教授

职称：教授，博士生导师
学位：博士(PhD)
毕业学校：香港科技大学
Email: liullin@mail.sysu.edu.cn
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招生方向：光学工程
研究方向隶属光学工程、数学、计算机科学与技术的交叉融合领域，欢迎加入！
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学术兼职和社会服务:
广州市半导体光源工程技术研究中心 主任

教育经历:
北京航空航天大学，学士；
北京航空航天大学，硕士；
香港科技大学，博士

授课课程:
《概率论与数理统计》、《光学工程进展》、《光学工程实验方法与技术》、《光学工程研究导论》等

研究方向:
隶属光学工程、数学、计算机科学与技术的交叉融合领域：
1、人工智能、机器人视觉、SLAM、计算成像技术、多模-多维成像技术；
2、光场3D显示（VR与AR等）、三维光学；
3、可见光通信及水下无线光通信，通信&感知一体化；
4、可靠性工程

科研项目:
1、广东省重点领域研发计划2019年度“新一代人工智能”项目，《工业级多模智能感知系统关键技术与边云协同应用》，中大方项目负责人
2、国家自然科学基金面上项目《 AlGaN基p-i-n紫外日盲探测器在雪崩软击穿过程中的损伤机理研究 》，主持
3、国家自然科学基金青年基金项目《高密度片外纳米孪晶铜连接在力-电-热耦合作用下的力学行为》，主持
4、国家自然科学基金-广东联合基金重点项目，《 半导体照明系统可靠性强化机理与试验方法设计 》，总排名第二
5、国家863计划项目，《 基于失效机理的LED照明系统可靠性与可控寿命技术研究 》，子课题负责人
6、国家863计划项目，《 城市快速路智能化半导体照明关键技术研发及示范 》，子课题负责人
7、广东省科技重大专项，可见光通信专题，《照明级宽光谱高速高压LED集成功能光发射器件的开发》，主持
8、广东省科技重大专项，可见光通信专题，《 室内可见光通信工程化应用的关键技术研发 》，子课题负责人
9、广东省自然科学基金创新团队，《 第三代半导体GaN电力电子材料与器件研究团队 》，核心人员
10、广州市科技计划，重点项目，《 全高清广色域裸眼3D显示技术的研发 》，主持
11、广州市科技计划项目，一般项目，《光场3D眼镜技术的研究及样机制备》，主持
12、高校基本科研业务费，交叉培育项目，《 头盔式虚拟现实光场显示技术的研究 》，主持

