09.069 Full length article
This research was supported by NSFC under Grant **
Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics
Ying Zhong, Rong An, Huiwen Ma, Chunqing Wang*
Functional materials for flexible and wearable smart devices have attracted much attention in recent years. This paper describes structure and properties of uniquely prepared, functional interconnectable nanoparticles (NPs) of Cu6Sn5 intermetallic compound that can allow 3D flexible packaging and nanocircuits. In situ TEM analysis confirms that size-controllable Cu6Sn5 NPs as small as ~6.40 nm can be made sinterable at the start temperature as low as ~130°C, which is much lower than its bulk melting point (MP) of 415 °C. After sintering, its high MP provides mechanical and thermal stability. Based on the in situ TEM observation and calculation, particle size and distribution affects the sintering process. More interestingly, the relative orientations of adjacent particles also play an important role. A new orientation related sintering mechanism noted as orientation unification (OU) is revealed as two adjacent particles exhibit orientation change to slowly match their orientation with each other during the heating process. The interesting interaction between nano-Cu6Sn5 and micro-Cu substrate during in situ TEM heating gives first hand atomic level proof of the formation of Cu3Sn. The nano-Cu6Sn5 joints possess high enough bonding strength and great high temperature working capability. This intermetallic nanosoldering approach can pioneer a novel strategy of circuit connection, by providing high working temperature interconnection materials for 3D flexible packaging and ultra-high-density micro/nano interconnections.
Keywords: Solder, Cu6Sn5 nanoparticle, Intermetallic, Interconnection, In situ TEM
ACS AMI: “一步法制备3D纳米锥阵列与纳米银烧接”
ACS Applied Materials & Interfaces 2017, 9, 4798？4807doi:10.1021/acsami.6b13031
This research was supported by NSFC under Grant **
One-Step Fabrication of 3D Nanohierarchical Nickel Nanomace Array To Sinter with Silver NPs and the Interfacial Analysis
Wei Zhou, Zhen Zheng, Chunqing Wang*, Zhongtao Wang, and Rong An
Three-dimensional (3D) nanohierarchical Ni nanomace (Ni NM) array was fabricated on copper substrate by only one step with electroplating method, the unique structure was covered with Au film (Ni/Au NM) without changing its morphology, and in the following step, it was sintered with silver nanoparticle (Ag NP) paste. The structure of the Ni NM array and its surface morphology were characterized by X-ray diffraction, scanning electron microscope (SEM), and atomic force microscope. The sintered interface was investigated by SEM, transmission electron microscopy, and energy-dispersive X-ray spectroscopy to analyze the sintering mechanism. The results showed that a metallurgical bond was successfully achieved at 250 °C without any gas or vacuum shield and extra pressure. The Cu substrate with Ni/Au NM array was able to join with the Ag NP paste without obvious voids. Due to the compatible chemical potential between Ag NPs and Ni/Au NM array, the Au element was able to diffuse into the Ag layer with about 800 nm distance. Based on the excellent 3D nanohierarchical structure, the shear strength of Ni/Au NM array was 6 times stronger than the flat Ni/Au coated substrate. It turned out that the substrate surface played a crucial role in improving the shear strength and sintering efficiency. The 3D Ni NM array had achieved an excellent bonding interface and had great potential application in the microelectronics packaging field.
KEYWORDS: nanomace array, silver nanoparticles, sintering, nanojoining, interface connection, interface analysis, shear strength
SMALL: “低温烧结Cu6Sn5纳米焊膏：超塑性的高温电路互连材料”
SMALL 2015, 11, No. 33, 4097–4103DOI: 10.1002/smll.**
This research was supported by NSFC under Grant **
Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections
Ying Zhong, Rong An, Chunqing Wang,* Zhen Zheng, Zhi-Quan Liu, Chin-Hung Liu, Cai-Fu Li, Tae Kyoung Kim, Sungho Jin*
High temperature circuit interconnection materials are highly desirable as the power density and high temperature capabilities of present-day electronic devices are experiencing unprecedented growth due to their rapid multifunctionalization and miniaturization, especially the commercialization of wide band gap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN). Although high melting point (MP) (e.g., >320 °C) solders such as Pb-, Au-, Zn-, Bi-based alloys can be utilized to provide high temperature resistance for the interconnection, they all have their own critical limitations such as toxicity, extremely high cost, poor corrosion resistance, and inferior electrical conductivity. Meanwhile, high MP alloys need higher processing temperatures to realize the melting and bonding, which may damage the circuits and substrates, especially when used in the packaging of currently burgeoning flexible and wearable devices. To address this problem, this paper proposes a novel category of circuit interconnection materials: nanoscaled intermetallics. Via nano route, Cu6Sn5 intermetallic nanoparticles (NPs) can act as the Holy Grail solution for the urgent hunger of high temperature bonding materials.
Journal of Membrane Science：“A Novel Cobalt-Free CO2-Stable Perovskite-Type Oxygen Permeable Membrane”
Journal of Membrane Science, Volume 573, 1 March 2019, Pages 504-510, doi:10.1016/j.memsci.2018.12.014.
This research was supported by NSFC under Grant **
A Novel Cobalt-Free CO2-Stable Perovskite-Type Oxygen Permeable Membrane
Zhongtao Wang, Wei Liu*, Yusen Wu, Wenping Sun, Wei Liu, Chunqing Wang*
A novel Cobalt-free perovskite dense oxygen permeable membrane with the composition Pr0.6Sr0.4Cu0.2Fe0.8O3-δ (PSCF) is designed and evaluated in this work. The XRD results reveal that the perovskite-type PSCF materials exhibit typical orthorhombic structure without any impurity phases. And PSCF powder exhibits excellent chemical stability in CO2 during high temperature annealing confirmed by HRTEM and thermogravimetric(TG) analysis. Upon the 20% Cu doping, the electrical conductivity of PSCF increases from 231.5 S cm？1 Pr0.6Sr0.4FeO3-δ (PSF) to 280.1 S cm？1 at around 773 K. Furthermore, the oxygen permeation flux through the dense PSCF membrane is evaluated and achieved 0.40 mL·min？1·cm？2 swept by He at 1173 K for a 1.4-mm-thick membrane which is much higher than that of PSF membrane (0.17 mL·min？1·cm？2). Meanwhile, the oxygen permeation of the PSCF membrane maintains a value of 0.16 mL·min？1·cm？2 for more than 100 h at 1073 K with CO2 as sweep gas. The present results indicate that PSCF oxygen-permeable membrane is a promising chemically device for oxygen production with sufficiently high oxygen permeation flux.
Applied Surface Science：晶态BLFMO/BSTCO双层薄膜增强铁电特性
Applied Surface Science 404 (2017) 162–167 do:10.1016/j.apsusc.2017.01.186
This research was supported by NSFC under Grant **
Crystallized Bi0.9La0.1Fe0.95Mn0.05O3/Ba0.7Sr0.3Ti0.95Co0.05O3 bilayer thin films with enhanced multiferroic properties
Bin Li, Chunqing Wang？, Guangbin Dou？, Zhenbin Wang, Weidong Fei
We report the synthesis of Bi0.9La0.1Fe0.95Mn0.05O3 (BLFMO) films with enhanced multiferroic properties and without second phase using Ba0.7Sr0.3Ti0.95Co0.05O3 (BSTCO) film as a buffer layer. Sol–gel processes were used to prepare the crystallized BLFMO/BSTCO films, in which magnetic domains were observed and no impurity phase was detected. We found that the buffer layer could effectively enhance the saturation magnetization and retentivity values of the BLFMO films, and especially the magnetic coercive field of these bilayer films was significantly stronger than that of the BLFMO films without buffer layers
Keywords: Multiferroics, Ferroelectricity, Magnetic properties, Perovskite
教育经历 Education
1978年2月入哈尔滨工业大学本科学习
1982年2月获哈尔滨工业大学工学学士学位
1984年12月获哈尔滨工业大学工学硕士学位
1989年12月获哈尔滨工业大学工学博士学位
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Feb. 1978: Undergraduate Student
Feb. 1982: Bachelor's degree in Welding Engineering
Dec. 1984: Master's degree in Materials Engineering
Dec. 1989: Doctoral Degree in Materials Science and Engineering (Electronics Packaging Technology)
工作经历 Work Experience
1974年1月-1978年2月，大庆油田建设公司，工人1984年12月 留校任助教，1986年7月 任讲师，1991年7月任副教授，1996年7月任教授1999年7月 被聘为材料科学与工程学科博士研究生导师2004年9月 被聘为电子科学与技术学科博士研究生导师1993-2000年 历任焊接教研室（系）副主任，主任1993-2000年 历任现代焊接生产技术国家实验室副主任，常务副主任：重点实验室筹建、验收，第一次评估、第二次评估2007- 负责筹建 电子封装技术 本科专业—————————————————————————————————————————————Dec. 1984: Assistant, Dept. of Metal Materials and Engineering, Harbin Institute of TechnologyJuly 1986, Lecturer, Dept. of Metal Materials and Engineering, Harbin Institute of TechnologyJuly 1991, Associate Professor, School of Materials Science and Engineering, HITJuly 1996, Professor, School of Materials Science and Engineering, HIT1993-2000: Vice Director, Director. Welding Department, HIT1993-2000: Vice director, State Key Lab. of Advanced Welding Production Technology2007- : Duty to set up Division of Electronics Packaging TechnologyPh.D Supervisor in Materials Science and Engineering, Electronics Science and Engineering
主要学术兼职 Academic Activities
中国电子学会 理事（曾）中国电子学会 电子制造与封装技术分会 常务理事中国电子学会 SMT专家咨询委员会 副理事长中国电子学会 电子封装专家委员会 副理事长中国半导体行业协会 封装与测试分会 副理事长美国电气电子工程师协会(IEEE, Inc) 会员曾任中国机械工程学会焊接分会常务理事/副秘书长韩国《焊接学会学报》国际版：顾问信息产业“十一五”规划及2020年中长期规划专家组 成员广东省无铅电子制造技术省部产学研联盟学术委员会 副主任2005 ICEPT国际学术会议，组织委员会 主席2017 ICEPT国际学术会议，组织委员会 主席2006年起历届ICEPT国际学术会议，技术委员会共同主席
