张洪潮
院系：机械工程学院
办公电话：**
电子信箱：hongchao18@163.com
更新时间：2012-3-13
其他专业：无



个人简介
1989年于丹麦工业大学机械制造专业获博士学位；
1990年8月―1995年8月在美国德克萨斯理工大学，助理教授
1995年9月- 2000年8月在美国德克萨斯理工大学，副教授；
1998年4月―1998年5月应邀赴瑞士联邦理工学院机械工程系短期访问，客座教授；
1998年6―1998年7月应邀赴清华大学机械工程学院短期访问，客座教授；
1998年1月―1998年8月应邀赴丹麦工业大学机械工程学院短期访问，客座教授；
2000年―2006年任美国德克萨斯理工大学先进制造技术应用与研究中心主任；
2000年至今任美国德克萨斯理工大学工业工程系教授；
2006年5月―2010年5月应邀赴合肥工业大学，任****讲座教授。
2010年6至今任大连理工学 国家 “****” 特聘教授, 机械工程学院教授、博导。目前担任国家973项目“机械装备再制造的基础科学问题”（2011-2016）的首席科学家一职。


社会兼职
国际生产工程研究院 (CIRP)会员；
美国机械工程师协会 (ASME) FELLOW；
美国电气和电子工程师协会 (IEEE) 会员；
工业工程师学会 (IIE) 高级会员；
制造工程师学会 (SME) 高级会员；
美国工程教育学会 (ASEE) 会员；
国际设计与流程学会 (SDPS) 奠基成员；
《International Journal of Sustainable Engineering》编委
《International Journal of Sustainable Manufacturing》编委
《International Journal of Advanced Manufacturing Technology》编委会顾问
《IEEE Transactions on Components, Packaging, and Manufacturing Technology》客座编辑
《IEEE Transactions on Robotics and Automation》、《IIE Transactions》客座编辑.


研究领域（研究课题）
研究领域
主要研究领域和方向: 可持续设计与制造, 全生命周期分析,绿色制造,低碳制造, 机械装备再制造.
（最近承担的研究课题)：
1.CMMI - National Science Foundation，An Energy Factor Based Energy Saving Design Approach Through Total Product Life Cycle；
2.EAGER - National Science Foundation (collaborate with Arizona State University），A Supercritical Fluids Material Process Model for Recycling of Printed Circuit Boards ；
3. NIST National Institute of Standards and Technology，A Unified Sustainability Measure Matrix for Electronic Industry；
4.College of Engineering Texas Tech University，End-of-Life Pathways for Electronics – Comprehensive Case Studies；
5.Image Microsystems Inc., Austin, Texas，Collaborative research on Sustainable Manufacturing and Reverse Logistics；
6.ATC Logistics and Electronics, Inc.，Life Cycle Analysis for End-of-Life Set-top-box Refurbishing and recycling；
7.National Science Foundation of China (NSFC) Co-PI with Chinese research partners in China，International Collaboration on Sustainable Manufacturing；
8.Image Microsystems, Austin, Texas，Reverse Logistic Problems for Plastic Recycling；
9.National Science Foundation (Co-PI with PI from UTPA)，Application of ER Property of Carbon Nano-Tubes in Conductive Adhesives to Improve Conductivity, Reliability and Product Disassembly；
10.National Science Foundation (PI, with four industrial Co-PIs)，GOALI: A Reverse logistic Business model for end-of- life electronic product recovery and recycling；
11.Advanced Research Program/ Advanced Technology Program of the Texas Higher Education Coordinating Board (PI)，A Prototype Model of Printed Circuit Boards Recycling Process；
12.Image Microsystems (PI)，End-of-Life Dell Computers Recovery and Recycling Management；
13.National Science Foundation (PI, collaborate with Che. Eng. and Dept. of Chemistry, TTU)，Exploratory Research: An Alternative Process Model For Printed Circuit Boards Recycling+ REU；
14.Teaching, Learning, and Technology Center Texas Tech University，Development of an Internet- Based Curriculum on Manufacturing Education for 21st Century；
15.Technology Development and Transfer program of the Texas Higher Education Coordinating Board (PI)，An Innovative Management System for End-of-Life Electronic Product Disassembly and Recycling。
16.2011年国家973项目“机械装备再制造的基础科学问题”相关科研工作

硕博研究方向
1.高端数控机床的低碳制造
2.基于传统金属切削的能耗模型
3.机械装备（含工程机械、中重型载重工具）的再制造
4.纳米制备过程的能耗模型
5.基于环境、社会及经济的三维可持续量化计算标准
6.企业的可持续力量化及测量
7.面向再制造的绿色环保清洗技术
8.面向全寿命周期的产品节能设计

出版著作和论文
出版著作：
1.Advanced Tolerancing Techniques (editing), John Wiley and Sons, Inc., New York, p. 588 1997 (H.C. Zhang).
2.Computerized Manufacturing Process Planning Systems, Chapman and Hall, p. 326, London, 1993 (H.C. Zhang and L. Alting).

