本课程讲解涉及微机电系统（MEMS）设计的方法、理论和技术，包括MEMS制作工艺和封装技术、MEMS器件的建模和模拟、相关电子线路与系统。详细地介绍了利用集总参数方法、弹性力学和结构力学方法、能量分析法对MEMS器件进行建模、模拟和分析的方法；同时对微系统设计所涉及的能量耗散问题和流体力学系统、电路、噪声和封装问题等进行了分析和介绍。通过应用实例研究，详细介绍了压阻式压力传感器、电容式加速度计、静电投影显示器、压电速率陀螺仪、DNA扩增芯片和气体传感器等器件和系统的设计和制作。

The method, theory and technology of Microsystem design, which includes MEMS fabrication process, encapsulation technology, the simulation of MEMS device, relative electronic circuit and system, is introduced in this Course. The course will first present the model, simulation and analysis of MEMS devices that use lumped parameter method, elasticity and structure mechanics, energy analysis method in detail. Then, it analyses micro system problems in energy dissipation, fluid dynamics, circuits, noise and encapsulation etc. Lastly, it will give some MEMS design and fabricate examples that involve piezoresistive pressure transducer, capacitive accelerator, electrostatic projection display, piezoelectricity rate gyroscope, PCR chip etc.