全国高校电子封装技术本科专业系列教材编写委员会主任航天八院、513所、台达电子等单位工艺顾问国防科技工业元器件封装技术创新中心专家委员会 委员
基本信息 Introduction
－哈尔滨工业大学电子封装技术专业于2007年获得教育部批准建立，于2008年正式列入国家普通高等学校招生目录[专业代码：080709T]，同时于哈尔滨本部校区和威海校区招生。
－电子封装技术专业目前已经形成本校区和威海校区相结合的本科生培养基地，本校区与深圳研究生院相呼应的研究生培养基地，并与国外著名高校和机构开展科学研究的合作，目标是培养具备综合知识、适合产业发展、学术与工程兼备、具有国际化视野的人才。
－电子封装是将微元件再加工及组合构成微系统及工作环境的制造技术。如机械制造业将齿轮、轴承、电动机等零部件组装制造成机床、机器人等机械产品，建筑业由水泥、砖头、钢筋建造成楼房和桥梁，电子封装是用晶片、阻容、MEMS等微元件制造电子器件、手机、计算机等电子产品。
－电子封装是基础制造技术，各类工业产品(家用电器、计算机、通讯、医疗、航空航天、汽车等)的控制部分无不是由微电子元件、光电子元件、射频与无线元件及MEMS等通过电子封装与存储、电源及显示器件相结合进行制造。
－电子封装是研究微电子产品制造的科学与技术，是一门新兴的交叉学科，涉及到设计、环境、测试、材料、制造和可靠性等多学科领域。电子工业的飞速发展，从原子、纳米、微米到宏观尺度的微加工对最尖端科学技术的渴望都使这门学科的研究与教育充满挑战。构建完整的电子封装制造科学与技术教学体系是专业近期最为迫切的任务。
－我国正在成为世界电子制造的大国，要成为电子制造的强国，需要更多创新型、国际化的专业人才。电子封装技术专业期望为我国电子信息产业的发展作出重要的贡献。
专业历史 History
哈尔滨工业大学微连接与电子封装研究室从1987年开始进行与电子制造相关的微连接技术研究，在国内最早提出了微连接的概念和定义。以后逐渐在SMT工艺、可靠性等方面开展工作。自1997年后将研究目标全面转向集成电路IC和微电子封装技术，系统开展了先进封装结构、封装材料、可靠性和装备关键技术的研究。在研究生培养、本科生教学方面开设了一系列课程，已经培养从事电子封装制造工艺的博士30余位和硕士近百位。基于已有的实力和国家的需求，建立电子封装技术专业的申请于2007年11月得到教育部的批准，开启了专业发展新的篇章。
多年来，在先进互连技术方面开展了超声激光无钎剂软钎焊方法、激光微锡球键合技术、高频电磁辐射钎料微凸台重熔互连方法、激光辅助LED芯片与热沉直接钎焊方法、多层纳米薄膜铜丝球键合方法等研究，持有39项国家发明专利，11项科技进步奖。在封装材料上开展了基于分子轨道理论的钎料合金设计方法、陶瓷制造损伤与封装可靠性、锡基合金的微观结构与力学性质、极限环境下钎料合金与接头的组织演变与力学损伤等工作。在封装设备方面开展了微锡球制作设备、面向MEMS封装的激光锡球键合设备等开发工作。
电子封装涉及微细至纳米甚至原子尺度的材料加工过程，研究至细致微。注重基础研究是本专业一贯的传统。在锡基合金中裂纹尖端的物理过程、润湿能力的量子学分析、含有限晶粒微细接头的力学描述、激光激励微小液滴中超声振动的原理、界面反应的交互作用和尺寸效应等方面提出了新的概念。完成和承担了十余项国家自然科学基金项目，发表论文300余篇。
国际化是电子封装技术专业发展的必然趋势。我们的毕业生已经工作在国内外著名的电子制造企业，我们的许多研究项目也来自于这些世界前列的电子制造企业。研究生在学习阶段进入企业实习、参加国际学术会议、与国际知名学者面对面交流、承担国际合作项目、到国外高校联合培养，专业为培养国际化人才开辟了多种途径。
专业学术带头人王春青教授现任中国半导体行业协会封装分会副理事长；中国电子学会理事及封装分会副理事长、SMT咨询专家委员会副理事长；第六届电子封装技术国际学术会议(ICEPT 2005)组织委员会主席、ICEPT 2017组织委员会主席、历届ICEPT组织委员会或技术委员会共同主席；信息产业2020年中长期规划专家组成员；广东省无铅电子制造技术部省产学研联盟学术委员会副主任。曾经担任焊接教研室(系)主任、焊接技术国家重点实验室常务副主任、焊接学会常务理事/副秘书长等职。
专业课程 Courses
半导体器件物理
微电子制造技术（双语）
电子封装结构与设计
电子封装可靠性
微纳连接原理与方法（双语）
MEMS和微系统封装（双语）
薄膜材料与工艺
表面组装技术
电子封装材料
电子封装创新设计
电子封装国际标准认证
电子封装基础实验
电子封装生产实习
电子封装模拟与仿真
电子封装项目设计
电子封装与社会
电子制造装备
封装热界面基础
光电子器件与封装技术
化学微加工
混合微电路技术
纳米材料
纳米电化学
纳米器件
微纳加工技术（双语）
先进印刷电路板材料与制造
先进连接概论
电子封装技术专业阅读与写作
陶瓷组装及连接技术
本科课程 Courses for Undergraduate Students
钎焊（焊接）电阻焊（焊接）微型计算机原理与应用（焊接）专业导论（电子封装）微电子制造科学与技术（电子封装，双语）微连接原理（电子封装）先进连接概论（电子封装）
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Soldering and BrazingResistance WeldingMicrocomputerIntroduction to specialty Microelectronics Manufacturing TechnologyMicrojoiningAdvanced Welding and Joining
电子封装技术专业教学研讨会
新闻标题第六届电子封装技术专业教学研讨会
发表时间2017年
2017年11月3日上午，第六届全国电子封装技术专业本科教学研讨会在江苏科技大学举行，来自华中科技大学、大连理工大学、华南理工大学、哈尔滨工业大学、西安电子科技大学等全国17所高校的50多位专家学者聚集一堂，研讨新形势下电子封装专业的本科教学工作。江苏科技大学副校长许俊华出席研讨会并致欢迎辞，哈尔滨工业大学王春青教授作为学校代表致辞，江苏科技大学材料学院党委书记祁凯主持研讨会。
新闻标题参加第四届电子封装技术专业教学研讨会
发表时间2013-11-05
10月31日－11月2日第四届全国高校电子封装技术本科专业教学研讨会在西安电子科技大学召开，有来自全国二十余所有关高校近50位教师及教学管理人员参加。我校电子封装技术专业王春青、田艳红教授及王春雨博士参加了会议。
我校王春青教授主持了主题研讨会，西安电子科技大学、华中科技大学和北京理工大学的专业教学负责人分别介绍了机电学科电子封装技术专业的教学特点、二级学科申报过程、加强专业实践培养环节的经验，哈工大电子封装技术专业田艳红教授介绍了我校电子封装技术专业修订的教学计划的特色以及向电子制造领域发展的科研探索。来自上海交大、清华大学、大连理工等高校的教师分别介绍了各自在电子封装教学和科研上成果以及未来的发展设想。
自2007年哈尔滨工业大学和北京理工大学在国防科工委领导下首批建成电子封装技术本科国防特色专业后，全国目前已有8所高校正式成立了电子封装技术专业，有30多所高校在材料学院、机械学院或微电子学院设立了电子封装的教学和科研方向。为了加速专业的发展，为我国信息和电子制造业培养高端人才，共享教学资源和经验，经哈工大、华科大和北理工提议，电子封装技术专业本科教学研讨会已连续举办四届，为专业的发展、教学计划的完善起到了积极的促进作用。
会议期间，与会教师一致认为专业核心教材的建设工作刻不容缓。经过讨论确立成立电子封装技术专业核心教材编写委员会，并明确了7本核心教材的编写任务。我校王春青教授被推选为教材编写委员会主任。
王春青教授应邀为西电机电学院200余位研究生做了“电子封装微细连接的尺寸效应”的学术报告，并与研究生们进行交流。
毕业博士
刘晓剑：Ag-Cu超固溶体纳米颗粒低温纳米连接及抗电化学迁移机理研究，2017
钟 颖：Cu6Sn5纳米颗粒低温烧结机理及耐高温纳米晶接头的制备，2017
周 炜：纳米阵列薄膜制备及与纳米银的烧结连接机理，2017
李海龙：Cu/Sn界面固态扩散行为及Cu3Sn/Cu界面空洞的形成机制，2015
朱建东：WCu基板上AlN-Al2O3-SiO2复相陶瓷绝缘薄膜制备与性能研究，2015
史 菲：镁基自生增强相及超细镁合金组织及性能的研究，2015
曾 超：Al2O3陶瓷封装热切缺陷及其对断裂强度影响的统计研究，2014
杨 磊：基于钎料球重熔的MEMS微部件自组装及熔滴激光驱动行为，2014
李 彬：铁酸铋基多铁性微纳米材料的制备、改性及器件集成，2014
杨世华：含有限晶粒的微小化SnAgCu/Cu焊点的力学行为，2010
田德文：熔滴与平面和角形结构碰撞的动态行为及形态，2009
刘 威：激光重熔微小接头中金锡化合物的演化及抑制，2008
安 荣：Sn基金属间化合物物性及Sn的键级势的第一性原理研究，2008
张 威：基于钎料润湿力的光纤自对准原理及激光软钎焊界面反应，2008
计红军：超声楔键合界面连接物理机理研究，2008
杭春进：铜球可变形性在线测量及Cu/Al键合点可靠性研究，2008
陈宏涛：双侧焊盘间界面冶金反应的交互作用及焊点的尺寸效应，2007
李福泉：钎料熔滴/焊盘瞬间接触液固反应及界面组织演变，2006
赵振清：铝合金焊接镀层的设计与表面活化方法研究，2006
丁 颖：Sn及Sn合金的微观断裂行为研究，2006
田艳红：多次重熔及老化过程中钎料凸点/焊盘界面组织演变，2003
冯武锋：Sn基钎料合金元素的合金化效果及润湿性的量子学研究，2001
李明雨：钎料液滴激光强迫超声振动及对钎料润湿的影响，2001
赵秀娟：微电子封装与组装互连软钎焊焊点形态优化设计，2001
王国忠：SMT焊点三维形态预测及其对焊点可靠性的影响，1996
梁旭文：表面组装激光软钎焊接头形成机理及接头质量实时控制，1996
毕业硕士
梁新宇，籍晓亮
韩 晔；安 琪；付星尧；杨 雪，许 迪，马慧文
付明亮，王 浩，朱梅，李扬，吴伟伟，王宏，飞景明
齐林，孙毅，王宁，钟 颖；
杨传超，王宁宁，陈莹磊
刘 琪，宗 飞，黄腾飞，赵少伟，李阳，鲁 凯，林鹏荣，韩磊磊
张成敬，曾 超，张彬彬，刁 慧；陈雅蓉，黄 毅，阎勃晗，王伟强
周文凡，田德文，王 磊，洪守玉，计红军，凌 理
王晨曦，孙丽丽，宫继承，刘 威，安 荣
张 威，丁 颖；苏功臣，张晓东，陈宏涛
尹春燕，张 磊；郑冠群，孙福江；冯武锋；赵秀娟，何 民；李明雨
王金铭，汪瑞军，陈志翔，李海晨；杨 敏，桑 岩；梁旭文；刘爱国
在读研究生
博士研究生
明雪飞 热管理测试 [在职]王仲涛 宽禁带半导体器件赵厢汐（硕博连读）籍晓亮（本硕博连读）安琪 (硕博连读)；王俊琪 (硕博连读)
硕士研究生
马飞石成杰、石宇皓
招生方向
1、微连接基础科学问题
2、新型互连材料与方法
3、纳米功能材料与器件
4、系统封装与集成
5、宽禁带半导体器件与模块制造
研究领域
主要研究方向:
电子封装技术：微连接、可靠性与失效分析、封装工艺、微系统集成、LED封装与照明、电子材料与器件等
精密焊接：钎焊、电阻焊、超声、微纳材料连接等
功能纳米材料与器件、功率模块封装等
————————————————————————————————————————————————————
Research Interests
Electronics Packaging: Microjoining, Reliability and Failure Analysis, Microsystem Integration, LED packaging and Lighting System, Electronic Materials and DevicesPrecision Welding: Soldering and Brazing, Resistance Spot Welding, Ultrasonic Bonding, NanojoiningFunctional Materials and Device, Power Module————————————————————————————————————————————————————
ResearcherID:I-2588-2012
ORCID:http://orcid.org/0000-0001-5784-4608
详细请浏览：
http://eptech.hit.edu.cn/EPTech/EPT_Researches.html
科研项目
软钎料合金与接头在极限环境下的微观组织演变与损伤（重点），自然科学基金委员会，2016-01 至 2019-12，U** 金属间化合物纳米颗粒低温融合及与金属薄膜的连接原理，自然科学基金委员会，2013-01 至 2017-12，** 含有限晶粒的电子封装微连接接头的微观力学行为，自然科学基金委员会，2007-01 至 2009-12， ** 光电子封装无源自对准激光重熔连接方法的原理，自然科学基金委员会，2005-01 至 2007-12，** 交变激光热源激励液态金属超声振荡原理研究，自然科学基金委员会。1997-01 至 1999-12，**高密度表面组装激光软钎焊连接及实时质量控制，自然科学基金委员会，1989-01 至 1991-12， **面向MEMS立体封装和组装的锡球凸点键合设备及工艺（863项目），科学技术部，2007-10 至 2010-07， 2007AA04Z314 SiC器件封装材料、工艺及可靠性研究，台达环境与教育基金会，2014-08 至 2016-07，DREK** Micro Mechanical Behaviors of Lead-free Solder Alloys and Joint，SAMSUNG ELECTRONICS CO., LTD，2007-01 至 2009-12 Optimized Product Design for Laser Solder Ball Bonding Technology in Magnetic Heads Assembly，SAE Magnetics (H.K) Ltd 东莞新科磁电制品厂，2004-02 至 2006-02Laser Micro Solder Ball Bumping for BGA/Flip Chip Packaging，ASM Pacific LTD，2000-01 至 2004-01 Molten Solder Jetting, ASM Pacific LTD，2000-01 至 2004-01贮存失效机理与延寿立体组装技术与应用智能化激光微焊接技术电阻点焊质量实时控制铝合金表面活化低温连接技术MEMS三维自组装技术混合电路及SiP高可靠陶瓷封装载体
博士研究生课题
锡基合金中裂纹尖端的物理行为有限晶粒接头力学尺寸效应润湿研究的量子学方法连接界面的交互作用及尺寸效应激光激励金属液滴中超声振动红外传感激光软钎焊质量控制熔融金属液滴与固体表面的碰撞过程互连接头可靠性IMC的物理及力学性质互连的形态与可靠性铜球可变形性及Cu/Al界面反应超声楔焊键合界面连接物理机理陶瓷封装的失效机理与可靠性基于润湿的MEMS微部件自组装方法铁电薄膜／纳米材料与器件表面活化低温连接方法激光锡球键合方法与IMC的演变光纤自对准定位方法的原理准晶合金设计与制备封装热阻测试方法薄膜半导体制冷器铜基板上的陶瓷薄膜图形电子产品的贮存失效机理与可靠性纳米合金颗粒的低温融合及与金属薄膜的连接机理薄膜表面纳米化及应用高温封装及可靠性宽禁带半导体的欧姆接触设计极限环境下的钎料合金力学行为钎料合金的低温冷脆钎焊接头的损伤力学二维纳米材料与器件
Journal Papers
2019年发表论文
1. Zhongtao Wang, Wei Liu, Yusen Wu, Wenping Sun, Wei Liu, Chunqing Wang*. A Novel Cobalt-Free CO2-Stable Perovskite-Type Oxygen Permeable Membrane, Journal of Membrane Science,Volume 573, 1 March 2019, pp504-510, doi:10.1016/j.memsci.2018.12.014. IF 6.578
2. Ying Zhong, Rong An, Huiwen Ma, Chunqing Wang*. Low-Temperature-Solderable Intermetallic Nanoparticles for 3D Printable Flexible Electronics. Acta Materialia, Volume 162, 1 January 2019:pp163-175, DOI: 10.1016/j.actamat.2018.09.069. IF6.036
3. Wei Liu, Yiping Wang, Zhen Zheng, Chunqing Wang, etc. Laser sintering mechanism and shear performance of Cu–Ag–Cu joints with mixed bimodal size Ag nanoparticles, Journal of Materials Science: Materials in Electronics, April 2019, Volume 30, Issue 8, pp7787–7793
2018年发表论文
1. Xiaoliang Ji, Rong An, Chunqing Wang, Chongyang Cai. Solid-State Spalling of Ag3Sn in an Eutectic SnPb Solder Joint with an Ag Thin Film/Ge Cell. Journal of Electronic Materials, September 2018, Volume 47, Issue 9, pp 5625–5631.
2. Siyu Sun, Qiang Guo, Hongtao Chen, Mingyu Li, Chunqing Wang. Solderless bonding with nanoporous copper as interlayer for high-temperature applications. Microelectronics Reliability. Volume 80, January 2018, Pages 198–204. DOI: 10.1016/j.microrel.2017.12.012.
3. Wang, Chenxi; Xu, Jikai; Zeng, Xiaorun; Tian, Yanhong; Wang, Chunqing; Suga, Tadatomo. Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning, JAPANESE JOURNAL OF APPLIED PHYSICS, MAY 16-18, 2017. Vol.57, I. 2, Feb 2018.
4. Chongyang Cai, Rong An, Chunqing Wang, Yanhong Tian, Xiaoliang Ji, Robust tuning of Kirkendall void density in circuit interconnections through substrate strain annealing, Journal of Materials Science: Materials in Electronics (2018) 29:8287–8292, https://doi.org/10.1007/s10854-018-8837-2I.
5. Wang, Chenxi，Xu, Jikai，Qi, Xiaoyun，Liu, Yannan，Tian, Yanhong，Wang, Chunqing，Suga, Tadatomo. Direct Homo/Heterogeneous Bonding of Silicon and Glass Using Vacuum Ultraviolet Irradiation in Air. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, V165, I4, 2018:ppH3093-H3098, DOI: 10.1149/2.**jes.
6. Wei Liu, Rong An, Chunqing Wang, Zhen Zheng, Yanhong Tian, Ronglin Xu, Zhongtao Wang. Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications. Micromachines 2018, 9, 346. doi:10.3390/mi**.
7. Chunjin Hang, He Zhang, Yanhong Tian, Chenxi Wang, Yuan Huang, Zhen Zheng and Chunqing Wang. A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package. Applied Sciences, 2018, 8(11), 2188; doi: 10.3390/app**.
