王桂莲，硕士生导师，上海交通大学工学博士，中共党员。
从事专业：电子信息工程
电话： 邮箱：wglwrc2016@126.com

研究方向
MEMS传感器,微电子封装，有限元分析等

个人简介
王桂莲，女，博士，讲师，毕业于上海交通大学，现于上海工程技术大学电子信息系从事教学和科研工作。曾参与了国家863计划项目、国家自然科学基金项目等科研项目的研究工作，在相关领域国内外学术期刊及国际学术会议上发表SCI论文近20篇，申请了国家发明专利4项。



研究成果
[1]Guilian Wang, Qian Nan, Guifu Ding,Heat transfer enhancement in microchannel heat sink with bidirectional rib,International Journal of Heat and Mass Transfer,Vol. 136, 597-609, 2019. (SCI二区收录)
[2]Guilian Wang, C, Rui Liu, Jiangbo Luo, Di Niu, Junhong Zhao, Xiaolin Zhao and Yan Wang. Design, simulation and fabrication of a flexible bond pad (FBP) with hollow annular protuberance to improve the thermal fatigue lifetime for Through Silicon Vias (TSVs), Journal of Micromechanics and Microengineering, Vol. 24, 125078, 2014. (SCI收录)
[3] Guilian Wang, Di Niu, Fuqiang Xie, Yan Wang, Xiaolin ZhaoandGuifu Ding.Experimental and numerical investigation of a microchannel heat sink (MCHS) with micro-scale ribs and grooves for chip cooling, Applied Thermal Engineering, Vol. 85, pp. 61-70, 2015. (SCI二区收录)
[4] Guilian Wang, Dawei Yang, Yan Wang, Di Niu,Xiaolin Zhao and Guifu Ding. Heat Transfer and Friction Characteristics of the Microfluidic Heat Sink with Variously-Shaped Ribs for Chip Cooling, Sensors, Vol.15，pp. 9548-9562，2015. (SCI收录)
[5] Guilian Wang, Guifu Ding and Xiaodan Miao.On-resistance reduction of vertical double diffusion metal oxide semiconductor devices with external stress, Micro Nano Letter, 2016 (SCI收录)



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