基本信息科学研究/Research论文专著/Publications教育教学/Teaching毕业生/Alumni
基本信息



1. 基础与交叉科学研究院, 微纳米技术研究中心.

2. 微系统与微结构制造教育部重点实验室, 微纳连接与电子封装中心.

3. 先进焊接与连接国家重点实验室, 电子封装与微纳制造中心.

4. 材料科学与工程学院, 焊接科学与工程系, 电子封装技术专业.

每年招收1-2名硕士研究生，欢迎理工学科背景的学生加入。

荣誉称号
面向MEMS 立体封装和组装微锡球激光键合工艺及设备，中国机械工业科学技术奖，二等奖，2014
电子封装技术新专业建设的研究与实践，黑龙江省高等教育教学成果奖，二等奖，2013

微连接技术基础及可靠性研究，黑龙江省高校科学技术进步奖，一等奖，2011

NXP Semiconductors Best Paper Award, 8th International Conference on Electronics Packaging Technology. 2007
Philips Best Paper Award, 6th International Conference on Electronics Packaging Technology. 2005
Third Award, GE Foundation Edison Cup Technology Innovation Competition. 2004



工作经历
时间工作经历
2009-2012哈尔滨工业大学, 化工学院, 博士后
2009-至今哈尔滨工业大学, 基础与交叉科学研究院, 讲师、副教授


教育经历
1998年-2002年, 哈尔滨工业大学, 材料成型与控制工程, 学士学位2002年-2004年, 哈尔滨工业大学, 材料加工工程, 硕士学位2004年-2008年, 哈尔滨工业大学, 材料加工工程, 博士学位


研究领域
目前研究方向
电子封装键合点和焊点的形成机制、性能表征及其可靠性

柔性电子封装及柔性互连含能材料外场诱导限域反应及其应用
仿生超材料功能设计及其封装组装


团队成员
李海龙: 博士生, 研究方向: 封装焊点贮存可靠性.朱建东: 博士生, 研究方向: 大功率封装钟颖: 博士生, 研究方向: 纳米钎料李亚飞: 硕士生, 研究方向: 自修复钎料系统设计与制备蔡重阳: 本科生(保研), 研究方向: 可延展仿生超材料张钧翀: 本科生, 研究方向: 自修复钎料.何军健: 本科生, 研究方向: 金属间化合物团簇融合机制.彭鹏: 本科生, 研究方向: Cu-Sn金属间化合物空位形成机理.陆骅俊: 本科生, 研究方向: 掺杂元素对Cu-Sn金属间化合物空位形成的影响.


