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基本信息 The basic information
姓名: 龙旭

学院: 力学与土木建筑学院


学历: 博士研究生毕业

学位: 工学博士


职称: 副教授

职务:


学科: 土木工程,力学-固体力学


邮箱: xulong@nwpu.edu.cn




招生信息 Admission Information
招收具有力学、土木工程和材料等专业背景的硕士研究生（推免优先）。
要求善于思考，耐心勤奋，严谨认真。
硕士阶段研究成果突出者，可推荐至海内外著名高校进行短期学术交流、攻读博士学位。



工作经历 Work Experience
2018年7月-至今，西北工业大学，力学与土木建筑学院，副教授
2014年12月-2018年7月，西北工业大学，力学与土木建筑学院，讲师
2014年2月-2014年12月，INTECSEA, WorleyParsons Group，高级有限元分析工程师（Senior FEM Engineer）
2011年10月- 2014年02月，新加坡南洋理工大学，防灾及防护科技研究中心，副研究员（Research Associate）
2009年2月-2009年8月，新加坡南洋理工大学，防灾及防护科技研究中心，项目研究员（Project Officer）



教育经历 Education Experience
2009年8月-2013年1月，新加坡南洋理工大学，结构力学，博士
2006年9月-2009年1月，中国科学院力学研究所，固体力学，硕士
2002年9月-2006年7月，同济大学，工程力学，学士



教育教学 Education And Teaching
指导2019届本科生毕业生Ibrahim Ibrahim Abdulkadir开展的“Progressive collapse analysis and mitigation of 3D beam-column frame structure”，荣获优秀本科毕业论文（2019年国际教育学院唯一）
指导2017届本科生毕业生蔚雪梅开展的“极端温度下TiO₂纳米颗粒增强混凝土抗压性能研究”，荣获优秀本科毕业论文（2017年全专业唯一）
指导2015级本科生徐孟飞开展的“高温高电流所致无铅焊点性能演化研究”，荣获第十六届“三航杯”大学生课外学术科技作品竞赛（自然科学类学术论文）三等奖
指导西北工业大学团队作品“沣河渡”，荣获2017年陕西省大学生结构设计竞赛三等奖及“最佳制作奖”
主持西北工业大学全英文课程建设项目，课程名称：Theory and design of reinforced concrete component to EuroCode2，课程编号：U06M12059.01（2016年）




荣誉获奖 Awards Information
2020年度Emerald最佳论文奖中Highly Commended Paper，论文名称：Board-level vapor phase soldering (VPS) with different temperature and vacuum conditions
ICEPT 2018最佳论文奖（Outstanding Paper Award），论文名称：Estimating the constitutive behaviour of sintered silver nanoparticles by nanoindentation
2017年度陕西高等学校科学技术奖一等奖，成果名称：新型微电子封装焊料及互联结构可靠性研究，学科门类：数理力学，第三完成人
2019年度陕西高等学校科学技术奖一等奖，成果名称：高温下结构可靠性及连续性倒塌研究，学科门类：基础研究、应用基础研究，第三完成人





科学研究 Scientific Research
1. 主持国家自然科学基金委员会青年科学基金项目“钢筋混凝土动态粘结-滑移关系及其结构抗连续倒塌性能影响研究”
2. 主持陕西省自然科学基础研究计划面上项目“热电力作用下无铅焊点不同尺度损伤演化规律及力学性能研究”
3. 主持航天科学技术基金项目“温度循环条件下PBGA力学性能退化规律及寿命预测研究”
4. 主持航天科学技术基金项目“考虑蠕变变形的焊点热循环疲劳寿命预测研究”
5. 主持华为创新研究计划（HIRP OPEN）“板级焊点的加速温度循环可靠性测试方法”
6. 主持中国航天科技集团公司西安空间技术研究院横向外协项目“无法兰波导软钎焊热变形强度和寿命研究”
7. 主持中国航天科技集团公司西安空间技术研究院横向外协项目“焊点的材料力学分析”
8. 主持中国航天科技集团公司西安空间技术研究院横向外协项目“功率型偏贴装工艺研究”
9. 主持中央高校基本科研业务费项目“基于纳米银电子封装材料宏微观力学研究及器件应用”
10. 主持中央高校基本科研业务费项目“微纳米无铅焊点微缺陷所致损伤演化机理及其宏观影响研究”