代表性科研成果:
1.书籍著作
1）《LED可见光通信关键器件与应用》，人民邮电出版社，2015年8月，第二章和第三章部分内容。
2、专利
在全息3D显示、光场3D显示（包含虚拟现实、增强现实等）领域申请中国发明专利、国际专利三十多项，部分已授权，包括授权美国专利1项、日本专利1项等。部分专利成果转让实施中。
在LED背光源、micro-LED、可见光通信领域申请中国发明专利二十余项，部分已授权。
3.获奖情况
"头戴式光场VR样机”，入选2019年度在美国圣何塞（硅谷）举办的SID美国显示周的I-Zone（创新区）。
原创的新型超多视图光场3D显示技术经过激烈竞争，入选2017年度在美国洛杉矶举办的SID美国显示周的I-Zone（创新区），基于该技术的参展样机为“光场3D眼镜(Light field 3D glasses)”系统和“光场VR(Light field HMD VR)”单目系统，获得了行业极大关注。该展由国际信息显示学会主办，已经有54年的历史，是目前全球最具影响力的显示领域专业盛会。国际信息显示学会是信息显示领域最大和最权威的专业学术组织。其中，I-Zone是SID的特色，展示最具创新性的显示技术，2017年I-Zone由Eink赞助。
Xilinx 2017 OpenHW设计大赛及学术峰会于与2017年8月3-5日在新加坡科技设计大学举行，共设置两个奖项(最佳创意奖和最佳设计奖)，指导的学生团队获最佳设计奖。
14th International Conference on Electronic Materials and Packaging(EMAP 2012), 香港, 指导的硕士生获最佳学生论文奖(Best student paper award)。
4. 主要学术论文（第一作者或通信作者）
1）"Over 700 MHz-3 dB Bandwidth UOWC System Based on Blue HV-LED With T-Bridge Pre-Equalizer”,IEEE Photonics Journal, Vol.11,No.3, **, June 2019, DOI: 10.1109/JPHOT.2019.**.
2)“GaN-based mid-power flip-chip light-emitting diode with high-3 dB bandwidth for visible light communications”. Applied Optics(1559-128X). 2018, 57(11):2773-2779
3) “GaN-based generic bi-function LED for potential duplex free-space VLCs”, July 2017, IEEE Photonics Journal, 10.1109/JPHOT.2017.**;
4) “Improving the ?3dB bandwidth of medium power GaN-based LEDs through periodic micro via-holes for visible light communications”, Optics Communications, vol. 392, pp.175-179, JUN 1 2017;
5) “Three-dimensional display on computer screen free from accommodation-convergence conflict”, Optics Communications, vol. 390, pp. 36-40, MAY 1 2017;
6) “A Power-Type Single GaN-Based Blue LED With Improved Linearity for 3 Gb/s Free-Space VLC Without Pre-equalization”, IEEE Photonics Journal, vol. 8(3), **, JUN 2016
7) “A LTPS-TFT Pixel Circuit for Active Matrix Organic Light Emitting Diode Based on Improved Current Mirror”, Displays, vol. 44, pp.1-4, SEP 2016
8) “Super multi-view three-dimensional display technique for portable devices”, Optics Express, vol. 24(5), pp. 4421-4430, MAR 7 2016
(该期top download，并被OSA和AIP联合推荐至Phys. Org.进行了题为“Shrinking 3D technology for comfortable smart phone viewing”专访报道, https://phys.org/news/2016-02-3d-technology-comfortable-smart-viewing.html)
9) “Improved spatiotemporal-multiplexing super-multiview display based on planar aligned OLED microdisplays”, Optics Express, vol. 23(17), pp. 21549-21564, AUG 24, 2015
10) “An explanation for catastrophic failures of GaN-based vertical structure LEDs subjected to thermoelectric stressing”, Journal of Physics D: Applied Physics, vol. 48(30), 305102, AUG 5, 2015
11) “Simultaneously Enhancing the Angular-Color Uniformity, Luminous Efficiency, and Reliability of White Light-Emitting Diodes by ZnO@SiO2 Modified Silicones”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol.5 (5), pp.599-605, MAY 2015
12) “Size- and current-density-controlled tunable wavelength in gan-based leds for potential dense wavelength-division multiplexing application”, IEEE Wireless Communications, vol. 22(2), pp. 74-79, APR 2015 (注：2016年影响因子8.9)
13) “Multiview three-dimensional display with continuous motion parallax through planar aligned OLED microdisplays”, Optics Express，vol. 23(5), pp. 6007-6019, MAR 9, 2015
14) “Generation of 360° three-dimensional display using circular-aligned OLED microdisplays”, Optics Express, vol.23(3), pp.2058-2069, FEB 9, 2015
15) “Super multi-view three-dimensional display through spatial-spectrum time-multiplexing of planar aligned OLED microdisplays”, Optics Express, vol. 22(25), pp.31448-31457, DEC 15, 2014
16) “Reliability Concerns Related With the Usage of Inorganic Particles in White Light-Emitting Diodes”, IEEE Transactions on Device and Materials Reliability, vol.14 (4), pp. 968-971, DEC 2014
17) “An explanation for invalidity of working currents' derating on improving light-emitting diode devices' reliability”, Journal of Applied Physics, vol.114(2), 023102, JUL 14, 2013
18) “Aggravated efficiency droop in vertical-structured gallium nitride light-emitting diodes induced by high temperature aging”, Journal of Applied Physics, vol.113(8),???? ?083105, FEB 28, 2013
19) “White LED devices with nearly uniform space-color distribution through nanoparticle usage”, 14^th International Conference on Electronic Materials and Packaging(EMAP 2012), Dec 2012, Hong Kong, (Best student paper award)
20) “Efficiency degradation behaviors of current/thermal co-stressed GaN-based blue light emitting diodes with vertical-structure”, Journal of Applied Physics, vol.111(9),???? 093110, MAY 1 2012
21) “Mold-Free in Situ Formation of Encapsulating Lens With Controllable Viewing Angle for LEDs by Photosensitive Polymerization Process”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol.2(5), pp. 793-798, MAY 2012
22) “Full Resolution 3D Display on Computer Screen Free from Accommodation-convergence Conflict”, May 2017, SID Symposium Digest of Technical Papers;
23）An a-IGZO TFT pixel circuit with improved current mirror for active matrix organic light emitting diode displays, Aug 2016, 17the International Conference on Electronic Packaging Technology (ICEPT);
24) Improving thermal management in high power LEDs through fabricating nano-twinned copper substrates, Aug 2015, 16^th International Conference on Electronic Packaging Technology (ICEPT);
25) The study on thermal crowding in high-power white light-emitting diode devices on luminaires, Aug 2015, 16^th International Conference on Electronic Packaging Technology (ICEPT);
5、特邀报告
1)“The investigation of LED's reliability through highly accelerated stress testing methods”, 14^th International Conference on Electronic Materials and Packaging(EMAP 2012), Dec 2012, Hong Kong;特邀报告，分会co-chair.
2)“Super multi-view three-dimensional light-field display technology for head-mounted virtural reality”, 2016 Progress in Electromagnetic Research Symposium (PIERS); Aug 2016, Shanghai, 特邀报告
3)“Bi-function GaN-based LEDs for bi-directional free-space visible light communications”, The 8^th International Conference on Information Optics and Photonics(CIOP2016), July 17-20, 2016, Shanghai, Workshop on Visible Light Communications, July 17^th 2016,特邀报告
4) “Light-field VR/AR head-mounted display systems based on OLED microdisplay devices”, The 12^th Conference on Lasers and Electro-Optics Pacific Rim(CLEO-PR2017) ? The 22^nd Optoelectronics and Communication Conference(OECC2017) ? The 5^th Photonics Global Conference 2017 (PGC 2017), July 31-August 4, 2017, Singapore. 特邀报告
5) “The applications of LED/OLED micro-display devices in VR light-field display systems”, International Conference on Display Technology (ICDT) 2017, February 18-20, 2017, Fuzhou, China. 特邀报告