Ricky Shi-wei LEE
李世瑋
PhD in Aeronautical and Astronautical Engineering
Purdue University, 1992

Acting Dean
Systems Hub, HKUST (Guangzhou)

Senior Advisor to the Vice-President for Research and Development

Chair Professor
Department of Mechanical and Aerospace Engineering

Executive Director of Shenzhen Platform Development Office

Director of Additive Manufacturing for Microelectronics & Microsystems Laboratory

Director of Electronic Packaging Laboratory

Director of HKUST Foshan Center for Technology and Commercialization

Director of HKUST Foshan Research Institute for Smart Manufacturing

Director of HKUST LED-FPD Technology Research and Development Center at Foshan



(852) 2358 7203
rickylee@ust.hk
Room LSK7004
Personal Web

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Google Scholar
0y5312YAAAAJ

ORCID
0000-0002-7706-522X

Scopus ID
8425908400




Research Interest Publications Projects Teaching Assignment RPG Supervision Space used




Research Interest

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Electronic packaging
Optical fibers and light-emitting diode (LED) packaging
Microelectromechanical systems (MEMS)
Lead-free soldering
Computational modeling



Publications

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All Years 396 2022 0 2021 6 2020 7 2019 11 2018 24 2017 12 2016 336

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2021 6

Characterization And Evaluation Of 3D-printed Connectors For Microfluidics
Micromachines, v. 12, (8), August 2021, article number 874
Xu, Qianwen; Lo, Jeffery C. C.; Lee, Shi-wei Article
Fabrication and Reliability Assessment of Cu Pillar Microbumps with Printed Polymer Cores
Journal of Electronic Packaging, Transactions of the ASME, v. 143, (3), September 2021, article number 031101
Qiu, Xing; Lo, Jeffery Chi Chuen; Cheng, Yuanjie; Lee, Shi-wei; Tseng, Yong Jhe; Chiu, Peter Article
Phosphor-free microLEDs with ultrafast and broadband features for visible light communications
Photonics Research, v. 9, (4), April 2021, p. 452-459
Tian, Zhenhuan; Li, Qiang; Wang, Xuzheng; Zhang, Mingyin; Su, Xilin; Zhang, Ye; Li, Yufeng; Yun, Feng; Lee, Shi-wei Article
Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays
2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 September 2021
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei Conference paper
Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED Displays via Laser-Patterned Quantum Dots Color Conversion Layer
2021 International Conference on Electronics Packaging, ICEP 2021, May 2021, article number 9451947, p. 153-154
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei Conference paper
The Study of Far-UVC 222-nm Excilamp and Germicidal-UVC 254-nm Low-pressure Hg Lamp: Optical Characteristics and Service Life
2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 September 2021
Zhao, Fanny; Dong, Guoshuai; Wu, Hao; Yang, Guoming; Shieh, Brian; Lee, S.W.Ricky; Deng, Ronghua Conference paper

2020 7

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance
Journal of Electronic Packaging, v. 142, (2), June 2020, article number 021008
Zhang, Qiming; Lee, Shi-wei Article
Directly Printed Hollow Connectors for Microfluidic Interconnection with UV-Assisted Coaxial 3D Printing
Applied Sciences, v. 10, (10), May 2020, article number 3384
Xu, Qianwen; Lo, Jeffery Chi Chuen; Lee, Shi-wei Article
UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars
Journal of Microelectromechanical Systems, v. 29, (6), December 2020, article number 9214960, p. 1523-1530
Qiu, Xing; Lo, Chi Chuen; Cheng, Yuanjie; Lee, Shi-wei; Tseng, Yong Jhe; Yi, Hung Kuan; Chiu, Peter Article
Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels
Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, v. 2020, July 2020, article number 9261020
Xu, Hua; Lo, Jeffrey Chi Chuen; Lee, Shi-wei Conference paper
Dimensionless Correlation between Empirical Modeling and T3ster Measurements for the Dynamic Thermal Characterization of the PWM-mode Current Driving UVLED
2020 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2020, November 2020, article number 9308826, p. 260-265
Zhao, Fanny; Zeng, Yapei; Dong, Guoshuai; Yang, Guoming; Shieh, Brian; Lee, Shi-wei Conference paper
Printing Unifrom QDs Polymer Thin Film for QLED Applications
Proceedings - Electronic Components and Technology Conference, v. 2020-June, June 2020, article number 9159247, p. 1992-1998
Tu, Ning; Lo, Jeffery Chi Chuen; Lee, Shi-wei Conference paper
Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display
2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020, August 2020, article number 9201924
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Shieh, Brian; Lee, Shi-wei Conference paper

2019 11

Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 9, (3), March 2019, article number 8463575, p. 562-566
Shang, Andrew Weber; Lo, Chi Chuen; Lee, Shi-wei Article
The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 9, (5), May 2019, article number 8533406, p. 871-876
Shang, Andrew Weber; Lo, Jeffery C. C.; Lee, Shi-wei Article
Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Curing for Microfluidic Connectors
2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9080964
Xu, Qianwen; Lee, Shi-wei; Lo, Jeffery C. C. Conference paper
Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL
2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081173
Shieh, Brian; Zeng, Fangyun; Yang, Guoming; Zhao, Fanny; Sher, Chin-Wei; Lee, Shi-wei Conference paper
Evaluation and Benchmarking of Cu Pillar Micro-bumps with Printed Polymer Core
2019 International Conference on Electronics Packaging, ICEP 2019, April 2019, article number 8733457, p. 24-27
Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei; Liou, Ying-Hong; Chiu, Peter Conference paper
Feasibility study of fan-out panel-level packaging for heterogeneous integrations
Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811162, p. 14-20
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Lin, Curry; Chang, Chieh Lin; Pan, Jhih Yuan; Wu, Hsing Hui; Xu, Iris; Chen, Tony; Li, Zhang; Tan, Kim Hwee; Lo, Penny; So, R.; Chen, Y. H.; Fan, Nelson; Kuah, Eric; Lin, Marc; Cheung, Y. M.; Ng, Eric; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Feasibility study of fan-out wafer-level packaging for heterogeneous integrations
Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811333, p. 903-909
Lau, John; Li, Ming; Xu, Iris; Chen, Tony; Tan, Kim Hwee; Li, Zhang; Fan, Nelson; Kuah, Eric; So, Raymond; Lo, Penny; Cheung, Y. M.; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N.C.; Ko, Cheng Ta; Yang, Henry; Chen, Y. H.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Inkjet Printing PEDOT:PSS without Coffee Ring Effect for QLED Applicaitons
2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081009
Tu, Ning; Lee, Shi-wei Conference paper
Investigation of Processing Parameters for the Fabrication of Microfluidic Connectors Using a UV-assisted Coaxial 3D Printing System
2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019, v. 2019, December 2019, article number 9026686, p. 640-644
Xu, Qianwen; Lo, Jeffery Chi Chuen; Lee, Shi-wei Conference paper
Junction Temperature Prediction of the Multi-LED Module with the Modified Thermal Resistance Matrix
2019 16th China International Forum on Solid State Lighting and 2019 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2019, November 2019, article number 9019796, p. 252-255
Zhao, Fanny; Shieh, Brian; Zeng, Fangyun; Yang, Guoming; Lee, Shi-wei Conference paper
Long-term Stability Evaluation of Thermal Interface Materials (TIMs)
2019 20th International Conference on Electronic Packaging Technology(ICEPT) / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081271
Lo, Jeffery C. C.; Tao, Mian; Cheng, Yuanjie; Xu, Qianwen; Xiao, Kunhui; Lee, Shi-wei Conference paper

2018 24

A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs
IEEE Photonics Technology Letters, v. 30, (6), March 2018, p. 513-516
Wang, Jiaqi; Lo, Chi Chuen; Lee, Shi-wei; Tao, Mian; Zou, Huayong; Yun, Feng Article
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (9), September 2018, article number 8410452, p. 1561-1572
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu-Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei Article
Correlation of warpage distribution with the material property scattering for warpage range prediction of PBGA components
Journal of Electronic Packaging, Transactions of the ASME, v. 140, (4), December 2018, article number 041005
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei; Xu, Wei Article
Design, materials, process, and fabrication of fan-out panel-level heterogeneous integration
Journal of Microelectronics and Electronic Packaging, v. 15, (4), October 2018, p. 141-147
Ko, Cheng Ta; Yang, Henry; Lau, John; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chang, Chieh Lin; Pan, Jhih Yuan; Wu, Hsing Hui; Chen, Y. H.; Chen, Tony; Xu, Iris; Lo, Penny; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Lin, Chia Hung; Beica, Rozalia; Lin, Marc; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei Article
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (6), June 2018, p. 991-1002
Lau, John H.; Li, Ming; Li, Qingqian Margie; Xu, Iris; Chen, Tony; Li, Zhang; Tan, Kim Hwee; Yong, Qing Xiang; Cheng, Zhong; Wee, Koh Sau; Beica, Rozalia; Ko, C. T.; Lim, Sze Pei; Fan, Nelson; Kuah, Eric; Kai, Wu; Cheung, Yiu-Ming; Ng, Eric; Xi, Cao; Ran, Jiang; Yang, Henry; Chen, Y. H.; Lee, N. C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei Article
Fan-Out Wafer-Level Packaging for Heterogeneous Integration
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (9), September 2018, article number 8410488, p. 1544-1560
Lau, John Hon Shing; Li, Ming; Li, Margie Qingqian; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee Raymond; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng Ta; Yang, Henry; Chen, Yu Hua; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei Article
Super flexible GaN light emitting diodes using microscale pyramid arrays through laser lift-off and dual transfer
Optics Express, v. 26, (2), January 2018, p. 1817-1824
Tian, Zhenhuan; Li, Yufeng; Su, Xilin; Feng, Lungang; Wang, Shuai; Ding, Wen; Li, Qiang; Zhang, Ye; Guo, Maofeng; Yun, Feng; Lee, Shi-wei Article
A Power Inductor Integration Technology Using a Silicon Interposer for DC-DC Converter Applications
Proceedings of the International Symposium on Power Semiconductor Devices and ICs, v. 2018-May, June 2018, p. 347-350
Ding, Yixiao; Fang, Xiangming; Gao, Yuan; Cai, Yuefei; Qiu, Xing; Mok, Kwok Tai Philip; Lee, Shi-wei; Lau, Kei May; Sin, Johnny Kin On Conference paper
Additive Manufacturing of Micro-channels on a Silicon Substrate based on Coaxial Printing Dispenser with in-situ UV LED Curing
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging / IEEE. New York, NY, USA : IEEE, 2018, Article no.: 8660886
Xu, Qianwen; Lee, Shi-wei; Lo, Chi Chuen Conference paper
Additive Manufacturing of Micro-scale Tunnels on a Silicon Substrate with in-situ UV LED Curing for MEMS Applications
2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings, 26 November 2018, article number 8546382
Lee, Shi-wei; Xu, Qianwen; Lo, Chi Chuen Conference paper
Analysis of pulse-driven LED junction temperature and its reliability
2018 15th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2018 / IEEE. New York, NY, USA : IEEE, 2018, p. 23-26, Article no.: 8587392
Yang, Nick G. M.; Shieh, Brian Y. R.; Zeng, Trio F. Y.; Lee, Shi-wei Conference paper
Broadband Emission of Asymmetric Pyramids obtained by Laser Drilling and SAG for Application of Phosphor Free White LEDs
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660821
Tian, Zhenhuan; Li, Qiang; Su, Xilin; Zhang, Ye; Guo, Maofeng; Zhang, Minyan; Ding, Wen; Li, Yufeng; Yun, Feng; Lee, Shi-wei Conference paper
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Proceedings - Electronic Components and Technology Conference, v.2018-May, August 2018, article number 8429574, p. 355-363
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material Properties
Proceedings - Electronic Components and Technology Conference, v. 2018-May, August 2018, article number 8429625, p. 718-723
Zhang, Qiming; Lo, Jeffery.C.C.; Lee, Shi-wei; Xu, Wei Conference paper
Effect of Material Properties and Bump Parameters on Capillary Filling in Through-Silicon-Via Underfill Dispensing
2018 20th International Conference on Electronic Materials and Packaging (EMAP), March 2019, article number 8660884
Le, Fuliang; Lee, Shi-wei; Tao, Mian; Lo, Chi Chuen Conference paper
Fan-out wafer-level packaging for heterogeneous integration
Proceedings - Electronic Components and Technology Conference, v.2018-May, August 2018, article number 8429869, p. 2360-2366
Lau, John H.; Li, Ming; Li, Margie; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng-Ta; Yang, Henry; Chen, Yu-Hua; Tao, Mian; Lo, Jeffery; Lee, Shi-wei Conference paper
Investigation of Light Scattering Effect Impact on Optical Performance of Phosphor Converted White Light Emitting Diodes
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660928
Wang, Jiaqi; Lee, Shi-wei; Shieh, Brian Conference paper
Investigation of the Influence of Packaging Material Degradation on the Optical Performance of Phosphor Converted White Light Emitting Diodes
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660758
Wang, Jiaqi; Lee, Shi-wei; Shieh, Brian Conference paper
Measurement of Dynamic Junction Temperature for LED Flash Units of Camera
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 / IEEE. New York, NY, USA : IEEE, 2018, Article no.: 8480831
Shieh, Brian; Zeng, Fangyun; Lee, Shi-wei; Yang, Guoming Conference paper
Quantum Dot Light Emitting Diodes Based on ZnO Nanoparticles
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660807
Tu, Ning; Kwok, Z. H. Eric; Lee, Shi-wei Conference paper
Reliability of Fan-out Wafer-level Packaging With Large Chips And Multiple Re-distributed Layers
Proceedings - Electronic Components and Technology Conference, v. 2018-May, August 2018, article number 8429752, p. 1574-1582
Lau, John Hon Shing; Li, Ming; Yang, Lei; Yong, Qing Xiang; Cheng, Zhong; Chen, Tony; Xu, Iris; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee Raymond; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Beica, Rozalia; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, NC; Ko, Cheng Ta; Yang, Henry; Chen, YH; Tao, Mian; Lo, Jeffery C.C.; Lee, Shi-wei Conference paper
Solderability Evaluation of Printed Silver Solder Pad for Wafer-level Packaging
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 / IEEE. New York, NY, USA : Institute of Electrical and Electronics Engineers Inc., 2018, p. 350-354
Tao, Mian; Lo, Jeffery C.C.; Liou, Ying Hong; Chiu, Peter; Lee, Shi-wei Conference paper
Thermal Characterization of Multi-chip Light Emitting Diodes With Thermal Resistance Matrix
2017 14th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2017, v. 2018-January, January 2018, p. 32-37
Zou, Huayong; Lu, Lingyan; Wang, Jiaqi; Shieh, Brian; Lee, Shi-wei Conference paper
Thermal Simulation for High Power LED Systems with Remote Phosphor Layer
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660903
Zhang, Minshu; Xie, An; Lo, Chi Chuen; Lee, Shi-wei; Ahmatjan, Madina; Hong, Feichi; Yin, Haotian Conference paper

2017 12

3D Chip Stacking with through Silicon-vias (TSVs) for Vertical Interconnect and Underfill Dispensing
Journal of Micromechanics and Microengineering, v. 27, (4), March 2017, article number 045012
Le, Fuliang; Lee, Shi-wei; Zhang, Qiming Article
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
Journal of Microelectronics and Electronic Packaging, v. 14, (4), October 2017, p. 123-131
Lau, John H.; Li, Ming; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Chen, Tony; Xu, Iris; Li, Margie; Cheung, Y.M.; Kai, Wu; Hao, Ji; Beica, Rozalia; Taylor, Tom; Ko, C. T.; Yang, Henry; Chen, Y. H.; Lim, Sze Pei; Lee, N. C.; Ran, Jiang; Wee, Koh Sau; Yong, Qingxiang; Xi, Cao; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei Article
Growth, Characterization, and Application of Well-defined Separated Gan-based Pyramid Array on Micropatterned Sapphire Substrate
Applied Physics Express, v. 10, (9), September 2017, article number 092101
Tian, Zhenhuan; Li, Yufeng; Su, Xilin; Feng, Lungang; Wang, Shuai; Zhang, Minyan; Ding, Wen; Li, Qiang; Zhang, Ye; Guo, Maofeng; Yun, Feng; Lee, Shi-wei Article
A Novel Chip-on-Board White Light-emitting Diode Design for Light Extraction Enhancement
Conference Proceedings - 2016 13th China International Forum on Solid State Lighting, SSLCHINA 2016 / IEEE. New York, NY, USA : IEEE, 2017, p. 24-27, Article no.: 7804342
Zou, Huayong; Wang, Jiaqi; Feng, Mingxin; Shieh, Brian; Lee, Shi-wei Conference paper
Effect of the Surface Curvature of the Phosphor Layer on the Optical Performance of a WLED
Conference Proceedings - 2016 13th China International Forum on Solid State Lighting, SSLCHINA 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 20-23, Article no.: 7804341
Wang, Jiaqi; Lee, Shi-wei; Zou, Huayong Conference paper
Effects of Interconnect Layout and Underfill Thermal Conductivity on the Thermal Resistance of Flip-Chip LEDs
19th International Conference on Electronics Materials and Packaging, EMAP 2017, Matsue, Japan, 25-28 September 2017
Shang, Andrew Weber; Cai, Yuefei; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Investigation on the Influence of Phosphor Particle Size Gradient on the Optical Performance of White Light-Emitting Diodes
Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 / IEEE. New York, NY, USA : IEEE, 2017, p. 259-263, Article no.: 7861483
Wang, Jiaqi; Lee, Shi-wei; Zou, Huayong Conference paper
Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for through Silicon Vias
18th International Conference on Electronic Packaging Technology, ICEPT 2017, September 2017, article number 8046728, p. 1537-1541
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, C.P. Conference paper
Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control
Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 / IEEE. New York, NY, USA : IEEE, 2017, p. 1153-1160, Article no.: 7992619
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Packaging of UV LED with a Stacked Silicon Reflector for Converged UV Emission
2017 International Conference on Electronics Packaging, ICEP 2017 / IEEE. New York, NY, USA : IEEE, 2017, p. 259-263, Article no.: 7939371
Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test
Proceedings - IEEE 67th Electronic Components and Technology Conference, 1 August 2017, article number 7999729, p. 448-455
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Transient Light Emission Microscopy for Detecting the Non-Uniform Junction Temperature in Flip-Chip Light Emitting Diodes
Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, v. 2017, April 2017, article number 7896944, p. 297-301, 2017 Thirty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm)
Tao, Mian; Lee, Shi-wei Conference paper

2016 18

An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 6, (8), Aug 2016, article number 7509610, p. 1174-1180
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung Article
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints
Microelectronics Reliability, v. 62, July 2016, p. 130-140
Yang, Chaoran; Le, Fuliang; Lee, Shi-wei Article
Characterisation of Copper Diffusion in Through Silicon Vias
Materials for Advanced Packaging / Edited by Daniel Lu & C.P. Wong. Switzerland : Springer, 2016, p. 923-951
Zhang, Xiaodong; Lee, Shi-wei; Le, Fuliang Book chapter
A Method for Measuring Thermal Conductivity of Paste Materials
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, 4 October 2016, article number 7583185, p. 510-513
Feng, Wilson; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei Conference paper
Application of Nano Silver sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583297, p. 1004-1009
Tao, Mian; Mei, Yunhui; Lee, Shi-wei; Yun, Feng; Lu, Guoquan Conference paper
Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation
Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 1312-1319, Article no.: 7517700
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei; Xu, Wei; Yang, Weihua Conference paper
Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583078, p. 1-6
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Effect of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package
2016 International Conference on Electronics Packaging, ICEP 2016, June 2016, article number 7486781, p. 52-56
Lee, Shi-wei; Tian, Zhenhuan; Zhang, Minshu; Xie, An Conference paper
Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583144, p. 318-321
Xie, Jinqi; Zhong, Zhe; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping Conference paper
Experimental Parametric Study on the Bumping and Coining of Gold Studs for Flip Chip Bonding
China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463955
Ren, Rongbin; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583171, p. 439-442
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping Conference paper
Investigation of Reliability of EMC and SMC on Reflectance for UV LED Applications
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 658-664, Article no.: 7463398
Qiu, Xing; Lo, Chi Chuen; Shang, Andrew W.; Lee, Shi-wei Conference paper
Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583147, p. 331-333
Wen, Haoran; Ji, Yaqiang; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping Conference paper
Low-dielectric-constant Novel Periodic Mesoporous Organosilica Thin Film for Interlayer Dielectric
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583109, p. 153-156
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping Conference paper
Novel Periodic Mesoporous Organosilica Thin Film with Low Dielectric Constant and High Mechanical Property
China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463952
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping Conference paper
Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum
2016 International Conference on Electronics Packaging, ICEP 2016, June 2016, article number 7486782, p. 57-61
Lo, Chi Chuen; Lee, Shi-wei; Guo, Xungao; Zhao, Huishan Conference paper
Sensitivity Study on the Precision of Data Acquisition for LED Life Prediction Based on the Degradation of Luminous Output
2016 6th Electronic System-Integration Technology Conference, ESTC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.:7764509
Lo, Jeffrey Chi Chuen; Yang, Guoming; Tao, Mian; Lee, Shi-wei Conference paper
Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging
China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463954
Shang, Andrew Weber; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei; Le, Fuliang Conference paper

2015 13

Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (10), October 2015, p. 1525-1532
Le, Fuliang; Lee, Shi-wei; Lo, Chi Chuen; Yang, Chaoran Article
Lens Forming by Stack Dispensing for LED Wafer Level Packaging
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (1), January 2015, article number 6965571, p. 15-20
Zhang, Rong; Lee, Shi-wei; Lo, Chi Chuen Article
Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (8), August 2015, article number 7163313, p. 1178-1185
Le, Fuliang; Lee, Shi-wei; Yang, Chaoran; Lo, Chi Chuen Article
Detection of the Non-uniformity of Junction Temperature in Large Light-emitting Diode Using an Improved Forward Voltage Method
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 / IEEE. New York, NY, USA : IEEE, 2015, Article no.: 7103108
Tao, Mian; Lee, Shi-wei Conference paper
Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias
Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159872, p. 1973-1979
Zhang, Guoping; Jiang, Kun; Liu, Qiang; Li, Jinhui; Sun, Rong; Lee, Shi-wei; Wong, C. P. Conference paper
Fluxless Packaging of an Implantable Medical Device for Transcorneal Electrical Stimulation
Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2016-February, February 2016, article number 7412282
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung Conference paper
Influence of Rubber Nanoparticles on the Properties of Novolac-diazonaphthoquinone Based Photoresist
16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds.. New York, NY, USA : IEEE, 2015, p. 1039-1042, Article no.: 7236757
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping Conference paper
Investigation of the Influence of Ag Reflective Layer on the Correlated Color Temperature and the Angular Color Uniformity of LED with Conformal Phosphor Coating
16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu., W eds. New York, NY, USA : IEEE, 2015, p. 830-834, Article no.: 7236709
Tian, Zhenhuan; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Sun, Rong Conference paper
Investigation on the Thermal Degradation Mechanism of Cu-Sn Intermetallic Compound in SAC Solder Joints with Cohesive Zone Modeling
Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159722, p. 1029-1037
Yang, Chaoran; Lee, Shi-wei Conference paper
Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, v. 2, 2015, article number V002T02A046
Wang, Jiaqi; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Tao, Mian Conference paper
Simulation and Optimization on Thermal Performance of LED Filament Light Bulb
2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015 / IEEE. New York, NY, USA : IEEE, 2015, p. 88-92, Article no.: 7360696
Feng, Wilson; Feng, Bruce; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei Conference paper
Thermally Conductive Adhesives Based on Silver Coated Copper Flake Fillers
16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds. New York, NY, USA : IEEE, 2015, p. 294-296, Article no.: 7236595
Xie, Jinqi; Ren, Huming; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping Conference paper
Wafer Level Bumping Technology for High Voltage LED Packaging
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings / IEEE. New York, NY, USA : IEEE, 2015, p. 54-57, Article no. 7365183
Wei, Tiwei; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei Conference paper

2014 8

Comparison of ball pull strength among various Sn-Cu-Ni solder joints with different pad surface finishes
Journal of Electronic Packaging, Transactions of the ASME, v. 136, (1), March 2014, article number 011003
Yang, Chaoran; Song, Fubin; Lee, Shi-wei Article
Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
Applied Thermal Engineering, v. 63, (2), February 2014, p. 588-597
Ye, Huaiyu; Koh, Sau Wee; Yuan, Cadmus; van Zeijl, Henk; Gielen, Alexander W.J.; Lee, Shi-wei; Zhang, Guoqi Article
Impact of Ni Concentration on the Intermetallic Compound Formation and Brittle Fracture Strength of Sn-Cu-Ni (SCN) Lead-free Solder Joints
Microelectronics Reliability, v.`54, (2), February 2014, p. 435-446
Yang, Chaoran; Song, Fubin; Lee, Shi-wei Article
Development of a real-time monitoring system with uni-photodetector for LED long term reliability tests
Proceedings: 2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014), Editors: Keyun Bi, Zhong Tian, Ziqiang Xu. The Institute of Electrical and Electronics Engineers, Inc., 2014, p. 1477-1481
Zhang, Grace G.; Lu, Sophie L.Y.; Yang, Nick G.M.; Zou, Sam H.Y.; Zhong, Steven D.L.; Lo, Chi Chuen; Lee, Ricky Shi Wei Conference paper
Lens forming by stack dispensing for LED wafer level packaging
2014 International Conference on Electronics Packaging, ICEP 2014, IEEE, 2014, p. 670-675, Article number 6826763
Zhang, Rong; Lee, Ricky Shi-wei; Lo, Chi Chuen Conference paper
Multilayer Dispensing of Remote Phosphor for LED Wafer Level Packaging with Pre-formed Silicone Lens
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, November 2014, article number 6962713
Lo, Chi Chuen; Lee, Ricky Shi Wei; Guo, Xungao; Zhao, Huishan Conference paper
O-2 Plasma Treatment in Polymer Insulation Process for Through Silicon Vias
Proceedings of the Electronic Packaging Technology Conference, EPTC, October 2014, article number 6922644, p. 235-238
Zhuang, Lulu; Jiang, Kun; Zhang, Guoping; Tang, Jiaoning; Sun, Rong; Lee, Ricky S W Conference paper
Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking
Proceedings - Electronic Components and Technology Conference, September 2014, article number 6897397, p. 919-924
Le, Fuliang; Lee, Ricky Shi-wei; Lau, Kei May; Yue, Chik Patrick; Sin, Johnny Kin On; Mok, Philip Kwok Tai; Ki, Wing Hung; Choi, Hoi Wai Conference paper

2013 13

電子材料界面裂紋的新型濕氣壓力模型
電子元件與材料=Electronic Components & Materials, (2), 2013, p. 62-65
張旻澍; 李世瑋; 盧智銓 Article
Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays
Proceedings - 2013 IEEE 63rd Electronic Components Conference, May 2013, article number 6575818, p. 1788-1793
Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Shi Wei Ricky Conference paper
Brittle Fracture of Intermetallic Compounds in SAC Solder Joints under High Speed Ball Pull/Pin Pull and Charpy Impact Tests
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 1294-1299
Yang, Chaoran; Xu, Guangsui; Lee, Ricky Shi-wei; Zhang, Xinping Conference paper
Design and Implementation of Fine Pitch COB LED Display
2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177325, p. 108-111
Yang, Nick G.M.; Jin, Gavin S.G.; Niu, Mike D.Y.; Gao, Andy G.X.; Lee, S. W. Ricky Conference paper
Experimental Characterization of Adhesion Strength between the Silicone Encapsulant and the Bottom of a SMD LED Leadframe Cup
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756676, p. 1212-1216
Zou, Sam H.Y.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-Wei Ricky Conference paper
Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via
Proceedings - Electronic Components and Technology Conference, 2013, article number 6575554, p. 81-85
Zhao, Songfang; Zhang, Guoping; Peng, Chongnan; Sun, Rong; Lee, Ricky S W; Zhu, Wenhui; Lai, Fangqi Conference paper
LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer
13th International Conference on Electronics Packaging (ICEP2013), Osaka, Japan, 10-12 April 2013
Liu, Huihua; Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhao, Huishan Conference paper
Measurement and Analysis of Interfacial Adhesion Strength between the Silicone Encapsulant and the Side Wall of a SMD LED Leadframe Cup
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756544, p. 612-616
Zhong, Steven D.L.; Zou, Sam H.Y.; Lo, Chi Chuen; Lee, Shi-Wei Ricky Conference paper
Optical Characterization of a Light Bulb with the Waffle Pack LED WLP Module
2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177334, p. 142-146
Liu, Huihua; Lo, Jeffery C.C.; Lee, Shi Wei Ricky Conference paper
Quasi-conformal Phosphor Dispensing on LED for White Light Illumination
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 563-567
Lee, Shi Wei Ricky; Guo, Xungao; Niu, Daoyuan; Lo, Chi Chuen Conference paper
Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013
Lo, Chi Chuen; Liu, Huihua; Lee, Shi Wei Ricky; Gu, Xungao; Zhao, Huishan Conference paper
Thermal Characterization of a Printed Circuit Board with Thermal Vias for The Application of High Brightness Light-emitting Diodes
China International Forum on Solid State Lighting, ChinaSSL, v. 2013, 2013, article number 7177331, p. 128-131
Tao, Mian; Feng, Zicheng; Swanson, John; Ganjei, John; Lo, Chi Chuen; Lee, Shi Wei Ricky Conference paper
Wetting Behavior of Polymer Liquid in Insulation Process for through Silicon via
2013 14th International Conference on Electronic Packaging Technology (ICEPT 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 360-363
Zhao, S.; Zhang, G.; Sun, R.; Lee, S.W.R. Conference paper

2012 22

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging
IEEE Transactions on Device and Materials Reliability, v. 12, (2), June 2012, article number 6168823, p. 189-193
Zhang, Rong; Lo, Chi Chuen; Lee, Shi-wei Article
Emerging trend for LED wafer level packaging
Frontiers of Optoelectronics, v. 5, (2), June 2012, p. 119-126
Lee, Shi-wei; Zhang, Rong; Chen, Kewei; Lo, Chi Chuen Article
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches
Microelectronics Reliability, v. 52, (5), May 2012, p. 922-932
Zhang, Rong; Lee, Shi-wei Article
Reliability of high-power LED packaging and assembly
Microelectronics Reliability, 52, (5), May 2012, p. 761-761
Liu, Cheng-Yi; Lee, Shi-wei; Shin, Moo Whan; Lai, Yi-Shao Article
電子塑封材料的高溫界面強度研究
电子元件与材料=Electronic Components & Materials, v. 31, (7), 2012, p. 67-69
張旻澍; 謝安; 李世瑋; 盧智銓 Article
绿色电子封装技术与材料
绿色微纳电子学 /王阳元 编. 北京: 科学出版社， 2010, p. 223-306
李世玮; 程玉华; 宋复斌; Lo, Chi Chuen Book chapter
Assessment of Non-uniform Temperature Effect on BGA De-component Process
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, p. 977-980
Tang, Kun; Song, Fubin; Lee, Ricky Shi Wei; Lo, Chi Chuen Conference paper
Comparative Study on Dendrite Formation on Solder Pads with ImAg and OSP Surface Finishes Using Water Drop Test Method
12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, April 17-20 2012, p. 274-279
Tang, Kun; Song, Fubin; Lee, Shi-Wei Ricky Conference paper
COMPARISON OF FATIGUE CRACK INITIATION/PROPAGATION AND DAISY-CHAIN RESISTANCE IN LEAD-FREE SOLDER JOINTS UNDER TEMPERATURE CYCLING TEST
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, p. 579-583
Chan, Yuen Sing; Song, Fubin; Lee, Shi Wei Ricky; Yang, Chaoran; Lo, Chi Chuen Conference paper
Determination of Driving Current of RGB LEDs for White Light Illumination
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, p. 1540-1545
Zhao, Huishan; Lee, Ricky Shi Wei Conference paper
Development of innovative cold pin pull test method for solder pad crater evaluation
14th International Conference on Electronic Materials and Packaging, EMAP 2012,, Hong Kong, 13-16 December 2012
Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Ricky Shi Wei Conference paper
Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants
14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, sesion P048, article number 6507893
Peng, Chongnan; Zhang, Guoping; Sun, Rong; Lee, Ricky Conference paper
Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips
35th International Electronics Manufacturing Technology (IEMT) Conference, Ipoh, Malaysia, 6-8 November 2012, session number P141
Tao, Mian; Lee, Shi-Wei Ricky; Yuen, Mathew M.F.; Zhang, Guoqi; Driel, W. van Conference paper
Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED
2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012, Kyoto, Japan, 10-12 Dec 2012, session P11-3, article number 6523414
Zhao, Huishan; Chen, Changying; Lee, Shi-Wei Ricky Conference paper
Fast Copper Plating Process for Through Silicon Via (TSV) Filling
ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, v. 11, 2011, p. 855-863
Wang, Su; Lee, Shi-wei Ricky Conference paper
Investigation of fracture behaviors of Cu-Sn intermetallics using impact test
2012 2nd IEEE CPMT Symposium Japan, ICSJ, Kyoto, Japan, 10-12 Dec 2012, session P11-4, article number 6523420
Yang, Chaoran; Lee, Ricky Shi-wei Conference paper
Investigation on Mechanical Properties and Bonding Parameters of Copper Wire Bonding
12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, 17-20 April 2012, p. 654-660
Cao, Jun; Ding, Yutian; Lee, Shi-Wei Ricky Conference paper
LED wafer level packaging with a remote phosphor cap
14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P068, article number 6507885
Liu, Huihua; Zhang, Rong; Lo, Chi Chuen; Lee, Shi-Wei Ricky Conference paper
Reverse wire bonding and phosphor printing for LED wafer level packaging
Proceedings - Electronic Components Conference, 2012, p. 1814-1818
Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhang, Rong; Li, Mei Conference paper
TSV Plating Using Copper Methanesulfonate Electrolyte with Single Component Suppressor
4th IEEE Electronics System-integration Technology Conference (ESTC), Amsterdam, Netherlands, 17-20 September, p. 1-5
Wu, Hailong; Lee, Shi-Wei Ricky Conference paper
Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects
14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P061, article number 6507881
Zhang, Minshu; Lo, Chi Chuen; Lee, Shi-Wei Ricky Conference paper
Underfill dispensing for 3D die stacking with through silicon vias
Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012, San Diego, California, USA, 2012, p. 548-553
Le, Fuliang; Lee, Ricky Shi-wei; Wu, Jingshen; Yuen, Matthew Ming Fai Conference paper