学术成果 Academic Achievements
学术专著：


龙旭，等，钢筋混凝土框架抗连续倒塌计算结构力学，科学出版社，2017.6，ISBN：978-7-03-053244-2。

龙旭，电子封装力学，科学出版社，2020.3，ISBN：978-7-03-064247-9。


SCI期刊文章（*通讯作者，中科院分区）:


1. X Long*, QP Jia, Z Li, ZX Wen (2020). Reverse analysis of constitutive properties of sintered silver particles from nanoindentations. International Journal of Solids and Structures, V. 191-192, pp 351-362. (Mechanics Q2, IF= 3.213)
2. X Long*, JM Xu, SB Wang, WB Tang, C Chang* (2020). Understanding the impact response of lead-free solder at high strain rates. International Journal of Mechanical Sciences, V. 172, 105416. (Q2, Mechanics Q2, IF=4.631)
3. X Long*, ZB Chen, WJ Wang, YH Fu, YP Wu (2020). Parameterized Anand constitutive model under a wide range of temperature and strain rate: experimental and theoretical studies. Journal of Materials Science, V. 55, pp 10811-10823. (Q2, TOP, IF= 3.553)
4. WB Tang, X Long*, FQ Yang (2020). Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature. Microelectronics Reliability, V.104, 113555. (Q3, IF=1.535)
5. WJ Wang, ZB Chen, SB Wang, X Long* (2020). Mechanics-based acceleration for estimating thermal fatigue life of electronic packaging structure. Microelectronics Reliability, V. 107, 113616. (Q3, IF=1.535)
6. X Long, CY Wang, PZ Zhao, SB Kang* (2020). Bond strength of steel reinforcement under different loading rates. Construction and Building Materials, V. 238, 117749. (Q1, TOP, IF=4.419)
7. J Du, Q Cao, X Tang, X Xu, X Long, J Ding*, C Guan*, W Huang (2020). 3D printing-assisted gyroidal graphite foam for advanced supercapacitors. Chemical Engineering Journal, 127885. (Q1, TOP, IF=10.652)
8. Q Cao, J Du, X Tang, X Xu*, L Huang, D Cai, X Long, X Wang, J Ding, C Guan*, W Huang* (2020). Structure-enhanced mechanically robust graphite foam with ultrahigh MnO₂ loading for supercapacitors, Research, **. (Q2)
9. SB Kang*, S Wang, X Long, DD Wang, CY Wang (2020). Investigation of dynamic bond-slip behaviour of reinforcing bars in concrete. Construction and Building Materials, V. 262, 120824. (Q1, TOP, IF=4.419)
10. CT Chen*, C Choe, D Kim, Z Zhang, X Long, Z Zhou, FS Wu, K Suganuma (2020). Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro. Journal of Alloys and Compounds. accepted. (Q2, IF=4.175)
11. X Long*, B Hu, YH Feng, C Chang, MY Li* (2019). Correlation of microstructure and constitutive behaviour of sintered silver particles via nanoindentation. International Journal of Mechanical Sciences, V.161-162, 105020. (Q2, Mechanics Q2, IF=4.134)
12. X Long*, YC Liu, FR Jia, YP Wu, YH Fu, C Zhou (2019). Thermal fatigue life of Sn-3.0Ag-0.5Cu solder joint under temperature cycling coupled with electric current. Journal of Materials Science: Materials in Electronics. V. 30, No. 8, pp 7654-7664. (Q3, IF=2.324)
13. X Long*, Z Li, XZ Lu, C Chang, QR Zhang, A Zehrid, W Ke, Y Yao, LL Ye, J Liu (2019). Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles. Materials Science & Engineering: A, V. 744, No. 28, pp 406-414. (Q2, TOP, IF= 4.081)
14. SB Wang, Y Yao, X Long* (2019). Critical review of size effects on microstructure and mechanical properties of solder joints for electronic packaging. Applied Sciences, V. 9, No. 2, 227. (Q3, IF= 2.217)