2017年发表论文
1. Wei Zhou, Zhen Zheng, Chunqing Wang*, Zhongtao Wang, and Rong An. One-Step Fabrication of 3D Nanohierarchical Nickel Nanomace Array To Sinter with Silver NPs and the Interfacial Analysis, Applied Materials and Interfaces, 2017, 9 (5), pp4798–4807. DOI: 10.1021/acsami. 6b13031, IF8.097
2. Bin Li, Chunqing Wang*, Guangbin Dou, Zhenbin Wang, Weidong Fei, Crystallized Bi0.9La0.1Fe0.95Mn 0.05O3/Ba0.7Sr0.3Ti0.95Co0.05O3 bilayer thin films with enhanced multiferroic properties. Applied Surface Science 404 (2017): pp162–167 DOI: 10.1016/j. apsusc.2017.01.186 IF4.439
3. Xiaojian Liu, Chunqing Wang*, Wei Liu, Zhen Zheng, Mingyu Li. Low temperature nanojoining of silver–copper nanopaste as die attach material for high temperature packaging. Journal of Materials Science: Materials in Electronics. April 2017, Volume 28, Issue 7, p5446–5451, DOI: 10.1007/s10854-016-6206-6
4. Xiaojian Liu, Zhen Zheng, Chunqing Wang*, Wei Liu, Rong An and Wei Zhang, Fusion behaviour and mechanism of ultrafine Ag-Cu nanoparticles induced by electron beam irradiation, Journal of Materials Science: Materials in Electronics, Volume 28, Number 11, 2017: p8206-8210, DOI: 10.1007/s10854-017-6531-4
5. Tianqi Hu, Hongtao Chen, Chunqing Wang, Mengshi Huang, Fufan Zhao. Study of electroless Sn-coated Cu microparticles and their application as a high temperature thermal interface material. Surface and Coatings Technology. Volume 319, 15 June 2017, pp230–240, DOI: 10.1016/j.surfcoat.2017.04.002
6. Tianqi Hu, Hongtao Chen, Mingyu Li, Chunqing Wang. Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions. Materials & Design, Volume 131, 5 October 2017, Pages 196-203
7. Wei Liu, Chunqing Wang*, Guangbin Dou*, Yanhong Tian, and Lei Yang.Laser-induced actuation of individual microsize liquid metal droplets on an open solid surface. Applied Physics Express 10, 017202 (2017) DOI:10.7567/APEX.10.017202
8. Wei Liu, Changhai Wang, Chunqing Wang, Xin Jiang, and Xi Huang. Laser Sintering of Nano-Ag Particle Paste for High-Temperature Electronics Assembly. IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, Volume: 7, Issue:7, July 2017;pp1050-1057. DOI: 10.1109/TCPMT.2017.**
9. Chenxi Wang, Yannan Liu, Yue Li, Yanhong Tian, Chunqing Wang and Tadatomo Suga. Mechanisms for Room-Temperature Fluorine Containing Plasma Activated Bonding. ECS Journal of Solid State Science and Technology, 6 (7) p373-378 (2017)
10. Chenxi Wang, Yuan Wang, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, Room-Temperature Direct Bonding of Silicon and Quartz Glass Wafers, Applied Physics Letters, V110, I 22, 221602 (2017). doi: 10.1063/1.**
11. Chenxi Wang, Yue Liu, Yannan Liu, Zhitian Yuan, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, Investigation of Thermal Treatment Processes for Dissimilar Wafer Bonding,International Symposium on Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7 held as part of the 231st Meeting of The Electrochemical-Society, MAY 28-JUN 01, 2017
12. Baolei Liu, Yanhong Tian*, Chenxi Wang, Rong An, Chunqing Wang. Ultrafast formation of unidirectional and reliable Cu3Sn-based intermetallic joints assisted by electric current. Intermetallics 80 (2017) p26-32. DOI: 10.1016/j.intermet.2016.10.004
2016年论文发表
1. Ying Zhong, Wei Liu, Chunqing Wang, Xiujuan Zhao, J.F.J.M. Caers. The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling. Materials Science and Engineering: A, Volume 652, 15 January 2016, Pages 264-270
2. Wang, Zhongtao; Liu, Wei; Wang, Chunqing. Recent Progress in Ohmic Contacts to Silicon Carbide for High-Temperature Applications. JOURNAL OF ELECTRONIC MATERIALS, Volume: 45 Issue: 1, JAN 2016 P:267-284
3. Xiaojian Liu, Wei Liu, Chunqing Wang, Zhen Zheng and Lingchao Kong, Preparation and Sintering Properties of Ag27Cu2Sn Nanopaste as Die Attach Material, Journal of ELECTRONIC MATERIALS, October 2016, Volume 45, Issue 10, pp 5436–5442
4. Xiaojian Liu, Wei Liu, Chunqing Wang , Zhen Zheng. Optimization and modeling for one-step synthesis process of Ag–Cu nano-particles using DOE methodology. Journal of Materials Science: Materials in Electronics. Volume 27, Issue 5, 2016: pp 4265-4274
5. Xiaojian Liu, Zhen Zheng, Chunqing Wang*, Wei Liu, Lingchao Kong. Effects of temperature and dispersants on the phases and morphology of Ag–Cu nanoparticles. Journal of Materials Science: Materials in Electronics. Volume 27 Number 10, 2016: p10065-10069
6. Tian, Yanhong,Jiang, Zhi; Wang, Chenxi; Ding, Su; Wen, Jiayue; Liu, Zhiquan; Wang, Chunqing. Sintering mechanism of the Cu-Ag core-shell nanoparticle paste at low temperature in ambient air. RSC ADVANCES, Vol.6 2016: p91783-91790
7. Shang Wang, Yanhong Tian, Su Ding and Chunqing Wang. The role of chloride ions in rapid synthesis of ultra-long silver nanowires for flexible electrodes. Materials Research Express, Volume 3, Number 7, July 2016
2015年论文发表
1. Ying Zhong , Rong An , Chunqing Wang*, Zhen Zheng , Zhi-Quan Liu , Chin-Hung Liu , Cai-Fu Li , Tae Kyoung Kim , and Sungho Jin *. Low Temperature Sintering Cu 6 Sn 5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections. small 2015, 11, No. 33, 4097–4103 IF: 9.598
2. Hailong Li, Rong An, Chunqing Wang, Zhi Jiang. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging. Journal of Alloys and Compounds 634 (2015): p94–98
3. Hailong Li, Rong An, Chunqing Wang, Yanhong Tian, Zhi Jiang. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints. Materials Letters. 144, (2015): p97–99
4. Hailong Li, Rong An, Chunqing Wang, Bin Li. Suppression of void nucleation in Sn3.0Ag0.5Cu/CU solder joint by rapid thermal processing. Materials Letters. 158, (2015):p252–254
5. Jiandong Zhu, Rong An, Chunqing Wang, and Guangwu Wen. Fabrication of Al2O3–Mullite–AlN Multiphase Ceramic Layer on W–Cu Substrates for Power Semiconductor Packaging. IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 5, NO. 2, FEBRUARY 2015:p182-187
6. Jiandong Zhu, Rong An, Chunqing Wang, Wei Liu. Synthesis of CrO single crystal slices by firing under water vapor atmosphere. Materials Letters 152 (2015) 13–16 [IF:2.489]
7. JIANDONG ZHU, RONG AN, CHUNQING WANG, WEI ZHANG, and GUANGWU WEN. Characterization of the Microstructure of an AlN-Mullite-Al2O3 Ceramic Layer on WCu Composite Alloy for Microelectronic Application. Journal of ELECTRONIC MATERIALS, Vol. 44, No. 11, 2015:p4154-4160
8. Fei SHI, Chun-qing WANG, Zhong-ming ZHANG. Microstructures, corrosion and mechanical properties of as-cast Mg-Zn-Y-(Gd) alloys. Transactions of Nonferrous Metals Society of China (English Edition) 25 (2015):p2172-2180
9. Shi, F (Shi Fei); Wang, CQ (Wang Chunqing); Guo, XF (Guo Xuefeng). Microstructures and Properties of As-Cast Mg92Zn4Y4 and Mg92Zn4Y3Gd1 Alloys with LPSO Phase. RARE METAL MATERIALS AND ENGINEERING. Vol. 44, Issue 7, 2015:p1617-1622
10. Chao Zeng, Chunqing Wang, Yanhong Tian, Chunjin Hang, Wei Liu, Rong An. Fracture Statistics Dominated by Hot-Cutting Defect and Deviation from Weibull Distribution. Journal of Harbin Institute of Technology (New Series), v 22, n 2, April 1, 2015: p 41-48
11. Chao Zeng, Chunqing Wang, Yanhong Tian, Chunjin Hang, Wei Liu, and Rong An, Characterization of the Hot-Cutting Defect Generated from Shape Machining of Alumina Green Tape in the Ceramic-Package Manufacturing Process, Journal of Microelectronics and Electronic Packaging. Volume 12, Number 1. 2015: p55-60
12. Su Ding, Yanhong Tian, Zhi Jiang, Chunqing Wang. Joining of Silver Nanowires by Femtosecond Laser Irradiation Method. MATERIALS TRANSACTIONS, Vol. 56 No. 7 (2015):p 981-983
13. HONGJUN JI, YUYOU MA, MINGYU LI, and CHUNQING WANG. Effect of the Silver Content of SnAgCu Solder on the Interfacial Reaction and on the Reliability of Angle Joints Fabricated by Laser-Jet Soldering. Journal of ELECTRONIC MATERIALS, Vol. 44, No. 2, 2015:p733-743
14. Wei Liu, Rong An, Chunqing Wang, Yanhong Tian. Effect of Au-Sn IMCs’ formation and morphologies on shear properties of laser reflowed micro-solder joints. Soldering & Surface Mount Technology. Vol. 27, Iss 1, 2015:p45 – 51
2014年发表文章
1、曾超,王春青,田艳红,张威。热切缺陷对陶瓷封装钎焊组装工艺可靠性的影响—I. 热切缺陷评估，焊接学报Vol.35 No. 9，September 2014：p105-108
2、曾超,王春青,田艳红,张威。热切缺陷对陶瓷封装钎焊组装工艺可靠性的影响—II. 接头结构设计，焊接学报Vol.35 No. 11，November 2014：p105-108
3、安荣, 田艳红，孔令超，王春青，常帅。自支撑Ti/Al 纳米多层膜激光诱发自蔓延行为，金属学报，Vol. 50 No.8, 2014:p937-943
4、Bin Li, Chunqing Wang, Guangbin Dou and Zhenbin Wang. Effects of Ba0.7Sr0.3TiO3-based buffer layers and La/Mn doping on the crystallization behavior and multiferroic properties of BiFeO3 thin films. RSC Advances, 2014, 4, 55889-55896 [IF: 3.840]
5、Zhuolin Li, Mingyu Li, Yong Xiao, Chunqing Wang. Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves. Ultrasonics Sonochemistry 21 (2014) 924–929
6、Hongjun Ji, Qiang Wanga, Mingyu Li, Chunqing Wang. Effects of ultrasonic irradiation and cooling rate on the solidification microstructure of Sn–3.0Ag–0.5Cu alloy. Journal of Materials Processing Technology 214 (2014) 13–20
7、HONGJUN JI, QIANG WANG, MINGYU LI, and CHUNQING WANG. Ultrafine-Grain and Isotropic Cu/SAC305/Cu Solder Interconnects Fabricated by High-Intensity Ultrasound-Assisted Solidification. Journal of ELECTRONIC MATERIALS, Vol. 43, No. 7, 2014:p2467-2478
8、Yujie Li, Xiaofu Tang, Yanteng Zhang, Jin Li, Chengbin Lv, Xinling Meng, Yilong Huang, Chunjin Hang, Chunqing Wang. Cu nanoparticles of low polydispersity synthesized by a double-template method and their stability. Colloid and Polymer Science (2014) 292:715–722
9、Yanhong Tian, Rui Zhang, Chunjin Hang, Lina Niu, Chunqing Wang. Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads. MATERIALS CHARACTERIZATION 88, (2014) 58–68
10、Yanhong Tian, Chunjin Hang, Xin Zhao, Baolei Liu, Ning Wang, Chunqing Wang. Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid–liquid interdiffusion bonding. J Mater Sci: Mater Electron (2014) 25:4170–4178
11、Chunqing Wang. HIGH TEMPERATURE VIABLE BONDING REALIZED BY SINTERING Sn-Cu IMC NANOALLOYS AT LOW TEMPERATURE. Keynote Lecture, IIW 2014 International Conference. Seoul, Korea. July 17, 2014
12、Chunqing Wang. HIGH TEMPERATURE BONDING REALIZED BY SINTERING Sn-Cu IMC NANOPASTE AT LOW TEMPERATURE. Plenary Keynote, The 2nd International Conference on Nanojoining and Microjoining. Emmetten, Switzerland. December 7 – 11, 2014
2013年发表论文
1. Zhang, Rui; Tian, Yanhong; Hang, Chunjin; Liu, Baolei; Wang, Chunqing. Formation mechanism and orientation of Cu3Sn grains in Cu-Sn intermetallic compound joints. MATERIALS LETTERS. Vol.110m p137-140. NOV 1, 2013.
2. Zhuolin Li, Mingyu Li, Yong Xiao, Chunqing Wang. Ultrarapid formation of homogeneous Cu6Sn5and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves. Ultrasonics Sonochemistry. Volume 21, Issue 3, May 2014, Pages 924–929.
3. Shuai Wang, Mingyu Li, Hongjun Ji and Chunqing Wang. Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging. Scripta Materialia 69 (2013) 789–792.
4. Zhihao Zhang, Mingyu Li, Chunqing Wang. Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging. Intermetallics 42 (2013) 52-55.
5. Yujie Li. Xiaofu Tang. Yanteng Zhang. Jin Li. Chengbin Lv. Xinling Meng. Yilong Huang. Chunjin Hang. Chunqing Wang. Cu nanoparticles of low polydispersity synthesized by a double-template method and their stability. Colloid Polym Sci. ？27 Nov. 2013 online
6. Mingyu Li, Zhuolin Li, Yong Xiao, and Chunqing Wang. Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature. APPLIED PHYSICS LETTERS 102, 094104 (2013).
7. Yang Lei; Liu Wei; Wang Chunqing; Tian Yanhong. Surface-Tension-Driven Self-Assembly of 3-D Microcomponents by Using Laser Reflow Soldering and Wire Limiting Mechanisms. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Volume: 3 Issue: 1 Pages:168-176 JAN 2013.
8. Y. Zhong, W. Zhang, C.Q. Wang, B. Li. Manufacturing and Microstructure of Cu Coated Diamonds/SnAgCu Composite Solder Bumps, Applied Mechanics and Materials, V288 (2013) pp323-327.
9. Bin Li, Chunqing Wang and Guangbin Dou, Synthesis of multiferroic Bi0.9La0.1Fe0.95Mn 0.05O3/Ba0.7Sr0.3TiO3/ Ni0.8Zn0.2Fe2O4 nanotubes with one closed end using a template-assisted sol–gel process. CrystEngComm, 2013, 15, 2147-2156.
10. Bin Li, Chunqing Wang*,Wei Liu, Mao Ye, Ning Wang. Multiferroic properties of La and Mn co-doped BiFeO3 nanofibers by sol–gel and electrospinning technique, Materials Letters, 90 (2013) 45–48.
11. Bin Li, Chunqing Wang*, Wei Zhang, Chunjin Hang, Jingming Fei, Hong Wang. Fabrication of multiferroic Ba0.7Sr0.3TiO3–Ni0.8Zn0.2Fe2O4 composite nanofibers by electrospinning, Materials Letters 91 (2013) 55–58.
12. Zhen Zheng, Ning Li, Chun-Qing Wang, De-Yu Li, Fan-Yu Meng, Yong-Ming Zhu, Qing Li, Gang Wu. Electrochemical synthesis of Ni–S/CeO2 composite electrodes for hydrogen evolution reaction. Journal of Power Sources, Volume 230, 15 May 2013, Pages 10-14.
13. Zhen Zheng, Ning Li, Chun-Qing Wang, De-Yu Li, Fan-Yu Meng, Yong-Ming Zhu. Effects of CeO2 on the microstructure and hydrogen evolution property of Ni–Zn coatings. Journal of Power Sources, Volume 222, 15 January 2013, Pages 88-91.
14. Liu, Wei; Tian, Yanhong; Wang, Chunqing; et al. Formation of AuSnx IMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow processes. Journal of Materials Science-Materials in Electronics Volume: 24 Issue: 1 Pages: 217-223 JAN 2013.