2011 18

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
Journal of Electronic Packaging, Transactions of ASME, v. 133, (3), September 2011, article number 031010
Lau, John H.; Zhang, M. S.; Lee, Shi-wei Article
Investigation on Copper Diffusion Depth in Copper Wire Bonding
Microelectronics Reliability, v. 51, (1), January 2011, p. 166-170
Chen, Catherine H.; Zhang, Shawn X.; Lee, Shi-wei; Mohamed, Lebbai Article
Spacing optimization of high power LED arrays for solid state lighting
Journal of Semiconductors, v. 32, (1), January 2011, article number 014005
Chan, Yuen Sing; Lee, Shi-wei Article
Shock test methods and test standards for portable electronic devices
Structural Dynamics of Electronic and Photonic Systems / Edited by Ephraim Suhir, David S. Steinberg, T. X. Yu. Hoboken, New Jersey : John Wiley & Sons, Inc., 2011, p. 159-173, Ch. 7
Zhou, C.Y.; Yu, Tongxi; Lee, Shi-wei; Suhir, Ephraim Book chapter
Technologies and Materials for Green IC Packaging
Green Micro/Nano Electronics / Wang, Yangyuan, Cheng, Yuhua, Chi, Minhwa. Berlin: Springer, p. 248-359
Lee, Ricky Shi Wei; Cheng, Y.; Song, F.; Lo, Irene M C Book chapter
A comparison of copper sulfate and methanesulfonate electrolytes in the copper plating process for through silicon via metallization
Advanced Packaging Materials, International Symposium on, 2011, p. 291-296
Wu, H.L.H.; Lee, Ricky Shi Wei Conference paper
Advanced LED wafer level packaging technologies
Proceedings of technical papers, 2011, p. 71-74
Lee, Shi-Wei Ricky Conference paper
Characterization and Comparison between the SnCuNi IMC in SnCu Solder with ENIG Pad Finish and in SnCuNi Solder with OSP Pad Finish
2011 International Conference on Electronic Materials and Packaging (EMAP), Kyoto, Japan, 2011
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi-wei Conference paper
Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests
EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings, 2011
Jiang, Tong; Xu, Zhengjian; Lee, Shi Wei Ricky; Song, Fubin; Lo, Chi Chuen; Yang, Chaoran Conference paper
Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints
Proceedings - Electronic Components Conference, 2011, p. 1070-1078
Chan, Y.S.; Lee, Ricky Shi Wei Conference paper
Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish
Proceedings - Electronic Components Conference, 2011, p. 971-978
Yang, C.; Song, F.; Lee, Ricky Shi Wei Conference paper
Enhancement of thermal conductivity of die attach adhesives (DAAs) using nanomaterials for high brightness light-emitting diode (HBLED)
Proceedings - Electronic Components Conference, 2011, p. 667-672
Lu, D.; Liu, C.; Lang, X.; Wang, B.; Li, Z.; Lee, W.M.P.; Lee, Ricky Shi Wei Conference paper
Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches
2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 2011
Lo, Chi Chuen; Zhang, R.; Lee, Ricky Shi Wei; Wang, Z. Conference paper
Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, p. 500-505, Article number6066885
Chan, Y.S.; Song, F.; Lee, Ricky Shi Wei Conference paper
LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection
Proceedings - 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), June 2011, article number 5898727, p. 1616-1621
Zhang, Rong; Lee, Ricky Shi-wei; Xiao, David guowei; Chen, Haiying Conference paper
Mechanical shock test performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag, BGA components with SAC305 solder paste on NiAu and OSP board surface finishes
IPC APEX EXPO Technical Conference 2011, v. 4, 2011, p. 3014-3077
Bath, Jasbir; Eagar, Wade; Bigcraft, Chad; Newman, Keith; Hu, Livia; Henshall, Gregory; Nguyen, Jennefier; Lee, M.J.; Syed, Ahmer; Xie, Weidong; Song, Fubin; Lee, Ricky Conference paper
Nondestructive inspection of through silicon via depth using scanning acoustic microscopy
International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, January 2011, article number 5699482
Zhang, Minshu; Lee, Ricky Shi-wei; Wu, Hailong; Zhang, Rong Conference paper
Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging
Proceedings of technical papers, 2011, p. 343-346
Wu, H. L. Henry; Lee, Ricky Shi Wei Conference paper

2010 20

3D IC Integration with TSV Interposers for High Performance Applications
Chip scale review, v. 14, (5), September 2010, p. 26-29
Lau, John H.; Chan, Y. S.; Lee, Shi-wei Article
3D LED and IC wafer level packaging
Microelectronics International, v. 27, (2), May 2010, p. 98-105
Lau, John; Lee, Shi-wei; Yuen, Ming Fai; Chan, Philip Ching Ho Article
Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-induced Damages in Polymeric Materials in Electronic Packaging
Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 1, p. 1-28
Fan, X.J.; Lee, S.W.R. Book chapter
Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages
Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 15, p. 389-409
Zhang, M.S.; Lee, S.W.R.; Fan, X.J. Book chapter
Nano-scale and Atomistic-scale Modeling of Advanced Materials
Nano-bio-electronic, Photonic and MEMS Packaging / Edited by C.P. Wong, Kyoung-Sik (Jack) Moon, Yi Li. New York: Springer, c2010, p. 719-758
Dai, Ruo Li; Liao, Wei-Hsin; Lin, Chun-Te; Chiang, Kuo-Ning; Lee, Shi-Wei Ricky Book chapter
A novel vapor pressure transfusion model for the popcorning analysis of Quad Flat No-lead (QFN) packages
Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, 2010
Zhang, Minshu; Lee, Ricky Shi Wei Conference paper
ASSESSMENT OF RELATIVE THERMAL FATIGUE LIFE OF SAC LEAD-FREE AND TIN-LEAD SOLDERS WITH CUSTOM-MADE BGA ASSEMBLIES CREATING VARIOUS STRESS RANGES
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, p. 803-807
Chan, Y.S.; Yang, C.; Lee, S. W. Ricky Conference paper
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Proceedings - Electronic Components and Technology Conference, 2010, p. 464-470
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi Wei; Newman, K. Conference paper
Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, 2010
Chan, Y.S.; Lee, Ricky Shi Wei Conference paper
Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors
Proceedings - Electronic Components and Technology Conference, 2010, p. 926-934
Song, F.; Yang, C.; Henry Wu, H.L.; Lo, Chi Chuen; Ricky Lee, S.W.; Newman, K. Conference paper
Embedded 3D hybrid IC integration System-in-Package (SiP) for opto-electronic interconnects in organic substrates
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, v. 4, 2010, p. 129-136
Lau, John H.; Zhang, Minshu; Lee, Shi-wei Conference paper
Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging
2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, IEEE, 2010, p. 1386-1392, Article number 5582822
Chen, Kewei; Zhang, Rong; Lee, Ricky Shi-wei Conference paper
Modeling of board level solder joint reliability under mechanical drop test with the consideration of plastic strain hardening of lead-free solder
2010 IEEE CPMT Symposium Japan, ICSJ10, 2010
Xu, Z.J.; Jiang, Tong; Song, Fubin; Lo, Jeffery; Lee, Ricky Shi Wei Conference paper
Nanoindentation characterization of lead-free solders and intermetallic compounds under thermal aging
43rd International Symposium on Microelectronics 2010, IMAPS 2010, 2010, p. 314-318
Jiang, T.; Song, Fubin; Yang, Cheng; Ricky Lee, S.W. Conference paper
Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design
Proceedings - Electronic Components and Technology Conference, 2010, p. 1166-1172
Xie, B.; Shi, X.Q.; Chung, C.H.; Lee, Ricky Shi Wei Conference paper
Predictive Modeling and Experimental Validation of Lead-Free Solder Joint Reliability under Temperature Cycling
2010 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE, 2010, p. 585-592
Chan, Y.S.; Song, F.; Lo, C. C. Jeffery; Lee, Eddie; Lee, S. W. Ricky Conference paper
Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging
12th International Conference on Electronics Materials and Packaging, Singapore, 25-27 October 2010
Zhang, Rong; Lee, Ricky Shi-wei Conference paper
Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate
7th China International Forum on Solid State Lighting (SSLCHINA 2014), Guangzhou, China, 15-17 October 2010
Lee, Ricky Shi-wei; Lo, Chi Chuen; Zhang, Rong Conference paper
Solid state light tube with periodic units of lateral-emitting LEDs
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), June 2010 , article number 5490788, p. 673-678
Lee, Shi-wei; Zhang, Rong; Leung, Wai Lok Wesley Conference paper
Thermal-enhanced and cost-effective 3D IC integration with TSV (Through-Silicon Via) interposers for high-performance applications
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 4, 2010, p. 137-144
Lau, John Hon Shing; Chan, Yuen Sing; Lee, Shi-wei Conference paper

2009 17

Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability
IEEE transactions on components and packaging technologies, v. 32, (3), 2009, SEP, p. 693-700
Chauhan, Preeti; Osterman, Michael; Lee, S. W. Ricky; Pecht, Michael Article
Experimental investigations and model study of moisture behaviors in polymeric materials
MICROELECTRONICS RELIABILITY, v. 49, (8), 2009, AUG, p. 861-871
Fan, X.J.; Lee, Ricky Shi Wei; Han, Q. Article
Micro thermoelectric cooler: Planar multistage
International Journal of Heat and Mass Transfer, v. 52, (7-8), March 2009, p. 1843-1852
Hwang, Gisuk; Gross, Andrew J.; Kim, Hanseup; Lee, S. W.; Ghafouri, Niloufar; Huang, Baoling; Lawrence, Christin; Uher, Ctirad; Najafi, Khalil; Kaviany, Massound Article
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
IEEE transactions on components and packaging technologies, v. 32, (4), 2009, DEC, p. 901-908
Nie, Lei; Osterman, Michael; Song, Fubin; Lo, Jeffery; Lee, S. W. Ricky; Pecht, Michael Article
Comparison of thermal fatigue reliability of SnPb and SAC solders under various stress range conditions
2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, 2009, p. 1119-1123
Yang, C.; Chan, Yuen Sing; Lee, Ricky Shi Wei; Ye, Y.; Liu, S. Conference paper
Comparison of Thermal Fatigue Reliability of SnPb and SAC Solders under Various Stress Range Conditions
2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, p. 1038-1042
Yang, Chaoran; Chan, Yuen Sing; Lee, S. W. Ricky; Ye, Yuming; Liu, Sang Conference paper
Correlation between Material Selection and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages
2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, p. 563-568
Zhang, Minshu; Lee, S. W. Ricky; Zhang, Jack; Yun, Howard; Starkey, Dale; Chau, Hung Conference paper
Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State Lighting
42nd International Symposium on Microelectronics (IMAPS), San Jose, CA,USA, 1-5 November, pp. 937-944
Chan, Yuan Sing; Lee, Shi-Wei Ricky Conference paper
Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting
2008 International Conference on Electronic Materials and Packaging (EMAP 2008), IEEE, 2009, p. 255-258, Article number 4784277
Lee, Ricky Shi-wei; Tong, Y.W.; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong Conference paper
Effect of UBM and BCB layers on the thermo-mechanical reliability of Wafer Level Chip Scale Package (WLCSP)
Procceedings of 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference / IEEE. Taiwan : IEEE, 2009, p. 407-410
Chan, Yuen Sing; Lee, Shi-wei; Song, Fubin; Lo, Chi Chuen; Jiang, T. Conference paper
Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2009, p. 863-868
Song, Fubin; Newman, K.; Yang, C.; Lee, Ricky Shi Wei Conference paper
Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests
EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2009, p. 245-252
Song, Fubin; Jiang, Tong; Lo, Chi Chuen; Lee, Ricky Shi Wei; Newman, Keith Conference paper
Investigation of the Relationship between Material Selections and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages
17th European Microelectronics and Packaging Conference and Exhibition (EMPC 2009), Palacongressi, Rimini (Italy), 14-17 Jun 2009
Zhang, Minshu; Lee, Ricky S W Conference paper
Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability
Proceedings - Electronic Components and Technology Conference, 2009, p. 125-133
Wu, H.L.H.; Song, F.; Lo, Chi Chuen; Jiang, T.; Newman, K.; Lee, S.W.R. Conference paper
Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting
2009 Proceedings of 59th Electronic Components and Technology Conference, June 2009, article number 5074321, p. 2137-2142
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong Conference paper
Stress analysis of hygrothermal delamination of Quad Flat No-lead (QFN) packages
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 12, 2009, p. 339-347
Zhang, Minshu; Lee, Ricky Shi Wei; Fan, Xuejun Conference paper
Surface analysis of outgassing contamination from edgebond epoxy adhesives on imag pads
Proceedings - Electronic Components and Technology Conference, 2009, p. 155-160
Wu, H.L.H.; Song, F.; Newman, K.; Lee, S.W.R. Conference paper

2008 15

Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain
IEEE transactions on components and packaging technologies, v. 31, (3), 2008, SEP, p. 683-690
Tsai, Ming-Yi; Chen, YuC; Lee, Shi Wei Ricky Article
Drop/impact tests and analysis of typical portable electronic devices
International journal of mechanical sciences, v. 50, (5), 2008, MAY, p. 905-917
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W. Article
Eddy current induced heating for the solder reflow of area array packages
IEEE transactions on advanced packaging, v. 31, (2), 2008, MAY, p. 399-403
Li, Mingyu; Xu, Hongbo; Lee, Shi-Wei Ricky; Kim, Jongmyung; Kim, Daewon Article
Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish
IEEE transactions on electronics packaging manufacturing, v. 31, (3), 2008, JUL, p. 185-191
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T. Article
Reliability Study of Surface Mount Printed Circuit Board Assemblies with Lead-free Solder Joints
Soldering & Surface Mount Technology, v. 20, (2), 2008, p. 30-38
Lo, Chi Chuen; Jia, B.F.; Liu, Zhe; Zhu, Jungao; Lee, Shi Wei Ricky Article
A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders
Proceedings - Electronic Components and Technology Conference, 2008, p. 146-154
Song, Fubin; Lo, Chi Chuen; Lam, Jimmy K.S.; Jiang, Tong; Lee, Shi Wei Ricky Conference paper
Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers
Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, 2008, p. 321-326
Lam, Jimmy K.S.; Lee, Shi Wei Ricky Conference paper
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 5, 2008, p. 47-53
Lo, Chi Chuen; Lee, Shi Wei Ricky Conference paper
Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications
Proceedings - Electronic Components and Technology Conference, 2008, p. 1887-1892
Lo, Chi Chuen; Lee, Shi Wei Ricky; Wu, Henry Hailong; Lam, Jimmy K.S. Conference paper
Development of novel dicing process by anisotropic wet etching with convex corner compensation
10th Electronics Packaging Technology Conference, EPTC 2008, 2008, p. 161-166
Lam, Jimmy K.S.; Lee, Ricky Shi Wei Conference paper
Fabrication of Nanoscale Vias by Offset Patterning
MicroNano2008-2nd International Conference on Integration and Commercialization of Micro and Nanosystems, Proceedings, 2008, p. 615-618
Lau, Chi Ho; Lee, Ricky Shi Wei Conference paper
Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-lead (QFN) Packages
Proc. ASME International Mechanical Engineering Congress & Exposition, Boston, MA, 31 October-6 November, IMECE2008/68120 (on CD-ROM)
Zhang, M.; Lee, Ricky Shi Wei Conference paper
Numerical analysis and experimental validation for the prediction of flip chip solder joint standoff height in MEMS microphone application
IEEE 9th VLSI Packaging Workshop in Japan, VPWJ 2008, 2008, p. 45-48
Lo, Chi Chuen; Lee, Ricky Shi Wei Conference paper
Wafer level encapsulation process for LED array packaging
2007 International Conference on Electronic Materials and Packaging, IEEE, 2008, Article number 4510307
Zhang, Rong; Lee, Ricky Shi-wei Conference paper
Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation
Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008, IEEE, 2008, Article number 4607038
Zhang, Rong; Lee, Ricky Shi-wei Conference paper

2007 22

Electro-elastic analysis of piezoelectric laminated plates
Advanced composite materials, v. 16, (1), 2007, JAN, p. 63-81
Zhao, Minghao; Qian, Caifu; Lee, Shi Wei Ricky; Tong, Pin; Suemasu, H.; Zhang, Tong-Yi Article
Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow
Micro- and Opto-electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging / Vol. 2, Physical Design--Reliability and Packaging/ Edited by E. Suhir, Y.C. Lee, C.P. Wong. New York: Springer, c2007, chapter 6, p. 151-173
Lee, Shi-Wei Ricky; Lo, Chi Chuen Book chapter
Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests
Proceedings - Electronic Components Conference, 2007, p. 364-372
Song, Fubin; Lee, S. W. Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen Conference paper
Characteristics of copper-to-silicon diffusion in copper wire bonding
Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, 2007, p. 2-9
Zhang, Shawn X.; Lee, Shi Wei Ricky; Lau, A.K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, Maarten Conference paper
Characterization and comparison of five SAC-based solder pastes for pb-free reflow soldering
HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007, p. 10-17
Chen, Catherine H.; Wong, Wallace; Lo, Chi Chuen; Song, Fubin; Lee, Shi Wei Ricky Conference paper
Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests
Proc. 16th European Microelectronics & Packaging Conference (EMPC), Oulu, Finland, 17-20 June, pp. 213-218
Song, Fubin; Lee, Shi-Wei Ricky; Clark, Stephen; Sykes, Bob; Newman, Keith Conference paper
Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 450-458
Song, F.; Ricky Lee, S.W.; Newman, K.; Clark, S.; Sykes, B. Conference paper
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 5, 2007, p. 47-54
Lo, Chi Chuen; Lee, Shi Wei Ricky Conference paper
Design of experiment (DoE) study on effects of various geometric parameters on copper diffusion in through silicon vias (TSVs)
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, p. 32-37
Zhang, Shawn X.; Lee, S. W. Ricky Conference paper
Development of 2D modeling techniques for the thermal fatigue analysis of solder joints of a module mounted in a 3D cavity on a printed circuit board
EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings, 2007, p. 713-718
Chan, Yuen Sing; Lee, Shi Wei Ricky; Ye, Yuming; Liu, Sang Conference paper
Drop impact of a typical portable electronic device - experiments and modeling
Proceedings of the 7th International Conference on Shock and Impact Loads on Structures, 2007, p. 61-70
Yu, Tongxi; Zhou, C.Y.; Lee, Ricky S.W. Conference paper
Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 463-470
Song, F.; Ricky Lee, S.W.; Newman, K.; Reynolds, H.; Clark, S.; Sykes, B. Conference paper
Effect of V-groove side wall feature on epoxy flow in passive alignment of optical fiber
6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Proceedings 2007, 2007, p. 202-208
Lam, K. S. Jimmy; Lee, S. W. Ricky Conference paper
Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board)
Proc. 9th International Conference on Electronic Materials and Packaging (EMAP), Daejon, Korea, 19-22 November, EMAP2007-P013
Lau, John H.; Lo, Chi Chuen; Lam, Jimmy K.S.; Soon, E.L.; Chow, W.S.; Lee, Shi-Wei Ricky Conference paper
Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, v. 2007, 2007, p. 39
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M. Conference paper
Effects of tooling tip wear and fixture rigidity on solder ball shear and ball pull tests
IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2, 2007, p. 889-894
Song, Fubin; Lee, S. W. Ricky Conference paper
Effects of underfills on the thermal-cycling tests of SnAgCu PBGA (Plastic Ball Grid Array) packages on ImAg PCB (Printed Circuit Board)
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 785-790
Lau, J.; Lo, Chi Chuen; Lam, J.; Soon, E.L.; Chow, W.S.; Lee, R. Conference paper
High-speed solder ball shear and pull tests vs. board level mechanical drop tests: Correlation of failure mode and loading speed
Proceedings - Electronic Components and Technology Conference, 2007, p. 1504-1513
Song, Fubin; Lee, Shi Wei Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen Conference paper
Multi-stacked flip chips with copper plated through silicon vias and re-distribution for 3D system-in-package integration
Materials Research Society Symposium Proceedings, v. 970, 2007, p. 179-190
Lee, Shi-Wei Ricky; Hon, Ronald Conference paper
Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres
ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 474-480
Song, F.; Ricky Lee, S.W. Conference paper
Screen-printing of yellow phosphor powder on blue Light Emitting Diode (LED) arrays for white light illumination
2007 Proceedings of the ASME InterPack Conference, IPACK 2007, v. 1, 2007, p. 19-24
Lee, Ka Ho; Lee, Shi Wei Ricky Conference paper
Wetting characteristics of solder reflow on copper traces without solder mask
ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 438-443
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lam, Jimmy K.S.; Wong, Wallace K.H. Conference paper

2006 26

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties
IEEE transactions on components and packaging technologies, v. 29, (1), 2006, MAR, p. 164-172
Gong, JF; Chan, PCH; Xiao, GW; Lee, RSW; Yuen, MMF Article
便携式电子产品的跌落冲击响应试验，仿真和理论
力学进展=Advances in Mechanics, v. 2006, (02), 2006, p. 239-246
周春燕; 余同希; 李世瑋 Article
Characterization of intermetallic compound formation and copper diffusion of copper wire bonding
Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1821-1826
Zhang, S.; Chen, C.; Lee, R.; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M. Conference paper
Comparison between experimental measurement and numerical analysis of warpage in PBGA package and assembly with the consideration of residual strain in the molding compound
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006
Tsai, Ming Yi; Chen, Yung Cheng; Lee, Shi Wei Ricky Conference paper
Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability
Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 891-898
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Design of shock table tests to mimic real-life drop conditions for portable electronic device
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, (EMAP2006) Hong Kong, 11-14 December, 2006., v. 1-3, p. 674-678
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W. Conference paper
Design, process development and prototyping of 3D packaging with multi-stacked flip chips and peripheral through silicon via interconnection
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 2006, p. 80-85
Hon, Ronald; Lee, Shi Wei Ricky Conference paper
Development and prototyping of a HB-LED array module for indoor solid state lighting
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006, p. 141-145
Lee, Shi Wei Ricky; Lau, C.H.; Chan, Siu Ping; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Chi Chuen Conference paper
Development and prototyping of a HB-LED array module for indoor solid state lighting
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006, p. 192-196
Lee, S. W. Ricky; Lau, C.H.; Chan, S.P.; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Jeffery C.C. Conference paper
Drop impact of a typical portable electronic device
WIT Transactions on the Built Environment, v. 87, 2006, p. 505-514
Zhou, C.Y.; Yu, T.X.; Lee, R.S.W. Conference paper
Drop impact of typical portable electronic product device
The 9th Int. Conf. on Structures Under Shock & Impact (SUSI 2006), New Forest, UK,, 3-5 July, 2006.
Zhou, C.Y.; Yu, Tongxi; Lee, R.S.W. Conference paper
Effect of high temperature storage on reliability of Sn-Ag-Cu flip chip solder bumps
International Conference on Electronic Materials and Packaging, EMAP, v. 2006, December 2006, article number 4430604
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T. Conference paper
Effect of Microstructure on Thermal and Mechanical Properties of PBGA Substrates
Proc. 8th International Conference on Electronic Materials and Packaging (EMAP), Kowloon, Hong Kong, 11-14 December, pp. 533-539
Tang, G.C.W.; Shing, J.W.K.; Chen, Haibin; Lee, Shi-Wei Ricky; Wu, Jingshen; McLellan, Neli Conference paper
Effect of solder mask thickness on shear and pull tests of lead-free solder balls
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, 2006
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Effects of Al pad deformation and TiW barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding
IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, p. 189-195
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, Angie K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, M. Conference paper
Effects of microstructure on thermal and mechanical properties of PBGA substrates
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 830-836
Tang, George Cw; Shing, Jacqueline Wk; Chen, Haibin; Lee, Ricky; Wu, Jingshen Conference paper
Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 687-693
Lau, Dennis; Chan, Y.S.; Lee, S. W. Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang Conference paper
Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 866-872
Lau, Dennis; Chan, Y.S.; Lee, Shi Wei Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang Conference paper
Fracture analysis on popcorning of plastic packages during solder reflow
Fracture of Nano and Engineering Materials and Structures: Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006 / Edited by E. E. Gdoutos. The Netherlands : Springer, 2006, p. 749-750
Lee, Shi-Wei Ricky; Lau, Dennis Chung Yin Conference paper
Impact of IMC thickness on lead-free solder joint reliability under thermal aging: Ball shear tests vs. cold bump pull tests
2006 International Microsystems, Packaging, Assembly Conference Taiwan (IMPACT), Proceedings, 2006, p. 109-112
Lee, Shi Wei Ricky; Song, Fubin Conference paper
Investigation of IMC thickness effect on the lead-free solder ball attachment strength: Comparison between ball shear test and cold bump pull test results
Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1196-1203
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Investigation of the effect of PCB base materials and pad surface finish on the thermal fatigue life of lead-free solder joints of PBGA and passive resistors
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 166-172
Song, Fubin; Lee, Shi Wei Ricky; Osterman, Michael; Pecht, Michael Conference paper
Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60°C
Electronic Components and Technology Conference, v. 2006, May 2006, article number 1645851, p. 1476-1483
Lau, John; Lee, Shi-wei; Song, Fubin; Lau, Chung Yin; Shangguan, Dongkai Conference paper
Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias and Re-Distribution for 3D System-in-Package Integration
Proc. MRS Symposium on Enabling Technologies for 3D Integration, Vol. 970, Boston, MA, 27-29 November pp. 179-190
Lee, Shi-Wei Ricky; Hon, R. Conference paper
Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2006, p. 379-384
Lee, Ka Ho; Lee, Shi Wei Ricky Conference paper
Thermal resistance analysis of a multi-stack flip chip 3-d package
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 145-149
Chan, Yuen Sing; Lee, Shi Wei Ricky Conference paper

2005 16

Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing
IEEE transactions on advanced packaging, v. 28, (3), 2005, AUG, p. 413-420
Tsui, Yat Kit; Lee, Shi Wei Ricky Article
Foreword: Three-dimensional packaging
IEEE Transactions on Advanced Packaging, v. 28, (3), 2005, Aug, p. 354-355
Bauer, Charles E.; Lee, Shi Wei Ricky Article
電子製造技術：利用無鉛、無鹵素和導電膠材料
化學工業出版社, 北京, 中國 / ISBN 7-5025-7004-7, 548 pages
劉, 漢誠; 汪, 正平; 李, 寧成; 李, 世瑋 Book
3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling
Proceedings - Electronic Components and Technology Conference, v. 1, 2005, p. 795-801
Lee, Shi Wei Ricky; Hon, Ronald; Zhang, Shawn Xiaodong; Wong, Chun Keung Conference paper
A systematic approach for determining the thermal fatigue-life of plastic ball array (PBGA) lead-free solder joints
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1021-1029
Lau, J.; Lee, R.; Dauksher, W.; Shangguan, D.; Song, F.; Lau, D. Conference paper
Assessment of long-term reliability in lead-free assemblies
Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v. 2005, 2005, p. 140-155
Ganesan, S.; Wu, J.; Pecht, M.; Lee, R.; Lo, Chi Chuen; Fu, Y.; Li, Y.; Xu, M. Conference paper
Characterization of copper-to-silicon diffusion for the application of 3D packaging with through silicon vias
2005 6th International Conference on Electronics Packaging Technology, v. 2005, 2005
Zhang, Xiaodong; Lee, Shi-Wei Ricky; Weng, Lutao; So, Sylvia Conference paper
Correlation between the strain on the printed circuit board and the stress in chips for the failure prediction of passive components
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 115-121
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky Conference paper
Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls
2005 6th International Conference on Electronics Packaging Technology, v. 2005, 2005
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Evaluation of bondability and reliability of single crystal copper wire bonding
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), 2005, p. 238-244
Chen, Hua; Lee, Shi Wei Ricky; Ding, Yutian Conference paper
Experimental investigation of the effect of reflow cooling rate on the IMC growth of SAC lead-free solder alloy
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 123-129
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition
Proceedings - Electronic Components Conference, 2005, p. 1783-1791
Lau, D.; Tsang, M.; Lee, SWR; Lo, Chi Chuen; Fu, LF; Jin, JW; Liu, S. Conference paper
Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging, San Francisco, California, USA, 17-22 July 2005, p. 947-953 (IPACK2005/73299 on CD-ROM)
Zhang, Xiaodong; Hon, Ronald; Lee, Shi-Wei Ricky Conference paper
Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection
PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, p. 384-389
Hon, R.; Lee, SWR; Zhang, SX; Wong, CK Conference paper
Optimization of epoxy flow for passive alignment of optical fiber arrays
Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v. 2005, 2005, p. 132-136
Lo, Chi Chuen; Li, Chung Yeung; Tai, Chung Leung; Lee, Shi Wei Ricky Conference paper
Thermal-fatigue life prediction equation for Plastic Ball Grid Array (PBGA) SnAgCu lead-free solder joints
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1013-1019
Lau, John; Lee, Shi Wei Ricky; Song, Fubin; Shangguan, Dongkai; Lau, Dennis C.; Dauksher, Walter Conference paper