15. WJ Wang, X Long*, CY Du, YH Fu, Y Yao, YP Wu (2019). Enrichment of the unified constitutive model for viscoplastic solders in wide strain rate and temperature ranges. Strength of Materials. V. 51, No. 6, pp 917-925. (Q4, IF=0.670)
16. C Chang*, GS Xiao, EQ Liu, JB Lin, XX Zhang, X Long, LL Zhang (2019). Revisiting the procedure for characterising mechanical properties in welded joints through nanoindentation，Materials Science and Technology, V.35, No. 8, pp 986-992. (Q4, IF= 1.938)
17. H Lu, FR Jia*, C Guo, HD Pan, X Long, GX Liu (2019). Effect of shale ash-based catalyst on the pyrolysis of fushun oil shale, Catalysts, V.9, No. 11, pp 1-15. (Q3, IF= 3.444)
18. X Long*, CY Du, Z Li, HC Guo, Y Yao, XZ Lu, XW Hu, LL Ye, J Liu* (2018). Finite element analysis to the constitutive behaviour of sintered silver nanoparticles under nanoindentation. International Journal of Applied Mechanics, V.10, No.10, **, pp 1-19. (Q3, IF= 1.939)
19. X Long*, XT Zhang, WB Tang, SB Wang, YH Feng, C Chang (2018). Calibration of a constitutive model from tension and nanoindentation for lead-free solder. Micromachines, V.9, No.11, pp 1-13. (Q3, IF= 2.426)
20. X Long*, YC Liu, Y Yao, FR Jia*, C Zhou, YH Fu, YP Wu (2018). Constitutive behaviour and life evaluation of solder joint under the multi-field loadings. AIP Advances, V. 8, No. 085001, pp 1-12, DOI: 10.1063/1.**. (Q3, IF=1.653)
21. X Long*, WB Tang, YH Feng, Y Yao, LM. Keer (2018). Strain rate sensitivity of sintered silver nanoparticles using rate-jump indentation. International Journal of Mechanical Sciences. V. 140, pp 60-67. (Q2, Mechanics Q2, IF=4.134)
22. X Long*, WB Tang, MF Xu, LM Keer, Y Yao (2018). Electric current assisted creep behaviour of Sn-3.0Ag-0.5Cu solder. Journal of Materials Science, V. 53, No. 8, pp 6219-6229. (Q2, IF=2.993)
23. X Long*, WB Tang, SB Wang, X He, Y Yao (2018). Annealing effect to constitutive behavior of Sn-3.0Ag-0.5Cu solder. Journal of Materials Science: Materials in Electronics, V. 29, No. 9, pp 7177–7187. (Q3, IF=2.324)
24. Y Yao*, X Long, LM Keer* (2017). A review of recent research on the mechanical behavior of lead-free solders. Applied Mechanics Reviews, V.69, No.4, 040802. (Q2, Mechanics Q1, IF=7.848)
25. X Long*, X He, Y Yao* (2017). An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates. Journal of Materials Science, V.52, No.10, pp. 6120-6137. (Q2, IF=2.993)
26. X Long*, SB Wang, YH Feng, Y Yao, LM Keer (2017). Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments. Materials Science & Engineering: A, V. 696, No.1, pp. 90-95. (Q2, IF=3.414)
27. X Long*, SB Wang, X He, Y Yao* (2017). Annealing optimization for tin-lead eutectic solder by constitutive experiment and simulation. Journal of Materials Research, V.32, No.16. pp. 3089-3099. (Q3, IF=1.495)
28. X Long*, YH Feng, Y Yao (2017). Cooling and annealing effect on indentation response of lead-free solder. International Journal of Applied Mechanics, V.9, No.4, **. (Q3, IF=1.954)
29. HC Guo, X Long*, Y Yao* (2017). Fire resistance of concrete filled steel tube columns subjected to non-uniform heating. Journal of Constructional Steel Research, V.128, pp. 542-554. (Q3, IF=2.509)
