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Manipulation and simulations of thermal field profiles in laser heat-mode lithography_上海光学精密机械研究所

上海光学精密机械研究所 免费考研网/2018-05-06

外文题目: Manipulation and simulations of thermal field profiles in laser heat-mode lithography
作者: Wei, Tao; Wei, Jingsong; Wang, Yang; Zhang, Long
刊名: J. Appl. Phys.
年: 2017 卷: 122 期: 22 文章编号:223107
英文关键词:

PHASE-CHANGE MATERIALS; NANO-IMPRINT LITHOGRAPHY; SCANNING PROBE LITHOGRAPHY; NANOIMPRINT LITHOGRAPHY; PATTERN FABRICATION; BEAM LITHOGRAPHY; CHANGE MEMORY; SOLAR-CELLS; THIN-FILMS; METASURFACE
英文摘要:
Laser heat-mode lithography is a very useful method for high-speed fabrication of large-area micro/nanostructures. To obtain nanoscale pattern structures, one needs to manipulate the thermal diffusion channels. This work reports the manipulation of the thermal diffusion in laser heat-mode lithography and provides methods to restrain the in-plane thermal diffusion and improve the out-of-plane thermal diffusion. The thermal field profiles in heat-mode resist thin films have been given. It is found that the size of the heat-spot can be decreased by decreasing the thickness of the heat-mode resist thin films, inserting the thermal conduction layers, and shortening the laser irradiation time. The optimized laser writing strategy is also given, where the in-plane thermal diffusion is completely restrained and the out-of-plane thermal diffusion is improved. The heat-spot size is almost equal to that of the laser spot, accordingly. This work provides a very important guide to laser heat-mode lithography. Published by AIP Publishing.


文献类型: 期刊论文
正文语种: English
收录类别: SCI
DOI: 10.1063/1.5002575


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