2012年发表文章：
1. Ni–CeO2composite cathode material for hydrogen evolution reaction in alkaline electrolyte.International Journal of Hydrogen Energy, Volume 37, Issue 19, October 2012, Pages 13921-13932.Zhen Zheng, Ning Li, Chun-Qing Wang, De-Yu Li, Yong-Ming Zhu, Gang Wu.
2. Effects of CeO2on the microstructure and hydrogen evolution property of Ni–Zn coatings. Journal of Power Sources, Volume 222, 15 January 2013, Pages 88-91.Zhen Zheng, Ning Li, Chun-Qing Wang, De-Yu Li, Fan-Yu Meng, Yong-Ming Zhu.
3. Synthesis of Co-doped barium strontium titanate nanofibers by sol-gel electrospinning process. Materials Letters, Volume 75, 15 May 2012, Pages 207-210. Bin Li, Chunqing Wang, Wei Liu, Ying Zhong, Rong An.
4. Fabrication of multiferroic Ba0.7Sr0.3TiO3–Ni0.8Zn0.2Fe2O4composite nanofibers by electrospinning. Materials Letters, In Press, Uncorrected Proof, Available online 26 September 2012. Bin Li, Chunqing Wang, Wei Zhang, Chunjin Hang, Jingming Fei, Hong Wang.
5. Multiferroic properties of La and Mn co-doped BiFeO3nanofibers by sol–gel and electrospinning technique. Materials Letters, Volume 90, 1 January 2013, Pages 45-48. Bin Li, Chunqing Wang, Wei Liu, Mao Ye, Ning Wang.
6. Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints. Materials Letters, Volume 86, 1 November 2012, Pages 157-160.Wei Liu, Yanhong Tian, Chunqing Wang, Xuelin Wang, Ruiyang Liu.
7. Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles. Materials Letters, Volume 85, 15 October 2012,Pages 61-63.Shuai Wang, Hongjun Ji, Mingyu Li, Chunqing Wang.
8. Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-state soldering. Intermetallics, Volume 25, June 2012, Pages 86-94.Ming Yang, Mingyu Li, Chunqing Wang.
9. Effect of Diamond Additions on Wettability and Distribution of SnAgCu Composite Solder.Journal of Materials Science & Technology, Volume 28, Issue 7, July 2012, Pages 661-665. Wei Zhang, Ying Zhong, Chunqing Wang.
10. Mechanical properties and microstructures of hybrid ultrasonic resistance brazing of WC-Co/BeCu. Journal of Materials Processing Technology, Volume 212, Issue 9, September 2012, Pages 1885-1891.Hongjun Ji, Mingyu Li, Yongfei Lu, Chunqing Wang.
11. Ultrasonic Bondability and Antioxidation Property of Ti/Cu/TaN/Ag Multi-layers on Si Substrate, Thin Solid Films. xxx (2012) xxx–xxx. Chunjin Hang, Yanhong Tian, Chunqing Wang, Ning Wang.
2011年前发表论文
1. Yanhong Tian, Chunjin Hang, Chunqing Wang, Shihua Yang, Pengrong Lin.Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing. Materials Science and Engineering A 529 (2011) 468–478
2. 王春青，王学林，田艳红，SnAgCu无铅微焊点剪切力学性能的体积效应，焊接学报，第32卷 第4期，2011年4月p1-4
3. Yanhong Tian, Chunjin Hang,Chunqing Wang, Gongqun Ouyang. Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectronics Reliability.2011(1):157-165
4. 田艳红,王春青,赵少伟.Cu焊盘TiN/Ag金属化层超声键合性能及抗氧化性能研究.金属学报2010 5(46):618-622
5. 田艳红,王春青,杨世华.SnAgCu/Cu无铅焊点剪切断裂行为的体积效应..金属学报2010,3(46):366-371
6. Shihua Yang, Yanhong Tian, Chunqing Wang. Investigation on Sn gring number and crystal orientation in the Sn-Ag-Cu/Cu solder joints of different sizes. J. Mater Electr (2010) 21:1174-1180
7. Tian Dewen,Yanhong Tian,Chunqing Wang,ChunjinHang. Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface. Journal of Materials Science, 44(7), pp 1772-1779, 2009
8. 阎勃晗,张威, 王春青. 光纤定位激光钎焊键合过程中钎料与镀层的界面反应. 材料科学与工艺, 02期, 2009
9. D. Tian, C. Wang and Y. Tian, Modeling of Micropitch Shift of a Magnetoelectrical Sensor During Laser Solder Ball Bonding Process, IEEE Transactions on Advanced Packaging, Vol. 32, No.1 Feb. 2009:p136-145
10. C. J. Hang, W. H. Song, I. Lum, M. Mayer, Y. Zhou, C. Q. Wanga, J. T. Moon, J. Persic. Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force. Microelectronic Engineering.
11. Hongjun Ji, Mingyu Li, Chunqing Wang, Han Sur Bang and Hee Seon Bang. In situ measurement of bond resistance varying with process parameters during ultrasonic wedge bonding. Journal of Materials Processing Technology. Volume 209, Issue 1, 1 January 2009, Pages 139-144.
12. Tian De-wen, Wang Chun-qing, Tian Yan-hong. Effect of solidification on solder bump formation in solder jet process: Simulation and experiment. 中国有色金属学会会刊(英文版), 18(5), pp 1201-1208, (2008/12/24)
13. Hongtao Chen, Chunqing Wang, Mingyu Li, and Dewen Tian. Effect of Thermal Aging on the Microstructure Evolution and Solder Joint Reliability in Hard Disk Drive Under Mechanical Shock. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 31, NO. 4, DECEMBER 2008 p831-836
14. D W Tian, Y H Tian, C Q Wang and C J Hang. Three-dimensional modelling of solder droplet impact onto a groove.JOURNAL OF PHYSICS D: APPLIED PHYSICS. 41 (2008) 245503 (12pp)
15. Yanhong Tiana, Chunqing Wang, Ivan Lum, M. Mayer, J.P. Jung, Y. Zhou,Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature. Journal of Materials Processing Technology Volume 208, Issues 1-3, 21 November 2008, Pages 179-186
16. 田德文，田艳红，王春青。 面向MEMS封装的微钎料球键合技术，电子工业专用设备，2008年37卷5期
17. Zhang Wei; Wang Chunqing; Tian Yanhong. Numerical and experimental analysis of solder joint self-alignment in fiber attachment soldering.Journal of Electronic Packaging, Transactions of the ASME, v 130, n 1, March, 2008, p011**
18. Liu Wei; Wang Chunqing; Tian Yanhong; Li, Mingyu. Investigation of sagging phenomenon observed in laser reflow soldering right-angled solder joints during isothermal aging or thermal cycle process.Journal of Alloys and Compounds.v 458, n 1-2, Jun 30, 2008, p323-329
19. F.Q.Li, C. Q.Wang and Y.H.Tian. Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad. Materials Science and Technology 2008 VOL 24 NO 6
20. LIU Wei, WANG Chunqing, TIAN Yanhong, CHEN Yarong. Effect of Zn addition in Sn-rich alloys on interfacial reaction with Au foils. Trans. Nonferrous Met. Soc. China. 18(2008) 617-622
21. RONG AN,CHUNQING WANG and YANHONG TIAN. Determination of the Elastic Properties of Au5Sn and AuSn from Ab Initio Calculations. Journal of ELECTRONIC MATERIALS, Vol.37,No.7,2008
22. Heeseon Bang, Hongjun JI, Mingyu LI, Chunqing WANG, and Han Sur BANG. Fracture Study of Ultrasonic Aluminum Wire Wedge Bonding on Copper Substrate with Mechanical Peeling-off Method. Materials Science Forum Vols. 580-582 (2008) pp 173-176
23. Yanhong TIAN, Chunqing WANG and Yarong CHEN. Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls. J. Mater. Sci. Technol., Vol.24 No.2, 2008:p220-226
24. Hui Diao, Chun-qing Wang,Lei Wang. Bonding of Aluminum Alloy by Hot-dipping Tin Coating. Advanced Materials Research Vol. 32 (2008) pp 93-98
25. Yanhong Tian,Chunqing Wang, Danyang Zhu,Y.Zhou.Finite element modeling of electron beam welding of a large complex Al alloy structure by parallel computations.Journal of materials processing technology 199 (2008):p41–48
26. C.J. Hang, C.Q. Wang, M. Mayer, Y.H. Tian, Y. Zhou, H.H. Wang. Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectronics Reliability 48 (2008):p416–424
27. Hongjun Ji, Mingyu Li, Jong-Myung Kim, Dae-Won Kim, Chunqing Wang. Nano features of Al/Au ultrasonic bond interface observed by high resolution transmission electron microscopy. Materials Characterization. v 59, n 10, October, 2008, p1419-1424
28. RONG AN, CHUNQING WANG, YANHONG TIAN, and HUAPING WU. Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations. Journal of ELECTRONIC MATERIALS, Vol. 37, No. 4, 2008: 477- 482
29. H.T. Chen, C.Q. Wang, Cheng.Y, and Y. Huang, Y.H. Tian, Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints, Journal of electronic materials , Vol.36 No.1(2007) 26-32
30. H.T. Chen, C.Q. Wang, M.Y. Li, and D.W. Tian, Influence of thermal cycling on the microstructure and shear strength of Sn3.5Ag0.75Cu and Sn63Pb37 solder joints on Au/Ni metallization, Journal of Materials Science and Technology, Vol.23 No. 1 (2007) 68-72.
31. H.T. Chen, C.Q. Wang, Cheng.Y, M.Y. Li, and Y. Huang, Cross-interaction of interfacial reactions in Ni (AuNiCu)-SnAg-Cu solder joints during reflow soldering and thermal aging, Journal of electronic materials , Vol.36 No.1(2007) 33-39
32. 刁慧，王春青，赵振清，田艳红，孔令超. SnCu钎料镀层与Cu/Ni镀层钎焊接头的界面反应. 中国有色金属学报. Vol.17 No.3 2007:410-416
33. Ding, Ying; Wang, Chunqing; Tian, Yanhong; Li, Mingyu. Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests. Journal of Alloys and Compounds, v 428, n 1-2, Jan 31, 2007, p 274-285
34. Hongjun Ji,Mingyu Li,Chunqing Wang, Han Sur Bang,Hee Seon Bang.Comparison of interface evolution of ultrasonic aluminum and gold wire wedge bonds during thermal aging.Materials Science and Engineering A 447 (2007) 111–118
35. Hang Chunjin, Wang Chunqing and Tian Yanhong. Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds, China Welding. Vol.16 No.3 Sep. 2007:46-50
36. Yanhong TIAN, Chunqing WANG and Danyang ZHU. Shape Prediction and Reliability Design of Ball Grid Array Solder Jointse. Key Engineering Materials Vols. 353-358 (2007)
37. Yanhong TIAN and Chunqing WANG. Modeling of the Temperature Field during Electron Beam Welding of Aluminum Alloy by a Pre-defined Keyhole. Key Engineering Materials Vols. 353-358 (2007)
38. 田艳红，王春青，孔令超. 激光键合技术在封装中的应用及研究进展. 电子工业专用设备. May. 2007（总第148 期）
39. TIAN Yanhong, WANG Chunqing, and :Liu Wei. Effects of Cu addition on growth of Au-Sn intermetallic compounds at Sn-xCu/Au interface during aging process. RARE METALS Vol.26,S pecI.s sueA, ug2007p, .331- 337
40. Hongjun Ji, Mingyu Li, Chunqing Wang, Jingwei Guan, Evolution of the bond interface during ultrasonic Al–Si wire wedge bonding process, Journal of Materials Processing Technology 182 (2007) 202–206
41. Zhao, Zhenqing, Wang, Chunqing; Li, Mingyu; Wang, Lei; Kong, Lingchao. The effects of pulsed Nd:YAG laser irradiation on surface energy of copper.Applied Surface Science, v 252, n 12, Apr 15, 2006, p 4257-4263
42. 王春青，田艳红，孔令超。电子封装与组装无铅化应用中的问题，半导体行业，2006年12月第75期:46-51
43. Mingyu Li, Hongjun Ji, Chunqing Wang. Interdiffusion of Al–Ni system enhanced by ultrasonic vibration at ambient temperature, Ultrasonics 45 (2006) 61–65
44. 王春青,丁颖. Sn及Sn合金的微观断裂行为，世界科技研究与发展，2006年第5期：19-29
45. 张威，王春青，阎勃晗，AuSn钎料及镀层界面金属间化合物的演变，稀有金属材料与工程，2006年第7期(35卷)：1143-1145
46. 张成敬，王春青，陶瓷阵列封装的两种形式及其接头可靠性，电子工业专用设备，2006年第35卷第8期：10-17
47. Chunqing Wang, Ying Ding. Micro Mechanical Behaviors of Solder Alloys of 100Sn, 63Sn37Pb and 96.5Sn3.5Ag under In-situ SEM/TEM Tensile Testing, Smart Processing Technology, Vol.1 (2006), High Temperature Society of Japan: 155-161
48. Li MY, Ji HJ, Wang CQ, et al. Irregular characteristics of bond interface formation in ultrasonic wire wedge bonding. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 22(4): 483-486 AUG 2006
49. H.T. Chen, C.Q. Wang, M.Y. Li. Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling Microelectronics Reliability 46 (2006) 1348–1356
50. 李福泉，王春青等，SnPb钎料与Au/Ni/Cu焊盘反应过程中Au的分布，焊接学报，2006 /V27 /N1
51. Fuquan Li, Chunqing Wang and Yanhong Tian. Interaction Kinetics between Sn-Pb Solder Droplet and Au/Ni/Cu pad, Journal of Materials Science and Technology, Vol.22, No.3, 2006:p392-396
52. H.T. Chen, C.Q. Wang, M.Y. Li, D.W. Tian. Effect of Cu diffusion through Ni on the interfacial reactions of Sn3.5Ag0.75Cu and SnPb solders with Au/Ni/Cu substrate during aging, Materials Letters 60 (2006) 1669–1672
53. Li Fu-quan, Wang Chun-qing. Influnce of interfacial reaction between molten SnAgCu solder droplet and Au/Ni/Cu pad on IMC evolition, Transactions of Nonfererrous Metals Society of China. 16(2006):p18-22
54. Ying Ding, Chunqing Wang, Yanhong Tian, and Binbin Zhang. In-situ observation on microfracture behavior ahead of the crack tip in 63Sn37Pb solder alloy.Metallurgical and Materials Transactions A. Vol. 37A, March, 2006, pp. 1017-1025.