论文期刊/Articles


2015Ying Zhong, Rong An, Chunqing Wang, Zhen Zheng, Zhi-Quan Liu, Chin-Hung Liu, Cai-Fu Li, Tae Kyoung Kim, Sungho Jin. Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super-uniform High Temperature Circuit Interconnections. Small (IF=8.368), 11(33), 4097-4103, 2015.Hailong Li, Rong An, Chunqing Wang, Bin Li. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing. Materials Lettes (IF=2.489). 158, 252-254, 2015.Jiandong Zhu, Rong An, Chunqing Wang, Wei Liu. Synthesis of CrO single crystal slices by firing under water vapor atmosphere. Materials Lettes (IF=2.489). 2015, 152:13-16.Jiandong Zhu, Rong An, Chunqing Wang, Wei Zhang, Guangwu Wen. Characterization of the Microstructure of an AlN-Mullite-Al₂O₃ Ceramic Layer on WCu Composite Alloy for Microelectronic Application. Journal of Electronic Materials (IF=1.798), 44(11), 4154-4160, 2015Rong An, Yanhong Tian, Rui Zhang, Chunqing Wang. Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints. Journal of Materials Science: Materials in Electronics (IF=1.569). 2015, 26(5):2674-2681.Wei Liu, Rong An*, Ying Ding, Chun-Qing Wang, Yan-Hong Tian, Kun Shen. Microstructure and property of AgCu/2wt% Ag added Sn-Pb solder/CuBe joints fabricated by vapor phase soldering. Rare Metals (IF=1.009). DOI 10.1007/s12598-015-0545-y, 2015. In PressHailong Li, Rong An*, Chunqing Wang, Zhi Jiang. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging. Journal of Alloys and Compounds (IF=2.99). 2015, 634:94-98.Hailong Li, Rong An*, Chunqing Wang, Yanhong Tian, Zhi Jiang. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints. Materials Letters (IF=2.489). 2015, 144:97-99.Jiandong Zhu, Rong An, Chunqing Wang, Guangwu Wen. Fabrication of Al2O3-Mullite-AlN Multiphase Ceramic Layer on W-Cu Substrates for Power Semiconductor Packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology (IF=1.18). 2015, 5(2):182-187.Wei Liu, Rong An, Chunqing Wang and Yanhong Tian. Effect of Au-Sn IMCs' formation and morphologies on shear properties of laser reflowed micro-solder joints. Soldering & Surface Mount Technology (IF=0.872), 2015, 27(1):45-51.2014Rong An, Yanhong Tian, Lingchao Kong, Chunqing Wang, Shuai Chang. Laser-ignited Self-propagating Behavior of Self-supporting Nano-scaled Ti/Al Multilayer Films. Acta Metallurgica Sinica -Chinese Edition (IF=0.54), 2014, 50(8):97-943.Jiandong Zhu, Rong An, Chunqing Wang, Yanhong Tian,Guangwu Wen. A novel Method to Fabricate AlN-Al2O3 Multiphase Ceramic Layer on WCu Alloy. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014.Rong An, Huiwen Ma, Hailong Li, Zhen Zheng, Chunqing Wang. Formation of single phase Cu-Sn IMCs via layer-by- layer electroplating of Cu and Sn metals. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014.Rong An, Yanhong Tian, Chunqing Wang. Effect of modulation structure on the laser-ignited self-propagating behavior of Ti/Al multilayer films. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014.Rong An, Di Xu, Chunqing Wang. Parallel-gap resistance welding between gold-plated silver interconnects and silver electrodes in germanium solar cells. 2014 15 the International Conference on Electronics Packaging Technology (EI), Chengdu, CHINA; 08/2014.2013Rong An, Wei Liu, Chunqing Wang, Yanhong Tian. Analytical bond-order potential for Sn. Acta Physica Sinica -Chinese Edition (IF=0.813), 2013; 62(12). Mei Zhu, Rong An*, Chunqing Wang, Xingyao Fu. Laser-induced Self-propagating Reaction in Ti/a-Si Multilayer Films. 2013 14th International Conference on Electronic Packaging Technology (EI); 08/2013.Hailong Li, Rong An*, Mingliang Fu, Chunqing Wang, Mei Zhu, Rui Zhang. Effect of High Temperature Thermal Aging on Microstructural Evolution of Sn3Ag0.5Cu/Cu Solder Joints. 2013 14th International Conference on Electronic Packaging Technology (EI); 08/2013.安荣、杭春进、刘威、张威、田艳红、王春青、电子封装与组装焊点钎料合金力学行为研究进展, 电子工艺技术, 第34卷, 第2期, 65-69页, 2013杭春进、安荣、飞景明、王宏、孙毅、王春青、大功率LED照明模块及高效散热结构优化设计, 焊接, 第2期, 20-24页, 2013杭春进、安荣、王宏、飞景明、王春青、郑振、铝制散热器翅片钎焊工艺研究, 焊接, 第1期, 27-29页，**Yanhong Tian, Wei Liu, Rong An, Wei Zhang, Lina Niu, Chunqing Wang. Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test, Journal of Materials Science (IF=2.371), 23(10):136-147, 2012.Bin Li, Chunqing Wang, Wei Liu, Ying Zhong, Rong An. Synthesis of Co-doped barium strontium titanate nanofibers by sol–gel/electrospinning process. Materials Letters (IF=2.489). 2012.Hailong Li, Chunqing Wang, Meng Yang, Ningning Wang, Rong An*, Yanjun Xu, The effect of Voids on Thermal Conductivity of Solder Joints, 2012 13th International Conference on Electronic Packaging Technology (EI); 08/2012.Yarong Chen, Meng Yang, Binbin Zhang, Rong An. Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics. 2012 13th International Conference on Electronic Packaging Technology (EI); 08/2012.Ningning Wang, Binbin Zhang, Rong An, Meng Yang. Research of reflow soldering on Al-SiC composite material and thick film ceramic substrates. 2012 13th International Conference on Electronic Packaging Technology (EI); 08/2012.安荣、杨猛、王宁宁、王春青、安茂忠、再流焊接头气孔对散热的影响, 电子工艺技术, 第33卷, 第3期, 127-131页, 2012-2011 Wei Liu, Rong An, Chunqing Wang, Yanhong Tian, Lei Yang, Lining Sun. Evolution of AuSnx intermetallic compounds in laser reflowed micro-solder joints, China Welding (EI), 20(1):1-5, 2011.安荣, 刘威, 杭春进, 田艳红, 王春青, 安茂忠. 电子封装与组装焊点界面反应及微观组织研究进展, 电子工艺技术, 第32卷, 第6期, 321-329页, 2011.Rong An, Chunqing Wang, Yanhong Tian. Depiction of the Elastic Anisotropy of AuSn4 and AuSn2 from First-principles Calculations, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) (EI); 08/2009.Rong An, Chunqing Wang, Yanhong Tian. Determination of the elastic properties of Au5Sn and AuSn from Ab initio calculations, Journal of Electronic Materials (IF=1.798). Vol. 37, No. 7, 2008: 968- 974.Rong An, Chunqing Wang, Yanhong Tian, Huaping Wu. Determination of the elastic properties of Cu3Sn through first-principles calculations, Journal of Electronic Materials (IF=1.798). Vol. 37, No. 4, 2008: 477- 482.Mingyu Li，Rong An，Chunqing Wang，Self excite reflowing and interfacial reaction of SnPb eutectic solder on BGA pad under alternate electromagnetic radiation. Acta Metallurgica Sinica (IF=0.54). 2004. 40(10):1093-1098.Rong An, Chunqing Wang, Yanhong Tian. First-Principles Study on the Elastic Anisotropy of Au5Sn and AuSn, 9th International Conference on Electronics Packaging Technology (EI), Shanghai, 2008.Rong An, Chunqing Wang and Yanhong Tian. Elastic property of Cu3Sn determined by a first-principles calculation on the basis of its crystal substructure, 8th International Conference on Electronics Packaging Technology (ICEPT2007) (EI), August 26-29, 2007. (SCI; EI) Best paper award.Rong An, Mingyu Li, Chunqing Wang, A New Solder Bumping Technology with Local Induction Heating, 8th International Conference on Electronics Packaging Technology (ICEPT2005), Aug. 30-Sep. 2, 2005. (EI) Best paper awardRong An, Chunqing Wang and Yanhong Tian. Investigation of Tin Atomic Migration of Tin-based Solders with Cluster Model and DV-Xa Method in Electromigration, 7th International Conference on Electronics Packaging Technology (ICEPT2006), Aug. 26 - 29, 2006. (SCI, EI)Rong An, Mingyu Li, Chunqing Wang. A Novel Reflow Method for Electronic Area Array Packaging, 1st International EcoDesign Electronics Symposium, Shanghai, 2004:117-121.