30. JD Wang, X Long, Y Yao* (2017). Effects of aging temperature on tensile and fatigue behavior of Sn-3.0Ag-0.5Cu solder joints. Journal of Materials Science: Materials in Electronics, V.28 (19), pp. 14884-14892. (Q3, IF=2.324)
31. SB Wang, Y Yao*, X Long (2017). Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints. Journal of Materials Science: Materials in Electronics, V.28 (23), pp. 17682-17692. (Q3, IF=2.324)
32. Y Yao*, R An, X Long (2017). Effect of electric current on fracture and constitutive behavior of Sn-Ag-Cu solder joints. Engineering Fracture Mechanics, V.171, pp. 85-97. (Q2, IF=2.580)
33. CH Chen*, YF Zhu, Y Yao, Y Huang, X Long (2016). An evaluation method to predict progressive collapse resistance of steel frame structures, Journal of Constructional Steel Research, V.122, pp. 238-250. (Q3, IF=2.509)
34. X Long*, YX Wang, LM Keer, Y Yao* (2016). Mechanical effects of isolated defects within a lead-free solder bump subjected to coupled thermal-electrical loading, Journal of Micromechanics and Molecular Physics, V. 1, No. 1:** (invited paper).
35. X Long*, CK Lee (2015). Improved strut-and-tie method for 2D RC beam-column joints under monotonic loading, Computers and Concrete, V.15, No.5, pp.807-831. (Q4, IF=1.637)
36. X Long*, CK Lee (2015). Modelling of two dimensional reinforced concrete beam-column joints subjected to monotonic loading, Advances in Structural Engineering, V. 18, No. 9, pp. 1461-1474. (Q4, IF=0.968)
37. X Long*, F Ge, YS Hong (2015). Feasibility study on buoyancy-weight ratios of a submerged floating tunnel prototype subjected to hydrodynamic loads, Acta Mechanica Sinica, V. 31, No. 5, pp. 750-761. (Q4, IF=1.545)
38. X Long*, KH Tan, CK Lee (2014). Bond stress-slip prediction under pullout and dowel action in reinforced concrete joints, ACI Structural Journal, V. 111, No. 4, pp. 977-988. (Q3, IF=1.197)
39. X Long*, JQ Bao, KH Tan, CK Lee (2014). Numerical simulation of reinforced concrete beam/column failure considering normal-shear stress interaction, Engineering Structures, V. 74, September, pp. 32-43. (Q2, IF=2.755)
40. X Long*, WF Yuan, KH Tan, CK Lee (2013). A superelement formulation for efficient structural analysis in progressive collapse, Structural Engineering and Mechanics, V. 48, No. 3, pp. 309-331. (Q4, IF=2.191)
41. X Long*, KH Tan, CK Lee (2013). A 3D co-rotational beam element for steel and RC framed structures, Structural Engineering and Mechanics, V. 48, No. 5, pp. 587-613. (Q4, IF=2.191)
42. X Long*, F Ge, L Wang, YS Hong (2009). Effects of fundamental structure parameters on dynamic responses of submerged floating tunnel under hydrodynamic loads, Acta Mechanica Sinica, V. 25, No. 3, pp. 335-344. (Q4, IF=1.545)
43. JQ Bao*, X Long, KH Tan, CK Lee (2013). A new generalized Drucker–Prager flow rule for concrete under compression, Engineering Structures, V.56, pp. 2076–2082. (Q2, IF=2.755)
44. F Ge*, X Long, L Wang, YS Hong (2009). Flow-induced vibrations of long circular cylinders modeled by coupled nonlinear oscillators, Science China Series G: Physics Mechanics and Astronomy, V. 52, No. 7, pp. 1086-1093. (Q3, IF=2.754)