共发表学术论文150余篇，今年来主要论文有：
[1]H. C. Zhang, & H. Li, “An Energy Factor Based Systematic Approach to Energy-saving Product Design,” Annals of the CIRP, Vol. 60/2010, pp.183-186.
[2]John Carrel, Hong-Chao Zhang, and Hua Li, “Review and future of Active Disassembly for Electronics Products,” the International Journal of Sustainable Engineering, Vol.2, No.4, pp. 252-264, 2009.
[3]Hua Li, Hong-Chao Zhang, and John Carrel, “Use of an Energy-Saving Concept to Assess Life-Cycle Impact in Engineering,” the International Journal of Sustainable Manufacturing, Vol. 2, No. 1, pp. 99-111, 2009.
[4]John Carrell, Derrick Tate, Shiren Wang, and Hong-Chao Zhang, “Shape Memory Polymer Snap-Fits fro Active Disassembly,” Journal of Cleaner Production, 2011, in press.
[5]Xueqing Qian, Hong-chao Zhang, “Design for Environment: An Environmentally Conscious Analysis Model for Modular Design” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 32, No. 3, pp.164-175, 2009.
[6]Jianzhi Li, Hong-Chao Zhang, Zhangxi Lin, “Asymmetric negotiation based collaborative product design for component reuse in disparate products,” Computers and Industrial Engineering, 2009, Vol. 57, No.1, pp.80-90.
[7]Lianzhi Li, Hong-Chao Zhang, Miguel A. Gonzalez,Steven Yu, “A multi-objective fuzzy graph approach for modular formulation considering end-of-life issues,” International Journal of Production Research, Vol.46, No. 14 July, pp.4011 -4033,2008.
[8]J. Li, Z. Wu, H.C. Zhang, “Application of Neural Network on Environmental Impact Assessment Tools. The International Journal of Sustainable Manufacturing,” Vol. 1, Nos. ?, pp.100-121, 2008.
[9]J. Li, H.C. Zhang, M. Gonzalez, S. Yu, “A Multi-objective Fuzzy Graph Approach for Modular Formulation Considering end-of-life Issues,” The International journal of Production Research Vol. 46, No. 14 pp. 4011-4033, 2008.
[10]C. Yuan, H. C. Zhang, G. B. McKenna,C. Kozeniewski, “Experimental Studies on Cryogenic Recycling of Printed Circuit Board,” The International Journal of Advanced Manufacturing Technology, Vol. 34, No. 7-8, pp. 657-666, 2007.
[11]D. Xiang, P. Meng,J. Wang, G. Duan, H. C. Zhang, “Printed Circuit Board Recycling Pocess and Its Environmental Impact Assessment,” The International Journal of Advanced Manufacturing Technology, Vol. 34, No. 9-10, pp. 1030-1036, 2007.
[12]K. Jin, H.C. Zhang, “A decision support model based on a reference point method for end-of-life electronic product management,” The International Journal of Advanced Manufacturing Technology, Vol. 31, No. 11-12, pp. 1251-1259, 2007.
[13]Q. Ke, H.C. Zhang, G. Liu, B. Li, “Energy-saving optimal design based on transfer function,” The proceeding of The17th CIRP International Conference on Life Cycle Engineering, May 2010, Hefei, pp. 93-95.
[14]C. Fan, H.C. Zhang, “A review of sustainable manufacturing measurement from product life cycle perspective,” Proceeding of The17th CIRP International Conference on Life Cycle Engineering, May 2010, Hefei, pp. 408-412.
[15]John Carrell, Hong-Chao Zhang, Derrick Tate, Bingbing Li, and Chengcheng Fan, “Design and Analysis of Shape Memory Polymer Snap-Fits for Active Disassembly,” 17th CIRP International Conference on Life Cycle Engineering, 19-21 May 2010: Hefei, Anhui, P.R. China, 2010.
[16]John Carrell, Derrick Tate, and Hong-Chao Zhang, “Robust Analysis of Active Disassembly,” International Symposium on Sustainable Systems and Technology, 19-21 May 2010: Washington, D.C. USA. 2010.
[17]John Carrel and Hong-Chao Zhang, “Review of Current End-of-Life Options for Electronics and Future Automatic Disassembly Options with Shape Memory Materials with Carbon Nano-tubes for Electronics,” Proceedings of The15th CIRP International Conference on Life Cycle Engineering, March 2008, Sydney, pp. 470-475.


在读学生人数
现指导博士生4名（中美两地），硕士生7名。

毕业学生人数
30名硕士生，25名博士生。