2004 16

Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate
Soldering & Surface Mount Technology, v. 16, (2), 2004, p. 21-26
Yan, Eric C.C.; Lee, Shi Wei Ricky; Huang, Xingjia Article
Electronic Manufacturing Service Industries in China
China's Electronics Industries / Edited by M.G. Pecht, Y.C. Chan, College Park, Maryland: CALCE EPSC Press, 2004, p.109-136
Donahoe, Daniel; Lee, Shi-Wei Ricky Book chapter
A new method for the solder ball pull test using a shape memory alloy tube
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 237-242
Lo, Chi Chuen; Lau, Dennis Chung Yin; Lee, Shi Wei Ricky; Chan, Simon; Chan, Franky; Chau, K.C. Conference paper
Characteristics of Resistance of Daisy-Chained PBGA Solder Joints under Thermal Fatigue Load, Three-Point Bending Load and Mechanical Drop Load
6th International Symposium on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, December 5-7, pp. 204-209
Lui, Ben Hoi Wai; Lee, Shi-Wei Ricky; Zhang, Shawn Xiao Dong Conference paper
Chip-on-chip 3D optical interconnect with passive alignment
Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 2015-2019
Lo, Chi Chuen; Lee, Ricky Shi Wei; Wu, Jingshen; Kim, Jang Kyo; Yuen, Matthew Ming Fai Conference paper
Computational analyses on the effects of irregular conditions during accelerated thermal cycling tests on board level solder joint reliability
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 516-521
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky Conference paper
Computational model validation with experimental data from temperature cycling tests of PBGA assemblies for the analysis of board level solder joint reliability
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004, 2004, p. 115-120
Lee, Shi Wei Ricky; Lau, Dennis Chung Yin Conference paper
Effects of underfill adhesion on flip chip package reliability
Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC), 2004, p. 96-101
Sham, Man Lung; Kim, Jang Kyo; Lee, R.S.W.; Wu, Jingshen; Yuen, Matthew Ming Fai Conference paper
Experimental assessment of passive alignment of optical fibers With V-grooves on silicon optical bench
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 375-380
Lo, Chi Chuen; Lee, Shi Wei Ricky Conference paper
Finite element analysis for thermal fatigue life estimation of PBGA solder joints with model validation by experimental data
ITHERM 2004, VOL 2, 2004, p. 724
Lee, SWR Conference paper
Formation and Plugging of Through-Silicon-Vias for 3D Packaging
7th VLSI Packaging Workshop of Japan (VLSI2004), Kyoto, Japan, 29 November-2 December, pp. 105-108,
Lee, Shi-Wei Ricky; Hon, Ronald; Zhang, Shawn Xiao Dong; So, Sylvia Conference paper
Formation of through-silicon-vias by laser drilling and deep reactive ion etching
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 243-248
Hon, Ronald; Zhang, Shawn Xiaodong; Lee, Shi Wei Ricky Conference paper
Gold embrittlement of solder joints in wafer level chip scale package on printed circuit board with Ni/Au surface finish
Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 400-406
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T. Conference paper
Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves
Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 830-834
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai Conference paper
Thermal fatigue-life prediction of lead-free solder joints
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, November 2004, article number IMECE2004-62493, p. 265-270
Lau, John H.; Lee, Shi-Wei Ricky; Shangguan, Dongkai Conference paper
Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)
Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 1563-1569
Lau, John H.; Shangguan, Dongkai; Lau, Dennis Chung Yin; Kung, Terry T.W.; Lee, Shi Wei Ricky Conference paper

2003 11

Electronics Manufacturing with Lead-free, Halogen-free, and Conductive Adhesive Materials
McGraw-Hill, New York, NY
Lau, John; Wong, C.P.; Lee, N.C.; Lee, S. W. Ricky Book
芯片尺寸封裝: 設計, 材料, 工藝, 可靠性及應用
清華大學出版社, 北京, 中國 / ISBN 7-302-07376-7/TN.147, 435 pages
劉, 漢誠; 李, 世瑋; 賈, 松良; 王, 水弟; 蔡, 堅 Book
A Reliability Comparison of Electroplated and Stencil Printed Flip-Chip Solder Bumps Based on UBM Related Intermetallic Compound Growth Properties
53rd Electronic Components and Technology Conference, ECTC, New Orleans, USA, 27-30 May, pp. 685-691
Gong, Jing-Feng; Xiao, Guo-Wei; Chan, Philip C.H.; Lee, Ricky S.W.; Yuen, Matthew M.F. Conference paper
Effects of thermal aging and Au addition on the electrical resistance of solder balls in flip chip and ultra-CSP packages
ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, p. 831-836
Huang, XJ; Lee, SWR; Li, M.; Chen, W. Conference paper
Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages
Proceedings of InterPACK’03, Maui, Hawaii, U.S.A., July 6-11, IPACK2003-35246 on CD-ROM
Huang, Xingjia; Lee, Shi-Wei Ricky; Li, Ming; Chen, William Conference paper
Multi-chip memory module with a flip-chip-on-chip structure and an optional center via hole for underfill dispensing
Proceedings - Electronic Components and Technology Conference, 2003, p. 864-869
Lee, Shi Wei Ricky; Tsui, Yat Kit; So, Raymond; Luo, Le Conference paper
Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies
Proceedings - Electronic Components and Technology Conference, 2003, p. 1850-1855
Xiao, G.W.; Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F. Conference paper
Optimization of stencil printing wafer bumping for fine pitch flip chip applications
Proceedings - Electronic Components and Technology Conference, 2003, p. 1724-1730
Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F. Conference paper
Passive alignment of optical fiber in a V-groove with low viscosity epoxy flow
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 3, November 2003, article number IMECE2003-43902, p. 403-406
Lo, Chi Chuen; Yung, C.S.; Lee, Shi-wei; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai Conference paper
The impact of the AC current crowding effect on BJT RF noise modeling
2003 IEEE CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS, 2003, p. 327-330
Lee, Wai Kit; Man, Tsz Yin; Mok, Philip K.T.; Ko, Ping Keung; Chan, Man Sun Conference paper
Three-dimensional packaging for multi-chip module with through-the-silicon via hole
PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, p. 1-7
Tsui, Yat Kit; Lee, Ricky S W; Wu, Jingshen; Kim, Jang Kyo; Yuen,Matthew Ming Fai Conference paper

2002 17

Analysis on solder ball shear testing conditions with a simple computational model
Soldering & Surface Mount Technology, v. 14, (1), 2002, p. 45-48
Lee, SWR; Huang, XJ Article
Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders
Soldering & Surface Mount Technology, v. 14, (3), 2002, p. 46-50
Lee, Shi Wei Ricky; Lui, Ben Hoi Wai; Kong, YH; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector Article
Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package
IEEE transactions on advanced packaging, v. 25, (4), 2002, NOV, p. 514-521
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Choi, Kwang Seong; Kim, Young Gon Article
Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP)
IEEE transactions on components and packaging technologies, v. 25, (1), 2002, MAR, p. 3-14
Lau, John H.; Lee, Shi Wei Ricky Article
Micro-machined Conformal silicon Molds for wafer bumping and probing
INTERNATIONAL journal OF NONLINEAR sciences and Numerical SIMULATION, v. 3, (3-4, Sp. Iss. SI), 2002, p. 399-404
Lee, Shi Wei Ricky; Lo, Chi Chuen; Law, K.H. Article
Modeling and analysis of 96.SSn-3.SAg lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board
IEEE transactions on electronics packaging manufacturing, v. 25, (1), 2002, JAN, p. 51-58
Lau, John H.; Lee, Shi Wei Ricky Article
Modeling of torsional vibration induced by extension-twisting coupling of anisotropic composite laminates with piezoelectric actuators
Smart materials & structures, v. 11, (1), 2002, FEB, p. 55-62
Zhu, Mei-Ling; Lee, Shi-Wei Ricky; Li, Hing-Leung; Zhang, Tong-Yi; Tong, Pin Article
Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications
Journal of Electronic Packaging, v. 124, (3), July 2002, p. 205-211
Lau, John; Lee, Ricky Shi Wei; Pan, S.H.; Chang, Chris Article
Effects of room temperature storage time on the shear strength of PBGA solder balls
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 2, 2002, p. 259-262
Lee, Shi Wei Ricky; Tsui, Yat-Kit; Hunag, Xingjia; Yan, Eric C.C. Conference paper
Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls
14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-4 (IMECE2002/39514 on CD-ROM)
Lee, S. W. Ricky; Tsui, Y.K.; Huang, X.; Yan, C.C. Conference paper
Evaluation of board level reliability of Pb-free PBGA solder joints
International Advanced Packaging Materials Symposium, v. 2002, March 2002, article number 990368, p. 82-89
Lee, Shi-wei; Lui, Hon Wai Ben; Kong, Y.K.; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector Conference paper
Experimental Evaluation on Solder Joint Reliability of PBGA Assembly under Mechanical Drop Test
14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-5 (IMECE2002/39493 on CD-ROM)
Lee, Shi Wei Ricky; Li, Tracy Yin Lai; Lui, Ben Hoi Wai Conference paper
Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging
PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, p. 478-481
Tsui, YK; Lee, SWR; Huang, XJ Conference paper
Experimental investigation on the progressive failure mechanism of solder balls during ball shear test
Proceedings - Electronic Components and Technology Conference, 2002, p. 968-973
Huang, Xingjia; Lee, Shi Wei Ricky; Yan, Chien Chun Conference paper
Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener
Proceedings - Electronic Components and Technology Conference, 2002, p. 112-118
Xiao, G.W.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F. Conference paper
Stress Relaxation in Plastic Molding Compounds
International Symposium on Electronic Materials & Packaging (EMAP2002), December 4-6, Kaohsiung, Taiwan, pp. 37-42
Lee, M.; Pecht, M.G.; Huang, X.; Lee, S. W. Ricky Conference paper
Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects
PhoPack2002, July 14-16, Stanford, California, U.S.A., pp. 26-30
Lau, John; Lee, S. W. Ricky Conference paper

2001 15

Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations
Circuit World, v. 28, (2), 2001, p. 32-38
Lee, Shi-Wei Ricky; Lau, John H. Article
Computational Analysis on the Effects of Double-Layer Build-Up Printed Circuit Board on the Wafer Level Chip Scale Package (WLCSP) Assembly with Pb-Free Solder Joints
International Journal of Microcircuits & Electronic Packaging, 24(2), 89-104
Lau, John; Lee, S. W. Ricky Article
Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies
International Journal of Microcircuits & Electronic Packaging, v. 24, (2), 2001, p. 246-262
Huang, Xingjia; Kallmayer, Christine; Aschenbrenner, Rolf; Lee, S. W. Ricky Article
Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies
IEEE transactions on components and packaging technologies, v. 24, (2), 2001, JUN, p. 285-292
Lau, John H.; Chang, Chris; Lee, Shi Wei Ricky Article
以PZT薄膜为驱动和传感的微型陀螺研制
壓電與聲光, v. 23, (1), February 2001, p. 18-22
马薇; 李世玮; 虞吉林 Article
Microvias for Low-Cost High-Density Interconnects
McGraw-Hill, New York, NY
Lau, John; Lee, S. W. Ricky Book
Bending analysis of piezoelectric laminates
IUTAM SYMPOSIUM ON SMART STRUCTURES AND STRUCTRONIC SYSTEMS, v. 89, 2001, p. 275-282
Zhao, MH; Qian, CF; Lee, SWR; Tong, P.; Zhang, TY Conference paper
Characterization and analysis on the solder ball sheer testing conditions
Proceedings - Electronic Components Conference, 2001, p. 1065-1071
Huang, XJ; Lee, SWR; Yan, CC; Hui, S. Conference paper
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy
Advances in Electronic Packaging, v. 1, 2001, p. 307-313
Dai, Lanhong; Lee, Shi-Wei Ricky Conference paper
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 1, 2001, p. 237-242
Lee, Shi-Wei Ricky; Dai, Lanhong Conference paper
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 2, 2001, p. 2301-2306
Lee, Shi-Wei Ricky; Dai, Lanhong Conference paper
Dynamic structural coupling behaviours of an anti-symmetric piezoelectric laminate
Proceedings of SPIE - The International Society for Optical Engineering, v. 4326, 2001, p. 331-339
Wong, Kelvin H.L.; Lee, Shi-Wei Ricky Conference paper
Effects of plasma cleaning on the reliability of wire bonding
Advances in Electronic Materials and Packaging, v. 2001, November 2001, article number 983955, p. 39-43
Nowful, J.M.; Lok, S.C.; Lee, Shi-wei Conference paper
Reliability of 96.5Sn-3.5Ag lead-free solder-bumped wafer level chip scale package (WLCSP) on build-up microvia printed circuit board
2001 HD Interntional Conference on Hig-Density Interconnect and Systems Packaging, Santa Clara, CA, United States, 17-20 April 2001; Proceedings of SPIE - The International Society for Optical Engineering, v. 4428, 2001, p. 314-322
Lau, John H.; Lee, Shi Wei Ricky Conference paper
Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate
Proceedings - Electronic Components and Technology Conference, 2001, p. 598-605
Xiao, G.; Chan, P.C.H.; Teng, A.; Lee, R.S.W.; Yuen, M.M.F. Conference paper

2000 22

A damage evolution model for thermal fatigue analysis of solder joints
Journal of electronic packaging, v. 122, (3), 2000, SEP, p. 200-206
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Pao, Yihsin Article
Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion
Key engineering materials, v. 177-1, (Part 1&2), 2000, p. 267-272
Dai, Lan Hong; Lee, Shi Wei Ricky; Huang, Xing Jia Article
Design and manufacturing of micro via-in-pad substrates for solder bumped flip chip applications
Journal of Electronics Manufacturing, v. 10, (1), 2000, p. 79-87
Lau, J.; Chang, C.; Lee, R.; Chen, T.Y.; Cheng, D.; Tseng, T.J.; Lin, D. Article
Effects of electric fields on the bending behavior of PZT-5H piezoelectric laminates
Smart materials and structures, v. 9, (6), 2000, p. 824-831
Cheng, Jinquan; Qian, Caifu; Zhao, Minghao; Lee, Shi Wei Ricky; Tong, Pin; Zhang, Tong-Yi Article
Failure analysis of solder bumped flip chip on low-cost substrates
IEEE transactions on electronics packaging manufacturing, v. 23, (1), 2000, JAN, p. 19-27
Lau, John H.; Chang, Chris C.P.; Lee, Shi Wei Ricky Article
Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills
Journal of Electronic Packaging, Transactions of the ASME, v. 112, (4), 2000, Dec, p. 306-310
Lau, John H.; Lee, Shi Wei Ricky Article
Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate
IEEE TRANSACTIONS on ULTRASONICS FERROELECTRICS and FREQUENCY control, v. 47, (6), 2000, NOV, p. 1561-1574
Zhu, ML; Lee, SWR; Zhang, TY; Tong, P. Article
Solder joint reliability of plastic ball grid array with solder bumped flip chip
Soldering & Surface Mount Technology, v. 12, (2), 2000, p. 16-23
Lee, Shi Wei Ricky; Lau, John H. Article
Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method
Journal of Electronic Packaging, Transactions of the ASME, v. 122, (1), 2000, March, p. 34-41
Lau, John H.; Lee, Shi Wei Ricky Article
一种新颖的四梁式压电薄膜微型陀螺
中國科學技術大學學報=Journal of china university of science and technology, v. 30, (4), August 2000
马薇; 李世玮; 虞吉林 Article
引线框架用铜合金与Sn-Pb共晶焊料界面组织研究
功能材料, v. 31, (5), 2000, p. 494-495
王谦; Lee, Shi Wei Ricky; 曹育文; 唐祥云; 马莒生 Article
电子封装中的焊点及其可靠性
電子元件與材料, v. 19, (2), 2000, p. 24-26
王谦; LEE, Shi-Wei Ricky; 汪刚强; 耿志挺; 黄乐; 唐祥云; 马莒生 Article
An analytical method of extension-twisting coupling vibration of piezoelectric composite laminates
7th International Conference on Structural Dynamics: Recent Advances; Southampton; UK; 24-27 July 2000, pp. 121-134. 2000
Zhu, M.L.; Lee, S.W.R.; Zhang, T.Y.; Tong, P. Conference paper
Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, p. 868-873
Lee, Shi Wei Ricky; Yan, Chien Chun; Karim, Zaheed; Huang, Xing Jia Conference paper
Effects of Build-Up Printed Circuit Board Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package (WLCSP)
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904141, p. 115-126
Lau, John H.; Lee, Ricky S W Conference paper
Effects of electric fields on the bending behavior of piezoelectric composite laminates
Materials Research Society symposia proceedings, v. 604, 2000, p. 59-64
Cheng, Jin Quan; Zhang, Tong Yi; Zhao, Ming Hao; Qian, Cai Fu; Lee, Shi Wei Ricky; Tong, Pin Conference paper
Experimental Characterization for the Shear Strength of Pb-Free Solder Balls on a PZT Substrate with Pd/Ag Pads
Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2000, 2000, Article number 906354, p. 86-90
Huang, Xingjia; Lee, Ricky S W; Tse, Wansze Conference paper
Modeling for prototyping of rotary piezoelectric motors
Structures and Materials, v. 7, 2000, p. 21-30
Lee, Shi-Wei Ricky; Zhu, Mei-Lirig; Wong, H.L. Conference paper
Reliability of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag Lead-Free Solder Joints on Build-Up Microvia Printed Circuit Board
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904133, p. 55-63
Lau, John H.; Lee, Ricky S W Conference paper
Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies
50th Electronic Components and Technology Conference, Las Vegas, NV, USA, 2000, p. 1360-1368
Lau, John; Chang, Chris; Lee, Shi Wei Ricky Conference paper
Study on the Interfaces Between Copper Alloys for Lead Frame and Sn-Pb Solder Alloys
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904185, p. 388-390
Qian, Wang; Lee, Ricky S W; Yuwen, Cao; Jusheng, Ma A. Conference paper
The Mechanical Properties Degradation of Solder Joints Under Thermal Cycling
2000, Article number 904153, p. 194-196
Wang, Qian; Lee, Ricky S W; Wang, Gangqiang; Chen, Guohai; Hung, Le; Ma, Jusheng Conference paper

1999 9

Assembly of large PBGAs on printed circuit board with large PQFPs directly on the opposite side
Journal of Electronics Manufacturing, v. 9, (4), 1999, p. 293-298
Lau, John H.; Lee, Shi-Wei Ricky; Chao, Henry Article
Computational analysis for the torsional vibration control of an anti-symmetric piezoelectric composite laminate
Journal of intelligent material systems and structures, v. 10, (7), 1999, JUL, p. 530-533
Lee, Shi Wei Ricky; Li, Hing Leung Article
Design and analysis of a microgyroscope with sol-gel piezoelectric plate
Smart materials & structures, v. 8, (2), 1999, APR, p. 212-217
He, Guohong; Nguyen, Christopher C.T.; Hui, JCM; Lee, Shi Wei Ricky; Luong, Howard Cam Article
Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages
Journal of Electronic Packaging, Transactions of the ASME, v. 121, (4), 1999, Dec, p. 242-248
Lau, John; Chen, Tony; Lee, Shi Wei Ricky Article
Chip Scale Package (CSP): Design, Materials, Process, Reliability & Applications
McGraw-Hill / New York, NY. (ISBN 0-07-038304-9, 564 pages)
Lau, J.H.; Lee, S.W.R. Book
Design and Performance of a Piezoelectric Microgyroscope
10th International Conference on Solid-State Sensors and Actuators (Transducers' 99), June 1999
Cheung, V.S.L.; Ma, W.; Luong, H.C.; Lee, R. Conference paper
Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board
Proceedings of the 1999 International Symposium on Microelectronics, Chicago, IL, USA, v.3906, 26-28 October 1999, p. 592-598
Lau, John H.; Lee, Shi Wei Ricky; Ouyang, Chien Conference paper
Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 1-4 June 1999, p. 571-582
Lau, John H.; Lee, Shi Wei Ricky; Chang, Chris; Ouyang, Chien Conference paper
Global Collaborative Electronic Packaging Education
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, p. 907-911
Tong, Pin; Lam, David C C; Yuen, Matthew Ming Fai; Kim, Jang Kyo; Lee, Ricky S W; Lee, Steve Han Keung; Chan, Philip Ching Ho Conference paper

1998 12

Computational modeling and analysis of a center-cracked panel repaired by bonded composite patch
Key Engineering Materials, v. 145-149, 1998, p. 601-606
Chau, RWT; Lee, Shi Wei Ricky Article
Critical issues in computational modeling and fatigue life analysis for PBGA solder joints
International Journal of Microcircuits and Electronic Packaging, v. 21, (3), 1998, p. 253-261
Zhang, Xiaowu; Lee, Shi Wei Ricky Article
Development and characterization of a rotary motor driven by anisotropic piezoelectric composite laminate
Smart materials & structures, v. 7, (3), 1998, JUN, p. 327-336
Lee, SWR; Li, HL Article
Effects of temperature profile on the life prediction of PBGA solder joints under thermal cycling
Key engineering materials, v. 145-9, (Part 1&2), 1998, p. 1133-1138
Zhang, Xiao Wu; Lee, Shi Wei Ricky Article
Experimental investigation of the shear strength of a unidirectional carbon/aluminum composite under dynamic torsional loading
Composites science and technology, v. 58, (10), 1998, p. 1667-1673
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky Article
Material response and failure mechanism of unidirectional metal matrix composites under impulsive shear loading
Key engineering materials, v. 141-1, (Part 1-2), 1998, p. 651-669
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky Article
Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading
Circuit World, v. 24, (3), 1998, p. 26-31
Lee, Shi-Wei Ricky; Zhang, Xiaowu Article
Solder joint reliability of cavity-down plastic ball grid array assemblies
Soldering & Surface Mount Technology, v. 10, (1), 1998, FEB, p. 26-31
Lee, Shi Wei Ricky; Lau, John H. Article
Special Issue on Piezoelectric Motors/Actuators and Their Applications - Preface
Smart Materials and Structures, v. 7, (3), June 1998, p. U3
Lee, Ricky S W Article
Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models
Key engineering materials, v. 145-9, (Part 1&2), 1998, p. 1127-1132
Park, Joo Hyuk; Kim, Jang Kyo; Yuen, Matthew Ming Fai; Lee, Shi Wei Ricky; Tong, Penger; Chan, Philip Ching Ho Article
Computational modeling and parametric study of a rotary actuator driven by piezoelectric composites
Proceedings of SPIE - The International Society for Optical Engineering, v. 3323, 1998, p. 414-421
Li, Hing Leung; Lee, Shi-Wei Ricky Conference paper
Thermal fatigue life prediction for solder joints with the consideration of damage evolution
2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, p. 279-285
Zhang, Xiao Wu; Lee, Shi Wei Ricky Conference paper

1997 6

Design for plastic ball grid array solder joint reliability
Circuit World, v. 23, (2), 1997, p. 11-X1
Lee, Shi-Wei Ricky; Lau, John H. Article
Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading
American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1559-1561
Lee, Shi-Wei Ricky; Zhang, Xiao Wu Article
Warpage analysis of plastic ball grid array packages
American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1789-1791
Lee, Shi-Wei Ricky Article
An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity
Proceedings of the Electronic Technology Conference, EPTC, v. 1997, October 1007, p. 82-85
Lee, Shi Wei Ricky; Yan, Chien Chun; Chow, LW; Papageorge, Marc Conference paper
Design for plastic ball grid array solder joint reliability
Proceedings of the NEPCON WEST'97. Part 3 (of 3), Anaheim, CA, USA, v. 2, 1997, Feb, p. 1023-1032
Lee, Shi Wei Ricky; Lau, John H. Conference paper
Solder joint reliability of plastic ball grid array with solder bumped flip chip
Paper - American Society of Mechanical Engineers, 1997
Lee, Shi Wei Ricky; Lau, John H. Conference paper

1996 6

Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages
Circuit World, v. 23, (1), 1996, p. X1-19
Lee, Shi-Wei; Lau, John H. Article
Impact performance of a woven fabric CFRP laminate
Polymers & polymer composites, v. 4, (8), 1996, p. 549-561
Kim, Jang Kyo; Leung, LM; Lee, Ricky Shi Wei; Hirai, Yasunobu Article
Anisotropic piezoelectric laminates for rotary actuators
Proceedings of SPIE - The International Society for Optical Engineering, v. 3321, 1996, p. 484-491
Lee, Shi-Wei Ricky; Li, Hing Leung Conference paper
Design of linear and rotary actuators using piezoelectric composite laminates
Progress in Advanced Materials and Mechanics, Vol. 1; Beijing; China; 12-15 Aug. 1996. pp. 304-309. 1996
Lee, SW R. Conference paper
Impact response of woven fabrics and cross-plies carbon fibre composites
Proc. 5th Symp. of Interfacial Materials Science on Composite Materials, Fukuoka, Japan, May 1996, p. 310-313
Kim, Jang-Kyo; Leung, L.M.; Lee, R.S.W.; Hirai, Y. Conference paper
Mechanical property study of composite grid reinforced concrete
Proceedings of the 2nd International Symposium on Civil Infrastructure Systems, Hong Kong/China, 1996, p. 205-210
Chen, M.; Li, Zongjin; Lee, R.; Tong, Ping Conference paper

1995 4

ON THE APPARENT BENDING ISOTROPY IN CLAMPED ELLIPTIC COMPOSITE LAMINATES
Journal of composite materials, v. 29, (12), 1995, p. 1601-1620
Lee, Shi Wei Ricky; SUN, Chin Teh Article
Actuation of Torsional Motion for Piezoelectric Laminated Beams
Dynamic Response & Behavior of Composites, v. 46, 1995, p. 139-146
Lee, Shi-Wei Ricky; Chan, Kwok Ho W. Conference paper
Bending/Twisting/Shearing Actuation and Sensing of Laminated Composite Beams with Piezopolymer Film
Intelligent Materials and Systems, 1995, p. 137-148
Lee, Shi-Wei Ricky; Sun, C.T. Conference paper
Evaluation of Residual Strength for Cracked Pressure Vessel Repaired by Composite Patch
Proc. ICCE/2 International Conference, New Orleans, LA, August 21-24 1995, p. 449-450
Lee, Shi-Wei Ricky Conference paper

1994 2

On the Sensing and Actuation of Clamped Elliptic Piezoelectric Laminates
Adaptive Structures and Composite Materials, Chicago, IL, USA, v. 45,November 6-11 1994, p. 275-279
Lee, Shi-Wei Ricky Conference paper
The Use of Clamped Circular Piezoelectric Laminates as Pressure Sensors
Proc. 9th ASC Conference, Newark, DE, September 20-22 1994, p. 331-339
Lee, Shi-Wei Ricky Conference paper

1993 3

A Quasi-Static Penetration Model for Composite Laminates
Journal of Composite Materials, v. 27, (3), 1993, p. 251-271
Lee, Shi-Wei Ricky; Sun, Chin Teh Article
Dynamic Penetration of Graphite/Epoxy Laminates Impacted by a Blunt-Ended Projectile
Composites Science & Technology, v. 49, (4), 1993, p. 369-380
Lee, Shi-Wei Ricky; Sun, Chin Teh Article
Bending Characteristics of Clamped Elliptic Symmetric Composite Laminates
Proc. 8th ASC Conference, Cleveland, OH, 20-22 October 1993, p. 1087-1096
Lee, Shi-Wei Ricky; Sun, Chin Teh Conference paper

1992 1

Ballistic Limit Prediction of Composite Laminates by a Quasi-Static Penetration Model
Proc. 24th SAMPE Technical Conference, Toronto, Canada, October 20-22 1992, p. 497-511
Lee, Shi-Wei Ricky; Sun, Chin Teh Conference paper

1991 1

Modeling Penetration Process of Composite Laminates Subjected to a Blunt-Ended Punch
Proc. 23rd SAMPE Technical Conference, Kiamesha Lake, NY, October 21-24 1991, p. 624-638
Lee, Shi-Wei Ricky; Sun, Chin Teh Conference paper

1988 3

Damage in Composite Laminates: Effects of Transverse Cracks
Mechanics of Materials, v. 7, 1988, p. 91-107
Herakovich, C.T.; Aboudi, J.; Lee, Shi-Wei Ricky; Strauss, E.A. Article
Three-Dimensional Analysis of Laminates with Cross Cracks
Journal of Applied Mechanics, ASME Transactions, v. 55, 1988, p. 389-397
Aboudi, J.; Lee, Shi-Wei Ricky; Herakovich, C.T. Article
2-D and 3-D Damage Effects in Cross-Ply Laminates
Mechanics of Composite Materials, Berkeley, CA, USA, v. 92, June 20-22 1988, p. 143-147
Herakovich, C.T.; Aboudi, J.; Lee, Shi-Wei Ricky; Strauss, E.A. Conference paper


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Article 3

Characterization And Evaluation Of 3D-printed Connectors For Microfluidics
Micromachines, v. 12, (8), August 2021, article number 874
Xu, Qianwen; Lo, Jeffery C. C.; Lee, Shi-wei
Fabrication and Reliability Assessment of Cu Pillar Microbumps with Printed Polymer Cores
Journal of Electronic Packaging, Transactions of the ASME, v. 143, (3), September 2021, article number 031101
Qiu, Xing; Lo, Jeffery Chi Chuen; Cheng, Yuanjie; Lee, Shi-wei; Tseng, Yong Jhe; Chiu, Peter
Phosphor-free microLEDs with ultrafast and broadband features for visible light communications
Photonics Research, v. 9, (4), April 2021, p. 452-459
Tian, Zhenhuan; Li, Qiang; Wang, Xuzheng; Zhang, Mingyin; Su, Xilin; Zhang, Ye; Li, Yufeng; Yun, Feng; Lee, Shi-wei

Conference paper 3

Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays
2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 September 2021
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei
Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED Displays via Laser-Patterned Quantum Dots Color Conversion Layer
2021 International Conference on Electronics Packaging, ICEP 2021, May 2021, article number 9451947, p. 153-154
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei
The Study of Far-UVC 222-nm Excilamp and Germicidal-UVC 254-nm Low-pressure Hg Lamp: Optical Characteristics and Service Life
2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 September 2021
Zhao, Fanny; Dong, Guoshuai; Wu, Hao; Yang, Guoming; Shieh, Brian; Lee, S.W.Ricky; Deng, Ronghua


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Article 3

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance
Journal of Electronic Packaging, v. 142, (2), June 2020, article number 021008
Zhang, Qiming; Lee, Shi-wei
Directly Printed Hollow Connectors for Microfluidic Interconnection with UV-Assisted Coaxial 3D Printing
Applied Sciences, v. 10, (10), May 2020, article number 3384
Xu, Qianwen; Lo, Jeffery Chi Chuen; Lee, Shi-wei
UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars
Journal of Microelectromechanical Systems, v. 29, (6), December 2020, article number 9214960, p. 1523-1530
Qiu, Xing; Lo, Chi Chuen; Cheng, Yuanjie; Lee, Shi-wei; Tseng, Yong Jhe; Yi, Hung Kuan; Chiu, Peter

Conference paper 4

Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels
Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, v. 2020, July 2020, article number 9261020
Xu, Hua; Lo, Jeffrey Chi Chuen; Lee, Shi-wei
Dimensionless Correlation between Empirical Modeling and T3ster Measurements for the Dynamic Thermal Characterization of the PWM-mode Current Driving UVLED
2020 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2020, November 2020, article number 9308826, p. 260-265
Zhao, Fanny; Zeng, Yapei; Dong, Guoshuai; Yang, Guoming; Shieh, Brian; Lee, Shi-wei
Printing Unifrom QDs Polymer Thin Film for QLED Applications
Proceedings - Electronic Components and Technology Conference, v. 2020-June, June 2020, article number 9159247, p. 1992-1998
Tu, Ning; Lo, Jeffery Chi Chuen; Lee, Shi-wei
Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display
2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020, August 2020, article number 9201924
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Shieh, Brian; Lee, Shi-wei


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Article 2

Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 9, (3), March 2019, article number 8463575, p. 562-566
Shang, Andrew Weber; Lo, Chi Chuen; Lee, Shi-wei
The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 9, (5), May 2019, article number 8533406, p. 871-876
Shang, Andrew Weber; Lo, Jeffery C. C.; Lee, Shi-wei

Conference paper 9

Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Curing for Microfluidic Connectors
2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9080964
Xu, Qianwen; Lee, Shi-wei; Lo, Jeffery C. C.
Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL
2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081173
Shieh, Brian; Zeng, Fangyun; Yang, Guoming; Zhao, Fanny; Sher, Chin-Wei; Lee, Shi-wei
Evaluation and Benchmarking of Cu Pillar Micro-bumps with Printed Polymer Core
2019 International Conference on Electronics Packaging, ICEP 2019, April 2019, article number 8733457, p. 24-27
Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei; Liou, Ying-Hong; Chiu, Peter
Feasibility study of fan-out panel-level packaging for heterogeneous integrations
Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811162, p. 14-20
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Lin, Curry; Chang, Chieh Lin; Pan, Jhih Yuan; Wu, Hsing Hui; Xu, Iris; Chen, Tony; Li, Zhang; Tan, Kim Hwee; Lo, Penny; So, R.; Chen, Y. H.; Fan, Nelson; Kuah, Eric; Lin, Marc; Cheung, Y. M.; Ng, Eric; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Feasibility study of fan-out wafer-level packaging for heterogeneous integrations
Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811333, p. 903-909
Lau, John; Li, Ming; Xu, Iris; Chen, Tony; Tan, Kim Hwee; Li, Zhang; Fan, Nelson; Kuah, Eric; So, Raymond; Lo, Penny; Cheung, Y. M.; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N.C.; Ko, Cheng Ta; Yang, Henry; Chen, Y. H.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Inkjet Printing PEDOT:PSS without Coffee Ring Effect for QLED Applicaitons
2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081009
Tu, Ning; Lee, Shi-wei
Investigation of Processing Parameters for the Fabrication of Microfluidic Connectors Using a UV-assisted Coaxial 3D Printing System
2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019, v. 2019, December 2019, article number 9026686, p. 640-644
Xu, Qianwen; Lo, Jeffery Chi Chuen; Lee, Shi-wei
Junction Temperature Prediction of the Multi-LED Module with the Modified Thermal Resistance Matrix
2019 16th China International Forum on Solid State Lighting and 2019 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2019, November 2019, article number 9019796, p. 252-255
Zhao, Fanny; Shieh, Brian; Zeng, Fangyun; Yang, Guoming; Lee, Shi-wei
Long-term Stability Evaluation of Thermal Interface Materials (TIMs)
2019 20th International Conference on Electronic Packaging Technology(ICEPT) / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081271
Lo, Jeffery C. C.; Tao, Mian; Cheng, Yuanjie; Xu, Qianwen; Xiao, Kunhui; Lee, Shi-wei