55. 田艳红，杭春进，王春青，Cu丝超声球焊及楔焊焊点可靠性及失效机理研究，电子工艺技术，2006年第2期(27卷)
56. Ying Ding, Chunqing Wang, Mingyu Li, Weiqiang Wang. In situ TEM observation of microcrack nucleation and propagation in pure tin solder. Materials Science and Engineering B 127 (2006):p62–69
57. Zhenqing Zhao, Chunqing Wang, Mingyu Li, Lei Wang. Nd:YAG laser surface treatment of copper to improve the wettability of Sn3.5Ag solder on copper, Surface & Coatings Technology 200 (2005) 2181–2186 [pdf]
58. 李福泉，王春青，田艳红，孔令超，钎料熔滴与焊盘界面反应及再重熔时的界面组织演变，中国有色金属学报，第15卷第10期：1506-1511，2005年
59. Ying Ding, Chunqing Wang, Mingyu Li, Scanning electron microscope in-situ investigation of fracture behavior in 96.5Sn3.5Ag lead-free solder, Journal of ELECTRON MATER 34 (10): 1324-1335 OCT 2005
60. 计红军，李明雨，王春青，超声引线键合点形态及界面金属学特征，电子工艺技术，26卷第5期，2005年9月:p249-253
61. 周文凡，田艳红，王春青，BGA焊点的形态预测与可靠性优化设计，电子工艺技术，26卷第4期，2005年7月:p187-191
62. 黄毅，王春青，赵振清，SnCu钎料合金镀层钎焊连接机理及界面反应，金属学报，2005;31(8):881-885
63. Zhao Zhengqing, Wang Chunqing, Low Temperature Bonding of LD31 Aluminum Alloys by Electric Brush Plating Ni and Cu Coatings, China Welding, Vol.14 No. 1 May 2005:24-28
64. Hongtao CHEN, Chunqing WANG, Mingyu LI, Yanhong TIAN, Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability, Journal of Materials Science and Engineering, 2005 Vol.21 No.3 P.419-422
65. 吴宜勇，李邦盛，王春青，单原子沉积原理及其应用，电子工业专用设备，2005年第6期：6-10
66. 张威，王春青，光纤固定软钎焊焊点的三维形态模拟，电子学报，2005年5月，33卷，第5期
67. Ding Ying, Wang Chunqing, Li Mingyu and Bang Han-Sur,In-situ SEM observation on fracture behaviors of Sn-based solder alloys, Journal of Materials Science, Vol. 40, No. 8, April 2005: P1993 - 2001
68. Mingyu Li and Chuning Wang. Simulative Design of Pad Structure for High Density Electronic Interconnection, Journal of Materials Science and Technology, Vol.21, No.1, 2005:p63-67
69. Ying Ding, Chunqing Wang, Mingyu Li and Han-Sur Bang, Evolution of deformation near the triple point of grain junctions in Sn-based solders during in situ tensile test, Materials letters, Vol. 59, Issue 6 (2005) P697-700
70. Ying Ding, Chunqing Wang, Li Mingyu and Bang Han-Sur, Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM, Materials Science and Engineering A, Volume 384, Issues 1-2，25 October 2004, P314-323
71. 李明雨，安荣，王春青. 交变电磁辐射下SnPb 共晶钎料在BGA 焊盘上自发热重熔及界面反应，金属学报，2004 (40),10:1093~1098
72. 李明雨，王春青，孔令超，.高桥邦夫.激光加热控制微细焊点钎料熔融方法研究，机械工程学报，2004(40), 10:170~174
73. Hongtao Chen, Chunqing Wang. The Numerical Analysis of the Effects of the Gravity on Solder Joint Formation in SMT, Proceedings of The 4th International Conference on Physical and Numerical Simulation of Materials Processing, 2004, Shanghai
74. Li Mingyu, Wang Chunqing et al. Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Device. ASME Journal of Electronic Packaging, 2004(126):22~25
75. 王晨曦,王春青, 孔令超，Ni/ NiCr 平行微隙焊接接头的形成机理，焊接学报，第25 卷，第4 期，2004 年8 月
76. 张威，王春青，半导体激光器组件封装中光纤的固定方法，半导体光电，2004 年25 卷第2 期：p87-90
77. 李福泉，王春青，田德文，田艳红，SnPb 钎料熔滴与Au/Ni/Cu 焊盘的反应过程，中国有色金属学报，2004年7月，14卷第7期:p1139-1143
78. 王春青，李明雨，田艳红，JIS Z 3198 无铅钎料试验方法简介与评述，电子工艺技术，2004 年第2 期:pp47-54
79. Yanhong Tian, Chunqing Wang, Deming Liu. Thermomechanical Bechavior of PBGA Package during Laser and Hot Air Reflow Soldering. MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2004, (12): 235 –243
80. 张威. 王春青. 孙福江. 钎料量对通孔再流焊焊点强度的影响规律，电子工艺技术，2004 年第一期
81. 丁颖、王春青、田艳红，通孔元件焊点的抗热疲劳性能预测-I. 焊点抗热疲劳能力的实验研究，金属学报，第39卷，第8期，2003年:879-884
82. 丁颖、王春青、田艳红，通孔元件焊点的抗热疲劳性能预测-II. 焊点内部力学响应特征的数值模拟，金属学报，第39卷，第8期，2003年:885-891
83. 丁颖、王春青，板厚影响通孔再流焊点抗热疲劳性能的试验研究，电子工艺技术，2003年第3期
84. Yanhong Tian, Chunqing Wang, Xiaodong Zhang and Deming Liu, Interaction Kinetics between PBGA Solder Balls and Au/Ni/Cu Metallisation during Laser Reflow Bumping, Soldering & Surface Mount Technology, Vol.15 No.2, 2003:pp17-21(Awarded by Emerald Literati Club, 2004 Highly Commended Award)
85. 李福权、王春青、张晓东，倒装芯片凸点制作方法，电子工艺技术，2003 年3 月，24 卷2 期:62-66
86. 杨敏，邹增大，王春青等，气孔缺陷位置对SMT 焊点热疲劳寿命影响的数值分析，中国机械工程，2003，14(8)p708-711
87. Tian, Yanhong; Wang, Chunqing; Ge, Xiushan; Liu, Peter; Liu, Deming, Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes,Materials Science and Engineering: B Volume: 95, Issue: 3 Sep. 1, 2002 pp. 254-262
88. 田艳红、王春青、张哓东，激光加热条件下SnPb 共晶钎料与Au/Ni/Cu 焊盘界面反应动力学，材料科学与工艺，Vol.10 No.2, Jun. 2002:pp136-139
89. 田艳红，王春青. 激光重熔在钎料凸点成形中的应用，电子工艺技术，2002 年，第23 卷第4 期：139-142
90. 田艳红，王春青. 激光与红外重熔对63Sn37Pb/ 焊盘界面微观组织的影响，中国有色金属学报，2002 年，第12 卷第3 期:471-475
91. 田艳红、王春青，微电子封装与组装中的再流焊技术研究进展，焊接，2002 年第6 期：5-9
92. Feng WF; Wang CQ; Morinaga M，Electronic structure mechanism for the Wettability of Sn-based solder alloys，JOURNAL OF ELECTRONIC MATERIALS 2002, Vol 31, Iss 3, pp 185-190
93. Feng WF; Wang CQ; Morinaga M; Yukawa H; Liu Y，Electronic structure calculation for properties of Sn-based solder alloys with the relativistic DV-X alpha method，MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING 2002, Vol 10, Iss 2, pp 121-129
94. Ezaki, H.; Nambu, T.; Ninomiya, R.; Nakahara, Y.; Wang, C.Q.; Morinaga, Estimation of liquidus temperature of Sn-based alloys and its application to the design of Pb-free solder,Journal of Materials Science: Materials in Electronics v 13 n 5 May 2002 Kluwer Academic Publishers p 269-272
95. 冯武锋，王春青，张磊，材料设计的发展新趋势- 材料设计计算方法，材料科学与工艺，Vol.8 No.4 Dec. 2002:pp57-62
96. 田艳红，王春青，激光重熔PBGA 钎料球与Au/Ni/Cu 焊盘界面反应，金属学报，2002;38(1):95-98
97. 杨敏，王春青等，表面组装印刷线路板上焊点信息的自动获取，焊接学报，2001 年第6 期：41-44
98. 丁颖，王春青，PCB 焊点可靠性问题的理论和实验研究进展，电子工艺技术，2001 年第6 期：P231-237
99. 杨敏，王春青等，热循环载荷下SMT 含气孔焊点应力应变的数值模拟，焊接技术，2001 年第5 期：P10-11
100.Li Mingyu, Wang Chunqing and Zhang Lei, Solder bridge mechanism in surface mount technology, Progress in Natural Science, Vol.11, No.3, March, 2001:p221-225 [pdf]
101.田艳红，王春青，钎料球激光重熔温度场数值模拟，焊接学报，2001 年第2 期：P75-78
102.Feng W, Wang, C, Morinaga, M. Quantum computational approach to design Sn-based Pb-free solder alloys in microelectronic mounting and packaging, Advances in Electronic Packaging, Volume 1, 2001, Pages 291-298
103.张磊，李明雨，王春青，细间距器件焊点桥连研究，电子工艺技术，2001 年1 月，第1 期:P10-12
104.王国忠，陈兆年( 冶金所)，王春青( 哈工大)，SMT 焊点间隙和贴片误差自调整作用分析，焊接学报，2000 年第1 期:p71
105.冯武锋，王春青，李明雨，电子元件焊接中的钎料合金研制及设计方法，电子工艺技术，第21 卷，第2 期，2000 年3 月
106.Wang Chunqing, Li Mingyu, Sun Fujiang, THE THERMAL PROCESS OF VACUUM FLUXLESS LASER SOLDERING AND ANALYSIS ON SOLDER SPREADING AND WETTING, Journal of Mechanical Engineering (English letters), 2000
107.Zhao Xiujuan, Wang Chunqing, An Integrated System for Prediction and Analysis of Solder Interconnection Shapes, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, VOL. 23, NO. 2, APRIL 2000"p87-92
108.Wang Chunqing, Zhao Xiujuan, etc., The Design of an Integrated System for Predicting and Analyzing Solder Joint Shape and Reliability in SMT，Acta Metallurgica Sinica, Jan. 2000.69~74
109.Wang Chunqing, Li Mingyu, Numerical simulation of the temperature field in a solder ball under pulsed laser and its effect on the vibration of the solder. Acta Metallurgica Sinica (English Letters), Vol. 13, No. 1, Jan. 2000, 168~172
110.Wang Chunqing, Feng Wufeng, Selecting Cluster Model in Alloy Designing Calculation with Discrete Variational Xa Method, Acta Metallurgica Sinica (English Letters), Vol. 13, No. 1, Jan. 2000, 84~88 [pdf]
111.Guozhong Wang, Zhaonian Chen(SIM), Chunqing Wang(HIT), Solder Joint Geometry of Tin-lead Alloy and Its Application in Electronic Packaging, Trans. Nonferous Met.Soc. China, Vol.9, No.4, 1999
112.Zhao Xiujuan, Wang Chunqing, etc., The Design of an Integrated System for Predicting and Analyzing Solder Joint Shape and Reliability in SMT, CHINA WELDING, Vol. 8, No.1, May 1999. 1~8
113.赵秀娟，王春青等, SMT 焊点三维形态的剖视分析方法, 焊接学报，No. 2, Vol. 20, 1999. 84~89
114.冯武锋，王春青，李明雨，SMD 真空无钎剂激光软钎焊试验研究与机理分析, 电子工艺技术,No.1,1999
115.Guozhong Wang, Zhaonian Chen(SIM), Chunqing Wang(HIT), Computer Simulation of Three Dimensional Castellated Solder Joint Geometry in Surface Mount technology, Modeling and Simulation in Materials Science and Engineering,6(1998):p557-565, UK
116.梁旭文，王春青等，基于润湿识别的SMT 激光软钎焊焊点质量控制研究，机械工程学报，Vol.34, No.5, 1998:p106-110
117.梁旭文，王春青等，激光钎焊中锡铅钎料在PCB 铜导体上的润湿特点, 焊接,No.7,1998
118.Feng Wufeng, Wang Chunqing, etc., Test research and mechanism analysis of vacuum fluxless laser soldering for SMD, Chine welding, Vol.7,1998:p139-147
119.赵秀娟，王春青，PSJS-SMT 软钎焊焊点形态预测集成系统, 焊接学报,Vol.18,1997
120.李明雨，王春青，微连接精密电阻焊机恒流控制方法, 焊接学报,Vol.18,1997
121.王国忠，王春青等，SMT 焊点元件与基板间隙的预测及其对焊点三维形态的影响, 电子工艺技术,No.2,1997
122.Wang Guozhong, Wang Chunqing, An Experimental Study of Effect of Solder Joint Geometry on Thermal Cycle Life in SMT, China welding, Vol.6, No.2, 1997
123.Wang Chunqing, Mechanical Strength Analysis of SMT Solder Joints by Finite Element Method, Welding Journal, June,1997
124.梁旭文，王春青等，表面组装激光软钎焊焊点实时红外辐射信号分析, 焊接学报,Vol.18,1997
125.梁旭文，王春青等，激光加热软钎焊微细焊点动态形成过程的计算机数值模拟, 焊接学报,Vol.18,1997
126.梁旭文，王春青等，SMT 激光软钎焊焊点质量红外传感的计算机数值模拟, 红外与毫米波学报,No.4,1997
127.Wang Chunqing, Mechanical Strength Analysis of SMT Solder Joints by Finite Element Method, China Welding,Vol.5,June,1996
128.王春青等，SMT 焊点形态对热应力分布影响的有限元分析, 电子工艺技术,No.6,1996
129.王国忠，王春青等，片式元件SMT 焊点三维形态计算与试验测量, 电子工艺技术,No.5,1996
130.王春青等，SMT 激光软钎焊焊点质量实时检测系统的研究, 电子工艺技术,No.2,1996
131.王春青，刘爱国等，激光/ 红外法SMT 软钎焊接头缺陷检测, 电子工艺技术,No.1,1996
132.Wang Guozhong, Wang Chunqing etc., Calculation of Three Dimensional Solder Joint Formation in Microelectronics Surface Mount Technology, Acta Metallugica Sinica (English letters),Vol.9,No.4,1996
133.杨敏，王春青，SMT-PCB 上焊点信息的自动图象识别方法研究, 电子信息理论与应用进展, 电子学会,1995
134.王国忠，王春青等，国外微电子表面组装焊点形态问题研究现状, 电子工艺技术,No.3,1995
135.王春青，PCB上焊点信息的自动获取及焊接路径的优化，焊接学报，Vol.16,No.2,1995
136.王春青，姜以宏等，SMT 激光软钎焊自动焊接系统的研究, 电子工艺技术,No.4,1994
137.王春青，微电子焊接与微连接. 电子科技导报,No.4,1995
138.王春青，姜以宏等，表面组装激光软钎焊接头质量的实时检测与控制, 中国机械工程,Vol.4,No.6,1993
139.王春青，姜以宏等，SMT 激光低温钎焊接合部热过程的数值模拟, 中国激光,Vol.A20,No.2,1993
140.王春青，姜以宏等，SMT 激光软钎焊微接合部母材向钎料中溶解的动态行为, 机械工程学报,Vol.29,No.2,1993
141.王春青，PCB上焊点信息自动获取及焊接路径优化, 电子工艺技术,No.5,1993
142.王春青，姜以宏等，软钎焊接头质量实时检测与控制方法研究, 电子工艺技术,No.1,1993
143.王春青，姜以宏等，表面组装激光软钎焊工艺研究, 电子工艺技术,No.5,1992
144.王春青，姜以宏等，微机控制的激光软钎焊装置, 电子工艺技术,No.4,1992
145.王春青，姜以宏等，SMT 激光软钎焊质量监测方法研究, 激光技术,Vol.16,No.2,1992
146.Wang Chunqing, Jiang Yihong, Experimental Investigation and Numerical Simulation of the SMT Laser Microsoldering Thermal Process, Soldering & Surface Mount Technology (Scotland),No.8,1991
147.王春青，姜以宏等，激光软钎焊过程分析, 电子工艺技术,No.3,1989
148.王春青，姜以宏，电阻焊质量实时控制的研究, 焊接,No.10,1987
149.王春青，姜以宏，获得多种波形点焊焊接电流的新方法, 焊接学报,Vol.6,No.2,1985
Low-Temperature-Solderable IntermetallicNanoparticles for 3D Printable Flexible Electronics Low-Temperature-Solderable IntermetallicNanoparticles for 3D Printable Flexible Electronics 10.1016/j.actamat.2018.09.069
Invited Speeches
1.Chunqing Wang*,Ying Zhong, Wei Zhou, Xiaojian Liu, Rong An, Wei Liu, Zhen Zheng,Keynote Speech, 3D Nanocone Array on Cu Substrate and Ag-Cu Alloy Nanopaste Sintering for High Temperature Packaging, 70th IIW Annual Assembly & International Conference, 25-30 June, 2017, Shanghai, China
2. 王春青，纳米Cu6Sn5焊膏：一种低温连接／高温服役的新型封装互连材料，2015中国国际焊料技术论坛， 江苏-苏州，2015年9月17日，特邀报告
3. 王春青，宽禁带半导体功率器件的封装及对电子行业上下游的影响，IPC2014,深圳，2014年11月27日，特邀报告
4.Chunqing Wang, Keynote Speech, High temperature interconnection realized by sintering Sn-based IMC nanopastes at low temperature. 2nd International Conference on Nanojoining and Microjoining (NMJ2014). Switzland. December, 7 - 10, 2014
5.Chunqing Wang, Keynote Speech,High temperature viable interconnection realized by sintering Sn-Cu IMC nanoalloys at low temperature, 67th International Institute of Welding Annual Assembly & International Conference (IIW 2014), Seoul, Korea. July 13 - 18, 2014