其余期刊及会议学术论文：


1. 张筱迪，毛明晖，卢昶衡，王文武，贾冯睿，龙旭*。基于有限元分析和机器学习的跌落所致封装结构力学行为预测[J]. 电子与封装, 2020, DOI: 10.16257/j.cnki.1681-1070.2021.0201.
2. X Long*, ZB Chen, HB Shi (2020). Constitutive model and parameter identification for lead-free SAC305 solder. 21th International Conference on Electronic Packaging Technology (ICEPT 2020), IEEE, Guangzhou, China, August 12-15, 2020. (EI)
3. JM Xu, CT Chen, X Long* (2020). Failure analysis of Sn-3.0Ag-0.5Cu solder under compression in wide ranges of temperature and strain rate. 22nd Electronics Packaging Technology Conference (EPTC 2020), IEEE, Singapore, December 2-4, 2020. (EI)
4. QP Jia, X Long* (2020). Determination of Young’s modulus of film on substrate by nanoindentation. 22nd Electronics Packaging Technology Conference (EPTC 2020), IEEE, Singapore, December 2-4, 2020. (EI)
5. ZB Chen, X Long* (2020). Tuning damage model to optimize the plastic strain distribution in electronic packaging structures. 22nd Electronics Packaging Technology Conference (EPTC 2020), IEEE, Singapore, December 2-4, 2020. (EI)
6. WB Tang, HB Shi, X Long* (2019). Growth behaviour of intermetallic compounds in Sn-3.0Ag-0.5Cu solder joints under annealing treatment with various temperatures. 20th International Conference on Electronic Packaging Technology (ICEPT 2019), IEEE, Hong Kong, China, August 12-15, 2019. (EI)
7. YP Wu, XJ Feng, WJ Xia, C Zou, XZ Lu, J Liu, X Long (2019). Effect of space environment on the reliability of sintered silver nanoparticles reinforced by SiC particles. 20th International Conference on Electronic Packaging Technology (ICEPT 2019), IEEE, Hong Kong, China, August 12-15, 2019. (EI)
8. WJ Wang, X Long* (2019). Temperature and strain-rate dependent constitutive model for prediction of thermal cycling life. IOP Conference Series: Materials Science and Engineering, V 531(1), September 26, 2019, Modeling in Mechanics and Materials. (EI)
9. X Long*, WB Tang, CG Huang (2019). Mechanical behavior of lead-free solder micro-joints under electrical conditions. 13th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA2019), January 11-14, 2019, Harbin, China. (EI)
10. LJ Huang, ZH Zhu, HR, Wu, X Long* (2019). Board-level vapor phase soldering (VPS) with different temperature and vacuum conditions. Multidiscipline Modeling in Materials and Structures, V.15, No.2, pp. 353-364. (EI)
11. X Long*, CY Du, B Hu, MY Li (2018). Comparison of sintered silver micro and nano particles: from microstructure to property. International Conference on Electronics Materials and Packaging (EMAP 2018), IEEE, Hong Kong, December 17-20, 2018. (EI)
12. WB Tang, X Long*, YC Liu, CY Du, Y Yao, C Zhou, YP Wu, FR Jia (2018). Effect of electric current on constitutive behaviour and microstructure of SAC305 solder joint. 20th Electronics Packaging Technology Conference (EPTC 2018), IEEE, Singapore, December 4-7, 2018. (EI)
13. X Long*, CY Du, WB Tang, YC Liu, Y Yao, FR Jia (2018). Constitutive behaviour of single lap joint of sintered silver paste. 20th Electronics Packaging Technology Conference (EPTC 2018), IEEE, Singapore, December 4-7, 2018. (EI)
14. X Long*, WB Tang, Y Yao, XZ Lu, J Liu, C Zhou, WJ Xia, YP Wu (2018). Estimating the constitutive behaviour of sintered silver nanoparticles by nanoindentation. 19th International Conference on Electronic Packaging Technology (ICEPT 2018), IEEE, Shanghai, August 8-11, 2018. (EI)