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Article 7

A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs
IEEE Photonics Technology Letters, v. 30, (6), March 2018, p. 513-516
Wang, Jiaqi; Lo, Chi Chuen; Lee, Shi-wei; Tao, Mian; Zou, Huayong; Yun, Feng
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (9), September 2018, article number 8410452, p. 1561-1572
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu-Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Correlation of warpage distribution with the material property scattering for warpage range prediction of PBGA components
Journal of Electronic Packaging, Transactions of the ASME, v. 140, (4), December 2018, article number 041005
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei; Xu, Wei
Design, materials, process, and fabrication of fan-out panel-level heterogeneous integration
Journal of Microelectronics and Electronic Packaging, v. 15, (4), October 2018, p. 141-147
Ko, Cheng Ta; Yang, Henry; Lau, John; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chang, Chieh Lin; Pan, Jhih Yuan; Wu, Hsing Hui; Chen, Y. H.; Chen, Tony; Xu, Iris; Lo, Penny; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Lin, Chia Hung; Beica, Rozalia; Lin, Marc; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (6), June 2018, p. 991-1002
Lau, John H.; Li, Ming; Li, Qingqian Margie; Xu, Iris; Chen, Tony; Li, Zhang; Tan, Kim Hwee; Yong, Qing Xiang; Cheng, Zhong; Wee, Koh Sau; Beica, Rozalia; Ko, C. T.; Lim, Sze Pei; Fan, Nelson; Kuah, Eric; Kai, Wu; Cheung, Yiu-Ming; Ng, Eric; Xi, Cao; Ran, Jiang; Yang, Henry; Chen, Y. H.; Lee, N. C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Fan-Out Wafer-Level Packaging for Heterogeneous Integration
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (9), September 2018, article number 8410488, p. 1544-1560
Lau, John Hon Shing; Li, Ming; Li, Margie Qingqian; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee Raymond; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng Ta; Yang, Henry; Chen, Yu Hua; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Super flexible GaN light emitting diodes using microscale pyramid arrays through laser lift-off and dual transfer
Optics Express, v. 26, (2), January 2018, p. 1817-1824
Tian, Zhenhuan; Li, Yufeng; Su, Xilin; Feng, Lungang; Wang, Shuai; Ding, Wen; Li, Qiang; Zhang, Ye; Guo, Maofeng; Yun, Feng; Lee, Shi-wei

Conference paper 17

A Power Inductor Integration Technology Using a Silicon Interposer for DC-DC Converter Applications
Proceedings of the International Symposium on Power Semiconductor Devices and ICs, v. 2018-May, June 2018, p. 347-350
Ding, Yixiao; Fang, Xiangming; Gao, Yuan; Cai, Yuefei; Qiu, Xing; Mok, Kwok Tai Philip; Lee, Shi-wei; Lau, Kei May; Sin, Johnny Kin On
Additive Manufacturing of Micro-channels on a Silicon Substrate based on Coaxial Printing Dispenser with in-situ UV LED Curing
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging / IEEE. New York, NY, USA : IEEE, 2018, Article no.: 8660886
Xu, Qianwen; Lee, Shi-wei; Lo, Chi Chuen
Additive Manufacturing of Micro-scale Tunnels on a Silicon Substrate with in-situ UV LED Curing for MEMS Applications
2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings, 26 November 2018, article number 8546382
Lee, Shi-wei; Xu, Qianwen; Lo, Chi Chuen
Analysis of pulse-driven LED junction temperature and its reliability
2018 15th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2018 / IEEE. New York, NY, USA : IEEE, 2018, p. 23-26, Article no.: 8587392
Yang, Nick G. M.; Shieh, Brian Y. R.; Zeng, Trio F. Y.; Lee, Shi-wei
Broadband Emission of Asymmetric Pyramids obtained by Laser Drilling and SAG for Application of Phosphor Free White LEDs
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660821
Tian, Zhenhuan; Li, Qiang; Su, Xilin; Zhang, Ye; Guo, Maofeng; Zhang, Minyan; Ding, Wen; Li, Yufeng; Yun, Feng; Lee, Shi-wei
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Proceedings - Electronic Components and Technology Conference, v.2018-May, August 2018, article number 8429574, p. 355-363
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material Properties
Proceedings - Electronic Components and Technology Conference, v. 2018-May, August 2018, article number 8429625, p. 718-723
Zhang, Qiming; Lo, Jeffery.C.C.; Lee, Shi-wei; Xu, Wei
Effect of Material Properties and Bump Parameters on Capillary Filling in Through-Silicon-Via Underfill Dispensing
2018 20th International Conference on Electronic Materials and Packaging (EMAP), March 2019, article number 8660884
Le, Fuliang; Lee, Shi-wei; Tao, Mian; Lo, Chi Chuen
Fan-out wafer-level packaging for heterogeneous integration
Proceedings - Electronic Components and Technology Conference, v.2018-May, August 2018, article number 8429869, p. 2360-2366
Lau, John H.; Li, Ming; Li, Margie; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng-Ta; Yang, Henry; Chen, Yu-Hua; Tao, Mian; Lo, Jeffery; Lee, Shi-wei
Investigation of Light Scattering Effect Impact on Optical Performance of Phosphor Converted White Light Emitting Diodes
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660928
Wang, Jiaqi; Lee, Shi-wei; Shieh, Brian
Investigation of the Influence of Packaging Material Degradation on the Optical Performance of Phosphor Converted White Light Emitting Diodes
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660758
Wang, Jiaqi; Lee, Shi-wei; Shieh, Brian
Measurement of Dynamic Junction Temperature for LED Flash Units of Camera
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 / IEEE. New York, NY, USA : IEEE, 2018, Article no.: 8480831
Shieh, Brian; Zeng, Fangyun; Lee, Shi-wei; Yang, Guoming
Quantum Dot Light Emitting Diodes Based on ZnO Nanoparticles
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660807
Tu, Ning; Kwok, Z. H. Eric; Lee, Shi-wei
Reliability of Fan-out Wafer-level Packaging With Large Chips And Multiple Re-distributed Layers
Proceedings - Electronic Components and Technology Conference, v. 2018-May, August 2018, article number 8429752, p. 1574-1582
Lau, John Hon Shing; Li, Ming; Yang, Lei; Yong, Qing Xiang; Cheng, Zhong; Chen, Tony; Xu, Iris; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee Raymond; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Beica, Rozalia; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, NC; Ko, Cheng Ta; Yang, Henry; Chen, YH; Tao, Mian; Lo, Jeffery C.C.; Lee, Shi-wei
Solderability Evaluation of Printed Silver Solder Pad for Wafer-level Packaging
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018 / IEEE. New York, NY, USA : Institute of Electrical and Electronics Engineers Inc., 2018, p. 350-354
Tao, Mian; Lo, Jeffery C.C.; Liou, Ying Hong; Chiu, Peter; Lee, Shi-wei
Thermal Characterization of Multi-chip Light Emitting Diodes With Thermal Resistance Matrix
2017 14th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2017, v. 2018-January, January 2018, p. 32-37
Zou, Huayong; Lu, Lingyan; Wang, Jiaqi; Shieh, Brian; Lee, Shi-wei
Thermal Simulation for High Power LED Systems with Remote Phosphor Layer
EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660903
Zhang, Minshu; Xie, An; Lo, Chi Chuen; Lee, Shi-wei; Ahmatjan, Madina; Hong, Feichi; Yin, Haotian


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Article 3

3D Chip Stacking with through Silicon-vias (TSVs) for Vertical Interconnect and Underfill Dispensing
Journal of Micromechanics and Microengineering, v. 27, (4), March 2017, article number 045012
Le, Fuliang; Lee, Shi-wei; Zhang, Qiming
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
Journal of Microelectronics and Electronic Packaging, v. 14, (4), October 2017, p. 123-131
Lau, John H.; Li, Ming; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Chen, Tony; Xu, Iris; Li, Margie; Cheung, Y.M.; Kai, Wu; Hao, Ji; Beica, Rozalia; Taylor, Tom; Ko, C. T.; Yang, Henry; Chen, Y. H.; Lim, Sze Pei; Lee, N. C.; Ran, Jiang; Wee, Koh Sau; Yong, Qingxiang; Xi, Cao; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Growth, Characterization, and Application of Well-defined Separated Gan-based Pyramid Array on Micropatterned Sapphire Substrate
Applied Physics Express, v. 10, (9), September 2017, article number 092101
Tian, Zhenhuan; Li, Yufeng; Su, Xilin; Feng, Lungang; Wang, Shuai; Zhang, Minyan; Ding, Wen; Li, Qiang; Zhang, Ye; Guo, Maofeng; Yun, Feng; Lee, Shi-wei

Conference paper 9

A Novel Chip-on-Board White Light-emitting Diode Design for Light Extraction Enhancement
Conference Proceedings - 2016 13th China International Forum on Solid State Lighting, SSLCHINA 2016 / IEEE. New York, NY, USA : IEEE, 2017, p. 24-27, Article no.: 7804342
Zou, Huayong; Wang, Jiaqi; Feng, Mingxin; Shieh, Brian; Lee, Shi-wei
Effect of the Surface Curvature of the Phosphor Layer on the Optical Performance of a WLED
Conference Proceedings - 2016 13th China International Forum on Solid State Lighting, SSLCHINA 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 20-23, Article no.: 7804341
Wang, Jiaqi; Lee, Shi-wei; Zou, Huayong
Effects of Interconnect Layout and Underfill Thermal Conductivity on the Thermal Resistance of Flip-Chip LEDs
19th International Conference on Electronics Materials and Packaging, EMAP 2017, Matsue, Japan, 25-28 September 2017
Shang, Andrew Weber; Cai, Yuefei; Lo, Chi Chuen; Lee, Shi-wei
Investigation on the Influence of Phosphor Particle Size Gradient on the Optical Performance of White Light-Emitting Diodes
Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 / IEEE. New York, NY, USA : IEEE, 2017, p. 259-263, Article no.: 7861483
Wang, Jiaqi; Lee, Shi-wei; Zou, Huayong
Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for through Silicon Vias
18th International Conference on Electronic Packaging Technology, ICEPT 2017, September 2017, article number 8046728, p. 1537-1541
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, C.P.
Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control
Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 / IEEE. New York, NY, USA : IEEE, 2017, p. 1153-1160, Article no.: 7992619
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei
Packaging of UV LED with a Stacked Silicon Reflector for Converged UV Emission
2017 International Conference on Electronics Packaging, ICEP 2017 / IEEE. New York, NY, USA : IEEE, 2017, p. 259-263, Article no.: 7939371
Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei
Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test
Proceedings - IEEE 67th Electronic Components and Technology Conference, 1 August 2017, article number 7999729, p. 448-455
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei
Transient Light Emission Microscopy for Detecting the Non-Uniform Junction Temperature in Flip-Chip Light Emitting Diodes
Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, v. 2017, April 2017, article number 7896944, p. 297-301, 2017 Thirty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm)
Tao, Mian; Lee, Shi-wei


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Article 2

An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 6, (8), Aug 2016, article number 7509610, p. 1174-1180
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints
Microelectronics Reliability, v. 62, July 2016, p. 130-140
Yang, Chaoran; Le, Fuliang; Lee, Shi-wei

Book chapter 1

Characterisation of Copper Diffusion in Through Silicon Vias
Materials for Advanced Packaging / Edited by Daniel Lu & C.P. Wong. Switzerland : Springer, 2016, p. 923-951
Zhang, Xiaodong; Lee, Shi-wei; Le, Fuliang

Conference paper 15

A Method for Measuring Thermal Conductivity of Paste Materials
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, 4 October 2016, article number 7583185, p. 510-513
Feng, Wilson; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei
Application of Nano Silver sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583297, p. 1004-1009
Tao, Mian; Mei, Yunhui; Lee, Shi-wei; Yun, Feng; Lu, Guoquan
Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation
Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 1312-1319, Article no.: 7517700
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei; Xu, Wei; Yang, Weihua
Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583078, p. 1-6
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei
Effect of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package
2016 International Conference on Electronics Packaging, ICEP 2016, June 2016, article number 7486781, p. 52-56
Lee, Shi-wei; Tian, Zhenhuan; Zhang, Minshu; Xie, An
Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583144, p. 318-321
Xie, Jinqi; Zhong, Zhe; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping
Experimental Parametric Study on the Bumping and Coining of Gold Studs for Flip Chip Bonding
China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463955
Ren, Rongbin; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei
Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583171, p. 439-442
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping
Investigation of Reliability of EMC and SMC on Reflectance for UV LED Applications
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 658-664, Article no.: 7463398
Qiu, Xing; Lo, Chi Chuen; Shang, Andrew W.; Lee, Shi-wei
Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583147, p. 331-333
Wen, Haoran; Ji, Yaqiang; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping
Low-dielectric-constant Novel Periodic Mesoporous Organosilica Thin Film for Interlayer Dielectric
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583109, p. 153-156
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping
Novel Periodic Mesoporous Organosilica Thin Film with Low Dielectric Constant and High Mechanical Property
China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463952
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping
Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum
2016 International Conference on Electronics Packaging, ICEP 2016, June 2016, article number 7486782, p. 57-61
Lo, Chi Chuen; Lee, Shi-wei; Guo, Xungao; Zhao, Huishan
Sensitivity Study on the Precision of Data Acquisition for LED Life Prediction Based on the Degradation of Luminous Output
2016 6th Electronic System-Integration Technology Conference, ESTC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.:7764509
Lo, Jeffrey Chi Chuen; Yang, Guoming; Tao, Mian; Lee, Shi-wei
Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging
China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463954
Shang, Andrew Weber; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei; Le, Fuliang


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Article 3

Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (10), October 2015, p. 1525-1532
Le, Fuliang; Lee, Shi-wei; Lo, Chi Chuen; Yang, Chaoran
Lens Forming by Stack Dispensing for LED Wafer Level Packaging
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (1), January 2015, article number 6965571, p. 15-20
Zhang, Rong; Lee, Shi-wei; Lo, Chi Chuen
Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (8), August 2015, article number 7163313, p. 1178-1185
Le, Fuliang; Lee, Shi-wei; Yang, Chaoran; Lo, Chi Chuen

Conference paper 10

Detection of the Non-uniformity of Junction Temperature in Large Light-emitting Diode Using an Improved Forward Voltage Method
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 / IEEE. New York, NY, USA : IEEE, 2015, Article no.: 7103108
Tao, Mian; Lee, Shi-wei
Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias
Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159872, p. 1973-1979
Zhang, Guoping; Jiang, Kun; Liu, Qiang; Li, Jinhui; Sun, Rong; Lee, Shi-wei; Wong, C. P.
Fluxless Packaging of an Implantable Medical Device for Transcorneal Electrical Stimulation
Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2016-February, February 2016, article number 7412282
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung
Influence of Rubber Nanoparticles on the Properties of Novolac-diazonaphthoquinone Based Photoresist
16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds.. New York, NY, USA : IEEE, 2015, p. 1039-1042, Article no.: 7236757
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping
Investigation of the Influence of Ag Reflective Layer on the Correlated Color Temperature and the Angular Color Uniformity of LED with Conformal Phosphor Coating
16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu., W eds. New York, NY, USA : IEEE, 2015, p. 830-834, Article no.: 7236709
Tian, Zhenhuan; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Sun, Rong
Investigation on the Thermal Degradation Mechanism of Cu-Sn Intermetallic Compound in SAC Solder Joints with Cohesive Zone Modeling
Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159722, p. 1029-1037
Yang, Chaoran; Lee, Shi-wei
Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, v. 2, 2015, article number V002T02A046
Wang, Jiaqi; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Tao, Mian
Simulation and Optimization on Thermal Performance of LED Filament Light Bulb
2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015 / IEEE. New York, NY, USA : IEEE, 2015, p. 88-92, Article no.: 7360696
Feng, Wilson; Feng, Bruce; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei
Thermally Conductive Adhesives Based on Silver Coated Copper Flake Fillers
16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds. New York, NY, USA : IEEE, 2015, p. 294-296, Article no.: 7236595
Xie, Jinqi; Ren, Huming; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping
Wafer Level Bumping Technology for High Voltage LED Packaging
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings / IEEE. New York, NY, USA : IEEE, 2015, p. 54-57, Article no. 7365183
Wei, Tiwei; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei


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Article 3

Comparison of ball pull strength among various Sn-Cu-Ni solder joints with different pad surface finishes
Journal of Electronic Packaging, Transactions of the ASME, v. 136, (1), March 2014, article number 011003
Yang, Chaoran; Song, Fubin; Lee, Shi-wei
Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
Applied Thermal Engineering, v. 63, (2), February 2014, p. 588-597
Ye, Huaiyu; Koh, Sau Wee; Yuan, Cadmus; van Zeijl, Henk; Gielen, Alexander W.J.; Lee, Shi-wei; Zhang, Guoqi
Impact of Ni Concentration on the Intermetallic Compound Formation and Brittle Fracture Strength of Sn-Cu-Ni (SCN) Lead-free Solder Joints
Microelectronics Reliability, v.`54, (2), February 2014, p. 435-446
Yang, Chaoran; Song, Fubin; Lee, Shi-wei

Conference paper 5

Development of a real-time monitoring system with uni-photodetector for LED long term reliability tests
Proceedings: 2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014), Editors: Keyun Bi, Zhong Tian, Ziqiang Xu. The Institute of Electrical and Electronics Engineers, Inc., 2014, p. 1477-1481
Zhang, Grace G.; Lu, Sophie L.Y.; Yang, Nick G.M.; Zou, Sam H.Y.; Zhong, Steven D.L.; Lo, Chi Chuen; Lee, Ricky Shi Wei
Lens forming by stack dispensing for LED wafer level packaging
2014 International Conference on Electronics Packaging, ICEP 2014, IEEE, 2014, p. 670-675, Article number 6826763
Zhang, Rong; Lee, Ricky Shi-wei; Lo, Chi Chuen
Multilayer Dispensing of Remote Phosphor for LED Wafer Level Packaging with Pre-formed Silicone Lens
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, November 2014, article number 6962713
Lo, Chi Chuen; Lee, Ricky Shi Wei; Guo, Xungao; Zhao, Huishan
O-2 Plasma Treatment in Polymer Insulation Process for Through Silicon Vias
Proceedings of the Electronic Packaging Technology Conference, EPTC, October 2014, article number 6922644, p. 235-238
Zhuang, Lulu; Jiang, Kun; Zhang, Guoping; Tang, Jiaoning; Sun, Rong; Lee, Ricky S W
Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking
Proceedings - Electronic Components and Technology Conference, September 2014, article number 6897397, p. 919-924
Le, Fuliang; Lee, Ricky Shi-wei; Lau, Kei May; Yue, Chik Patrick; Sin, Johnny Kin On; Mok, Philip Kwok Tai; Ki, Wing Hung; Choi, Hoi Wai


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Article 1

電子材料界面裂紋的新型濕氣壓力模型
電子元件與材料=Electronic Components & Materials, (2), 2013, p. 62-65
張旻澍; 李世瑋; 盧智銓

Conference paper 12

Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays
Proceedings - 2013 IEEE 63rd Electronic Components Conference, May 2013, article number 6575818, p. 1788-1793
Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Shi Wei Ricky
Brittle Fracture of Intermetallic Compounds in SAC Solder Joints under High Speed Ball Pull/Pin Pull and Charpy Impact Tests
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 1294-1299
Yang, Chaoran; Xu, Guangsui; Lee, Ricky Shi-wei; Zhang, Xinping
Design and Implementation of Fine Pitch COB LED Display
2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177325, p. 108-111
Yang, Nick G.M.; Jin, Gavin S.G.; Niu, Mike D.Y.; Gao, Andy G.X.; Lee, S. W. Ricky
Experimental Characterization of Adhesion Strength between the Silicone Encapsulant and the Bottom of a SMD LED Leadframe Cup
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756676, p. 1212-1216
Zou, Sam H.Y.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-Wei Ricky
Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via
Proceedings - Electronic Components and Technology Conference, 2013, article number 6575554, p. 81-85
Zhao, Songfang; Zhang, Guoping; Peng, Chongnan; Sun, Rong; Lee, Ricky S W; Zhu, Wenhui; Lai, Fangqi
LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer
13th International Conference on Electronics Packaging (ICEP2013), Osaka, Japan, 10-12 April 2013
Liu, Huihua; Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhao, Huishan
Measurement and Analysis of Interfacial Adhesion Strength between the Silicone Encapsulant and the Side Wall of a SMD LED Leadframe Cup
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756544, p. 612-616
Zhong, Steven D.L.; Zou, Sam H.Y.; Lo, Chi Chuen; Lee, Shi-Wei Ricky
Optical Characterization of a Light Bulb with the Waffle Pack LED WLP Module
2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177334, p. 142-146
Liu, Huihua; Lo, Jeffery C.C.; Lee, Shi Wei Ricky
Quasi-conformal Phosphor Dispensing on LED for White Light Illumination
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 563-567
Lee, Shi Wei Ricky; Guo, Xungao; Niu, Daoyuan; Lo, Chi Chuen
Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013
Lo, Chi Chuen; Liu, Huihua; Lee, Shi Wei Ricky; Gu, Xungao; Zhao, Huishan
Thermal Characterization of a Printed Circuit Board with Thermal Vias for The Application of High Brightness Light-emitting Diodes
China International Forum on Solid State Lighting, ChinaSSL, v. 2013, 2013, article number 7177331, p. 128-131
Tao, Mian; Feng, Zicheng; Swanson, John; Ganjei, John; Lo, Chi Chuen; Lee, Shi Wei Ricky
Wetting Behavior of Polymer Liquid in Insulation Process for through Silicon via
2013 14th International Conference on Electronic Packaging Technology (ICEPT 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 360-363
Zhao, S.; Zhang, G.; Sun, R.; Lee, S.W.R.


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Article 5

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging
IEEE Transactions on Device and Materials Reliability, v. 12, (2), June 2012, article number 6168823, p. 189-193
Zhang, Rong; Lo, Chi Chuen; Lee, Shi-wei
Emerging trend for LED wafer level packaging
Frontiers of Optoelectronics, v. 5, (2), June 2012, p. 119-126
Lee, Shi-wei; Zhang, Rong; Chen, Kewei; Lo, Chi Chuen
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches
Microelectronics Reliability, v. 52, (5), May 2012, p. 922-932
Zhang, Rong; Lee, Shi-wei
Reliability of high-power LED packaging and assembly
Microelectronics Reliability, 52, (5), May 2012, p. 761-761
Liu, Cheng-Yi; Lee, Shi-wei; Shin, Moo Whan; Lai, Yi-Shao
電子塑封材料的高溫界面強度研究
电子元件与材料=Electronic Components & Materials, v. 31, (7), 2012, p. 67-69
張旻澍; 謝安; 李世瑋; 盧智銓

Book chapter 1

绿色电子封装技术与材料
绿色微纳电子学 /王阳元 编. 北京: 科学出版社， 2010, p. 223-306
李世玮; 程玉华; 宋复斌; Lo, Chi Chuen

Conference paper 16

Assessment of Non-uniform Temperature Effect on BGA De-component Process
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, p. 977-980
Tang, Kun; Song, Fubin; Lee, Ricky Shi Wei; Lo, Chi Chuen
Comparative Study on Dendrite Formation on Solder Pads with ImAg and OSP Surface Finishes Using Water Drop Test Method
12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, April 17-20 2012, p. 274-279
Tang, Kun; Song, Fubin; Lee, Shi-Wei Ricky
COMPARISON OF FATIGUE CRACK INITIATION/PROPAGATION AND DAISY-CHAIN RESISTANCE IN LEAD-FREE SOLDER JOINTS UNDER TEMPERATURE CYCLING TEST
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, p. 579-583
Chan, Yuen Sing; Song, Fubin; Lee, Shi Wei Ricky; Yang, Chaoran; Lo, Chi Chuen
Determination of Driving Current of RGB LEDs for White Light Illumination
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, p. 1540-1545
Zhao, Huishan; Lee, Ricky Shi Wei
Development of innovative cold pin pull test method for solder pad crater evaluation
14th International Conference on Electronic Materials and Packaging, EMAP 2012,, Hong Kong, 13-16 December 2012
Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Ricky Shi Wei
Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants
14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, sesion P048, article number 6507893
Peng, Chongnan; Zhang, Guoping; Sun, Rong; Lee, Ricky
Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips
35th International Electronics Manufacturing Technology (IEMT) Conference, Ipoh, Malaysia, 6-8 November 2012, session number P141
Tao, Mian; Lee, Shi-Wei Ricky; Yuen, Mathew M.F.; Zhang, Guoqi; Driel, W. van
Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED
2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012, Kyoto, Japan, 10-12 Dec 2012, session P11-3, article number 6523414
Zhao, Huishan; Chen, Changying; Lee, Shi-Wei Ricky
Fast Copper Plating Process for Through Silicon Via (TSV) Filling
ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, v. 11, 2011, p. 855-863
Wang, Su; Lee, Shi-wei Ricky
Investigation of fracture behaviors of Cu-Sn intermetallics using impact test
2012 2nd IEEE CPMT Symposium Japan, ICSJ, Kyoto, Japan, 10-12 Dec 2012, session P11-4, article number 6523420
Yang, Chaoran; Lee, Ricky Shi-wei
Investigation on Mechanical Properties and Bonding Parameters of Copper Wire Bonding
12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, 17-20 April 2012, p. 654-660
Cao, Jun; Ding, Yutian; Lee, Shi-Wei Ricky
LED wafer level packaging with a remote phosphor cap
14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P068, article number 6507885
Liu, Huihua; Zhang, Rong; Lo, Chi Chuen; Lee, Shi-Wei Ricky
Reverse wire bonding and phosphor printing for LED wafer level packaging
Proceedings - Electronic Components Conference, 2012, p. 1814-1818
Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhang, Rong; Li, Mei
TSV Plating Using Copper Methanesulfonate Electrolyte with Single Component Suppressor
4th IEEE Electronics System-integration Technology Conference (ESTC), Amsterdam, Netherlands, 17-20 September, p. 1-5
Wu, Hailong; Lee, Shi-Wei Ricky
Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects
14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P061, article number 6507881
Zhang, Minshu; Lo, Chi Chuen; Lee, Shi-Wei Ricky
Underfill dispensing for 3D die stacking with through silicon vias
Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012, San Diego, California, USA, 2012, p. 548-553
Le, Fuliang; Lee, Ricky Shi-wei; Wu, Jingshen; Yuen, Matthew Ming Fai


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Article 3

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
Journal of Electronic Packaging, Transactions of ASME, v. 133, (3), September 2011, article number 031010
Lau, John H.; Zhang, M. S.; Lee, Shi-wei
Investigation on Copper Diffusion Depth in Copper Wire Bonding
Microelectronics Reliability, v. 51, (1), January 2011, p. 166-170
Chen, Catherine H.; Zhang, Shawn X.; Lee, Shi-wei; Mohamed, Lebbai
Spacing optimization of high power LED arrays for solid state lighting
Journal of Semiconductors, v. 32, (1), January 2011, article number 014005
Chan, Yuen Sing; Lee, Shi-wei

Book chapter 2

Shock test methods and test standards for portable electronic devices
Structural Dynamics of Electronic and Photonic Systems / Edited by Ephraim Suhir, David S. Steinberg, T. X. Yu. Hoboken, New Jersey : John Wiley & Sons, Inc., 2011, p. 159-173, Ch. 7
Zhou, C.Y.; Yu, Tongxi; Lee, Shi-wei; Suhir, Ephraim
Technologies and Materials for Green IC Packaging
Green Micro/Nano Electronics / Wang, Yangyuan, Cheng, Yuhua, Chi, Minhwa. Berlin: Springer, p. 248-359
Lee, Ricky Shi Wei; Cheng, Y.; Song, F.; Lo, Irene M C

Conference paper 13

A comparison of copper sulfate and methanesulfonate electrolytes in the copper plating process for through silicon via metallization
Advanced Packaging Materials, International Symposium on, 2011, p. 291-296
Wu, H.L.H.; Lee, Ricky Shi Wei
Advanced LED wafer level packaging technologies
Proceedings of technical papers, 2011, p. 71-74
Lee, Shi-Wei Ricky
Characterization and Comparison between the SnCuNi IMC in SnCu Solder with ENIG Pad Finish and in SnCuNi Solder with OSP Pad Finish
2011 International Conference on Electronic Materials and Packaging (EMAP), Kyoto, Japan, 2011
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi-wei
Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests
EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings, 2011
Jiang, Tong; Xu, Zhengjian; Lee, Shi Wei Ricky; Song, Fubin; Lo, Chi Chuen; Yang, Chaoran
Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints
Proceedings - Electronic Components Conference, 2011, p. 1070-1078
Chan, Y.S.; Lee, Ricky Shi Wei
Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish
Proceedings - Electronic Components Conference, 2011, p. 971-978
Yang, C.; Song, F.; Lee, Ricky Shi Wei
Enhancement of thermal conductivity of die attach adhesives (DAAs) using nanomaterials for high brightness light-emitting diode (HBLED)
Proceedings - Electronic Components Conference, 2011, p. 667-672
Lu, D.; Liu, C.; Lang, X.; Wang, B.; Li, Z.; Lee, W.M.P.; Lee, Ricky Shi Wei
Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches
2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 2011
Lo, Chi Chuen; Zhang, R.; Lee, Ricky Shi Wei; Wang, Z.
Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, p. 500-505, Article number6066885
Chan, Y.S.; Song, F.; Lee, Ricky Shi Wei
LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection
Proceedings - 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), June 2011, article number 5898727, p. 1616-1621
Zhang, Rong; Lee, Ricky Shi-wei; Xiao, David guowei; Chen, Haiying
Mechanical shock test performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag, BGA components with SAC305 solder paste on NiAu and OSP board surface finishes
IPC APEX EXPO Technical Conference 2011, v. 4, 2011, p. 3014-3077
Bath, Jasbir; Eagar, Wade; Bigcraft, Chad; Newman, Keith; Hu, Livia; Henshall, Gregory; Nguyen, Jennefier; Lee, M.J.; Syed, Ahmer; Xie, Weidong; Song, Fubin; Lee, Ricky
Nondestructive inspection of through silicon via depth using scanning acoustic microscopy
International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, January 2011, article number 5699482
Zhang, Minshu; Lee, Ricky Shi-wei; Wu, Hailong; Zhang, Rong
Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging
Proceedings of technical papers, 2011, p. 343-346
Wu, H. L. Henry; Lee, Ricky Shi Wei


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Article 2

3D IC Integration with TSV Interposers for High Performance Applications
Chip scale review, v. 14, (5), September 2010, p. 26-29
Lau, John H.; Chan, Y. S.; Lee, Shi-wei
3D LED and IC wafer level packaging
Microelectronics International, v. 27, (2), May 2010, p. 98-105
Lau, John; Lee, Shi-wei; Yuen, Ming Fai; Chan, Philip Ching Ho

Book chapter 3

Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-induced Damages in Polymeric Materials in Electronic Packaging
Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 1, p. 1-28
Fan, X.J.; Lee, S.W.R.
Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages
Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 15, p. 389-409
Zhang, M.S.; Lee, S.W.R.; Fan, X.J.
Nano-scale and Atomistic-scale Modeling of Advanced Materials
Nano-bio-electronic, Photonic and MEMS Packaging / Edited by C.P. Wong, Kyoung-Sik (Jack) Moon, Yi Li. New York: Springer, c2010, p. 719-758
Dai, Ruo Li; Liao, Wei-Hsin; Lin, Chun-Te; Chiang, Kuo-Ning; Lee, Shi-Wei Ricky