6. 王春青，电子封装与组装中微细连接的尺寸效应，IPCWorksASIA 2012，2012年10月30日
7. 王春青，大会报告：电子封装中的科学问题研究，中国半导体行业协会第四届电子封装测试技术与市场研讨会，成都，2006年5月16-17日
8.Chunqing Wang*, Ying Ding. Micro Behaviors of Solder Alloys under In-situ SEM/TEM Tensile Testing , International Symposium on Smart Processing Technology, JAPAN, November 14-15, 2005.Invited Speech
9.Chunqing Wang*, Mingyu Li and Yanhong.Tian,Interconnection Technology in Electronic Packaging and Assembly,Intelligent Technology in Welding and Joining for the 21st Century, International Welding/Joining Conference-Korea 2002.Invited Speech
10. 王春青*，李明雨、田艳红，大会特邀报告：电子封装与组装中的微连接技术，焊接学会全国学术会议，2001 年9 月，天津
11. 王春青，大会特邀报告：微电子封装与组装技术，2001年第六届SMT全国学术会议，2001年10月，上海
12. Keyun Bi, Chunqing Wang (Chair of the Organization Committee). Proceedings of 6th International Conference on Electronics Packaging Technology, Shenzhen, China. August 31-September 2nd, 2005. (IIEEE Catalog Number: 05EX1194, ISBN: 0-7803-9449-6, 742 pages)
Conference paper
1.Void propensity in solder joints on a single copper pad with a grain size spectrum tuned by strain annealing Chongyang Cai; Rong An; Chunqing Wang; Yanhong Tian 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 1612 - 1616
2.Quasi in situ study about growth kinetics of Ag3Sn at the interface of eutectic SnPb/electroplated Ag soder joint in the long-term satellite Xiaoliang Ji; Rong An; Chunqing Wang 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 221 - 225
3. A novel method for bonding strength evaluation Jikai Xu; Chenxi Wang; Xiaoyun Qi; Yongheng Jia; Xiaoliang Ji; Yanhong Tian; Chunqing Wang 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 1598 - 1602
4.The mechanism study of low-temperature brittle fracture of bulk Sn-based solder Qi An; Chunqing Wang; Xiangxi Zhao; Hong Wang 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 1233 - 1237
5.The Fabrication of the Cu/Ni/Cu surface multilayer nano-array and the interconnection with the SAC305 solder Zhen Zheng; Fan Yang; Ludong Yang; Chunqing Wang 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 1623 - 1625
6.Interposer connection reliability using double-side solder bump for board-level vertical interconnection Yue Li; Chunjin Hang; Yanhong Tian; Wei Liu; Chunqing Wang; Xuguang Guo 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 501 - 504
7.Copper-tin reaction and preparation of microsolder joints under high frequency alternating magnetic field Wei Liu; Yiping Wang; Chunqing Wang; Yanhong Tian 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 1592 - 1594
8.Effect of multilayer films and current on IMC formation in solder joints Wei Liu; Yuzhuo Nie; Chunqing Wang; Yanhong Tian 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 1561 - 1563
9.The effect of voids at the Cu3Sn/Cu interface on the failure behavior of the Cu/Sn63Pb37 solder joints under high-speed shear loading Qi Lin; Li Hailong; Chunqing Wang 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 552 - 556
10. Study on preparation and rapid laser sintering process of nano silver pastes Wei Liu; Ronglin Xu; Chunqing Wang; Yanhong Tian 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 1525 - 1528
11. Reliability prediction of different size solder bumps in thermal shock test using FEM Yongheng Jia; Chunjin Hang; Yanhong Tian; Wei Liu; Chunqing Wang; Xuguang Guo; Xiuli Wang 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 580 –583
12. Study on the pre-tinned effect in the electroless tin plating process Zhen Zheng; Zhen Qiao; Wei Zhou; Chunqing Wang 2017 18th International Conference on Electronic Packaging Technology(ICEPT) Year: 2017 Pages: 1568 - 1571
13. Zhen Zheng; Fan Yang; Chunqing Wang. Study of interconnection between Ni nano-array and nano-Ag solder. 2016 17th International Conference on Electronic Packaging Technology(ICEPT) Year: 2016 Pages: 849 - 851
14. Xiaoliang Ji; Rong An; Chunqing Wang; Yanhong Tian. Microstructure of solar cell interconnections by resistance welding. 2016 17th International Conference on Electronic Packaging Technology(ICEPT) Year: 2016 Pages: 776 - 779
15. Wei Zhou; Zhen Zheng; Chunqing Wang. Single crystal copper nanocrystallization and sintered with silver nanoparticles. 2016 17th International Conference on Electronic Packaging Technology(ICEPT) Year: 2016 Pages: 1015 - 1017
16. Chenxi Wang; Jikai Xu; Yannan Liu; Yanhong Tian; Chunqing Wang; Tadatomo Suga.A novel surface humidity controlled bonder for low-temperature wafer bonding. 2016 17th International Conference on Electronic Packaging Technology(ICEPT) Year: 2016 Pages: 893 –896
17. Xiaojian Liu; Chunqing Wang; Zhen Zheng; Wei Liu. Synthesis and characterization of ultra-fine bimetallic Ag-Cu nanoparticles as die attach materials. 2016 17th International Conference on Electronic Packaging Technology(ICEPT) Year: 2016 Pages: 206 –208
18. Ying Zhong; Chunqing Wang; Xiujuan Zhao; Caers, J.F.J.M., "The influence of high melting point elements on the reliability of solder during thermal shocks," in Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th , pp.2162-2167, 26-29 May 2015
19. Lingchao Kong; Zhen Zheng; Rong An; Hailong Li; Mingliang Fu; Yanhong Tian; Chunqing Wang, "Degradation mechanisms of solder joints on printed circuit boards during storage determined by infrared multi-point temperature measurements," in Electronic Packaging Technology (ICEPT), 2015 16th International Conference on , pp.911-914, 11-14 Aug. 2015
20. Fei Shi; Chunqing Wang, "Study on microstructure, texture and thermal properties of LPSO reinforced Mg-Zn-Y(-Gd) alloys," in Electronic Packaging Technology (ICEPT), 2015 16th International Conference on , pp.375-380, 11-14 Aug. 2015
21. Rong An; Huiwen Ma; Hailong Li; Zhen Zheng; Chunqing Wang, "Formation of single phase Cu-Sn IMCs via layer-by-layer electroplating of Cu and Sn metals," in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on , pp.980-984, 12-15 Aug. 2014
22. Rong An; Di Xu; Chunqing Wang, "Parallel-gap resistance welding between gold-plated silver interconnects and silver electrodes in germanium solar cells," in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on , pp.985-988, 12-15 Aug. 2014
23. Chunjin Hang; Yanhong Tian; Chunqing Wang; Hong Wang, "Research on tensile property and creep resistance of electroplating nickel reinforced by A12O3 nanoparticles," in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on , pp.476-479, 12-15 Aug. 2014
24. Xuguang Guo; Yanhong Tian; Shang Wang; Chunqing Wang, "Parallel gap resistance thick wire bonding for vertical interconnection in 3D assembly," in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on , pp.6-9, 12-15 Aug. 2014
25. Rong An; Yanhong Tian; Chunqing Wang, "Effect of modulation structure on the laser-ignited self-propagating behavior of Ti/Al multilayer films," in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on , pp.1530-1533, 12-15 Aug. 2014
26. Keming Zeng; Yujie Li; Jin Chang; Chunjin Hang; Chunqing Wang, "Secondary optical design of LED lamps with high CRI and adjustable CCT," in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on , pp.1472-1476, 12-15 Aug. 2014
27. Jiandong Zhu; Rong An; Chunqing Wang; Yanhong Tian; Guangwu Wen, "A novel method to fabricate AlN-Al2O3 multiphase ceramic layer on WCu alloy," in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on , pp.155-158, 12-15 Aug. 2014
28. Baolei Liu; Yanhong Tian; Shang Wang; Rui Zhang; Xin Zhao; Chenglong Dong; Chunqing Wang, "Rapid formation of Cu-Sn intermetallic compounds by strong electric current," in Electronic Packaging Technology (ICEPT), 2014 15th International Conference on , pp.489-492, 12-15 Aug. 2014
29. Hailong Li; Rong An; Mingliang Fu; Chunqing Wang; Mei Zhu; Rui Zhang, "Effect of high temperature thermal aging on microstructural evolution of Sn3Ag0.5Cu/Cu solder joints," in Electronic Packaging Technology (ICEPT), 2013 14th International Conference on , pp.772-776, 11-14 Aug. 2013
30. Chunjin Hang; Shaopeng Sun; Panpan Lin; Chunqing Wang, "Molecular Dynamics study of thermal conductivity in bismuth telluride thin films," in Electronic Packaging Technology (ICEPT), 2013 14th International Conference on , pp.413-416, 11-14 Aug. 2013
31. Mei Zhu; Rong An; Chunqing Wang; Xingyao Fu, "Laser-induced self-propagating reaction in Ti/a-Si multilayer films," in Electronic Packaging Technology (ICEPT), 2013 14th International Conference on , pp.1227-1230, 11-14 Aug. 2013
32. Chunjing Hang; Jingming Fei; Yanhong Tian; Wei Zhang; Chunqing Wang; Zhao, S.; Caers, J., "The effects of humidity and temperature aging test on flexible packaging LED module," in Electronic Packaging Technology (ICEPT), 2013 14th International Conference on , pp.1126-1129, 11-14 Aug. 2013
33. Hang, Chunjin; Wang, Hong; Fei, Jingming; Wang, Chunqing, "Development of a new die-attach process and related bonding tool for multi-chip LED module," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.1429,1431, 13-16 Aug. 2012
34. Li, Bin; Wang, Chunqing; Liu, Wei; Zhong, Ying; Zhang, Zhixin, "Synthesis of multiferroic Ba0.7Sr0.3TiO3-based thin films for memory devices by chemical solution deposition," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.12,14, 13-16 Aug. 2012
35. Zhu, Jiandong; Wang, Chunqing; Hang, Chunjin; Tian, Yanhong, "Growth and shear strength of intermetallic compounds in Sn-Ag-Cu solder joints," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.40,43, 13-16 Aug. 2012
36. Tian, Yanhong; Wang, Ning; Li, Yang; Wang, Chunqing, "Mechanism of low temperature Cu-In Solid-Liquid Interdiffusion bonding in 3D package," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.216,218, 13-16 Aug. 2012
37. Ji, Hongjun; Li, Mingyu; Wang, Chunqing, "Ultrasonic-induced deformation nanostructures in coarse-grained aluminum wires at room temperature," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.302,305, 13-16 Aug. 2012
38. Han, Leilei; Wang, Chunqing; Hang, Chunjin, "Theoretical study on power factor of Si/Ge multi-layer thermoelectric micro-cooler," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.637,640, 13-16 Aug. 2012
39. Yang, Lei; Wang, Chunqing; Liu, Wei; Tian, Yanhong, "Dynamic model for analyzing the motion of molten solder during self-assembly," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.649,652, 13-16 Aug. 2012
40. Li, Hailong; Wang, Chunqing; Yang, Meng; Wang, Ningning; An, Rong; Xu, Yanjun, "The effect of voids on thermal conductivity of solder joints," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.1061,1064, 13-16 Aug. 2012
41. Tian, Yanhong; Qin, Jingkai; He, Xiaobin; Wang, Chunqing, "Effect of grain orientation on electromigration degradation in lead-free solder joints," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.1080,1082, 13-16 Aug. 2012
42. Hang, Chunjin; Fei, Jingming; Wang, Hong; Wang, Chunqing, "Thermal characterization of high power LED array in aluminum base copper clad laminate package," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp.1425,1428, 13-16 Aug. 2012
43. Zhong Ying; Zhang Wei; Wang Chunqing; Wang Chunyu; Li Bin; , "Preparation and microstructure of functionally gradient diamond/SAC composite solder bumps," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on, pp.1-5, 8-11 Aug. 2011