专利
已公开的发明专利硅/金属含能调制膜诱导反应制备高温服役低电阻接头的方法，2014.3，中国， **1.X扫描式热传导线温检测工件浅表裂纹的方法，2013.7，中国， **8.5倒装焊芯片焊点缺陷双热像仪红外测温检测法，2013.4，中国，**0.X板级立体封装中板间连接电阻热焊方法，2014/9/10, CN**3.4.孔令超；安荣；郑振，敏捷化电热自焊接电路板，2014/9/10, 黑龙江, CN**0.2. 已授权的发明专利采用红外多点测温热阻法检测电路板焊点可靠性的检测系统，2012.11，中国，ZL**9.6一种可提高导线与焊盘焊接效率及可靠性的手工电烙铁头，2014.10，中国，ZL**6.3


讲授课程
电子封装可靠性简介: 材料学院电子封装技术专业主干课程, 主要讲授电子封装相关的可靠性工程数学, 可靠性试验, 可靠性物理, 失效分析等内容.

混合微电路技术简介: 材料学院电子封装技术专业选修课程, 主要讲授薄膜电路, 厚膜电路, 混合电路设计和制造工艺等内容.

本科毕业生/Bachelors
2015

何军健彭鹏陆骅俊2014

马慧文, 研究生皮义群, 北京微电子研究所许迪, 研究生付明亮, 沈阳2013

宋雪, 研究生付星尧, 天马微电子(上海)2012

钱磊, 威海许艳君, 华中科大研究生张林, 上海804所王璐, 威海白天睿, 威海2011

常帅, 新加坡国立大学朱梅, 上海804所王振斌, 美国加州大学圣地亚哥分校