本课程主要介绍微米/纳米先进制造技术，包括微电子制造的单项工艺及其集成技术、微电子机械系统(MEMS)和纳米加工技术等。主要内容有：微米/纳米制造技术的现状和展望、半导体衬底、真空科学和等离子体，各种单项微电子加工工艺，如扩散、热氧化、离子注入、光学和非光学光刻、刻蚀、物理淀积、化学气相淀积、外延生长等，以及各种单项工艺的集成技术，如器件隔离、接触和金属化、CMOS、MOSFET技术和硅双极型工艺技术，并初步介绍微电子机械系统(MEMS)和纳米加工技术。 本课程是双语教学，主要课本是美国Campbell教授撰写的微电子制造科学原理与工程技术（英文版），通过本课程的学习，使学生了解和掌握微电子制造的单项工艺及其集成技术、微电子机械系统(MEMS)和纳米加工技术等，并使学生掌握本课程的专业英语词汇，锻炼学生的专业英语自学能力和表达能力。

This course will introduce the advanced micro/nano fabrication technology. Including unit processes of microelectronic fabrication, MEMS and nano fabrication technique. The main contents are: Status and prospects of micro/nano fabrication technology, semiconductor substrates, vacuum science and plasmas. Several unit processes of microfabrication like diffusion, thermal oxidation, ion implantation, optical and nonoptical lithography, etching, physical deposition, chemical vapor deposition and epitaxial growth. Process integration of these unit processes for example CMOS technique and silicon bipolar technique, microelectro mechanical systems (MEMS) and some nano fabrication technologies will be introduced. This course is bilingual. The book of Stephen A. Campbell, “The Science and Engineering of Microelectronic Fabrication” will be used. Through this course, knowledge of unit processes of microelectronic fabrication, MEMS and some nano fabrication technique will be introduced. After this course, students will be request to mastery English glossaries of micro/nano fabrication technologies. The ability of self- learning and presentation in English of students will be exercised