Conference paper 15

A novel vapor pressure transfusion model for the popcorning analysis of Quad Flat No-lead (QFN) packages
Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, 2010
Zhang, Minshu; Lee, Ricky Shi Wei
ASSESSMENT OF RELATIVE THERMAL FATIGUE LIFE OF SAC LEAD-FREE AND TIN-LEAD SOLDERS WITH CUSTOM-MADE BGA ASSEMBLIES CREATING VARIOUS STRESS RANGES
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, p. 803-807
Chan, Y.S.; Yang, C.; Lee, S. W. Ricky
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Proceedings - Electronic Components and Technology Conference, 2010, p. 464-470
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi Wei; Newman, K.
Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, 2010
Chan, Y.S.; Lee, Ricky Shi Wei
Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors
Proceedings - Electronic Components and Technology Conference, 2010, p. 926-934
Song, F.; Yang, C.; Henry Wu, H.L.; Lo, Chi Chuen; Ricky Lee, S.W.; Newman, K.
Embedded 3D hybrid IC integration System-in-Package (SiP) for opto-electronic interconnects in organic substrates
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, v. 4, 2010, p. 129-136
Lau, John H.; Zhang, Minshu; Lee, Shi-wei
Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging
2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, IEEE, 2010, p. 1386-1392, Article number 5582822
Chen, Kewei; Zhang, Rong; Lee, Ricky Shi-wei
Modeling of board level solder joint reliability under mechanical drop test with the consideration of plastic strain hardening of lead-free solder
2010 IEEE CPMT Symposium Japan, ICSJ10, 2010
Xu, Z.J.; Jiang, Tong; Song, Fubin; Lo, Jeffery; Lee, Ricky Shi Wei
Nanoindentation characterization of lead-free solders and intermetallic compounds under thermal aging
43rd International Symposium on Microelectronics 2010, IMAPS 2010, 2010, p. 314-318
Jiang, T.; Song, Fubin; Yang, Cheng; Ricky Lee, S.W.
Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design
Proceedings - Electronic Components and Technology Conference, 2010, p. 1166-1172
Xie, B.; Shi, X.Q.; Chung, C.H.; Lee, Ricky Shi Wei
Predictive Modeling and Experimental Validation of Lead-Free Solder Joint Reliability under Temperature Cycling
2010 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE, 2010, p. 585-592
Chan, Y.S.; Song, F.; Lo, C. C. Jeffery; Lee, Eddie; Lee, S. W. Ricky
Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging
12th International Conference on Electronics Materials and Packaging, Singapore, 25-27 October 2010
Zhang, Rong; Lee, Ricky Shi-wei
Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate
7th China International Forum on Solid State Lighting (SSLCHINA 2014), Guangzhou, China, 15-17 October 2010
Lee, Ricky Shi-wei; Lo, Chi Chuen; Zhang, Rong
Solid state light tube with periodic units of lateral-emitting LEDs
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), June 2010 , article number 5490788, p. 673-678
Lee, Shi-wei; Zhang, Rong; Leung, Wai Lok Wesley
Thermal-enhanced and cost-effective 3D IC integration with TSV (Through-Silicon Via) interposers for high-performance applications
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 4, 2010, p. 137-144
Lau, John Hon Shing; Chan, Yuen Sing; Lee, Shi-wei


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Article 4

Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability
IEEE transactions on components and packaging technologies, v. 32, (3), 2009, SEP, p. 693-700
Chauhan, Preeti; Osterman, Michael; Lee, S. W. Ricky; Pecht, Michael
Experimental investigations and model study of moisture behaviors in polymeric materials
MICROELECTRONICS RELIABILITY, v. 49, (8), 2009, AUG, p. 861-871
Fan, X.J.; Lee, Ricky Shi Wei; Han, Q.
Micro thermoelectric cooler: Planar multistage
International Journal of Heat and Mass Transfer, v. 52, (7-8), March 2009, p. 1843-1852
Hwang, Gisuk; Gross, Andrew J.; Kim, Hanseup; Lee, S. W.; Ghafouri, Niloufar; Huang, Baoling; Lawrence, Christin; Uher, Ctirad; Najafi, Khalil; Kaviany, Massound
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
IEEE transactions on components and packaging technologies, v. 32, (4), 2009, DEC, p. 901-908
Nie, Lei; Osterman, Michael; Song, Fubin; Lo, Jeffery; Lee, S. W. Ricky; Pecht, Michael

Conference paper 13

Comparison of thermal fatigue reliability of SnPb and SAC solders under various stress range conditions
2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, 2009, p. 1119-1123
Yang, C.; Chan, Yuen Sing; Lee, Ricky Shi Wei; Ye, Y.; Liu, S.
Comparison of Thermal Fatigue Reliability of SnPb and SAC Solders under Various Stress Range Conditions
2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, p. 1038-1042
Yang, Chaoran; Chan, Yuen Sing; Lee, S. W. Ricky; Ye, Yuming; Liu, Sang
Correlation between Material Selection and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages
2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, p. 563-568
Zhang, Minshu; Lee, S. W. Ricky; Zhang, Jack; Yun, Howard; Starkey, Dale; Chau, Hung
Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State Lighting
42nd International Symposium on Microelectronics (IMAPS), San Jose, CA,USA, 1-5 November, pp. 937-944
Chan, Yuan Sing; Lee, Shi-Wei Ricky
Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting
2008 International Conference on Electronic Materials and Packaging (EMAP 2008), IEEE, 2009, p. 255-258, Article number 4784277
Lee, Ricky Shi-wei; Tong, Y.W.; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong
Effect of UBM and BCB layers on the thermo-mechanical reliability of Wafer Level Chip Scale Package (WLCSP)
Procceedings of 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference / IEEE. Taiwan : IEEE, 2009, p. 407-410
Chan, Yuen Sing; Lee, Shi-wei; Song, Fubin; Lo, Chi Chuen; Jiang, T.
Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2009, p. 863-868
Song, Fubin; Newman, K.; Yang, C.; Lee, Ricky Shi Wei
Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests
EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2009, p. 245-252
Song, Fubin; Jiang, Tong; Lo, Chi Chuen; Lee, Ricky Shi Wei; Newman, Keith
Investigation of the Relationship between Material Selections and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages
17th European Microelectronics and Packaging Conference and Exhibition (EMPC 2009), Palacongressi, Rimini (Italy), 14-17 Jun 2009
Zhang, Minshu; Lee, Ricky S W
Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability
Proceedings - Electronic Components and Technology Conference, 2009, p. 125-133
Wu, H.L.H.; Song, F.; Lo, Chi Chuen; Jiang, T.; Newman, K.; Lee, S.W.R.
Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting
2009 Proceedings of 59th Electronic Components and Technology Conference, June 2009, article number 5074321, p. 2137-2142
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong
Stress analysis of hygrothermal delamination of Quad Flat No-lead (QFN) packages
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 12, 2009, p. 339-347
Zhang, Minshu; Lee, Ricky Shi Wei; Fan, Xuejun
Surface analysis of outgassing contamination from edgebond epoxy adhesives on imag pads
Proceedings - Electronic Components and Technology Conference, 2009, p. 155-160
Wu, H.L.H.; Song, F.; Newman, K.; Lee, S.W.R.


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Article 5

Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain
IEEE transactions on components and packaging technologies, v. 31, (3), 2008, SEP, p. 683-690
Tsai, Ming-Yi; Chen, YuC; Lee, Shi Wei Ricky
Drop/impact tests and analysis of typical portable electronic devices
International journal of mechanical sciences, v. 50, (5), 2008, MAY, p. 905-917
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W.
Eddy current induced heating for the solder reflow of area array packages
IEEE transactions on advanced packaging, v. 31, (2), 2008, MAY, p. 399-403
Li, Mingyu; Xu, Hongbo; Lee, Shi-Wei Ricky; Kim, Jongmyung; Kim, Daewon
Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish
IEEE transactions on electronics packaging manufacturing, v. 31, (3), 2008, JUL, p. 185-191
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T.
Reliability Study of Surface Mount Printed Circuit Board Assemblies with Lead-free Solder Joints
Soldering & Surface Mount Technology, v. 20, (2), 2008, p. 30-38
Lo, Chi Chuen; Jia, B.F.; Liu, Zhe; Zhu, Jungao; Lee, Shi Wei Ricky

Conference paper 10

A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders
Proceedings - Electronic Components and Technology Conference, 2008, p. 146-154
Song, Fubin; Lo, Chi Chuen; Lam, Jimmy K.S.; Jiang, Tong; Lee, Shi Wei Ricky
Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers
Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, 2008, p. 321-326
Lam, Jimmy K.S.; Lee, Shi Wei Ricky
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 5, 2008, p. 47-53
Lo, Chi Chuen; Lee, Shi Wei Ricky
Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications
Proceedings - Electronic Components and Technology Conference, 2008, p. 1887-1892
Lo, Chi Chuen; Lee, Shi Wei Ricky; Wu, Henry Hailong; Lam, Jimmy K.S.
Development of novel dicing process by anisotropic wet etching with convex corner compensation
10th Electronics Packaging Technology Conference, EPTC 2008, 2008, p. 161-166
Lam, Jimmy K.S.; Lee, Ricky Shi Wei
Fabrication of Nanoscale Vias by Offset Patterning
MicroNano2008-2nd International Conference on Integration and Commercialization of Micro and Nanosystems, Proceedings, 2008, p. 615-618
Lau, Chi Ho; Lee, Ricky Shi Wei
Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-lead (QFN) Packages
Proc. ASME International Mechanical Engineering Congress & Exposition, Boston, MA, 31 October-6 November, IMECE2008/68120 (on CD-ROM)
Zhang, M.; Lee, Ricky Shi Wei
Numerical analysis and experimental validation for the prediction of flip chip solder joint standoff height in MEMS microphone application
IEEE 9th VLSI Packaging Workshop in Japan, VPWJ 2008, 2008, p. 45-48
Lo, Chi Chuen; Lee, Ricky Shi Wei
Wafer level encapsulation process for LED array packaging
2007 International Conference on Electronic Materials and Packaging, IEEE, 2008, Article number 4510307
Zhang, Rong; Lee, Ricky Shi-wei
Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation
Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008, IEEE, 2008, Article number 4607038
Zhang, Rong; Lee, Ricky Shi-wei


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Article 1

Electro-elastic analysis of piezoelectric laminated plates
Advanced composite materials, v. 16, (1), 2007, JAN, p. 63-81
Zhao, Minghao; Qian, Caifu; Lee, Shi Wei Ricky; Tong, Pin; Suemasu, H.; Zhang, Tong-Yi

Book chapter 1

Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow
Micro- and Opto-electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging / Vol. 2, Physical Design--Reliability and Packaging/ Edited by E. Suhir, Y.C. Lee, C.P. Wong. New York: Springer, c2007, chapter 6, p. 151-173
Lee, Shi-Wei Ricky; Lo, Chi Chuen

Conference paper 20

Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests
Proceedings - Electronic Components Conference, 2007, p. 364-372
Song, Fubin; Lee, S. W. Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen
Characteristics of copper-to-silicon diffusion in copper wire bonding
Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, 2007, p. 2-9
Zhang, Shawn X.; Lee, Shi Wei Ricky; Lau, A.K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, Maarten
Characterization and comparison of five SAC-based solder pastes for pb-free reflow soldering
HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007, p. 10-17
Chen, Catherine H.; Wong, Wallace; Lo, Chi Chuen; Song, Fubin; Lee, Shi Wei Ricky
Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests
Proc. 16th European Microelectronics & Packaging Conference (EMPC), Oulu, Finland, 17-20 June, pp. 213-218
Song, Fubin; Lee, Shi-Wei Ricky; Clark, Stephen; Sykes, Bob; Newman, Keith
Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 450-458
Song, F.; Ricky Lee, S.W.; Newman, K.; Clark, S.; Sykes, B.
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 5, 2007, p. 47-54
Lo, Chi Chuen; Lee, Shi Wei Ricky
Design of experiment (DoE) study on effects of various geometric parameters on copper diffusion in through silicon vias (TSVs)
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, p. 32-37
Zhang, Shawn X.; Lee, S. W. Ricky
Development of 2D modeling techniques for the thermal fatigue analysis of solder joints of a module mounted in a 3D cavity on a printed circuit board
EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings, 2007, p. 713-718
Chan, Yuen Sing; Lee, Shi Wei Ricky; Ye, Yuming; Liu, Sang
Drop impact of a typical portable electronic device - experiments and modeling
Proceedings of the 7th International Conference on Shock and Impact Loads on Structures, 2007, p. 61-70
Yu, Tongxi; Zhou, C.Y.; Lee, Ricky S.W.
Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 463-470
Song, F.; Ricky Lee, S.W.; Newman, K.; Reynolds, H.; Clark, S.; Sykes, B.
Effect of V-groove side wall feature on epoxy flow in passive alignment of optical fiber
6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Proceedings 2007, 2007, p. 202-208
Lam, K. S. Jimmy; Lee, S. W. Ricky
Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board)
Proc. 9th International Conference on Electronic Materials and Packaging (EMAP), Daejon, Korea, 19-22 November, EMAP2007-P013
Lau, John H.; Lo, Chi Chuen; Lam, Jimmy K.S.; Soon, E.L.; Chow, W.S.; Lee, Shi-Wei Ricky
Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, v. 2007, 2007, p. 39
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M.
Effects of tooling tip wear and fixture rigidity on solder ball shear and ball pull tests
IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2, 2007, p. 889-894
Song, Fubin; Lee, S. W. Ricky
Effects of underfills on the thermal-cycling tests of SnAgCu PBGA (Plastic Ball Grid Array) packages on ImAg PCB (Printed Circuit Board)
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 785-790
Lau, J.; Lo, Chi Chuen; Lam, J.; Soon, E.L.; Chow, W.S.; Lee, R.
High-speed solder ball shear and pull tests vs. board level mechanical drop tests: Correlation of failure mode and loading speed
Proceedings - Electronic Components and Technology Conference, 2007, p. 1504-1513
Song, Fubin; Lee, Shi Wei Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen
Multi-stacked flip chips with copper plated through silicon vias and re-distribution for 3D system-in-package integration
Materials Research Society Symposium Proceedings, v. 970, 2007, p. 179-190
Lee, Shi-Wei Ricky; Hon, Ronald
Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres
ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 474-480
Song, F.; Ricky Lee, S.W.
Screen-printing of yellow phosphor powder on blue Light Emitting Diode (LED) arrays for white light illumination
2007 Proceedings of the ASME InterPack Conference, IPACK 2007, v. 1, 2007, p. 19-24
Lee, Ka Ho; Lee, Shi Wei Ricky
Wetting characteristics of solder reflow on copper traces without solder mask
ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 438-443
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lam, Jimmy K.S.; Wong, Wallace K.H.


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Article 2

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties
IEEE transactions on components and packaging technologies, v. 29, (1), 2006, MAR, p. 164-172
Gong, JF; Chan, PCH; Xiao, GW; Lee, RSW; Yuen, MMF
便携式电子产品的跌落冲击响应试验，仿真和理论
力学进展=Advances in Mechanics, v. 2006, (02), 2006, p. 239-246
周春燕; 余同希; 李世瑋

Conference paper 24

Characterization of intermetallic compound formation and copper diffusion of copper wire bonding
Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1821-1826
Zhang, S.; Chen, C.; Lee, R.; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M.
Comparison between experimental measurement and numerical analysis of warpage in PBGA package and assembly with the consideration of residual strain in the molding compound
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006
Tsai, Ming Yi; Chen, Yung Cheng; Lee, Shi Wei Ricky
Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability
Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 891-898
Song, Fubin; Lee, Shi Wei Ricky
Design of shock table tests to mimic real-life drop conditions for portable electronic device
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, (EMAP2006) Hong Kong, 11-14 December, 2006., v. 1-3, p. 674-678
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W.
Design, process development and prototyping of 3D packaging with multi-stacked flip chips and peripheral through silicon via interconnection
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 2006, p. 80-85
Hon, Ronald; Lee, Shi Wei Ricky
Development and prototyping of a HB-LED array module for indoor solid state lighting
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006, p. 141-145
Lee, Shi Wei Ricky; Lau, C.H.; Chan, Siu Ping; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Chi Chuen
Development and prototyping of a HB-LED array module for indoor solid state lighting
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006, p. 192-196
Lee, S. W. Ricky; Lau, C.H.; Chan, S.P.; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Jeffery C.C.
Drop impact of a typical portable electronic device
WIT Transactions on the Built Environment, v. 87, 2006, p. 505-514
Zhou, C.Y.; Yu, T.X.; Lee, R.S.W.
Drop impact of typical portable electronic product device
The 9th Int. Conf. on Structures Under Shock & Impact (SUSI 2006), New Forest, UK,, 3-5 July, 2006.
Zhou, C.Y.; Yu, Tongxi; Lee, R.S.W.
Effect of high temperature storage on reliability of Sn-Ag-Cu flip chip solder bumps
International Conference on Electronic Materials and Packaging, EMAP, v. 2006, December 2006, article number 4430604
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T.
Effect of Microstructure on Thermal and Mechanical Properties of PBGA Substrates
Proc. 8th International Conference on Electronic Materials and Packaging (EMAP), Kowloon, Hong Kong, 11-14 December, pp. 533-539
Tang, G.C.W.; Shing, J.W.K.; Chen, Haibin; Lee, Shi-Wei Ricky; Wu, Jingshen; McLellan, Neli
Effect of solder mask thickness on shear and pull tests of lead-free solder balls
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, 2006
Song, Fubin; Lee, Shi Wei Ricky
Effects of Al pad deformation and TiW barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding
IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, p. 189-195
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, Angie K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, M.
Effects of microstructure on thermal and mechanical properties of PBGA substrates
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 830-836
Tang, George Cw; Shing, Jacqueline Wk; Chen, Haibin; Lee, Ricky; Wu, Jingshen
Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 687-693
Lau, Dennis; Chan, Y.S.; Lee, S. W. Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang
Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 866-872
Lau, Dennis; Chan, Y.S.; Lee, Shi Wei Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang
Fracture analysis on popcorning of plastic packages during solder reflow
Fracture of Nano and Engineering Materials and Structures: Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006 / Edited by E. E. Gdoutos. The Netherlands : Springer, 2006, p. 749-750
Lee, Shi-Wei Ricky; Lau, Dennis Chung Yin
Impact of IMC thickness on lead-free solder joint reliability under thermal aging: Ball shear tests vs. cold bump pull tests
2006 International Microsystems, Packaging, Assembly Conference Taiwan (IMPACT), Proceedings, 2006, p. 109-112
Lee, Shi Wei Ricky; Song, Fubin
Investigation of IMC thickness effect on the lead-free solder ball attachment strength: Comparison between ball shear test and cold bump pull test results
Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1196-1203
Song, Fubin; Lee, Shi Wei Ricky
Investigation of the effect of PCB base materials and pad surface finish on the thermal fatigue life of lead-free solder joints of PBGA and passive resistors
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 166-172
Song, Fubin; Lee, Shi Wei Ricky; Osterman, Michael; Pecht, Michael
Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60°C
Electronic Components and Technology Conference, v. 2006, May 2006, article number 1645851, p. 1476-1483
Lau, John; Lee, Shi-wei; Song, Fubin; Lau, Chung Yin; Shangguan, Dongkai
Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias and Re-Distribution for 3D System-in-Package Integration
Proc. MRS Symposium on Enabling Technologies for 3D Integration, Vol. 970, Boston, MA, 27-29 November pp. 179-190
Lee, Shi-Wei Ricky; Hon, R.
Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2006, p. 379-384
Lee, Ka Ho; Lee, Shi Wei Ricky
Thermal resistance analysis of a multi-stack flip chip 3-d package
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 145-149
Chan, Yuen Sing; Lee, Shi Wei Ricky


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Article 2

Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing
IEEE transactions on advanced packaging, v. 28, (3), 2005, AUG, p. 413-420
Tsui, Yat Kit; Lee, Shi Wei Ricky
Foreword: Three-dimensional packaging
IEEE Transactions on Advanced Packaging, v. 28, (3), 2005, Aug, p. 354-355
Bauer, Charles E.; Lee, Shi Wei Ricky

Book 1

電子製造技術：利用無鉛、無鹵素和導電膠材料
化學工業出版社, 北京, 中國 / ISBN 7-5025-7004-7, 548 pages
劉, 漢誠; 汪, 正平; 李, 寧成; 李, 世瑋

Conference paper 13

3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling
Proceedings - Electronic Components and Technology Conference, v. 1, 2005, p. 795-801
Lee, Shi Wei Ricky; Hon, Ronald; Zhang, Shawn Xiaodong; Wong, Chun Keung
A systematic approach for determining the thermal fatigue-life of plastic ball array (PBGA) lead-free solder joints
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1021-1029
Lau, J.; Lee, R.; Dauksher, W.; Shangguan, D.; Song, F.; Lau, D.
Assessment of long-term reliability in lead-free assemblies
Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v. 2005, 2005, p. 140-155
Ganesan, S.; Wu, J.; Pecht, M.; Lee, R.; Lo, Chi Chuen; Fu, Y.; Li, Y.; Xu, M.
Characterization of copper-to-silicon diffusion for the application of 3D packaging with through silicon vias
2005 6th International Conference on Electronics Packaging Technology, v. 2005, 2005
Zhang, Xiaodong; Lee, Shi-Wei Ricky; Weng, Lutao; So, Sylvia
Correlation between the strain on the printed circuit board and the stress in chips for the failure prediction of passive components
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 115-121
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky
Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls
2005 6th International Conference on Electronics Packaging Technology, v. 2005, 2005
Song, Fubin; Lee, Shi Wei Ricky
Evaluation of bondability and reliability of single crystal copper wire bonding
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), 2005, p. 238-244
Chen, Hua; Lee, Shi Wei Ricky; Ding, Yutian
Experimental investigation of the effect of reflow cooling rate on the IMC growth of SAC lead-free solder alloy
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 123-129
Song, Fubin; Lee, Shi Wei Ricky
Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition
Proceedings - Electronic Components Conference, 2005, p. 1783-1791
Lau, D.; Tsang, M.; Lee, SWR; Lo, Chi Chuen; Fu, LF; Jin, JW; Liu, S.
Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging, San Francisco, California, USA, 17-22 July 2005, p. 947-953 (IPACK2005/73299 on CD-ROM)
Zhang, Xiaodong; Hon, Ronald; Lee, Shi-Wei Ricky
Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection
PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, p. 384-389
Hon, R.; Lee, SWR; Zhang, SX; Wong, CK
Optimization of epoxy flow for passive alignment of optical fiber arrays
Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v. 2005, 2005, p. 132-136
Lo, Chi Chuen; Li, Chung Yeung; Tai, Chung Leung; Lee, Shi Wei Ricky
Thermal-fatigue life prediction equation for Plastic Ball Grid Array (PBGA) SnAgCu lead-free solder joints
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1013-1019
Lau, John; Lee, Shi Wei Ricky; Song, Fubin; Shangguan, Dongkai; Lau, Dennis C.; Dauksher, Walter


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Article 1

Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate
Soldering & Surface Mount Technology, v. 16, (2), 2004, p. 21-26
Yan, Eric C.C.; Lee, Shi Wei Ricky; Huang, Xingjia

Book chapter 1

Electronic Manufacturing Service Industries in China
China's Electronics Industries / Edited by M.G. Pecht, Y.C. Chan, College Park, Maryland: CALCE EPSC Press, 2004, p.109-136
Donahoe, Daniel; Lee, Shi-Wei Ricky

Conference paper 14

A new method for the solder ball pull test using a shape memory alloy tube
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 237-242
Lo, Chi Chuen; Lau, Dennis Chung Yin; Lee, Shi Wei Ricky; Chan, Simon; Chan, Franky; Chau, K.C.
Characteristics of Resistance of Daisy-Chained PBGA Solder Joints under Thermal Fatigue Load, Three-Point Bending Load and Mechanical Drop Load
6th International Symposium on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, December 5-7, pp. 204-209
Lui, Ben Hoi Wai; Lee, Shi-Wei Ricky; Zhang, Shawn Xiao Dong
Chip-on-chip 3D optical interconnect with passive alignment
Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 2015-2019
Lo, Chi Chuen; Lee, Ricky Shi Wei; Wu, Jingshen; Kim, Jang Kyo; Yuen, Matthew Ming Fai
Computational analyses on the effects of irregular conditions during accelerated thermal cycling tests on board level solder joint reliability
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 516-521
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky
Computational model validation with experimental data from temperature cycling tests of PBGA assemblies for the analysis of board level solder joint reliability
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004, 2004, p. 115-120
Lee, Shi Wei Ricky; Lau, Dennis Chung Yin
Effects of underfill adhesion on flip chip package reliability
Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC), 2004, p. 96-101
Sham, Man Lung; Kim, Jang Kyo; Lee, R.S.W.; Wu, Jingshen; Yuen, Matthew Ming Fai
Experimental assessment of passive alignment of optical fibers With V-grooves on silicon optical bench
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 375-380
Lo, Chi Chuen; Lee, Shi Wei Ricky
Finite element analysis for thermal fatigue life estimation of PBGA solder joints with model validation by experimental data
ITHERM 2004, VOL 2, 2004, p. 724
Lee, SWR
Formation and Plugging of Through-Silicon-Vias for 3D Packaging
7th VLSI Packaging Workshop of Japan (VLSI2004), Kyoto, Japan, 29 November-2 December, pp. 105-108,
Lee, Shi-Wei Ricky; Hon, Ronald; Zhang, Shawn Xiao Dong; So, Sylvia
Formation of through-silicon-vias by laser drilling and deep reactive ion etching
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 243-248
Hon, Ronald; Zhang, Shawn Xiaodong; Lee, Shi Wei Ricky
Gold embrittlement of solder joints in wafer level chip scale package on printed circuit board with Ni/Au surface finish
Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 400-406
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T.
Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves
Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 830-834
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai
Thermal fatigue-life prediction of lead-free solder joints
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, November 2004, article number IMECE2004-62493, p. 265-270
Lau, John H.; Lee, Shi-Wei Ricky; Shangguan, Dongkai
Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)
Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 1563-1569
Lau, John H.; Shangguan, Dongkai; Lau, Dennis Chung Yin; Kung, Terry T.W.; Lee, Shi Wei Ricky


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Book 2

Electronics Manufacturing with Lead-free, Halogen-free, and Conductive Adhesive Materials
McGraw-Hill, New York, NY
Lau, John; Wong, C.P.; Lee, N.C.; Lee, S. W. Ricky
芯片尺寸封裝: 設計, 材料, 工藝, 可靠性及應用
清華大學出版社, 北京, 中國 / ISBN 7-302-07376-7/TN.147, 435 pages
劉, 漢誠; 李, 世瑋; 賈, 松良; 王, 水弟; 蔡, 堅

Conference paper 9

A Reliability Comparison of Electroplated and Stencil Printed Flip-Chip Solder Bumps Based on UBM Related Intermetallic Compound Growth Properties
53rd Electronic Components and Technology Conference, ECTC, New Orleans, USA, 27-30 May, pp. 685-691
Gong, Jing-Feng; Xiao, Guo-Wei; Chan, Philip C.H.; Lee, Ricky S.W.; Yuen, Matthew M.F.
Effects of thermal aging and Au addition on the electrical resistance of solder balls in flip chip and ultra-CSP packages
ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, p. 831-836
Huang, XJ; Lee, SWR; Li, M.; Chen, W.
Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages
Proceedings of InterPACK’03, Maui, Hawaii, U.S.A., July 6-11, IPACK2003-35246 on CD-ROM
Huang, Xingjia; Lee, Shi-Wei Ricky; Li, Ming; Chen, William
Multi-chip memory module with a flip-chip-on-chip structure and an optional center via hole for underfill dispensing
Proceedings - Electronic Components and Technology Conference, 2003, p. 864-869
Lee, Shi Wei Ricky; Tsui, Yat Kit; So, Raymond; Luo, Le
Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies
Proceedings - Electronic Components and Technology Conference, 2003, p. 1850-1855
Xiao, G.W.; Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F.
Optimization of stencil printing wafer bumping for fine pitch flip chip applications
Proceedings - Electronic Components and Technology Conference, 2003, p. 1724-1730
Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F.
Passive alignment of optical fiber in a V-groove with low viscosity epoxy flow
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 3, November 2003, article number IMECE2003-43902, p. 403-406
Lo, Chi Chuen; Yung, C.S.; Lee, Shi-wei; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai
The impact of the AC current crowding effect on BJT RF noise modeling
2003 IEEE CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS, 2003, p. 327-330
Lee, Wai Kit; Man, Tsz Yin; Mok, Philip K.T.; Ko, Ping Keung; Chan, Man Sun
Three-dimensional packaging for multi-chip module with through-the-silicon via hole
PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, p. 1-7
Tsui, Yat Kit; Lee, Ricky S W; Wu, Jingshen; Kim, Jang Kyo; Yuen,Matthew Ming Fai


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Article 8

Analysis on solder ball shear testing conditions with a simple computational model
Soldering & Surface Mount Technology, v. 14, (1), 2002, p. 45-48
Lee, SWR; Huang, XJ
Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders
Soldering & Surface Mount Technology, v. 14, (3), 2002, p. 46-50
Lee, Shi Wei Ricky; Lui, Ben Hoi Wai; Kong, YH; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector
Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package
IEEE transactions on advanced packaging, v. 25, (4), 2002, NOV, p. 514-521
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Choi, Kwang Seong; Kim, Young Gon
Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP)
IEEE transactions on components and packaging technologies, v. 25, (1), 2002, MAR, p. 3-14
Lau, John H.; Lee, Shi Wei Ricky
Micro-machined Conformal silicon Molds for wafer bumping and probing
INTERNATIONAL journal OF NONLINEAR sciences and Numerical SIMULATION, v. 3, (3-4, Sp. Iss. SI), 2002, p. 399-404
Lee, Shi Wei Ricky; Lo, Chi Chuen; Law, K.H.
Modeling and analysis of 96.SSn-3.SAg lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board
IEEE transactions on electronics packaging manufacturing, v. 25, (1), 2002, JAN, p. 51-58
Lau, John H.; Lee, Shi Wei Ricky
Modeling of torsional vibration induced by extension-twisting coupling of anisotropic composite laminates with piezoelectric actuators
Smart materials & structures, v. 11, (1), 2002, FEB, p. 55-62
Zhu, Mei-Ling; Lee, Shi-Wei Ricky; Li, Hing-Leung; Zhang, Tong-Yi; Tong, Pin
Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications
Journal of Electronic Packaging, v. 124, (3), July 2002, p. 205-211
Lau, John; Lee, Ricky Shi Wei; Pan, S.H.; Chang, Chris

Conference paper 9

Effects of room temperature storage time on the shear strength of PBGA solder balls
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 2, 2002, p. 259-262
Lee, Shi Wei Ricky; Tsui, Yat-Kit; Hunag, Xingjia; Yan, Eric C.C.
Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls
14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-4 (IMECE2002/39514 on CD-ROM)
Lee, S. W. Ricky; Tsui, Y.K.; Huang, X.; Yan, C.C.
Evaluation of board level reliability of Pb-free PBGA solder joints
International Advanced Packaging Materials Symposium, v. 2002, March 2002, article number 990368, p. 82-89
Lee, Shi-wei; Lui, Hon Wai Ben; Kong, Y.K.; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector
Experimental Evaluation on Solder Joint Reliability of PBGA Assembly under Mechanical Drop Test
14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-5 (IMECE2002/39493 on CD-ROM)
Lee, Shi Wei Ricky; Li, Tracy Yin Lai; Lui, Ben Hoi Wai
Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging
PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, p. 478-481
Tsui, YK; Lee, SWR; Huang, XJ
Experimental investigation on the progressive failure mechanism of solder balls during ball shear test
Proceedings - Electronic Components and Technology Conference, 2002, p. 968-973
Huang, Xingjia; Lee, Shi Wei Ricky; Yan, Chien Chun
Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener
Proceedings - Electronic Components and Technology Conference, 2002, p. 112-118
Xiao, G.W.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F.
Stress Relaxation in Plastic Molding Compounds
International Symposium on Electronic Materials & Packaging (EMAP2002), December 4-6, Kaohsiung, Taiwan, pp. 37-42
Lee, M.; Pecht, M.G.; Huang, X.; Lee, S. W. Ricky
Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects
PhoPack2002, July 14-16, Stanford, California, U.S.A., pp. 26-30
Lau, John; Lee, S. W. Ricky


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Article 5

Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations
Circuit World, v. 28, (2), 2001, p. 32-38
Lee, Shi-Wei Ricky; Lau, John H.
Computational Analysis on the Effects of Double-Layer Build-Up Printed Circuit Board on the Wafer Level Chip Scale Package (WLCSP) Assembly with Pb-Free Solder Joints
International Journal of Microcircuits & Electronic Packaging, 24(2), 89-104
Lau, John; Lee, S. W. Ricky
Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies
International Journal of Microcircuits & Electronic Packaging, v. 24, (2), 2001, p. 246-262
Huang, Xingjia; Kallmayer, Christine; Aschenbrenner, Rolf; Lee, S. W. Ricky
Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies
IEEE transactions on components and packaging technologies, v. 24, (2), 2001, JUN, p. 285-292
Lau, John H.; Chang, Chris; Lee, Shi Wei Ricky
以PZT薄膜为驱动和传感的微型陀螺研制
壓電與聲光, v. 23, (1), February 2001, p. 18-22
马薇; 李世玮; 虞吉林

Book 1

Microvias for Low-Cost High-Density Interconnects
McGraw-Hill, New York, NY
Lau, John; Lee, S. W. Ricky

Conference paper 9

Bending analysis of piezoelectric laminates
IUTAM SYMPOSIUM ON SMART STRUCTURES AND STRUCTRONIC SYSTEMS, v. 89, 2001, p. 275-282
Zhao, MH; Qian, CF; Lee, SWR; Tong, P.; Zhang, TY
Characterization and analysis on the solder ball sheer testing conditions
Proceedings - Electronic Components Conference, 2001, p. 1065-1071
Huang, XJ; Lee, SWR; Yan, CC; Hui, S.
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy
Advances in Electronic Packaging, v. 1, 2001, p. 307-313
Dai, Lanhong; Lee, Shi-Wei Ricky
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 1, 2001, p. 237-242
Lee, Shi-Wei Ricky; Dai, Lanhong
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 2, 2001, p. 2301-2306
Lee, Shi-Wei Ricky; Dai, Lanhong
Dynamic structural coupling behaviours of an anti-symmetric piezoelectric laminate
Proceedings of SPIE - The International Society for Optical Engineering, v. 4326, 2001, p. 331-339
Wong, Kelvin H.L.; Lee, Shi-Wei Ricky
Effects of plasma cleaning on the reliability of wire bonding
Advances in Electronic Materials and Packaging, v. 2001, November 2001, article number 983955, p. 39-43
Nowful, J.M.; Lok, S.C.; Lee, Shi-wei
Reliability of 96.5Sn-3.5Ag lead-free solder-bumped wafer level chip scale package (WLCSP) on build-up microvia printed circuit board
2001 HD Interntional Conference on Hig-Density Interconnect and Systems Packaging, Santa Clara, CA, United States, 17-20 April 2001; Proceedings of SPIE - The International Society for Optical Engineering, v. 4428, 2001, p. 314-322
Lau, John H.; Lee, Shi Wei Ricky
Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate
Proceedings - Electronic Components and Technology Conference, 2001, p. 598-605
Xiao, G.; Chan, P.C.H.; Teng, A.; Lee, R.S.W.; Yuen, M.M.F.