44. Leilei Han; Chunqing Wang; , "Effect of quantum effects on electrical transport in Si/Ge/Si sandwich structure," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on, pp.1-2, 8-11 Aug. 2011
45. Yanhong Tian; Lina Niu; Chunqing Wang; , "Analysis of Cu6Sn5 grain orientations in Sn3.0Ag0.5Cu lead-free solder joints," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on, pp.1-4, 8-11 Aug. 2011
46. Zeng Chao; Wang Chunqing; Tian Yanhong; Liu Wei; An Rong; Hang Chunjing; , "Characterization of the hot-cutting defects produced by the processing of alumina green tape," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on, pp.1-4, 8-11 Aug. 2011
47. Bin Li; Chunqing Wang; Weiwei Wu; Wei Zhang; Ying Zhong; , "Effect of LaNiO3 electrode on crystallization of BaTiO3 thin films for capacitors prepared by solgel technique," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on, pp.1-4, 8-11 Aug. 2011
48. Lei Yang; Wei Liu; Chunqing Wang; Yanhong Tian; , "Development of a three-dimensional integrated solder ball bumping & bonding method for MEMS devices," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on, pp.1-4, 8-11 Aug. 20
49. Lei Yang; Wei Liu; Chunqing Wang; Yanhong Tian; , "Self-assembly of three-dimensional microstructures in MEMS via fluxless laser reflow soldering," Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on, pp.1-4, 8-11 Aug. 2011
50. Chenxi Wang and Chunqing Wang,Improved Modeling for Solder Joint Geometry and Self-Alignment in Flip Chip Bonding,2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,p747
51. Yanhong Tian, Bo Long,Chunqing Wang,Finite Element Analysis of Electromigration Reliability in Copper Chip Interconnect,2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,p1124
52. Yanhong Tian, Ningning Wang, Chunqing Wang,Shaowei Zhao,Ultrasonic Bondability and Antioxidation Property of Ti/Cu/Ag Metallization on Si Substrate,2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,p305
53. Wei Liu, Chunqing Wang, Lining Sun, Yanhong Tian,Effect of Protection Atmosphere’s Temperature on Morphology of Au-Sn IMCs in Laser Reflowed Micro-solder Joints,2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,p442
54. Leilei Han; Chunqing Wang; , "Advances in thermoelectric microcooling," Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on, pp.1359-1361, 16-19 Aug. 2010
55. Lei Yang, Chunqing Wang, Wei Liu,Yang Li,Study of MEMS Self-Assembly Using Molten Solder Ball,2010 11th International Conference on Electronic Packaging Technology & High Density Packaging,p1302
56. Shihua Yang, Yanhong Tian, Chunqing Wang, Tengfei Huang. Modeling Thermal Fatigue in Anisotropic Sn-Ag-Cu/Cu Solder Joints. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009
57. Rong An, Chunqing Wang, Yanhong Tian. Depiction of the Elastic Anisotropy of AuSn4 and AuSn2 from First-principles Calculations. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009
58. Wei Liu, Chunqing Wang, Lining Sun, Yanhong Tian, Yarong Chen. Effect of Cu Addition in Sn-containing Solder Joints on Interfacial Reactions with Au Foils. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009
59. Yanhong Tian, Shaowei Zhao, Chunqing Wang. Characterization of Ag Nanofilm Metallization on Copper Chip Interconnect and Its Ultrasonic Bondability. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009
60. Guanqun Zheng, Chunqing Wang. Shape and Fatigue Life Prediction of Chip Resistor Solder Joints. 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009
61. Tian Dewen; Wang Chunqing; Tian Yanhong. Numerical simulation of solder spreading and solidification during solder jet bumping process. Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
62. Yang Shihua; Wang Chunqing; Tian Yanhong; Lin Pengrong; Liang Le.Limited β-Sn grain number of miniaturized Sn-Ag-Cu solder joints. Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
63.Ji Hongjun; Li Mingyu; Wang Chunqing; Kim Jongmyung; Kim Daewon. Nanoscale analysis of ultrasonic wedge bond interface by using high-resolution transmission electron microscopy. Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
64. Yanhong Tian, Chunqing Wang, Pengrong Lin, Shihua Yang. Shear Fracture Behavior of Sn3.0Ag0.5Cu Solder Joints on Cu Pads with Differeint Solder Volumes. ICEPT-HDP 2008, Shanghai, July 28-31,2008
65. Rong An, Chunqing Wang, Yanhong Tian. First-principles Study on the Elastic Anisotropy of Au-Sn Intermetallic Compounds. ICEPT-HDP 2008, Shanghai, July 28-31,2008
66. C. J. Hang,I. Lum, J. Lee,M. Mayer, Y. Zhou, C. Q. Wang, S. J. Hong, S. M. Lee.On-line Hardness Characterization of Novel 2-mil Copper Bonding Wires. Proceedings of IPACK2007. July 8-12, 2007, Vancouver, British Columbia, CANADA
67. Wei Zhang, Chunqing Wang, Yanhong Tian, Design of Solder Joint for Self-Alignment in Optical Fiber Attachment Soldering, ICEPT 2007
68. R. An, C. Q. Wang, Y. H. Tian，Elastic Property of Cu3Sn Determined by a First-Principles Calculation on the Basis of its Crystal Substructure. ICEPT 2007
69. Chao Zeng, Chunqing Wang, Yanhong Tian, Lingchao Kong, The Impact of Defect formed in Hot-cutting Process on Reliability of Ceramic Packaging And A Novel Structure Design Concept, ICEPT 2007
70. Yang Shihua, Lin Pengrong, Tian Yanhong, Wang Chunqing, Liang Le and Wang Qian, Effect of Solder Volume on Shear Strength between Sn-3.0Ag-0.5Cu Solder and Cu Metallization, ICEPT 2007
71. Yanhong Tian, Chunjin Hang, Chunqing Wang, Y. Zhou, Evolution of Cu/Al Intermetallic Compounds in the Copper Bump bonds during Aging Process, ICEPT 2007
72. Dewen Tian, Chunqing Wang, Yanhong Tian, A Computational Model of a Molten Solder Droplet Spreading on Orthogonal Pads, ICEPT 2007
73. Wei Liu, Chunqing Wang, Yanhong Tian, Lingchao Kong, Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process. ICEPT 2007
74. Hongjun Ji, Mingyu Li, Younggak Kweon, Woongseong Chang,Chunqing Wang, Observation of Ultrasonic Al-Si Wire Wedge Bond Interface Using High Resolution Transmission Electron Microscope, ICEPT 2007
75. Rong An, Chunqing Wang and Yanhong Tian. Investigation of Tin Atomic Migration of Tin-based Solders with Cluster Model and DV-Xa Method in Electromigration, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China: 829-832
76. Wei Liu, Chunqing Wang. Evolution of AuSnx Intermetallic Components in Laser Reflowed Right-angled Solder Joints During Isothermal Aging Process, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China
77. Yan Bohan, Wang Chunqing, Zhang Wei. The Microstructure of Eutectic Au-Sn and In-Sn Solders on Au/Ti and Au/Ni Metallizations during Laser Solder Bonding Process for Optical Fiber Alignment, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China
78. Dewen Tian, Chunqing Wang, Yanhong Tian, and Hongtao Chen. Prediction of Micro Pitch Motion of a Microsensor Component during Laser Soldering Interconnection Process, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China
79. Chao Zeng, Chunqing Wang. The Research Status of Stress and Failure Analysis in Ceramic Packaging, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China
80. Wei Zhang, Chunqing Wang, Yanhong Tian. Numerical and Experimental Study on Solder Joint Self-Alignment for Optical Fiber Attachment Assembly, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China
81. Hongjun JI, Mingyu LI, Chunqing WANG. Interfacial Characters and Physical Mechanism Investigation of Ultrasonic Wedge Bonds, 7th International Conference on Electronics Packaging Technology (ICEPT2006)August 26 - 29, 2006, Shanghai, China
82. 王春青，田艳红，孔令超，电子封装与组装无铅化应用中的问题，半导体行业协会第四届电子封装测试与市场研讨会，成都，2006年5月16-17日
83. Hongjun Ji, Mingyu Li, Au Tai Kung, Chunqing Wang. The Diffusion of Ni into Al Wire at the Interface of Ultrasonic Wire Bond During High Temperature Storage, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
84. An Rong, Mingyu Li, Chunqing Wang, A New Solder Bumping Technology with Local Induction Heating, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
85. Zhang Wei, Wang Chunqing, Tian Yanhong, Prediction of Solder Joint geometry for Optical Fiber attachment Assembly in Direct-Coupling Applications, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
86. Dewen Tian, Hongtao Chen, Chunqing Wang, Effect of thermal aging on microstructure, shear and mechanical shock failures for solder ball bonding joint. ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
87. Mingyu Li, Hongbo Xu, Chunqing Wang, Han Sur Bang, Hee Seon Bang, IMC Evolution and Reliability of Lead-free Solder Bump Formed by Induction Self Heat Reflow, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
88. Weiqiang Wang, Ying Ding and Chunqing Wang, Molecular dynamics (MD) simulation of uniaxial tension of β-Sn single crystals with nanocracks, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
89. Chunjin Hang, Chunqing Wang, Mingda Shi, Xiaochun Wu, Honghui Wang, Study of Copper Free Air Ball in Thermosonic Copper Ball Bonding, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
90. Wenfan Zhou, Chunqing Wang, Microstructure of Sn-Ag-Cu Lead-free Flip Chip Interconnects during Aging, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
91. Hong Shouyu, Hang Chunjing, Wang Chunqing, Experimental Research of Copper Wire Ball Bonding, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
92. Wei Liu, Chunqing Wang, Mingyu Li, Li Ling, Comparison of AuSnx IMCs’s Morphology, Distribution in Lead-free Solder Joints Fabricated by Laser and Hot Air Reflow Process, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
93. Yarong Chen, Yanhong Tian, Chunqing Wang , Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering, ICEPT 2005, ISBN: 0-7803-9449-6, Aug. 30-Sep. 2, 2005 [pdf]
94. Wei Liu, Chunqing Wang and Mingyu Li, Effect of Laser Input Energy on Wetting Areas of Solder and Formation of Intermetallic Compound at Sn-0.3Ag-0.75Cu/Au Right-angled Joint Interface, 2005 International Conference on Asian Green Electronics, March 15-18, 2005 [pdf]
95. Lei Wang, Chun-qing Wang, Zhen-qing Zhao, Yi Huang, Interfacial Characteristics of Sn3.5Ag Solder on Copper after Nd:YAG Laser Surface Irradiation, 2005 International Conference on Asian Green Electronics, March 15-18, 2005 [pdf]
96. Hongtao Chen, Chunqing Wang and Mingyu Li, Mechanical Shock Testing and Modeling of Lead-free Solder Joint in HD Driver Head Assembly, 2005 International Conference on Asian Green Electronics, March 15-18, 2005 [pdf]
97. Yanhong Tian, Jicheng Gong, Chunqing Wang, Norman Y. Zhou. Finite Element Modeling of Residual Stress and Distortion in Electron Beam Welding of 6061 Aluminum . International Conference on Joining of Advanced and Specialty Materials VII, October , 2004 ASM Materials Solutions Conference, Columbus, USA
98. Zhenqing Zhao, Chunqing Wang, Mingyu Li, Lingchao Kong. A Novel Method to Improve the Wettability of Sn-Ag on Copper by Laser Surface Treatment. 2004 International Conference on the Business of Electronic Product Reliability and Liability, April 27-30,2004, Shanghai, China,pp192
99. Li Fuquan, Wang Chunqing, Solder bump fabricated by Molten Droplet for Electronic Interconnection.2004 International Conference on the Business of Electronic Product Reliability and Liability, April 27-30,2004, Shanghai, China,pp197