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Article 12

A damage evolution model for thermal fatigue analysis of solder joints
Journal of electronic packaging, v. 122, (3), 2000, SEP, p. 200-206
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Pao, Yihsin
Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion
Key engineering materials, v. 177-1, (Part 1&2), 2000, p. 267-272
Dai, Lan Hong; Lee, Shi Wei Ricky; Huang, Xing Jia
Design and manufacturing of micro via-in-pad substrates for solder bumped flip chip applications
Journal of Electronics Manufacturing, v. 10, (1), 2000, p. 79-87
Lau, J.; Chang, C.; Lee, R.; Chen, T.Y.; Cheng, D.; Tseng, T.J.; Lin, D.
Effects of electric fields on the bending behavior of PZT-5H piezoelectric laminates
Smart materials and structures, v. 9, (6), 2000, p. 824-831
Cheng, Jinquan; Qian, Caifu; Zhao, Minghao; Lee, Shi Wei Ricky; Tong, Pin; Zhang, Tong-Yi
Failure analysis of solder bumped flip chip on low-cost substrates
IEEE transactions on electronics packaging manufacturing, v. 23, (1), 2000, JAN, p. 19-27
Lau, John H.; Chang, Chris C.P.; Lee, Shi Wei Ricky
Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills
Journal of Electronic Packaging, Transactions of the ASME, v. 112, (4), 2000, Dec, p. 306-310
Lau, John H.; Lee, Shi Wei Ricky
Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate
IEEE TRANSACTIONS on ULTRASONICS FERROELECTRICS and FREQUENCY control, v. 47, (6), 2000, NOV, p. 1561-1574
Zhu, ML; Lee, SWR; Zhang, TY; Tong, P.
Solder joint reliability of plastic ball grid array with solder bumped flip chip
Soldering & Surface Mount Technology, v. 12, (2), 2000, p. 16-23
Lee, Shi Wei Ricky; Lau, John H.
Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method
Journal of Electronic Packaging, Transactions of the ASME, v. 122, (1), 2000, March, p. 34-41
Lau, John H.; Lee, Shi Wei Ricky
一种新颖的四梁式压电薄膜微型陀螺
中國科學技術大學學報=Journal of china university of science and technology, v. 30, (4), August 2000
马薇; 李世玮; 虞吉林
引线框架用铜合金与Sn-Pb共晶焊料界面组织研究
功能材料, v. 31, (5), 2000, p. 494-495
王谦; Lee, Shi Wei Ricky; 曹育文; 唐祥云; 马莒生
电子封装中的焊点及其可靠性
電子元件與材料, v. 19, (2), 2000, p. 24-26
王谦; LEE, Shi-Wei Ricky; 汪刚强; 耿志挺; 黄乐; 唐祥云; 马莒生

Conference paper 10

An analytical method of extension-twisting coupling vibration of piezoelectric composite laminates
7th International Conference on Structural Dynamics: Recent Advances; Southampton; UK; 24-27 July 2000, pp. 121-134. 2000
Zhu, M.L.; Lee, S.W.R.; Zhang, T.Y.; Tong, P.
Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, p. 868-873
Lee, Shi Wei Ricky; Yan, Chien Chun; Karim, Zaheed; Huang, Xing Jia
Effects of Build-Up Printed Circuit Board Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package (WLCSP)
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904141, p. 115-126
Lau, John H.; Lee, Ricky S W
Effects of electric fields on the bending behavior of piezoelectric composite laminates
Materials Research Society symposia proceedings, v. 604, 2000, p. 59-64
Cheng, Jin Quan; Zhang, Tong Yi; Zhao, Ming Hao; Qian, Cai Fu; Lee, Shi Wei Ricky; Tong, Pin
Experimental Characterization for the Shear Strength of Pb-Free Solder Balls on a PZT Substrate with Pd/Ag Pads
Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2000, 2000, Article number 906354, p. 86-90
Huang, Xingjia; Lee, Ricky S W; Tse, Wansze
Modeling for prototyping of rotary piezoelectric motors
Structures and Materials, v. 7, 2000, p. 21-30
Lee, Shi-Wei Ricky; Zhu, Mei-Lirig; Wong, H.L.
Reliability of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag Lead-Free Solder Joints on Build-Up Microvia Printed Circuit Board
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904133, p. 55-63
Lau, John H.; Lee, Ricky S W
Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies
50th Electronic Components and Technology Conference, Las Vegas, NV, USA, 2000, p. 1360-1368
Lau, John; Chang, Chris; Lee, Shi Wei Ricky
Study on the Interfaces Between Copper Alloys for Lead Frame and Sn-Pb Solder Alloys
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904185, p. 388-390
Qian, Wang; Lee, Ricky S W; Yuwen, Cao; Jusheng, Ma A.
The Mechanical Properties Degradation of Solder Joints Under Thermal Cycling
2000, Article number 904153, p. 194-196
Wang, Qian; Lee, Ricky S W; Wang, Gangqiang; Chen, Guohai; Hung, Le; Ma, Jusheng


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Article 4

Assembly of large PBGAs on printed circuit board with large PQFPs directly on the opposite side
Journal of Electronics Manufacturing, v. 9, (4), 1999, p. 293-298
Lau, John H.; Lee, Shi-Wei Ricky; Chao, Henry
Computational analysis for the torsional vibration control of an anti-symmetric piezoelectric composite laminate
Journal of intelligent material systems and structures, v. 10, (7), 1999, JUL, p. 530-533
Lee, Shi Wei Ricky; Li, Hing Leung
Design and analysis of a microgyroscope with sol-gel piezoelectric plate
Smart materials & structures, v. 8, (2), 1999, APR, p. 212-217
He, Guohong; Nguyen, Christopher C.T.; Hui, JCM; Lee, Shi Wei Ricky; Luong, Howard Cam
Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages
Journal of Electronic Packaging, Transactions of the ASME, v. 121, (4), 1999, Dec, p. 242-248
Lau, John; Chen, Tony; Lee, Shi Wei Ricky

Book 1

Chip Scale Package (CSP): Design, Materials, Process, Reliability & Applications
McGraw-Hill / New York, NY. (ISBN 0-07-038304-9, 564 pages)
Lau, J.H.; Lee, S.W.R.

Conference paper 4

Design and Performance of a Piezoelectric Microgyroscope
10th International Conference on Solid-State Sensors and Actuators (Transducers' 99), June 1999
Cheung, V.S.L.; Ma, W.; Luong, H.C.; Lee, R.
Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board
Proceedings of the 1999 International Symposium on Microelectronics, Chicago, IL, USA, v.3906, 26-28 October 1999, p. 592-598
Lau, John H.; Lee, Shi Wei Ricky; Ouyang, Chien
Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 1-4 June 1999, p. 571-582
Lau, John H.; Lee, Shi Wei Ricky; Chang, Chris; Ouyang, Chien
Global Collaborative Electronic Packaging Education
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, p. 907-911
Tong, Pin; Lam, David C C; Yuen, Matthew Ming Fai; Kim, Jang Kyo; Lee, Ricky S W; Lee, Steve Han Keung; Chan, Philip Ching Ho


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Article 10

Computational modeling and analysis of a center-cracked panel repaired by bonded composite patch
Key Engineering Materials, v. 145-149, 1998, p. 601-606
Chau, RWT; Lee, Shi Wei Ricky
Critical issues in computational modeling and fatigue life analysis for PBGA solder joints
International Journal of Microcircuits and Electronic Packaging, v. 21, (3), 1998, p. 253-261
Zhang, Xiaowu; Lee, Shi Wei Ricky
Development and characterization of a rotary motor driven by anisotropic piezoelectric composite laminate
Smart materials & structures, v. 7, (3), 1998, JUN, p. 327-336
Lee, SWR; Li, HL
Effects of temperature profile on the life prediction of PBGA solder joints under thermal cycling
Key engineering materials, v. 145-9, (Part 1&2), 1998, p. 1133-1138
Zhang, Xiao Wu; Lee, Shi Wei Ricky
Experimental investigation of the shear strength of a unidirectional carbon/aluminum composite under dynamic torsional loading
Composites science and technology, v. 58, (10), 1998, p. 1667-1673
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky
Material response and failure mechanism of unidirectional metal matrix composites under impulsive shear loading
Key engineering materials, v. 141-1, (Part 1-2), 1998, p. 651-669
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky
Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading
Circuit World, v. 24, (3), 1998, p. 26-31
Lee, Shi-Wei Ricky; Zhang, Xiaowu
Solder joint reliability of cavity-down plastic ball grid array assemblies
Soldering & Surface Mount Technology, v. 10, (1), 1998, FEB, p. 26-31
Lee, Shi Wei Ricky; Lau, John H.
Special Issue on Piezoelectric Motors/Actuators and Their Applications - Preface
Smart Materials and Structures, v. 7, (3), June 1998, p. U3
Lee, Ricky S W
Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models
Key engineering materials, v. 145-9, (Part 1&2), 1998, p. 1127-1132
Park, Joo Hyuk; Kim, Jang Kyo; Yuen, Matthew Ming Fai; Lee, Shi Wei Ricky; Tong, Penger; Chan, Philip Ching Ho

Conference paper 2

Computational modeling and parametric study of a rotary actuator driven by piezoelectric composites
Proceedings of SPIE - The International Society for Optical Engineering, v. 3323, 1998, p. 414-421
Li, Hing Leung; Lee, Shi-Wei Ricky
Thermal fatigue life prediction for solder joints with the consideration of damage evolution
2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, p. 279-285
Zhang, Xiao Wu; Lee, Shi Wei Ricky


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Article 3

Design for plastic ball grid array solder joint reliability
Circuit World, v. 23, (2), 1997, p. 11-X1
Lee, Shi-Wei Ricky; Lau, John H.
Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading
American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1559-1561
Lee, Shi-Wei Ricky; Zhang, Xiao Wu
Warpage analysis of plastic ball grid array packages
American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1789-1791
Lee, Shi-Wei Ricky

Conference paper 3

An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity
Proceedings of the Electronic Technology Conference, EPTC, v. 1997, October 1007, p. 82-85
Lee, Shi Wei Ricky; Yan, Chien Chun; Chow, LW; Papageorge, Marc
Design for plastic ball grid array solder joint reliability
Proceedings of the NEPCON WEST'97. Part 3 (of 3), Anaheim, CA, USA, v. 2, 1997, Feb, p. 1023-1032
Lee, Shi Wei Ricky; Lau, John H.
Solder joint reliability of plastic ball grid array with solder bumped flip chip
Paper - American Society of Mechanical Engineers, 1997
Lee, Shi Wei Ricky; Lau, John H.


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Article 2

Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages
Circuit World, v. 23, (1), 1996, p. X1-19
Lee, Shi-Wei; Lau, John H.
Impact performance of a woven fabric CFRP laminate
Polymers & polymer composites, v. 4, (8), 1996, p. 549-561
Kim, Jang Kyo; Leung, LM; Lee, Ricky Shi Wei; Hirai, Yasunobu

Conference paper 4

Anisotropic piezoelectric laminates for rotary actuators
Proceedings of SPIE - The International Society for Optical Engineering, v. 3321, 1996, p. 484-491
Lee, Shi-Wei Ricky; Li, Hing Leung
Design of linear and rotary actuators using piezoelectric composite laminates
Progress in Advanced Materials and Mechanics, Vol. 1; Beijing; China; 12-15 Aug. 1996. pp. 304-309. 1996
Lee, SW R.
Impact response of woven fabrics and cross-plies carbon fibre composites
Proc. 5th Symp. of Interfacial Materials Science on Composite Materials, Fukuoka, Japan, May 1996, p. 310-313
Kim, Jang-Kyo; Leung, L.M.; Lee, R.S.W.; Hirai, Y.
Mechanical property study of composite grid reinforced concrete
Proceedings of the 2nd International Symposium on Civil Infrastructure Systems, Hong Kong/China, 1996, p. 205-210
Chen, M.; Li, Zongjin; Lee, R.; Tong, Ping


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Article 1

ON THE APPARENT BENDING ISOTROPY IN CLAMPED ELLIPTIC COMPOSITE LAMINATES
Journal of composite materials, v. 29, (12), 1995, p. 1601-1620
Lee, Shi Wei Ricky; SUN, Chin Teh

Conference paper 3

Actuation of Torsional Motion for Piezoelectric Laminated Beams
Dynamic Response & Behavior of Composites, v. 46, 1995, p. 139-146
Lee, Shi-Wei Ricky; Chan, Kwok Ho W.
Bending/Twisting/Shearing Actuation and Sensing of Laminated Composite Beams with Piezopolymer Film
Intelligent Materials and Systems, 1995, p. 137-148
Lee, Shi-Wei Ricky; Sun, C.T.
Evaluation of Residual Strength for Cracked Pressure Vessel Repaired by Composite Patch
Proc. ICCE/2 International Conference, New Orleans, LA, August 21-24 1995, p. 449-450
Lee, Shi-Wei Ricky


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Conference paper 2

On the Sensing and Actuation of Clamped Elliptic Piezoelectric Laminates
Adaptive Structures and Composite Materials, Chicago, IL, USA, v. 45,November 6-11 1994, p. 275-279
Lee, Shi-Wei Ricky
The Use of Clamped Circular Piezoelectric Laminates as Pressure Sensors
Proc. 9th ASC Conference, Newark, DE, September 20-22 1994, p. 331-339
Lee, Shi-Wei Ricky


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Article 2

A Quasi-Static Penetration Model for Composite Laminates
Journal of Composite Materials, v. 27, (3), 1993, p. 251-271
Lee, Shi-Wei Ricky; Sun, Chin Teh
Dynamic Penetration of Graphite/Epoxy Laminates Impacted by a Blunt-Ended Projectile
Composites Science & Technology, v. 49, (4), 1993, p. 369-380
Lee, Shi-Wei Ricky; Sun, Chin Teh

Conference paper 1

Bending Characteristics of Clamped Elliptic Symmetric Composite Laminates
Proc. 8th ASC Conference, Cleveland, OH, 20-22 October 1993, p. 1087-1096
Lee, Shi-Wei Ricky; Sun, Chin Teh


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Conference paper 1

Ballistic Limit Prediction of Composite Laminates by a Quasi-Static Penetration Model
Proc. 24th SAMPE Technical Conference, Toronto, Canada, October 20-22 1992, p. 497-511
Lee, Shi-Wei Ricky; Sun, Chin Teh


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Conference paper 1

Modeling Penetration Process of Composite Laminates Subjected to a Blunt-Ended Punch
Proc. 23rd SAMPE Technical Conference, Kiamesha Lake, NY, October 21-24 1991, p. 624-638
Lee, Shi-Wei Ricky; Sun, Chin Teh


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Article 2

Damage in Composite Laminates: Effects of Transverse Cracks
Mechanics of Materials, v. 7, 1988, p. 91-107
Herakovich, C.T.; Aboudi, J.; Lee, Shi-Wei Ricky; Strauss, E.A.
Three-Dimensional Analysis of Laminates with Cross Cracks
Journal of Applied Mechanics, ASME Transactions, v. 55, 1988, p. 389-397
Aboudi, J.; Lee, Shi-Wei Ricky; Herakovich, C.T.

Conference paper 1

2-D and 3-D Damage Effects in Cross-Ply Laminates
Mechanics of Composite Materials, Berkeley, CA, USA, v. 92, June 20-22 1988, p. 143-147
Herakovich, C.T.; Aboudi, J.; Lee, Shi-Wei Ricky; Strauss, E.A.


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2016 18

An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 6, (8), Aug 2016, article number 7509610, p. 1174-1180
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung Article
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints
Microelectronics Reliability, v. 62, July 2016, p. 130-140
Yang, Chaoran; Le, Fuliang; Lee, Shi-wei Article
Characterisation of Copper Diffusion in Through Silicon Vias
Materials for Advanced Packaging / Edited by Daniel Lu & C.P. Wong. Switzerland : Springer, 2016, p. 923-951
Zhang, Xiaodong; Lee, Shi-wei; Le, Fuliang Book chapter
A Method for Measuring Thermal Conductivity of Paste Materials
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, 4 October 2016, article number 7583185, p. 510-513
Feng, Wilson; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei Conference paper
Application of Nano Silver sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583297, p. 1004-1009
Tao, Mian; Mei, Yunhui; Lee, Shi-wei; Yun, Feng; Lu, Guoquan Conference paper
Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation
Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 1312-1319, Article no.: 7517700
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei; Xu, Wei; Yang, Weihua Conference paper
Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583078, p. 1-6
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Effect of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package
2016 International Conference on Electronics Packaging, ICEP 2016, June 2016, article number 7486781, p. 52-56
Lee, Shi-wei; Tian, Zhenhuan; Zhang, Minshu; Xie, An Conference paper
Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583144, p. 318-321
Xie, Jinqi; Zhong, Zhe; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping Conference paper
Experimental Parametric Study on the Bumping and Coining of Gold Studs for Flip Chip Bonding
China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463955
Ren, Rongbin; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei Conference paper
Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583171, p. 439-442
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping Conference paper
Investigation of Reliability of EMC and SMC on Reflectance for UV LED Applications
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 658-664, Article no.: 7463398
Qiu, Xing; Lo, Chi Chuen; Shang, Andrew W.; Lee, Shi-wei Conference paper
Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583147, p. 331-333
Wen, Haoran; Ji, Yaqiang; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping Conference paper
Low-dielectric-constant Novel Periodic Mesoporous Organosilica Thin Film for Interlayer Dielectric
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583109, p. 153-156
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping Conference paper
Novel Periodic Mesoporous Organosilica Thin Film with Low Dielectric Constant and High Mechanical Property
China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463952
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping Conference paper
Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum
2016 International Conference on Electronics Packaging, ICEP 2016, June 2016, article number 7486782, p. 57-61
Lo, Chi Chuen; Lee, Shi-wei; Guo, Xungao; Zhao, Huishan Conference paper
Sensitivity Study on the Precision of Data Acquisition for LED Life Prediction Based on the Degradation of Luminous Output
2016 6th Electronic System-Integration Technology Conference, ESTC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.:7764509
Lo, Jeffrey Chi Chuen; Yang, Guoming; Tao, Mian; Lee, Shi-wei Conference paper
Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging
China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463954
Shang, Andrew Weber; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei; Le, Fuliang Conference paper

2015 13

Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (10), October 2015, p. 1525-1532
Le, Fuliang; Lee, Shi-wei; Lo, Chi Chuen; Yang, Chaoran Article
Lens Forming by Stack Dispensing for LED Wafer Level Packaging
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (1), January 2015, article number 6965571, p. 15-20
Zhang, Rong; Lee, Shi-wei; Lo, Chi Chuen Article
Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing
IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (8), August 2015, article number 7163313, p. 1178-1185
Le, Fuliang; Lee, Shi-wei; Yang, Chaoran; Lo, Chi Chuen Article
Detection of the Non-uniformity of Junction Temperature in Large Light-emitting Diode Using an Improved Forward Voltage Method
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 / IEEE. New York, NY, USA : IEEE, 2015, Article no.: 7103108
Tao, Mian; Lee, Shi-wei Conference paper
Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias
Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159872, p. 1973-1979
Zhang, Guoping; Jiang, Kun; Liu, Qiang; Li, Jinhui; Sun, Rong; Lee, Shi-wei; Wong, C. P. Conference paper
Fluxless Packaging of an Implantable Medical Device for Transcorneal Electrical Stimulation
Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2016-February, February 2016, article number 7412282
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung Conference paper
Influence of Rubber Nanoparticles on the Properties of Novolac-diazonaphthoquinone Based Photoresist
16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds.. New York, NY, USA : IEEE, 2015, p. 1039-1042, Article no.: 7236757
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping Conference paper
Investigation of the Influence of Ag Reflective Layer on the Correlated Color Temperature and the Angular Color Uniformity of LED with Conformal Phosphor Coating
16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu., W eds. New York, NY, USA : IEEE, 2015, p. 830-834, Article no.: 7236709
Tian, Zhenhuan; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Sun, Rong Conference paper
Investigation on the Thermal Degradation Mechanism of Cu-Sn Intermetallic Compound in SAC Solder Joints with Cohesive Zone Modeling
Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159722, p. 1029-1037
Yang, Chaoran; Lee, Shi-wei Conference paper
Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, v. 2, 2015, article number V002T02A046
Wang, Jiaqi; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Tao, Mian Conference paper
Simulation and Optimization on Thermal Performance of LED Filament Light Bulb
2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015 / IEEE. New York, NY, USA : IEEE, 2015, p. 88-92, Article no.: 7360696
Feng, Wilson; Feng, Bruce; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei Conference paper
Thermally Conductive Adhesives Based on Silver Coated Copper Flake Fillers
16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds. New York, NY, USA : IEEE, 2015, p. 294-296, Article no.: 7236595
Xie, Jinqi; Ren, Huming; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping Conference paper
Wafer Level Bumping Technology for High Voltage LED Packaging
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings / IEEE. New York, NY, USA : IEEE, 2015, p. 54-57, Article no. 7365183
Wei, Tiwei; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei Conference paper

2014 8

Comparison of ball pull strength among various Sn-Cu-Ni solder joints with different pad surface finishes
Journal of Electronic Packaging, Transactions of the ASME, v. 136, (1), March 2014, article number 011003
Yang, Chaoran; Song, Fubin; Lee, Shi-wei Article
Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
Applied Thermal Engineering, v. 63, (2), February 2014, p. 588-597
Ye, Huaiyu; Koh, Sau Wee; Yuan, Cadmus; van Zeijl, Henk; Gielen, Alexander W.J.; Lee, Shi-wei; Zhang, Guoqi Article
Impact of Ni Concentration on the Intermetallic Compound Formation and Brittle Fracture Strength of Sn-Cu-Ni (SCN) Lead-free Solder Joints
Microelectronics Reliability, v.`54, (2), February 2014, p. 435-446
Yang, Chaoran; Song, Fubin; Lee, Shi-wei Article
Development of a real-time monitoring system with uni-photodetector for LED long term reliability tests
Proceedings: 2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014), Editors: Keyun Bi, Zhong Tian, Ziqiang Xu. The Institute of Electrical and Electronics Engineers, Inc., 2014, p. 1477-1481
Zhang, Grace G.; Lu, Sophie L.Y.; Yang, Nick G.M.; Zou, Sam H.Y.; Zhong, Steven D.L.; Lo, Chi Chuen; Lee, Ricky Shi Wei Conference paper
Lens forming by stack dispensing for LED wafer level packaging
2014 International Conference on Electronics Packaging, ICEP 2014, IEEE, 2014, p. 670-675, Article number 6826763
Zhang, Rong; Lee, Ricky Shi-wei; Lo, Chi Chuen Conference paper
Multilayer Dispensing of Remote Phosphor for LED Wafer Level Packaging with Pre-formed Silicone Lens
Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, November 2014, article number 6962713
Lo, Chi Chuen; Lee, Ricky Shi Wei; Guo, Xungao; Zhao, Huishan Conference paper
O-2 Plasma Treatment in Polymer Insulation Process for Through Silicon Vias
Proceedings of the Electronic Packaging Technology Conference, EPTC, October 2014, article number 6922644, p. 235-238
Zhuang, Lulu; Jiang, Kun; Zhang, Guoping; Tang, Jiaoning; Sun, Rong; Lee, Ricky S W Conference paper
Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking
Proceedings - Electronic Components and Technology Conference, September 2014, article number 6897397, p. 919-924
Le, Fuliang; Lee, Ricky Shi-wei; Lau, Kei May; Yue, Chik Patrick; Sin, Johnny Kin On; Mok, Philip Kwok Tai; Ki, Wing Hung; Choi, Hoi Wai Conference paper

2013 13

電子材料界面裂紋的新型濕氣壓力模型
電子元件與材料=Electronic Components & Materials, (2), 2013, p. 62-65
張旻澍; 李世瑋; 盧智銓 Article
Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays
Proceedings - 2013 IEEE 63rd Electronic Components Conference, May 2013, article number 6575818, p. 1788-1793
Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Shi Wei Ricky Conference paper
Brittle Fracture of Intermetallic Compounds in SAC Solder Joints under High Speed Ball Pull/Pin Pull and Charpy Impact Tests
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 1294-1299
Yang, Chaoran; Xu, Guangsui; Lee, Ricky Shi-wei; Zhang, Xinping Conference paper
Design and Implementation of Fine Pitch COB LED Display
2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177325, p. 108-111
Yang, Nick G.M.; Jin, Gavin S.G.; Niu, Mike D.Y.; Gao, Andy G.X.; Lee, S. W. Ricky Conference paper
Experimental Characterization of Adhesion Strength between the Silicone Encapsulant and the Bottom of a SMD LED Leadframe Cup
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756676, p. 1212-1216
Zou, Sam H.Y.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-Wei Ricky Conference paper
Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via
Proceedings - Electronic Components and Technology Conference, 2013, article number 6575554, p. 81-85
Zhao, Songfang; Zhang, Guoping; Peng, Chongnan; Sun, Rong; Lee, Ricky S W; Zhu, Wenhui; Lai, Fangqi Conference paper
LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer
13th International Conference on Electronics Packaging (ICEP2013), Osaka, Japan, 10-12 April 2013
Liu, Huihua; Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhao, Huishan Conference paper
Measurement and Analysis of Interfacial Adhesion Strength between the Silicone Encapsulant and the Side Wall of a SMD LED Leadframe Cup
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756544, p. 612-616
Zhong, Steven D.L.; Zou, Sam H.Y.; Lo, Chi Chuen; Lee, Shi-Wei Ricky Conference paper
Optical Characterization of a Light Bulb with the Waffle Pack LED WLP Module
2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177334, p. 142-146
Liu, Huihua; Lo, Jeffery C.C.; Lee, Shi Wei Ricky Conference paper
Quasi-conformal Phosphor Dispensing on LED for White Light Illumination
2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 563-567
Lee, Shi Wei Ricky; Guo, Xungao; Niu, Daoyuan; Lo, Chi Chuen Conference paper
Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013
Lo, Chi Chuen; Liu, Huihua; Lee, Shi Wei Ricky; Gu, Xungao; Zhao, Huishan Conference paper
Thermal Characterization of a Printed Circuit Board with Thermal Vias for The Application of High Brightness Light-emitting Diodes
China International Forum on Solid State Lighting, ChinaSSL, v. 2013, 2013, article number 7177331, p. 128-131
Tao, Mian; Feng, Zicheng; Swanson, John; Ganjei, John; Lo, Chi Chuen; Lee, Shi Wei Ricky Conference paper
Wetting Behavior of Polymer Liquid in Insulation Process for through Silicon via
2013 14th International Conference on Electronic Packaging Technology (ICEPT 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 360-363
Zhao, S.; Zhang, G.; Sun, R.; Lee, S.W.R. Conference paper

2012 22

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging
IEEE Transactions on Device and Materials Reliability, v. 12, (2), June 2012, article number 6168823, p. 189-193
Zhang, Rong; Lo, Chi Chuen; Lee, Shi-wei Article
Emerging trend for LED wafer level packaging
Frontiers of Optoelectronics, v. 5, (2), June 2012, p. 119-126
Lee, Shi-wei; Zhang, Rong; Chen, Kewei; Lo, Chi Chuen Article
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches
Microelectronics Reliability, v. 52, (5), May 2012, p. 922-932
Zhang, Rong; Lee, Shi-wei Article
Reliability of high-power LED packaging and assembly
Microelectronics Reliability, 52, (5), May 2012, p. 761-761
Liu, Cheng-Yi; Lee, Shi-wei; Shin, Moo Whan; Lai, Yi-Shao Article
電子塑封材料的高溫界面強度研究
电子元件与材料=Electronic Components & Materials, v. 31, (7), 2012, p. 67-69
張旻澍; 謝安; 李世瑋; 盧智銓 Article
绿色电子封装技术与材料
绿色微纳电子学 /王阳元 编. 北京: 科学出版社， 2010, p. 223-306
李世玮; 程玉华; 宋复斌; Lo, Chi Chuen Book chapter
Assessment of Non-uniform Temperature Effect on BGA De-component Process
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, p. 977-980
Tang, Kun; Song, Fubin; Lee, Ricky Shi Wei; Lo, Chi Chuen Conference paper
Comparative Study on Dendrite Formation on Solder Pads with ImAg and OSP Surface Finishes Using Water Drop Test Method
12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, April 17-20 2012, p. 274-279
Tang, Kun; Song, Fubin; Lee, Shi-Wei Ricky Conference paper
COMPARISON OF FATIGUE CRACK INITIATION/PROPAGATION AND DAISY-CHAIN RESISTANCE IN LEAD-FREE SOLDER JOINTS UNDER TEMPERATURE CYCLING TEST
PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, p. 579-583
Chan, Yuen Sing; Song, Fubin; Lee, Shi Wei Ricky; Yang, Chaoran; Lo, Chi Chuen Conference paper
Determination of Driving Current of RGB LEDs for White Light Illumination
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, p. 1540-1545
Zhao, Huishan; Lee, Ricky Shi Wei Conference paper
Development of innovative cold pin pull test method for solder pad crater evaluation
14th International Conference on Electronic Materials and Packaging, EMAP 2012,, Hong Kong, 13-16 December 2012
Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Ricky Shi Wei Conference paper
Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants
14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, sesion P048, article number 6507893
Peng, Chongnan; Zhang, Guoping; Sun, Rong; Lee, Ricky Conference paper
Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips
35th International Electronics Manufacturing Technology (IEMT) Conference, Ipoh, Malaysia, 6-8 November 2012, session number P141
Tao, Mian; Lee, Shi-Wei Ricky; Yuen, Mathew M.F.; Zhang, Guoqi; Driel, W. van Conference paper
Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED
2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012, Kyoto, Japan, 10-12 Dec 2012, session P11-3, article number 6523414
Zhao, Huishan; Chen, Changying; Lee, Shi-Wei Ricky Conference paper
Fast Copper Plating Process for Through Silicon Via (TSV) Filling
ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, v. 11, 2011, p. 855-863
Wang, Su; Lee, Shi-wei Ricky Conference paper
Investigation of fracture behaviors of Cu-Sn intermetallics using impact test
2012 2nd IEEE CPMT Symposium Japan, ICSJ, Kyoto, Japan, 10-12 Dec 2012, session P11-4, article number 6523420
Yang, Chaoran; Lee, Ricky Shi-wei Conference paper
Investigation on Mechanical Properties and Bonding Parameters of Copper Wire Bonding
12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, 17-20 April 2012, p. 654-660
Cao, Jun; Ding, Yutian; Lee, Shi-Wei Ricky Conference paper
LED wafer level packaging with a remote phosphor cap
14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P068, article number 6507885
Liu, Huihua; Zhang, Rong; Lo, Chi Chuen; Lee, Shi-Wei Ricky Conference paper
Reverse wire bonding and phosphor printing for LED wafer level packaging
Proceedings - Electronic Components Conference, 2012, p. 1814-1818
Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhang, Rong; Li, Mei Conference paper
TSV Plating Using Copper Methanesulfonate Electrolyte with Single Component Suppressor
4th IEEE Electronics System-integration Technology Conference (ESTC), Amsterdam, Netherlands, 17-20 September, p. 1-5
Wu, Hailong; Lee, Shi-Wei Ricky Conference paper
Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects
14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P061, article number 6507881
Zhang, Minshu; Lo, Chi Chuen; Lee, Shi-Wei Ricky Conference paper
Underfill dispensing for 3D die stacking with through silicon vias
Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012, San Diego, California, USA, 2012, p. 548-553
Le, Fuliang; Lee, Ricky Shi-wei; Wu, Jingshen; Yuen, Matthew Ming Fai Conference paper

2011 18

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards
Journal of Electronic Packaging, Transactions of ASME, v. 133, (3), September 2011, article number 031010
Lau, John H.; Zhang, M. S.; Lee, Shi-wei Article
Investigation on Copper Diffusion Depth in Copper Wire Bonding
Microelectronics Reliability, v. 51, (1), January 2011, p. 166-170
Chen, Catherine H.; Zhang, Shawn X.; Lee, Shi-wei; Mohamed, Lebbai Article
Spacing optimization of high power LED arrays for solid state lighting
Journal of Semiconductors, v. 32, (1), January 2011, article number 014005
Chan, Yuen Sing; Lee, Shi-wei Article
Shock test methods and test standards for portable electronic devices
Structural Dynamics of Electronic and Photonic Systems / Edited by Ephraim Suhir, David S. Steinberg, T. X. Yu. Hoboken, New Jersey : John Wiley & Sons, Inc., 2011, p. 159-173, Ch. 7
Zhou, C.Y.; Yu, Tongxi; Lee, Shi-wei; Suhir, Ephraim Book chapter
Technologies and Materials for Green IC Packaging
Green Micro/Nano Electronics / Wang, Yangyuan, Cheng, Yuhua, Chi, Minhwa. Berlin: Springer, p. 248-359
Lee, Ricky Shi Wei; Cheng, Y.; Song, F.; Lo, Irene M C Book chapter
A comparison of copper sulfate and methanesulfonate electrolytes in the copper plating process for through silicon via metallization
Advanced Packaging Materials, International Symposium on, 2011, p. 291-296
Wu, H.L.H.; Lee, Ricky Shi Wei Conference paper
Advanced LED wafer level packaging technologies
Proceedings of technical papers, 2011, p. 71-74
Lee, Shi-Wei Ricky Conference paper
Characterization and Comparison between the SnCuNi IMC in SnCu Solder with ENIG Pad Finish and in SnCuNi Solder with OSP Pad Finish
2011 International Conference on Electronic Materials and Packaging (EMAP), Kyoto, Japan, 2011
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi-wei Conference paper
Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests
EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings, 2011
Jiang, Tong; Xu, Zhengjian; Lee, Shi Wei Ricky; Song, Fubin; Lo, Chi Chuen; Yang, Chaoran Conference paper
Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints
Proceedings - Electronic Components Conference, 2011, p. 1070-1078
Chan, Y.S.; Lee, Ricky Shi Wei Conference paper
Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish
Proceedings - Electronic Components Conference, 2011, p. 971-978
Yang, C.; Song, F.; Lee, Ricky Shi Wei Conference paper
Enhancement of thermal conductivity of die attach adhesives (DAAs) using nanomaterials for high brightness light-emitting diode (HBLED)
Proceedings - Electronic Components Conference, 2011, p. 667-672
Lu, D.; Liu, C.; Lang, X.; Wang, B.; Li, Z.; Lee, W.M.P.; Lee, Ricky Shi Wei Conference paper
Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches
2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 2011
Lo, Chi Chuen; Zhang, R.; Lee, Ricky Shi Wei; Wang, Z. Conference paper
Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, p. 500-505, Article number6066885
Chan, Y.S.; Song, F.; Lee, Ricky Shi Wei Conference paper
LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection
Proceedings - 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), June 2011, article number 5898727, p. 1616-1621
Zhang, Rong; Lee, Ricky Shi-wei; Xiao, David guowei; Chen, Haiying Conference paper
Mechanical shock test performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag, BGA components with SAC305 solder paste on NiAu and OSP board surface finishes
IPC APEX EXPO Technical Conference 2011, v. 4, 2011, p. 3014-3077
Bath, Jasbir; Eagar, Wade; Bigcraft, Chad; Newman, Keith; Hu, Livia; Henshall, Gregory; Nguyen, Jennefier; Lee, M.J.; Syed, Ahmer; Xie, Weidong; Song, Fubin; Lee, Ricky Conference paper
Nondestructive inspection of through silicon via depth using scanning acoustic microscopy
International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, January 2011, article number 5699482
Zhang, Minshu; Lee, Ricky Shi-wei; Wu, Hailong; Zhang, Rong Conference paper
Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging
Proceedings of technical papers, 2011, p. 343-346
Wu, H. L. Henry; Lee, Ricky Shi Wei Conference paper

2010 20

3D IC Integration with TSV Interposers for High Performance Applications
Chip scale review, v. 14, (5), September 2010, p. 26-29
Lau, John H.; Chan, Y. S.; Lee, Shi-wei Article
3D LED and IC wafer level packaging
Microelectronics International, v. 27, (2), May 2010, p. 98-105
Lau, John; Lee, Shi-wei; Yuen, Ming Fai; Chan, Philip Ching Ho Article
Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-induced Damages in Polymeric Materials in Electronic Packaging
Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 1, p. 1-28
Fan, X.J.; Lee, S.W.R. Book chapter
Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages
Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 15, p. 389-409
Zhang, M.S.; Lee, S.W.R.; Fan, X.J. Book chapter
Nano-scale and Atomistic-scale Modeling of Advanced Materials
Nano-bio-electronic, Photonic and MEMS Packaging / Edited by C.P. Wong, Kyoung-Sik (Jack) Moon, Yi Li. New York: Springer, c2010, p. 719-758
Dai, Ruo Li; Liao, Wei-Hsin; Lin, Chun-Te; Chiang, Kuo-Ning; Lee, Shi-Wei Ricky Book chapter
A novel vapor pressure transfusion model for the popcorning analysis of Quad Flat No-lead (QFN) packages
Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, 2010
Zhang, Minshu; Lee, Ricky Shi Wei Conference paper
ASSESSMENT OF RELATIVE THERMAL FATIGUE LIFE OF SAC LEAD-FREE AND TIN-LEAD SOLDERS WITH CUSTOM-MADE BGA ASSEMBLIES CREATING VARIOUS STRESS RANGES
IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, p. 803-807
Chan, Y.S.; Yang, C.; Lee, S. W. Ricky Conference paper
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Proceedings - Electronic Components and Technology Conference, 2010, p. 464-470
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi Wei; Newman, K. Conference paper
Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling
2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, 2010
Chan, Y.S.; Lee, Ricky Shi Wei Conference paper
Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors
Proceedings - Electronic Components and Technology Conference, 2010, p. 926-934
Song, F.; Yang, C.; Henry Wu, H.L.; Lo, Chi Chuen; Ricky Lee, S.W.; Newman, K. Conference paper
Embedded 3D hybrid IC integration System-in-Package (SiP) for opto-electronic interconnects in organic substrates
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, v. 4, 2010, p. 129-136
Lau, John H.; Zhang, Minshu; Lee, Shi-wei Conference paper
Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging
2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, IEEE, 2010, p. 1386-1392, Article number 5582822
Chen, Kewei; Zhang, Rong; Lee, Ricky Shi-wei Conference paper
Modeling of board level solder joint reliability under mechanical drop test with the consideration of plastic strain hardening of lead-free solder
2010 IEEE CPMT Symposium Japan, ICSJ10, 2010
Xu, Z.J.; Jiang, Tong; Song, Fubin; Lo, Jeffery; Lee, Ricky Shi Wei Conference paper
Nanoindentation characterization of lead-free solders and intermetallic compounds under thermal aging
43rd International Symposium on Microelectronics 2010, IMAPS 2010, 2010, p. 314-318
Jiang, T.; Song, Fubin; Yang, Cheng; Ricky Lee, S.W. Conference paper
Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design
Proceedings - Electronic Components and Technology Conference, 2010, p. 1166-1172
Xie, B.; Shi, X.Q.; Chung, C.H.; Lee, Ricky Shi Wei Conference paper
Predictive Modeling and Experimental Validation of Lead-Free Solder Joint Reliability under Temperature Cycling
2010 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE, 2010, p. 585-592
Chan, Y.S.; Song, F.; Lo, C. C. Jeffery; Lee, Eddie; Lee, S. W. Ricky Conference paper
Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging
12th International Conference on Electronics Materials and Packaging, Singapore, 25-27 October 2010
Zhang, Rong; Lee, Ricky Shi-wei Conference paper
Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate
7th China International Forum on Solid State Lighting (SSLCHINA 2014), Guangzhou, China, 15-17 October 2010
Lee, Ricky Shi-wei; Lo, Chi Chuen; Zhang, Rong Conference paper
Solid state light tube with periodic units of lateral-emitting LEDs
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), June 2010 , article number 5490788, p. 673-678
Lee, Shi-wei; Zhang, Rong; Leung, Wai Lok Wesley Conference paper
Thermal-enhanced and cost-effective 3D IC integration with TSV (Through-Silicon Via) interposers for high-performance applications
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 4, 2010, p. 137-144
Lau, John Hon Shing; Chan, Yuen Sing; Lee, Shi-wei Conference paper

2009 17

Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability
IEEE transactions on components and packaging technologies, v. 32, (3), 2009, SEP, p. 693-700
Chauhan, Preeti; Osterman, Michael; Lee, S. W. Ricky; Pecht, Michael Article
Experimental investigations and model study of moisture behaviors in polymeric materials
MICROELECTRONICS RELIABILITY, v. 49, (8), 2009, AUG, p. 861-871
Fan, X.J.; Lee, Ricky Shi Wei; Han, Q. Article
Micro thermoelectric cooler: Planar multistage
International Journal of Heat and Mass Transfer, v. 52, (7-8), March 2009, p. 1843-1852
Hwang, Gisuk; Gross, Andrew J.; Kim, Hanseup; Lee, S. W.; Ghafouri, Niloufar; Huang, Baoling; Lawrence, Christin; Uher, Ctirad; Najafi, Khalil; Kaviany, Massound Article
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
IEEE transactions on components and packaging technologies, v. 32, (4), 2009, DEC, p. 901-908
Nie, Lei; Osterman, Michael; Song, Fubin; Lo, Jeffery; Lee, S. W. Ricky; Pecht, Michael Article
Comparison of thermal fatigue reliability of SnPb and SAC solders under various stress range conditions
2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, 2009, p. 1119-1123
Yang, C.; Chan, Yuen Sing; Lee, Ricky Shi Wei; Ye, Y.; Liu, S. Conference paper
Comparison of Thermal Fatigue Reliability of SnPb and SAC Solders under Various Stress Range Conditions
2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, p. 1038-1042
Yang, Chaoran; Chan, Yuen Sing; Lee, S. W. Ricky; Ye, Yuming; Liu, Sang Conference paper
Correlation between Material Selection and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages
2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, p. 563-568
Zhang, Minshu; Lee, S. W. Ricky; Zhang, Jack; Yun, Howard; Starkey, Dale; Chau, Hung Conference paper
Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State Lighting
42nd International Symposium on Microelectronics (IMAPS), San Jose, CA,USA, 1-5 November, pp. 937-944
Chan, Yuan Sing; Lee, Shi-Wei Ricky Conference paper
Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting
2008 International Conference on Electronic Materials and Packaging (EMAP 2008), IEEE, 2009, p. 255-258, Article number 4784277
Lee, Ricky Shi-wei; Tong, Y.W.; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong Conference paper
Effect of UBM and BCB layers on the thermo-mechanical reliability of Wafer Level Chip Scale Package (WLCSP)
Procceedings of 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference / IEEE. Taiwan : IEEE, 2009, p. 407-410
Chan, Yuen Sing; Lee, Shi-wei; Song, Fubin; Lo, Chi Chuen; Jiang, T. Conference paper
Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2009, p. 863-868
Song, Fubin; Newman, K.; Yang, C.; Lee, Ricky Shi Wei Conference paper
Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests
EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2009, p. 245-252
Song, Fubin; Jiang, Tong; Lo, Chi Chuen; Lee, Ricky Shi Wei; Newman, Keith Conference paper
Investigation of the Relationship between Material Selections and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages
17th European Microelectronics and Packaging Conference and Exhibition (EMPC 2009), Palacongressi, Rimini (Italy), 14-17 Jun 2009
Zhang, Minshu; Lee, Ricky S W Conference paper
Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability
Proceedings - Electronic Components and Technology Conference, 2009, p. 125-133
Wu, H.L.H.; Song, F.; Lo, Chi Chuen; Jiang, T.; Newman, K.; Lee, S.W.R. Conference paper
Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting
2009 Proceedings of 59th Electronic Components and Technology Conference, June 2009, article number 5074321, p. 2137-2142
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong Conference paper
Stress analysis of hygrothermal delamination of Quad Flat No-lead (QFN) packages
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 12, 2009, p. 339-347
Zhang, Minshu; Lee, Ricky Shi Wei; Fan, Xuejun Conference paper
Surface analysis of outgassing contamination from edgebond epoxy adhesives on imag pads
Proceedings - Electronic Components and Technology Conference, 2009, p. 155-160
Wu, H.L.H.; Song, F.; Newman, K.; Lee, S.W.R. Conference paper

2008 15

Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain
IEEE transactions on components and packaging technologies, v. 31, (3), 2008, SEP, p. 683-690
Tsai, Ming-Yi; Chen, YuC; Lee, Shi Wei Ricky Article
Drop/impact tests and analysis of typical portable electronic devices
International journal of mechanical sciences, v. 50, (5), 2008, MAY, p. 905-917
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W. Article
Eddy current induced heating for the solder reflow of area array packages
IEEE transactions on advanced packaging, v. 31, (2), 2008, MAY, p. 399-403
Li, Mingyu; Xu, Hongbo; Lee, Shi-Wei Ricky; Kim, Jongmyung; Kim, Daewon Article
Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish
IEEE transactions on electronics packaging manufacturing, v. 31, (3), 2008, JUL, p. 185-191
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T. Article
Reliability Study of Surface Mount Printed Circuit Board Assemblies with Lead-free Solder Joints
Soldering & Surface Mount Technology, v. 20, (2), 2008, p. 30-38
Lo, Chi Chuen; Jia, B.F.; Liu, Zhe; Zhu, Jungao; Lee, Shi Wei Ricky Article
A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders
Proceedings - Electronic Components and Technology Conference, 2008, p. 146-154
Song, Fubin; Lo, Chi Chuen; Lam, Jimmy K.S.; Jiang, Tong; Lee, Shi Wei Ricky Conference paper
Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers
Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, 2008, p. 321-326
Lam, Jimmy K.S.; Lee, Shi Wei Ricky Conference paper
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 5, 2008, p. 47-53
Lo, Chi Chuen; Lee, Shi Wei Ricky Conference paper
Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications
Proceedings - Electronic Components and Technology Conference, 2008, p. 1887-1892
Lo, Chi Chuen; Lee, Shi Wei Ricky; Wu, Henry Hailong; Lam, Jimmy K.S. Conference paper
Development of novel dicing process by anisotropic wet etching with convex corner compensation
10th Electronics Packaging Technology Conference, EPTC 2008, 2008, p. 161-166
Lam, Jimmy K.S.; Lee, Ricky Shi Wei Conference paper
Fabrication of Nanoscale Vias by Offset Patterning
MicroNano2008-2nd International Conference on Integration and Commercialization of Micro and Nanosystems, Proceedings, 2008, p. 615-618
Lau, Chi Ho; Lee, Ricky Shi Wei Conference paper
Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-lead (QFN) Packages
Proc. ASME International Mechanical Engineering Congress & Exposition, Boston, MA, 31 October-6 November, IMECE2008/68120 (on CD-ROM)
Zhang, M.; Lee, Ricky Shi Wei Conference paper
Numerical analysis and experimental validation for the prediction of flip chip solder joint standoff height in MEMS microphone application
IEEE 9th VLSI Packaging Workshop in Japan, VPWJ 2008, 2008, p. 45-48
Lo, Chi Chuen; Lee, Ricky Shi Wei Conference paper
Wafer level encapsulation process for LED array packaging
2007 International Conference on Electronic Materials and Packaging, IEEE, 2008, Article number 4510307
Zhang, Rong; Lee, Ricky Shi-wei Conference paper
Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation
Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008, IEEE, 2008, Article number 4607038
Zhang, Rong; Lee, Ricky Shi-wei Conference paper

2007 22

Electro-elastic analysis of piezoelectric laminated plates
Advanced composite materials, v. 16, (1), 2007, JAN, p. 63-81
Zhao, Minghao; Qian, Caifu; Lee, Shi Wei Ricky; Tong, Pin; Suemasu, H.; Zhang, Tong-Yi Article
Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow
Micro- and Opto-electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging / Vol. 2, Physical Design--Reliability and Packaging/ Edited by E. Suhir, Y.C. Lee, C.P. Wong. New York: Springer, c2007, chapter 6, p. 151-173
Lee, Shi-Wei Ricky; Lo, Chi Chuen Book chapter
Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests
Proceedings - Electronic Components Conference, 2007, p. 364-372
Song, Fubin; Lee, S. W. Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen Conference paper
Characteristics of copper-to-silicon diffusion in copper wire bonding
Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, 2007, p. 2-9
Zhang, Shawn X.; Lee, Shi Wei Ricky; Lau, A.K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, Maarten Conference paper
Characterization and comparison of five SAC-based solder pastes for pb-free reflow soldering
HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007, p. 10-17
Chen, Catherine H.; Wong, Wallace; Lo, Chi Chuen; Song, Fubin; Lee, Shi Wei Ricky Conference paper
Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests
Proc. 16th European Microelectronics & Packaging Conference (EMPC), Oulu, Finland, 17-20 June, pp. 213-218
Song, Fubin; Lee, Shi-Wei Ricky; Clark, Stephen; Sykes, Bob; Newman, Keith Conference paper
Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 450-458
Song, F.; Ricky Lee, S.W.; Newman, K.; Clark, S.; Sykes, B. Conference paper
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 5, 2007, p. 47-54
Lo, Chi Chuen; Lee, Shi Wei Ricky Conference paper
Design of experiment (DoE) study on effects of various geometric parameters on copper diffusion in through silicon vias (TSVs)
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, p. 32-37
Zhang, Shawn X.; Lee, S. W. Ricky Conference paper
Development of 2D modeling techniques for the thermal fatigue analysis of solder joints of a module mounted in a 3D cavity on a printed circuit board
EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings, 2007, p. 713-718
Chan, Yuen Sing; Lee, Shi Wei Ricky; Ye, Yuming; Liu, Sang Conference paper
Drop impact of a typical portable electronic device - experiments and modeling
Proceedings of the 7th International Conference on Shock and Impact Loads on Structures, 2007, p. 61-70
Yu, Tongxi; Zhou, C.Y.; Lee, Ricky S.W. Conference paper
Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 463-470
Song, F.; Ricky Lee, S.W.; Newman, K.; Reynolds, H.; Clark, S.; Sykes, B. Conference paper
Effect of V-groove side wall feature on epoxy flow in passive alignment of optical fiber
6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Proceedings 2007, 2007, p. 202-208
Lam, K. S. Jimmy; Lee, S. W. Ricky Conference paper
Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board)
Proc. 9th International Conference on Electronic Materials and Packaging (EMAP), Daejon, Korea, 19-22 November, EMAP2007-P013
Lau, John H.; Lo, Chi Chuen; Lam, Jimmy K.S.; Soon, E.L.; Chow, W.S.; Lee, Shi-Wei Ricky Conference paper
Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, v. 2007, 2007, p. 39
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M. Conference paper
Effects of tooling tip wear and fixture rigidity on solder ball shear and ball pull tests
IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2, 2007, p. 889-894
Song, Fubin; Lee, S. W. Ricky Conference paper
Effects of underfills on the thermal-cycling tests of SnAgCu PBGA (Plastic Ball Grid Array) packages on ImAg PCB (Printed Circuit Board)
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 785-790
Lau, J.; Lo, Chi Chuen; Lam, J.; Soon, E.L.; Chow, W.S.; Lee, R. Conference paper
High-speed solder ball shear and pull tests vs. board level mechanical drop tests: Correlation of failure mode and loading speed
Proceedings - Electronic Components and Technology Conference, 2007, p. 1504-1513
Song, Fubin; Lee, Shi Wei Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen Conference paper
Multi-stacked flip chips with copper plated through silicon vias and re-distribution for 3D system-in-package integration
Materials Research Society Symposium Proceedings, v. 970, 2007, p. 179-190
Lee, Shi-Wei Ricky; Hon, Ronald Conference paper
Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres
ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 474-480
Song, F.; Ricky Lee, S.W. Conference paper
Screen-printing of yellow phosphor powder on blue Light Emitting Diode (LED) arrays for white light illumination
2007 Proceedings of the ASME InterPack Conference, IPACK 2007, v. 1, 2007, p. 19-24
Lee, Ka Ho; Lee, Shi Wei Ricky Conference paper
Wetting characteristics of solder reflow on copper traces without solder mask
ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 438-443
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lam, Jimmy K.S.; Wong, Wallace K.H. Conference paper

2006 26

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties
IEEE transactions on components and packaging technologies, v. 29, (1), 2006, MAR, p. 164-172
Gong, JF; Chan, PCH; Xiao, GW; Lee, RSW; Yuen, MMF Article
便携式电子产品的跌落冲击响应试验，仿真和理论
力学进展=Advances in Mechanics, v. 2006, (02), 2006, p. 239-246
周春燕; 余同希; 李世瑋 Article
Characterization of intermetallic compound formation and copper diffusion of copper wire bonding
Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1821-1826
Zhang, S.; Chen, C.; Lee, R.; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M. Conference paper
Comparison between experimental measurement and numerical analysis of warpage in PBGA package and assembly with the consideration of residual strain in the molding compound
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006
Tsai, Ming Yi; Chen, Yung Cheng; Lee, Shi Wei Ricky Conference paper
Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability
Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 891-898
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Design of shock table tests to mimic real-life drop conditions for portable electronic device
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, (EMAP2006) Hong Kong, 11-14 December, 2006., v. 1-3, p. 674-678
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W. Conference paper
Design, process development and prototyping of 3D packaging with multi-stacked flip chips and peripheral through silicon via interconnection
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 2006, p. 80-85
Hon, Ronald; Lee, Shi Wei Ricky Conference paper
Development and prototyping of a HB-LED array module for indoor solid state lighting
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006, p. 141-145
Lee, Shi Wei Ricky; Lau, C.H.; Chan, Siu Ping; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Chi Chuen Conference paper
Development and prototyping of a HB-LED array module for indoor solid state lighting
2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006, p. 192-196
Lee, S. W. Ricky; Lau, C.H.; Chan, S.P.; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Jeffery C.C. Conference paper
Drop impact of a typical portable electronic device
WIT Transactions on the Built Environment, v. 87, 2006, p. 505-514
Zhou, C.Y.; Yu, T.X.; Lee, R.S.W. Conference paper
Drop impact of typical portable electronic product device
The 9th Int. Conf. on Structures Under Shock & Impact (SUSI 2006), New Forest, UK,, 3-5 July, 2006.
Zhou, C.Y.; Yu, Tongxi; Lee, R.S.W. Conference paper
Effect of high temperature storage on reliability of Sn-Ag-Cu flip chip solder bumps
International Conference on Electronic Materials and Packaging, EMAP, v. 2006, December 2006, article number 4430604
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T. Conference paper
Effect of Microstructure on Thermal and Mechanical Properties of PBGA Substrates
Proc. 8th International Conference on Electronic Materials and Packaging (EMAP), Kowloon, Hong Kong, 11-14 December, pp. 533-539
Tang, G.C.W.; Shing, J.W.K.; Chen, Haibin; Lee, Shi-Wei Ricky; Wu, Jingshen; McLellan, Neli Conference paper
Effect of solder mask thickness on shear and pull tests of lead-free solder balls
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, 2006
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Effects of Al pad deformation and TiW barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding
IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, p. 189-195
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, Angie K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, M. Conference paper
Effects of microstructure on thermal and mechanical properties of PBGA substrates
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 830-836
Tang, George Cw; Shing, Jacqueline Wk; Chen, Haibin; Lee, Ricky; Wu, Jingshen Conference paper
Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 687-693
Lau, Dennis; Chan, Y.S.; Lee, S. W. Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang Conference paper
Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis
ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 866-872
Lau, Dennis; Chan, Y.S.; Lee, Shi Wei Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang Conference paper
Fracture analysis on popcorning of plastic packages during solder reflow
Fracture of Nano and Engineering Materials and Structures: Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006 / Edited by E. E. Gdoutos. The Netherlands : Springer, 2006, p. 749-750
Lee, Shi-Wei Ricky; Lau, Dennis Chung Yin Conference paper
Impact of IMC thickness on lead-free solder joint reliability under thermal aging: Ball shear tests vs. cold bump pull tests
2006 International Microsystems, Packaging, Assembly Conference Taiwan (IMPACT), Proceedings, 2006, p. 109-112
Lee, Shi Wei Ricky; Song, Fubin Conference paper
Investigation of IMC thickness effect on the lead-free solder ball attachment strength: Comparison between ball shear test and cold bump pull test results
Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1196-1203
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Investigation of the effect of PCB base materials and pad surface finish on the thermal fatigue life of lead-free solder joints of PBGA and passive resistors
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 166-172
Song, Fubin; Lee, Shi Wei Ricky; Osterman, Michael; Pecht, Michael Conference paper
Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60°C
Electronic Components and Technology Conference, v. 2006, May 2006, article number 1645851, p. 1476-1483
Lau, John; Lee, Shi-wei; Song, Fubin; Lau, Chung Yin; Shangguan, Dongkai Conference paper
Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias and Re-Distribution for 3D System-in-Package Integration
Proc. MRS Symposium on Enabling Technologies for 3D Integration, Vol. 970, Boston, MA, 27-29 November pp. 179-190
Lee, Shi-Wei Ricky; Hon, R. Conference paper
Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2006, p. 379-384
Lee, Ka Ho; Lee, Shi Wei Ricky Conference paper
Thermal resistance analysis of a multi-stack flip chip 3-d package
2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 145-149
Chan, Yuen Sing; Lee, Shi Wei Ricky Conference paper

2005 16

Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing
IEEE transactions on advanced packaging, v. 28, (3), 2005, AUG, p. 413-420
Tsui, Yat Kit; Lee, Shi Wei Ricky Article
Foreword: Three-dimensional packaging
IEEE Transactions on Advanced Packaging, v. 28, (3), 2005, Aug, p. 354-355
Bauer, Charles E.; Lee, Shi Wei Ricky Article
電子製造技術：利用無鉛、無鹵素和導電膠材料
化學工業出版社, 北京, 中國 / ISBN 7-5025-7004-7, 548 pages
劉, 漢誠; 汪, 正平; 李, 寧成; 李, 世瑋 Book
3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling
Proceedings - Electronic Components and Technology Conference, v. 1, 2005, p. 795-801
Lee, Shi Wei Ricky; Hon, Ronald; Zhang, Shawn Xiaodong; Wong, Chun Keung Conference paper
A systematic approach for determining the thermal fatigue-life of plastic ball array (PBGA) lead-free solder joints
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1021-1029
Lau, J.; Lee, R.; Dauksher, W.; Shangguan, D.; Song, F.; Lau, D. Conference paper
Assessment of long-term reliability in lead-free assemblies
Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v. 2005, 2005, p. 140-155
Ganesan, S.; Wu, J.; Pecht, M.; Lee, R.; Lo, Chi Chuen; Fu, Y.; Li, Y.; Xu, M. Conference paper
Characterization of copper-to-silicon diffusion for the application of 3D packaging with through silicon vias
2005 6th International Conference on Electronics Packaging Technology, v. 2005, 2005
Zhang, Xiaodong; Lee, Shi-Wei Ricky; Weng, Lutao; So, Sylvia Conference paper
Correlation between the strain on the printed circuit board and the stress in chips for the failure prediction of passive components
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 115-121
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky Conference paper
Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls
2005 6th International Conference on Electronics Packaging Technology, v. 2005, 2005
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Evaluation of bondability and reliability of single crystal copper wire bonding
Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), 2005, p. 238-244
Chen, Hua; Lee, Shi Wei Ricky; Ding, Yutian Conference paper
Experimental investigation of the effect of reflow cooling rate on the IMC growth of SAC lead-free solder alloy
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 123-129
Song, Fubin; Lee, Shi Wei Ricky Conference paper
Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition
Proceedings - Electronic Components Conference, 2005, p. 1783-1791
Lau, D.; Tsang, M.; Lee, SWR; Lo, Chi Chuen; Fu, LF; Jin, JW; Liu, S. Conference paper
Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging, San Francisco, California, USA, 17-22 July 2005, p. 947-953 (IPACK2005/73299 on CD-ROM)
Zhang, Xiaodong; Hon, Ronald; Lee, Shi-Wei Ricky Conference paper
Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection
PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, p. 384-389
Hon, R.; Lee, SWR; Zhang, SX; Wong, CK Conference paper
Optimization of epoxy flow for passive alignment of optical fiber arrays
Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v. 2005, 2005, p. 132-136
Lo, Chi Chuen; Li, Chung Yeung; Tai, Chung Leung; Lee, Shi Wei Ricky Conference paper
Thermal-fatigue life prediction equation for Plastic Ball Grid Array (PBGA) SnAgCu lead-free solder joints
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1013-1019
Lau, John; Lee, Shi Wei Ricky; Song, Fubin; Shangguan, Dongkai; Lau, Dennis C.; Dauksher, Walter Conference paper