100.Hongtao Chen, Chunqing Wang, Mingyu Li. Experimental and FEM Studies of J-lead Solder Joint Reliability. 2004 International Conference on the Business of Electronic Product Reliability and Liability, April 27-30,2004, Shanghai, China,pp200
101.Liu Wei; Wang Chunqing; Li Mingyu; Tian Yanhong; Guan Jingwei. The effects of laser reflow conditions on the formation of intermetallic compounds at Sn3.0Ag0.5Cu Solder/Cu joint interface, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP@#%04, 2004, p 70-73 [pdf]
102.Wei Zhang; Chunqing Wang. Prediction of stand-off height and three-dimensional shape of solder joint in fiber attachment soldering, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP@#%04, 2004, p 151-153 [pdf]
103.Li Fuquan; Wang Chunqing; Zhao Zhenqing; Liu Peter; Liu Deming. Heat transfer analyses of molten droplet solder bumping for electronic interconnection, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP@#%04, 2004, p 336-340 [pdf]
104.Ding Ying, Li Mingyu, Wang Chunqing. Influence of Displacement rate on Deformation Behavior of Pure Tin during Tensile Tests under the SEM.2004 International Conference on the Business of Electronic Product Reliability and Liability, April 27-30,2004, Shanghai, China,pp206
105.Zhengqing Zhao, Chunqing Wang, Mingyu Li, Lingchao Kong, Wettability Characteristics of Sn-3.5Ag Solder on Copper Treated by Nd:YAG Laser, ECODESIGN China 2004, Shanghai, March 22-23, 2004:pp100-105
106.Rong An, Mingyu Li, Chunqing Wang, Lingchao Kong, A Novel Reflow Method for Electronic Area Array Packaging, ECODESIGN China 2004, Shanghai, March 22-23, 2004:pp117-121
107.Mingyu Li,Chunqing Wang. Solder Joints Design Attribute to No Solder Bridge For Fine Pitch Device. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp70 [pdf]
108.Xiaodong Zhang, Chunqing Wang, Yanhong Tian. Design of Laser Scanning Solder Bumping System. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp141-144 [pdf]
109.ChenXi Wang, Chunqing Wang. Parallel Gap Bonding Mechanism of Joint Formation for Thin Film Metallization.Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China. pp 184-186 [pdf]
110.Chenxi Wang, Chunqing Wang. Self-Sensed Inspection of Joint Temperature For Thin-Film Sensors. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp422-426 [pdf]
111.Yanhong Tian, Chunqing Wang, Jicheng Gong. Characteritics of Interfacial Microstructure of PBGA Solder Bump during Multi-Reflow and Aging Processes. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp260 [pdf]
112.Ying Ding, Chunqing Wang, Yanhong Tian. Experimental Research on Reliability of Relfowed Through-Hole Solder Joints. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp 377 [pdf]
113.Fuquan Li, Chunqing Wang, Yanhong Tian. Laser Ink-jet Solder BUmp Fabrication for Electronic Interconnection. Fifth International Conference on Electronic Packaging Technology Proceedings. ICEPT@#%2003. OCT.28-30,2003, Shanghai, China.pp 476 [pdf]
114.Yanhong Tian, Chunqing Wang, C. K. Pater, and Deming Liu, Evolution of Intermetallic Compounds at Interface Between PBGA Solder Ball and Pads During Laser Reflow Soldering,2002 Internal Conference on Electronic Materials and Packaging (EMAP2002),December 3-6, 2002, Kaohsuing, Taiwan
115.Yanhong Tian , Chunqing Wang, (HIT),Deming Liu ( ASM),Thermalmechanical Behavior of PBGA Package During Laser and Hot Air Reflow Soldering, 2002 Internal Conference on Electronic Materials and Packaging (EMAP2002),December 3-6, 2002, Kaohsuing, Taiwan
116.Chunqing Wang*, Mingyu Li and Yanhong.Tian, Invited Lecture:Interconnection Technology in Electronic Packaging and Assembly,Intelligent Technology in Welding and Joining for the 21st Century, International Welding/Joining Conference-Korea 2002
117.Yanhong Tian and Chunqing Wang, Experimental Study on Laser and Hot Air Reflow Soldering of PBGA Solder Ball,Intelligent Technology in Welding and Joining for the 21st Century, International Welding/Joining Conference-Korea 2002
118.王春青*，李明雨、田艳红，大会特邀报告：电子封装与组装中的微连接技术，焊接学会全国学术会议论文集，2001 年9 月，天津
119.Tian Yanhong, Wang Chunqing. INTERFACIAL REACTION BETWEEN PBGA SOLDER BALLS AND Au/Ni/Cu PAD DURING LASER REFLOW BUMPING, Proceedings of IPACK@#%01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, July 8–13, 2001, Kauai, Hawaii, USA
120.W. F. Feng, C. Q. Wang, M. Morinaga, Quantum Approach For The Design Of Sn-Based Solders, ISEPT2001, CPMT IEEE, August 2001
121.Ying Chunyan, Wang Chunqing, An Integrated System for Predicting and Analyzing Solder Interconnection joint, IESPT@#%2001, CPMT IEEE, August 2001
122.Mingyu Li, Chunqing Wang, Wei Zhang,The principle of fluxless soldering in the heat of supersonic modulated laser, IESPT@#%2001, CPMT IEEE, August 2001
123.Lei Zhang, Chun-qing. Wang, and Ming-yu Li. Computer Analysis of Solder Bridge in QFP and BGA. IESPT@#%2001, CPMT IEEE, August 2001
124.Tian Yanhong, Wang Chunqing, FEM Simulation on Thermomechanical Response of PBGA Package during Laser and Hot Air Reflow Bumping, ISEPT@#%2001,CPMT IEEE, August 2001
125.Xiujuan Zhao, Chunqing Wang, etc., Investigation on Bridge in QFP and Fatigue in BGA Based on Simulating Solder Joints Formation, Proceeding of SPIE, The International Society for Optical Engineering, Boston, November,2000
126.Zhao Xiujuan, Wang Chunqing, etc., Automatic Finite Element Simulating System of Solder Joint Formation, Conference on Intelligent Systems in Design and Manufacturing II, Proceeding of SPIE, The International Society for Optical Engineering, Boston, Sept. 1999
127.赵秀娟, 郑冠群, 王春青, SMT 焊点形态预测的可视化处理, 第九届全国焊接会议论文集，2-590~593, 1999, 天津
128.冯武锋，王春青，微组装无钎剂钎料真空激光加热铺展润湿行为, 第九届全国焊接会议论文集，2-594~597, 1999, 天津
129.李明雨, 王春青, 孙福江, 低真空下激光加热Sn-Pb 钎料润湿铺展热过程特性, 第九届全国焊接会议论文集，2-586~589, 1999, 天津
130.王春青，李明雨，无钎剂加压钎焊结合机理研究, 机械工业出版社, 焊接学会论文集,1997
131.王春青，王金铭，片式元件接头热应力有限元计算，中国电子学会焊接专业委员会第五届学术会议，1995
132.王春青，陈志翔，激光软钎焊PCB 焊点定位及焊接路径规划，中国电子学会焊接专业委员会第五届学术会议，1995
133.王春青，李明雨，适用于微连接的精密电阻钎焊微机控制器，中国电子学会焊接专业委员会第五届学术会议，1995
134.王春青，微电子焊接技术的发展，中国电子学会，电子学科跨世纪优秀人才学术讨论会论文集，1994 年12 月
135.王春青，焊接学科研究的新领域- 微连接，中国电子学会焊接专业青年委员会第一学术会议，1994
136.王国忠，王春青等，SMT 焊点缺陷及检测技术国内外研究动态，中国电子学会焊接专业青年委员会第一学术会议，1994
137.梁旭文，王春青等，SMT 激光软钎焊加热方法对焊点质量的影响，中国电子学会焊接专业青年委员会第一学术会议，1994
138.王春青，姜以宏等，SMT 激光软钎焊过程自动化系统的研究，中国电子学会第二届表面安装技术与片式元件学术研讨会论文集，1993 年12 月，西安
139.梁旭文，王春青等，SMT 激光软钎焊自动焊接系统的研究，中国电子学会第二届表面安装技术与片式元件学术研讨会论文集，1993 年12 月，西安
140.王春青，仲田周次，接合界面温度测定方法，日本溶接学会全国大会讲演概要，第41 集，1987 ：407
141.王春青，仲田周次，接合部温度上升及形成过程观察，日本溶接学会全国大会讲演概要，第41 集，1987 ：408
142.Wang Chunqing, Jiang Yihong, Study on Real Time Quality Control of Resistance Spot Welding, The International Symposium of the JIW,No.3,1986
Authorized Patents
1, ZL **.9, 超声激光无钎剂软钎焊方法＊, 王春青;李明雨;冯武峰;孙福江;张磊
2, ZL**3.3, 高频电磁辐射钎料微凸台重熔互连方法／, 李明雨;王春青
3, ZL **.2, 用激光熔化合金钎料丝直接制作凸点的方法＊, 王春青;李福泉;田艳红
4, ZL**6.6, 双电热丝熔切法锡球制备机＊, 孔令超;王春青;李明雨;程刚
5, ZL**7.0, 双电热丝熔切直接钎料凸点制作方法＊, 孔令超;王春青;李明雨;程刚
6, ZL**6.1, 微小钎料合金焊球的制作装置及方法＊, 王春青;田德文;孔令超;田艳红
7, ZL**1.6, 制造LED芯片与热沉直接封装的散热组件的方法＊, 王春青;孔令超;田艳红
8, ZL**0.X, 单束激光辅助LED芯片与热沉直接钎焊的方法＊,王春青;孔令超;田艳红;杨罡
9, ZL**9.7, 双束激光辅助LED芯片与热沉直接键合的方法(已转让天津卓辉)＊／, 王春青;田艳红;孔令超
10, ZL**0.4, 一种印制电路板虚焊点的红外检测方法／, 周双锋;孔令超;刘战捷;王春青
11, ZL**1.1, 单基板多芯片组大功率LED封装一次键合方法＊, 王春青;杭春进
12, ZL**8.7, 光学透镜白光LED的封装工艺＊, 杭春进;王春青
13, ZL**4.4, LED多芯片吸嘴＊, 王春青;杭春进
14, ZL**6.9, 面向MEMS立体封装和组装的锡球凸点键合及质量检测方法＊, 王春青;杨磊;刘威;田艳红
15, ZL**0.3, 植球键合机的锡球供料装置＊, 王春青;杨磊;刘威;田艳红
16, ZL**3.2, 检测电路板焊点可靠性的红外测温检测法／, 孔令超;田艳红;王春青;杭春进;刘威
17, ZL**9.6, 采用红外多点测温热阻法检测电路板焊点可靠性的检测系统／, 孔令超;田艳红;王春青;刘威;安荣
18, ZL**2.9, 扫描式薄膜图形激光转移方法＊, 王春青;刘威;田艳红;孔令超
19, ZL**1.6, 一种钙钛矿结构陶瓷溶胶的制备方法＊, 王春青;李彬;田艳红;王宁;孔令超
20, ZL**0.8, 基于钎料球激光重熔工艺的MEMS自组装方法＊, 王春青;杨磊;刘威;田艳红
21, ZL**0.4, 纳米金属间化合物焊膏及其制备方法＊, 王春青;钟颖;杭春进
22, ZL**6.2, 一种采用纳米金属间化合物颗粒制备低温互连高温服役接头的方法＊, 王春青;钟颖;杭春进
23, ZL**6.8, 一种基于引线键合的MEMS自组装过程的限位方法＊, 王春青;杨磊;刘威;田艳红;王增胜
24, ZL**6.3,一种可提高导线与焊盘焊接效率及可靠性的手工电烙铁头／, 刘威;王春青;田艳红;安荣;杭春进
25, **1, 一种大功率高显色性可调光的LED灯, 李宇杰;杭春进;孙江燕;王春青;常进;刘晓庆;
26, ZL**5.8, 一种垂直互连双面凸点转接板制造过程的辅助装置＊gf, 王春青；田艳红；吴伟伟；刘宝磊
27, ZL**18, 一种低温快速连接活化金属表面与微纳米连接材料的方法－, 郑振;周炜;王春青*
28, **0.8, 热-超声-电磁复合场调控金属间化合物生长实现芯片高可靠立体互连的方法, 田艳红;刘宝磊;孔令超;杭春进;王春青*
29, **1.X, 硅/金属含能调制膜诱导反应制备高温服役低电阻接头的方法, 安荣;孔令超;王春青;田艳红;郑振*
30, **6.X, 一种制备Ag-Cu-Ti纳米合金焊料的方法, 王春青;刘晓剑*
31, ZL**9.7, 一种使用微纳米级金属颗粒填充Sn基焊料实现电子组件高温封装的方法, 刘威;郑振;王春青*
32, ZL**0.5, 一种用于电子模块高温封装微纳米铜颗粒填充Sn基焊膏及其制备方法, 郑振;刘威;王春青*
33, ZL**8.2, 一种水下LED照明灯具防水密封装置, 李宇杰; 常进; 刘晓庆; 杭春进; 王春青;
34, ZL**7.8, 一种水下电器电线过孔防水密封装置, 李宇杰; 刘晓庆; 常进; 杭春进; 王春青;
35, CN**1.4, 一种大功率高显色性可调光的LED灯, 李宇杰;杭春进;孙江燕;王春青;常进;刘晓庆;邱东阳;汪洋;
36, CN**2.2, 一种使用激光前向转印具有特定晶粒取向和数量薄膜诱发金属间化合物生长的方法, 刘威;王春青;田艳红;安荣;郑振;
37, CN**0.6, 一种采用多层微米、亚微米薄膜快速制备可高温服役全IMC微焊点的方法, 刘威;王春青;田艳红;
38, CN**9.6, 一种辅助手动晶圆键合装置, 王晨曦; 许继开; 田艳红; 刘艳南; 曾小润; 王春青;
39,CN**3.4,一种压力可调可用于气体保护下的热压键合夹具, 王晨曦; 许继开; 田艳红; 王春青;
40.CN**8, 测量表面形貌检测双层及多层薄膜间内部缺陷的方法, 王晓婷，王春青
申请专利
1. CN**9, 投射式无损检测薄膜间内部缺陷的红外热像装置及方法, 王晓婷，王春青，2016.11.18，2017.05.17
2. CN**1, 一种基于局域电沉积的引线键合焊点结构的制备方法, 郑振; 王春青; 孔令超; 安荣，2017.12.19，2018.04.20
3. CN**2, 一种基于快速局域电沉积的引线键合方法, 郑振; 王春青; 孔令超; 刘威，2017.12.19，2018.05.18
4. CN**4, 一种扩展服役工作温度范围的组合合金软钎焊焊接结构的制备方法, 王春青;安琪;籍晓亮;赵厢汐，2017.12.21，2018.05.11
5. CN**6, 一种在线无损监测锡及其合金发生低温相变的方法, 王春青;籍晓亮;安琪;赵厢汐，2017.12.22，2018.05.23
6. CN**1, 一种测定锡及锡合金样品中白锡转变为灰锡比例的方法, 王春青;赵厢汐;籍晓亮;安琪，2018.01.22，2018.07.20
7. CN**3, 一种多用途电感-电容一体化结构, 王春青；梁新宇；石宇皓；石成杰，2018.05.28，2018.11.06
8. CN**6，一种单相纳米银铜合金固溶体焊膏及其制备方法，王春青，郑振，刘威，2018.11.28，2019.02.15
9.CN**7，一种采用单相纳米银铜合金焊膏制备低温连接高温服役接头的方法，王春青，郑振，刘威，2018.11.28，2019.03.29
教学奖 Teaching Award
电子封装技术新专业建设的研究与实践，黑龙江省高等教育教学成果二等奖，2013年
科技奖 Scientific and technological awards.
一种印刷电路板虚焊点的红外检测方法，中国专利优秀奖，2017年
电子封装中的微连接基础问题研究，黑龙江省科学技术二等奖，2015年
面向MEMS立体封装和组装微锡球激光键合工艺及设备，中国机械工业科学技术奖二等奖，2014年
SMT激光软钎焊过程自动化及质量控制，航空航天工业部科技进步二等奖，1998年
电极位移法点焊质量微机自适应控制装置的研究，航空航天工业部科技进步二等奖，1991年
智能化激光微焊接技术，电子工业部科学技术三等奖，1996年
SMT激光软钎焊高可靠性钎料膏，航空航天工业部科技进步三等奖，1998年
社会工作
中国电子学会先进工作者，2017年
国家半导体照明工程研发及产业联盟十年贡献奖，2014年
电子封装技术突出贡献奖，中国电子学会电子制造与封装分会，2009年
第18届电子封装技术国际学术会议在哈尔滨成功举办
2017年8月16至19日，由中国电子学会、中国科学院微电子研究所、国际电气电子工程师联合会电子元件封装和生产技术学会（IEEE-CPMT，技术主办）、哈尔滨工业大学主办，中国电子学会电子制造与封装技术分会、哈尔滨工业大学先进焊接与连接国家重点实验室承办的第十八届电子封装技术国际会议（The 18th International Conference on Electronics Packaging Technology, ICEPT 2017）在中国哈尔滨太阳岛花园酒店举行，来自美国、英国、奥地利、法国、德国、荷兰、瑞典、日本、韩国、新加坡、马来西亚、印度、中国大陆、中国香港、中国台湾等近20个国家和地区的400余名专家学者、工业界代表参加大会，交流电子封装技术领域的关键技术和最新进展。
8月16日上午的开幕式由大会共主席荷兰代尔夫特理工大学张国旗教授主持。首先由国际电气电子工程师联合会电子元件封装和生产技术学会主席Jean Trewhella和大会主席、中国科学院微电子研究所所长叶甜春教授，分别代表IEEE-CPMT学会和ICEPT大会委员会向大会荣誉主席、中国电子学会电子制造与封装技术分会电子封装分会荣誉理事长毕克允教授颁发纪念奖牌，以表彰其多年来对ICEPT会议的发展建设作出的杰出贡献。随后大会主席叶甜春教授讲话宣布会议开幕。
开幕式之后，IEEE-CPMT主席Jean M. Trewhella女士、香港中文大学C.P. Wong教授、美国佐治亚理工学院封装研究中心主任Rao R Tummala教授、日月光高级技术顾问William Chen先生、中国JCET的Ming Liu博士、日本的Tadatomo Suga教授和Katsuaki Suganuma教授等14位国内外专家作大会特邀报告。荷兰Delft理工大学的张国旗教授、IEEE-CPMT前任主席、香港科技大学的Ricky Lee教授、美国Lamar大学的樊学军教授、哈尔滨工业大学王春青教授共同主持了大会。
第19届电子封装技术国际学术会议在中国上海召开
第十九届国际电子封装技术会议（ICEPT 2018）于2018年8月8日至11日在中国上海隆重召开。此次会议由中国科学院微电子所、国际电气电子工程师协会电子封装学会（IEEE-EPS）和中国电子学会电子制造与封装技术分会（CIE-EMPT）主办，华进半导体封装先导技术研发中心有限公司协办。
8月9日上午9点，ICEPT 2018正式拉开帷幕，大会主席、中科院微电子研究所叶甜春所长致开幕词。随后国际电气电子工程师协会电子封装学会主席Dr.Avram Bar-Cohen为大会做了开篇报告。大会期间，来自海内外学术界和工业界的专家、学者和研究人员围绕先进封装、应用可靠性、制造、设备和自动化、射频，高速I/O，信号/电源完整性、MEMS和新兴技术、互连技术、材料与工艺、热/机械模拟和表征、光电子和显示、功率电子等十个主题展开了深入研讨，共同交流电子封装与制造技术的新进展和新思路。
ICEPT作为国际上最著名的电子封装技术会议之一，得到了中国电子学会、中国科协的高度评价，已成为国际电子封装领域四大品牌会议之一。本次会议共收集到来自世界各地学术界与产业界的500余篇高质量学术论文，进行了上百场演讲，报告人与听众广泛和深入地进行了学术和技术交流，也为青年科研人员和学生提供了相互学习交流的平台。
第20届电子封装技术国际学术会议将在2019年8月在香港举行
第20届电子封装技术国际学术会议将在2019年8月在香港举行，详细请浏览网站：www.ICEPT.org
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哈尔滨工业大学材料科学与工程学院研究生考研导师简介-王春青
本站小编 Free考研网/2019-05-25
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