2004 16

Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate
Soldering & Surface Mount Technology, v. 16, (2), 2004, p. 21-26
Yan, Eric C.C.; Lee, Shi Wei Ricky; Huang, Xingjia Article
Electronic Manufacturing Service Industries in China
China's Electronics Industries / Edited by M.G. Pecht, Y.C. Chan, College Park, Maryland: CALCE EPSC Press, 2004, p.109-136
Donahoe, Daniel; Lee, Shi-Wei Ricky Book chapter
A new method for the solder ball pull test using a shape memory alloy tube
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 237-242
Lo, Chi Chuen; Lau, Dennis Chung Yin; Lee, Shi Wei Ricky; Chan, Simon; Chan, Franky; Chau, K.C. Conference paper
Characteristics of Resistance of Daisy-Chained PBGA Solder Joints under Thermal Fatigue Load, Three-Point Bending Load and Mechanical Drop Load
6th International Symposium on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, December 5-7, pp. 204-209
Lui, Ben Hoi Wai; Lee, Shi-Wei Ricky; Zhang, Shawn Xiao Dong Conference paper
Chip-on-chip 3D optical interconnect with passive alignment
Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 2015-2019
Lo, Chi Chuen; Lee, Ricky Shi Wei; Wu, Jingshen; Kim, Jang Kyo; Yuen, Matthew Ming Fai Conference paper
Computational analyses on the effects of irregular conditions during accelerated thermal cycling tests on board level solder joint reliability
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 516-521
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky Conference paper
Computational model validation with experimental data from temperature cycling tests of PBGA assemblies for the analysis of board level solder joint reliability
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004, 2004, p. 115-120
Lee, Shi Wei Ricky; Lau, Dennis Chung Yin Conference paper
Effects of underfill adhesion on flip chip package reliability
Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC), 2004, p. 96-101
Sham, Man Lung; Kim, Jang Kyo; Lee, R.S.W.; Wu, Jingshen; Yuen, Matthew Ming Fai Conference paper
Experimental assessment of passive alignment of optical fibers With V-grooves on silicon optical bench
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 375-380
Lo, Chi Chuen; Lee, Shi Wei Ricky Conference paper
Finite element analysis for thermal fatigue life estimation of PBGA solder joints with model validation by experimental data
ITHERM 2004, VOL 2, 2004, p. 724
Lee, SWR Conference paper
Formation and Plugging of Through-Silicon-Vias for 3D Packaging
7th VLSI Packaging Workshop of Japan (VLSI2004), Kyoto, Japan, 29 November-2 December, pp. 105-108,
Lee, Shi-Wei Ricky; Hon, Ronald; Zhang, Shawn Xiao Dong; So, Sylvia Conference paper
Formation of through-silicon-vias by laser drilling and deep reactive ion etching
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 243-248
Hon, Ronald; Zhang, Shawn Xiaodong; Lee, Shi Wei Ricky Conference paper
Gold embrittlement of solder joints in wafer level chip scale package on printed circuit board with Ni/Au surface finish
Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 400-406
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T. Conference paper
Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves
Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 830-834
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai Conference paper
Thermal fatigue-life prediction of lead-free solder joints
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, November 2004, article number IMECE2004-62493, p. 265-270
Lau, John H.; Lee, Shi-Wei Ricky; Shangguan, Dongkai Conference paper
Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)
Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 1563-1569
Lau, John H.; Shangguan, Dongkai; Lau, Dennis Chung Yin; Kung, Terry T.W.; Lee, Shi Wei Ricky Conference paper

2003 11

Electronics Manufacturing with Lead-free, Halogen-free, and Conductive Adhesive Materials
McGraw-Hill, New York, NY
Lau, John; Wong, C.P.; Lee, N.C.; Lee, S. W. Ricky Book
芯片尺寸封裝: 設計, 材料, 工藝, 可靠性及應用
清華大學出版社, 北京, 中國 / ISBN 7-302-07376-7/TN.147, 435 pages
劉, 漢誠; 李, 世瑋; 賈, 松良; 王, 水弟; 蔡, 堅 Book
A Reliability Comparison of Electroplated and Stencil Printed Flip-Chip Solder Bumps Based on UBM Related Intermetallic Compound Growth Properties
53rd Electronic Components and Technology Conference, ECTC, New Orleans, USA, 27-30 May, pp. 685-691
Gong, Jing-Feng; Xiao, Guo-Wei; Chan, Philip C.H.; Lee, Ricky S.W.; Yuen, Matthew M.F. Conference paper
Effects of thermal aging and Au addition on the electrical resistance of solder balls in flip chip and ultra-CSP packages
ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, p. 831-836
Huang, XJ; Lee, SWR; Li, M.; Chen, W. Conference paper
Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages
Proceedings of InterPACK’03, Maui, Hawaii, U.S.A., July 6-11, IPACK2003-35246 on CD-ROM
Huang, Xingjia; Lee, Shi-Wei Ricky; Li, Ming; Chen, William Conference paper
Multi-chip memory module with a flip-chip-on-chip structure and an optional center via hole for underfill dispensing
Proceedings - Electronic Components and Technology Conference, 2003, p. 864-869
Lee, Shi Wei Ricky; Tsui, Yat Kit; So, Raymond; Luo, Le Conference paper
Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies
Proceedings - Electronic Components and Technology Conference, 2003, p. 1850-1855
Xiao, G.W.; Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F. Conference paper
Optimization of stencil printing wafer bumping for fine pitch flip chip applications
Proceedings - Electronic Components and Technology Conference, 2003, p. 1724-1730
Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F. Conference paper
Passive alignment of optical fiber in a V-groove with low viscosity epoxy flow
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 3, November 2003, article number IMECE2003-43902, p. 403-406
Lo, Chi Chuen; Yung, C.S.; Lee, Shi-wei; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai Conference paper
The impact of the AC current crowding effect on BJT RF noise modeling
2003 IEEE CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS, 2003, p. 327-330
Lee, Wai Kit; Man, Tsz Yin; Mok, Philip K.T.; Ko, Ping Keung; Chan, Man Sun Conference paper
Three-dimensional packaging for multi-chip module with through-the-silicon via hole
PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, p. 1-7
Tsui, Yat Kit; Lee, Ricky S W; Wu, Jingshen; Kim, Jang Kyo; Yuen,Matthew Ming Fai Conference paper

2002 17

Analysis on solder ball shear testing conditions with a simple computational model
Soldering & Surface Mount Technology, v. 14, (1), 2002, p. 45-48
Lee, SWR; Huang, XJ Article
Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders
Soldering & Surface Mount Technology, v. 14, (3), 2002, p. 46-50
Lee, Shi Wei Ricky; Lui, Ben Hoi Wai; Kong, YH; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector Article
Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package
IEEE transactions on advanced packaging, v. 25, (4), 2002, NOV, p. 514-521
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Choi, Kwang Seong; Kim, Young Gon Article
Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP)
IEEE transactions on components and packaging technologies, v. 25, (1), 2002, MAR, p. 3-14
Lau, John H.; Lee, Shi Wei Ricky Article
Micro-machined Conformal silicon Molds for wafer bumping and probing
INTERNATIONAL journal OF NONLINEAR sciences and Numerical SIMULATION, v. 3, (3-4, Sp. Iss. SI), 2002, p. 399-404
Lee, Shi Wei Ricky; Lo, Chi Chuen; Law, K.H. Article
Modeling and analysis of 96.SSn-3.SAg lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board
IEEE transactions on electronics packaging manufacturing, v. 25, (1), 2002, JAN, p. 51-58
Lau, John H.; Lee, Shi Wei Ricky Article
Modeling of torsional vibration induced by extension-twisting coupling of anisotropic composite laminates with piezoelectric actuators
Smart materials & structures, v. 11, (1), 2002, FEB, p. 55-62
Zhu, Mei-Ling; Lee, Shi-Wei Ricky; Li, Hing-Leung; Zhang, Tong-Yi; Tong, Pin Article
Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications
Journal of Electronic Packaging, v. 124, (3), July 2002, p. 205-211
Lau, John; Lee, Ricky Shi Wei; Pan, S.H.; Chang, Chris Article
Effects of room temperature storage time on the shear strength of PBGA solder balls
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 2, 2002, p. 259-262
Lee, Shi Wei Ricky; Tsui, Yat-Kit; Hunag, Xingjia; Yan, Eric C.C. Conference paper
Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls
14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-4 (IMECE2002/39514 on CD-ROM)
Lee, S. W. Ricky; Tsui, Y.K.; Huang, X.; Yan, C.C. Conference paper
Evaluation of board level reliability of Pb-free PBGA solder joints
International Advanced Packaging Materials Symposium, v. 2002, March 2002, article number 990368, p. 82-89
Lee, Shi-wei; Lui, Hon Wai Ben; Kong, Y.K.; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector Conference paper
Experimental Evaluation on Solder Joint Reliability of PBGA Assembly under Mechanical Drop Test
14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-5 (IMECE2002/39493 on CD-ROM)
Lee, Shi Wei Ricky; Li, Tracy Yin Lai; Lui, Ben Hoi Wai Conference paper
Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging
PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, p. 478-481
Tsui, YK; Lee, SWR; Huang, XJ Conference paper
Experimental investigation on the progressive failure mechanism of solder balls during ball shear test
Proceedings - Electronic Components and Technology Conference, 2002, p. 968-973
Huang, Xingjia; Lee, Shi Wei Ricky; Yan, Chien Chun Conference paper
Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener
Proceedings - Electronic Components and Technology Conference, 2002, p. 112-118
Xiao, G.W.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F. Conference paper
Stress Relaxation in Plastic Molding Compounds
International Symposium on Electronic Materials & Packaging (EMAP2002), December 4-6, Kaohsiung, Taiwan, pp. 37-42
Lee, M.; Pecht, M.G.; Huang, X.; Lee, S. W. Ricky Conference paper
Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects
PhoPack2002, July 14-16, Stanford, California, U.S.A., pp. 26-30
Lau, John; Lee, S. W. Ricky Conference paper

2001 15

Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations
Circuit World, v. 28, (2), 2001, p. 32-38
Lee, Shi-Wei Ricky; Lau, John H. Article
Computational Analysis on the Effects of Double-Layer Build-Up Printed Circuit Board on the Wafer Level Chip Scale Package (WLCSP) Assembly with Pb-Free Solder Joints
International Journal of Microcircuits & Electronic Packaging, 24(2), 89-104
Lau, John; Lee, S. W. Ricky Article
Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies
International Journal of Microcircuits & Electronic Packaging, v. 24, (2), 2001, p. 246-262
Huang, Xingjia; Kallmayer, Christine; Aschenbrenner, Rolf; Lee, S. W. Ricky Article
Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies
IEEE transactions on components and packaging technologies, v. 24, (2), 2001, JUN, p. 285-292
Lau, John H.; Chang, Chris; Lee, Shi Wei Ricky Article
以PZT薄膜为驱动和传感的微型陀螺研制
壓電與聲光, v. 23, (1), February 2001, p. 18-22
马薇; 李世玮; 虞吉林 Article
Microvias for Low-Cost High-Density Interconnects
McGraw-Hill, New York, NY
Lau, John; Lee, S. W. Ricky Book
Bending analysis of piezoelectric laminates
IUTAM SYMPOSIUM ON SMART STRUCTURES AND STRUCTRONIC SYSTEMS, v. 89, 2001, p. 275-282
Zhao, MH; Qian, CF; Lee, SWR; Tong, P.; Zhang, TY Conference paper
Characterization and analysis on the solder ball sheer testing conditions
Proceedings - Electronic Components Conference, 2001, p. 1065-1071
Huang, XJ; Lee, SWR; Yan, CC; Hui, S. Conference paper
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy
Advances in Electronic Packaging, v. 1, 2001, p. 307-313
Dai, Lanhong; Lee, Shi-Wei Ricky Conference paper
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)
American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 1, 2001, p. 237-242
Lee, Shi-Wei Ricky; Dai, Lanhong Conference paper
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)
ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 2, 2001, p. 2301-2306
Lee, Shi-Wei Ricky; Dai, Lanhong Conference paper
Dynamic structural coupling behaviours of an anti-symmetric piezoelectric laminate
Proceedings of SPIE - The International Society for Optical Engineering, v. 4326, 2001, p. 331-339
Wong, Kelvin H.L.; Lee, Shi-Wei Ricky Conference paper
Effects of plasma cleaning on the reliability of wire bonding
Advances in Electronic Materials and Packaging, v. 2001, November 2001, article number 983955, p. 39-43
Nowful, J.M.; Lok, S.C.; Lee, Shi-wei Conference paper
Reliability of 96.5Sn-3.5Ag lead-free solder-bumped wafer level chip scale package (WLCSP) on build-up microvia printed circuit board
2001 HD Interntional Conference on Hig-Density Interconnect and Systems Packaging, Santa Clara, CA, United States, 17-20 April 2001; Proceedings of SPIE - The International Society for Optical Engineering, v. 4428, 2001, p. 314-322
Lau, John H.; Lee, Shi Wei Ricky Conference paper
Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate
Proceedings - Electronic Components and Technology Conference, 2001, p. 598-605
Xiao, G.; Chan, P.C.H.; Teng, A.; Lee, R.S.W.; Yuen, M.M.F. Conference paper

2000 22

A damage evolution model for thermal fatigue analysis of solder joints
Journal of electronic packaging, v. 122, (3), 2000, SEP, p. 200-206
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Pao, Yihsin Article
Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion
Key engineering materials, v. 177-1, (Part 1&2), 2000, p. 267-272
Dai, Lan Hong; Lee, Shi Wei Ricky; Huang, Xing Jia Article
Design and manufacturing of micro via-in-pad substrates for solder bumped flip chip applications
Journal of Electronics Manufacturing, v. 10, (1), 2000, p. 79-87
Lau, J.; Chang, C.; Lee, R.; Chen, T.Y.; Cheng, D.; Tseng, T.J.; Lin, D. Article
Effects of electric fields on the bending behavior of PZT-5H piezoelectric laminates
Smart materials and structures, v. 9, (6), 2000, p. 824-831
Cheng, Jinquan; Qian, Caifu; Zhao, Minghao; Lee, Shi Wei Ricky; Tong, Pin; Zhang, Tong-Yi Article
Failure analysis of solder bumped flip chip on low-cost substrates
IEEE transactions on electronics packaging manufacturing, v. 23, (1), 2000, JAN, p. 19-27
Lau, John H.; Chang, Chris C.P.; Lee, Shi Wei Ricky Article
Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills
Journal of Electronic Packaging, Transactions of the ASME, v. 112, (4), 2000, Dec, p. 306-310
Lau, John H.; Lee, Shi Wei Ricky Article
Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate
IEEE TRANSACTIONS on ULTRASONICS FERROELECTRICS and FREQUENCY control, v. 47, (6), 2000, NOV, p. 1561-1574
Zhu, ML; Lee, SWR; Zhang, TY; Tong, P. Article
Solder joint reliability of plastic ball grid array with solder bumped flip chip
Soldering & Surface Mount Technology, v. 12, (2), 2000, p. 16-23
Lee, Shi Wei Ricky; Lau, John H. Article
Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method
Journal of Electronic Packaging, Transactions of the ASME, v. 122, (1), 2000, March, p. 34-41
Lau, John H.; Lee, Shi Wei Ricky Article
一种新颖的四梁式压电薄膜微型陀螺
中國科學技術大學學報=Journal of china university of science and technology, v. 30, (4), August 2000
马薇; 李世玮; 虞吉林 Article
引线框架用铜合金与Sn-Pb共晶焊料界面组织研究
功能材料, v. 31, (5), 2000, p. 494-495
王谦; Lee, Shi Wei Ricky; 曹育文; 唐祥云; 马莒生 Article
电子封装中的焊点及其可靠性
電子元件與材料, v. 19, (2), 2000, p. 24-26
王谦; LEE, Shi-Wei Ricky; 汪刚强; 耿志挺; 黄乐; 唐祥云; 马莒生 Article
An analytical method of extension-twisting coupling vibration of piezoelectric composite laminates
7th International Conference on Structural Dynamics: Recent Advances; Southampton; UK; 24-27 July 2000, pp. 121-134. 2000
Zhu, M.L.; Lee, S.W.R.; Zhang, T.Y.; Tong, P. Conference paper
Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, p. 868-873
Lee, Shi Wei Ricky; Yan, Chien Chun; Karim, Zaheed; Huang, Xing Jia Conference paper
Effects of Build-Up Printed Circuit Board Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package (WLCSP)
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904141, p. 115-126
Lau, John H.; Lee, Ricky S W Conference paper
Effects of electric fields on the bending behavior of piezoelectric composite laminates
Materials Research Society symposia proceedings, v. 604, 2000, p. 59-64
Cheng, Jin Quan; Zhang, Tong Yi; Zhao, Ming Hao; Qian, Cai Fu; Lee, Shi Wei Ricky; Tong, Pin Conference paper
Experimental Characterization for the Shear Strength of Pb-Free Solder Balls on a PZT Substrate with Pd/Ag Pads
Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2000, 2000, Article number 906354, p. 86-90
Huang, Xingjia; Lee, Ricky S W; Tse, Wansze Conference paper
Modeling for prototyping of rotary piezoelectric motors
Structures and Materials, v. 7, 2000, p. 21-30
Lee, Shi-Wei Ricky; Zhu, Mei-Lirig; Wong, H.L. Conference paper
Reliability of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag Lead-Free Solder Joints on Build-Up Microvia Printed Circuit Board
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904133, p. 55-63
Lau, John H.; Lee, Ricky S W Conference paper
Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies
50th Electronic Components and Technology Conference, Las Vegas, NV, USA, 2000, p. 1360-1368
Lau, John; Chang, Chris; Lee, Shi Wei Ricky Conference paper
Study on the Interfaces Between Copper Alloys for Lead Frame and Sn-Pb Solder Alloys
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904185, p. 388-390
Qian, Wang; Lee, Ricky S W; Yuwen, Cao; Jusheng, Ma A. Conference paper
The Mechanical Properties Degradation of Solder Joints Under Thermal Cycling
2000, Article number 904153, p. 194-196
Wang, Qian; Lee, Ricky S W; Wang, Gangqiang; Chen, Guohai; Hung, Le; Ma, Jusheng Conference paper

1999 9

Assembly of large PBGAs on printed circuit board with large PQFPs directly on the opposite side
Journal of Electronics Manufacturing, v. 9, (4), 1999, p. 293-298
Lau, John H.; Lee, Shi-Wei Ricky; Chao, Henry Article
Computational analysis for the torsional vibration control of an anti-symmetric piezoelectric composite laminate
Journal of intelligent material systems and structures, v. 10, (7), 1999, JUL, p. 530-533
Lee, Shi Wei Ricky; Li, Hing Leung Article
Design and analysis of a microgyroscope with sol-gel piezoelectric plate
Smart materials & structures, v. 8, (2), 1999, APR, p. 212-217
He, Guohong; Nguyen, Christopher C.T.; Hui, JCM; Lee, Shi Wei Ricky; Luong, Howard Cam Article
Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages
Journal of Electronic Packaging, Transactions of the ASME, v. 121, (4), 1999, Dec, p. 242-248
Lau, John; Chen, Tony; Lee, Shi Wei Ricky Article
Chip Scale Package (CSP): Design, Materials, Process, Reliability & Applications
McGraw-Hill / New York, NY. (ISBN 0-07-038304-9, 564 pages)
Lau, J.H.; Lee, S.W.R. Book
Design and Performance of a Piezoelectric Microgyroscope
10th International Conference on Solid-State Sensors and Actuators (Transducers' 99), June 1999
Cheung, V.S.L.; Ma, W.; Luong, H.C.; Lee, R. Conference paper
Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board
Proceedings of the 1999 International Symposium on Microelectronics, Chicago, IL, USA, v.3906, 26-28 October 1999, p. 592-598
Lau, John H.; Lee, Shi Wei Ricky; Ouyang, Chien Conference paper
Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 1-4 June 1999, p. 571-582
Lau, John H.; Lee, Shi Wei Ricky; Chang, Chris; Ouyang, Chien Conference paper
Global Collaborative Electronic Packaging Education
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, p. 907-911
Tong, Pin; Lam, David C C; Yuen, Matthew Ming Fai; Kim, Jang Kyo; Lee, Ricky S W; Lee, Steve Han Keung; Chan, Philip Ching Ho Conference paper

1998 12

Computational modeling and analysis of a center-cracked panel repaired by bonded composite patch
Key Engineering Materials, v. 145-149, 1998, p. 601-606
Chau, RWT; Lee, Shi Wei Ricky Article
Critical issues in computational modeling and fatigue life analysis for PBGA solder joints
International Journal of Microcircuits and Electronic Packaging, v. 21, (3), 1998, p. 253-261
Zhang, Xiaowu; Lee, Shi Wei Ricky Article
Development and characterization of a rotary motor driven by anisotropic piezoelectric composite laminate
Smart materials & structures, v. 7, (3), 1998, JUN, p. 327-336
Lee, SWR; Li, HL Article
Effects of temperature profile on the life prediction of PBGA solder joints under thermal cycling
Key engineering materials, v. 145-9, (Part 1&2), 1998, p. 1133-1138
Zhang, Xiao Wu; Lee, Shi Wei Ricky Article
Experimental investigation of the shear strength of a unidirectional carbon/aluminum composite under dynamic torsional loading
Composites science and technology, v. 58, (10), 1998, p. 1667-1673
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky Article
Material response and failure mechanism of unidirectional metal matrix composites under impulsive shear loading
Key engineering materials, v. 141-1, (Part 1-2), 1998, p. 651-669
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky Article
Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading
Circuit World, v. 24, (3), 1998, p. 26-31
Lee, Shi-Wei Ricky; Zhang, Xiaowu Article
Solder joint reliability of cavity-down plastic ball grid array assemblies
Soldering & Surface Mount Technology, v. 10, (1), 1998, FEB, p. 26-31
Lee, Shi Wei Ricky; Lau, John H. Article
Special Issue on Piezoelectric Motors/Actuators and Their Applications - Preface
Smart Materials and Structures, v. 7, (3), June 1998, p. U3
Lee, Ricky S W Article
Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models
Key engineering materials, v. 145-9, (Part 1&2), 1998, p. 1127-1132
Park, Joo Hyuk; Kim, Jang Kyo; Yuen, Matthew Ming Fai; Lee, Shi Wei Ricky; Tong, Penger; Chan, Philip Ching Ho Article
Computational modeling and parametric study of a rotary actuator driven by piezoelectric composites
Proceedings of SPIE - The International Society for Optical Engineering, v. 3323, 1998, p. 414-421
Li, Hing Leung; Lee, Shi-Wei Ricky Conference paper
Thermal fatigue life prediction for solder joints with the consideration of damage evolution
2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, p. 279-285
Zhang, Xiao Wu; Lee, Shi Wei Ricky Conference paper

1997 6

Design for plastic ball grid array solder joint reliability
Circuit World, v. 23, (2), 1997, p. 11-X1
Lee, Shi-Wei Ricky; Lau, John H. Article
Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading
American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1559-1561
Lee, Shi-Wei Ricky; Zhang, Xiao Wu Article
Warpage analysis of plastic ball grid array packages
American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1789-1791
Lee, Shi-Wei Ricky Article
An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity
Proceedings of the Electronic Technology Conference, EPTC, v. 1997, October 1007, p. 82-85
Lee, Shi Wei Ricky; Yan, Chien Chun; Chow, LW; Papageorge, Marc Conference paper
Design for plastic ball grid array solder joint reliability
Proceedings of the NEPCON WEST'97. Part 3 (of 3), Anaheim, CA, USA, v. 2, 1997, Feb, p. 1023-1032
Lee, Shi Wei Ricky; Lau, John H. Conference paper
Solder joint reliability of plastic ball grid array with solder bumped flip chip
Paper - American Society of Mechanical Engineers, 1997
Lee, Shi Wei Ricky; Lau, John H. Conference paper

1996 6

Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages
Circuit World, v. 23, (1), 1996, p. X1-19
Lee, Shi-Wei; Lau, John H. Article
Impact performance of a woven fabric CFRP laminate
Polymers & polymer composites, v. 4, (8), 1996, p. 549-561
Kim, Jang Kyo; Leung, LM; Lee, Ricky Shi Wei; Hirai, Yasunobu Article
Anisotropic piezoelectric laminates for rotary actuators
Proceedings of SPIE - The International Society for Optical Engineering, v. 3321, 1996, p. 484-491
Lee, Shi-Wei Ricky; Li, Hing Leung Conference paper
Design of linear and rotary actuators using piezoelectric composite laminates
Progress in Advanced Materials and Mechanics, Vol. 1; Beijing; China; 12-15 Aug. 1996. pp. 304-309. 1996
Lee, SW R. Conference paper
Impact response of woven fabrics and cross-plies carbon fibre composites
Proc. 5th Symp. of Interfacial Materials Science on Composite Materials, Fukuoka, Japan, May 1996, p. 310-313
Kim, Jang-Kyo; Leung, L.M.; Lee, R.S.W.; Hirai, Y. Conference paper
Mechanical property study of composite grid reinforced concrete
Proceedings of the 2nd International Symposium on Civil Infrastructure Systems, Hong Kong/China, 1996, p. 205-210
Chen, M.; Li, Zongjin; Lee, R.; Tong, Ping Conference paper

1995 4

ON THE APPARENT BENDING ISOTROPY IN CLAMPED ELLIPTIC COMPOSITE LAMINATES
Journal of composite materials, v. 29, (12), 1995, p. 1601-1620
Lee, Shi Wei Ricky; SUN, Chin Teh Article
Actuation of Torsional Motion for Piezoelectric Laminated Beams
Dynamic Response & Behavior of Composites, v. 46, 1995, p. 139-146
Lee, Shi-Wei Ricky; Chan, Kwok Ho W. Conference paper
Bending/Twisting/Shearing Actuation and Sensing of Laminated Composite Beams with Piezopolymer Film
Intelligent Materials and Systems, 1995, p. 137-148
Lee, Shi-Wei Ricky; Sun, C.T. Conference paper
Evaluation of Residual Strength for Cracked Pressure Vessel Repaired by Composite Patch
Proc. ICCE/2 International Conference, New Orleans, LA, August 21-24 1995, p. 449-450
Lee, Shi-Wei Ricky Conference paper

1994 2

On the Sensing and Actuation of Clamped Elliptic Piezoelectric Laminates
Adaptive Structures and Composite Materials, Chicago, IL, USA, v. 45,November 6-11 1994, p. 275-279
Lee, Shi-Wei Ricky Conference paper
The Use of Clamped Circular Piezoelectric Laminates as Pressure Sensors
Proc. 9th ASC Conference, Newark, DE, September 20-22 1994, p. 331-339
Lee, Shi-Wei Ricky Conference paper

1993 3

A Quasi-Static Penetration Model for Composite Laminates
Journal of Composite Materials, v. 27, (3), 1993, p. 251-271
Lee, Shi-Wei Ricky; Sun, Chin Teh Article
Dynamic Penetration of Graphite/Epoxy Laminates Impacted by a Blunt-Ended Projectile
Composites Science & Technology, v. 49, (4), 1993, p. 369-380
Lee, Shi-Wei Ricky; Sun, Chin Teh Article
Bending Characteristics of Clamped Elliptic Symmetric Composite Laminates
Proc. 8th ASC Conference, Cleveland, OH, 20-22 October 1993, p. 1087-1096
Lee, Shi-Wei Ricky; Sun, Chin Teh Conference paper

1992 1

Ballistic Limit Prediction of Composite Laminates by a Quasi-Static Penetration Model
Proc. 24th SAMPE Technical Conference, Toronto, Canada, October 20-22 1992, p. 497-511
Lee, Shi-Wei Ricky; Sun, Chin Teh Conference paper

1991 1

Modeling Penetration Process of Composite Laminates Subjected to a Blunt-Ended Punch
Proc. 23rd SAMPE Technical Conference, Kiamesha Lake, NY, October 21-24 1991, p. 624-638
Lee, Shi-Wei Ricky; Sun, Chin Teh Conference paper

1988 3

Damage in Composite Laminates: Effects of Transverse Cracks
Mechanics of Materials, v. 7, 1988, p. 91-107
Herakovich, C.T.; Aboudi, J.; Lee, Shi-Wei Ricky; Strauss, E.A. Article
Three-Dimensional Analysis of Laminates with Cross Cracks
Journal of Applied Mechanics, ASME Transactions, v. 55, 1988, p. 389-397
Aboudi, J.; Lee, Shi-Wei Ricky; Herakovich, C.T. Article
2-D and 3-D Damage Effects in Cross-Ply Laminates
Mechanics of Composite Materials, Berkeley, CA, USA, v. 92, June 20-22 1988, p. 143-147
Herakovich, C.T.; Aboudi, J.; Lee, Shi-Wei Ricky; Strauss, E.A. Conference paper


No Publications






Teaching Assignment

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2021-22 Winter 0 2021-22 Fall 1 2020-21 Summer 0 2020-21 Spring 0 2020-21 Winter 0 2020-21 Fall 0

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SYSH6780 Career Development for Systems Hub Research Students


No Teaching Assignments


No Teaching Assignments


No Teaching Assignments


No Teaching Assignments


No Teaching Assignments






Research Postgraduate (RPG) Supervision From January 2019 to December 2022 (As of 30 January 2022)

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All Supervisions Current RPGs Graduated RPGs

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Current RPGs

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Doctor of Philosophy CANG, Mingpei
Smart Manufacturing( 2022 - )

ZHENG, Wenjia
Smart Manufacturing( 2022 - )

YU, Lin (co-supervision)
Intelligent Transportation( 2021 - )

XU, Qianwen
Smart Manufacturing( 2020 - )

XU, Hua
Mechanical Engineering( 2019 - )

CHENG, Yuanjie
Mechanical Engineering( 2018 - )

TU, Ning
Mechanical Engineering( 2017 - )

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Graduated RPGs

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Doctor of Philosophy QIU, Xing
Mechanical Engineering( Completed in 2020 )

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Master of Philosophy XU, Qianwen
Mechanical Engineering( Completed in 2020 )









ProjectsFrom January 2020 to December 2022

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All Projects 9 Leading Projects 4 Participating Projects 5

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A High-accuracy Wafer Polisher and Bonders for Heterogeneous Integration


用於異質性整合的高精度磨片機和鍵合機 Participating


RGC - Collaborative Research Fund


Project Team (HKUST)
POON Andrew Wing On (Lead)
CHAN Man Sun
CHEN Kevin Jing
FAN Zhiyong
LAU Kei May
LEE Ricky Shi-wei
LEE Yi-Kuen
LI Zhigang
QIU Huihe
SRIVASTAVA Abhishek Kumar
WONG Man
YE Wenjing
YOBAS Levent
YU Hongyu


2021 -




Development of a Long-Term Biocompatible Wireless Transcleral Electrical Stimulation Implant System for Pre-clinical Trials


開發用於臨床前試驗的長期生物相容無線鞏膜電刺激植入系統 Participating


Innovation and Technology Fund, Neurotech (Hong Kong) Limited


Project Team (HKUST)
TSUI Chi Ying (Lead)
KI Wing Hung
LEE Ricky Shi-wei


2020 -




UVC LED Sterilization of Personal Protective Equipment for Reuse Purposes


以深紫外線LED 消毒殺菌技術實現個人防護設備之再利用 Leading


Innovation and Technology Fund


Project Team (HKUST)
LEE Ricky Shi-wei (Lead)


2020 - 2021




The subsidies of FYTRI R&D spending for 2018


2018年度廣州市香港科大霍英東研究院新型研發機構建設后補助 Leading


Guangzhou Municipal Science and Technology Bureau


Project Team (HKUST)
LEE Ricky Shi-wei (Lead)


2019 - 2021




Nansha Entrepreneurship (Demonstration) Base Recognition


廣州市南沙區創業（示范）基地 Leading


Nansha Science & Technology Bureau


Project Team (HKUST)
LEE Ricky Shi-wei (Lead)


2019 - 2020




Implementation of the Re-distribution Layer (RDL) by Additive Manufacturing for Rapid Prototyping of Chip-level Interconnection


以增材製造技術實現芯片級再佈線互連之快速原型製作 Leading


Innovation and Technology Fund


Project Team (HKUST)
LEE Ricky Shi-wei (Lead)


2018 - 2021




A Deep Reactive Ion Etching System for Nanosystem Fabrication


用於納米系統製造的反應離子深硅刻蝕設備 Participating


RGC - Collaborative Research Fund


Project Team (HKUST)
POON Andrew Wing On (Lead)
CHAN Ho Bun
CHAN Man Sun
FAN Zhiyong
LAU Kei May
LEE Ricky Shi-wei
LEE Yi-Kuen
LI Zhigang
SIN Johnny Kin On
WEN Weijia
WONG Man
YE Wenjing
YOBAS Levent


2017 - 2020




State Key Laboratory of Advanced Displays and Optoelectronics Technologies (The Hong Kong University of Science and Technology)


先進顯示與光電子技術國家重點實驗室（香港科技大學） Participating


Innovation and Technology Fund


Project Team (HKUST)
WONG Man (Lead)
CHAN Che Ting
CHAN Man Sun
CHEN Kevin Jing
FAN Zhiyong
KWOK Hoi Sing
LAU Kei May
LEE Ricky Shi-wei
POON Andrew Wing On
QUAN Long
SHENG Ping
TSUI Chi Ying
WONG Kam Sing
YUAN George Jie
YUE Chik Patrick


2013 -




Proposal to study the Thermal-Mechanical Stress in Electronic Packages Participating


ASAT Ltd.


Project Team (HKUST)
YANG Jinglei (Lead)
LEE Ricky Shi-wei


1997 -