15. WJ Wang, Y Yao, X Long*, ZH Zhu (2018). Material and structural optimization of fatigue life of PBGA under temperature cycling. 19th International Conference on Electronic Packaging Technology (ICEPT 2018), IEEE, Shanghai, August 8-11, 2018. (EI)
16. HC Guo, Y Yao, X Long* (2018). Porosity effect on the constitutive model of porous material under nanoindentation. 19th International Conference on Electronic Packaging Technology (ICEPT 2018), IEEE, Shanghai, August 8-11, 2018. (EI)
17. G He, Y Yao*, JD Wang, SB Wang, X Long* (2018). Aging effect on defect evolution and shear strength of nano-silver solder joint. 19th International Conference on Electronic Packaging Technology (ICEPT 2018), IEEE, Shanghai, August 8-11, 2018. (EI)
18. C Li, CY Wang, PZ Zhao, SB Kang*, X Long (2018). Bond strength of embedded steel reinforcement at high strain rates. International fib Congress 2018, Melbourne, Australia, October 7-11, 2018.
19. XM Yu, SB Kang, X Long* (2018). Compressive strength of concrete reinforced by TiO₂ nanoparticles. AIP Conference Proceedings, Changsha, October 26-28, 2018. (EI)
20. YC Liu, WW Wang, FR Jia, ZH Zhu, X Long* (2018). Temperature effect on tensile behaviour of Sn-Pb eutectic solder. International Conference on Mechanical Design, Manufacture and Automation Engineering (MDMAE2018), Xi’an, June 24-25, 2018. (EI)
21. X Long*, WB Tang, WJ Xia, YP Wu, LF Ren, Y Yao (2017). Porosity and Young's modulus of pressure-less sintered silver nanoparticles. 19th Electronics Packaging Technology Conference (EPTC 2017), IEEE, Singapore, December 6-9, 2017, DOI: 10.1109/EPTC.2017.**. (EI)
22. X Long*, WB Tang, ZH Zhu, YP Wu, LF Ren, Y Yao (2017). Creep behavior of annealed lead-fee solder for high-power electronic device. 2nd International Conference on Applied Mechanics and Mechatronics Engineering (AMME2017). Shanghai, November 26-27, DOI: 201710.12783/dtetr/amme2017/19478. (EI)
23. X Long*, WB Tang, ZH Zhu, YP Wu, LF Ren, Y Yao (2017). Determination of Young’s modulus of tensile specimen for lead-free solder. 2nd International Conference on Applied Mechanics, Electronics and Mechatronics Engineering (AMEME2017), Beijing, October 22-23, 2017, DOI: 10.12783/dtetr/ameme2017/16239. (EI)
24. 龙旭，汤文斌，王绍斌，何许，姚尧（2017），适用于SnAgCu焊料大应变率范围的统一蠕变塑性本构模型，中国力学大会暨庆祝中国力学学会成立60周年大会，北京，2017年8月13-16日。
25. X Long*, Y Yao, YP Wu, WJ Xia, LF Ren (2017). Effect of thermal cycling on tensile behaviour of SAC305 solder. 18th International Conference on Electronic Packaging Technology (ICEPT 2017), IEEE, Harbin, August 16-19, 2017, DOI: 10.1109/ICEPT.2017.**. (EI)
26. X Long, Y Yao*, LM Keer (2016). Effect of isolated intermetallic compounds under electromigration in lead-free solders. 24th International Congress of Theoretical and Applied Mechanics, 21-26 August 2016, Montreal, Canada.
27. X Long*, BJ Chen, Y Yao (2016). Thermo-visco-plastic constitutive model for lead-containing and lead-free solders subjected to monotonic and cyclic loadings. 17th International Conference on Electronic Packaging Technology (ICEPT 2016), IEEE, Wuhan, August 17-19, 2016, DOI: 10.1109/ICEPT.2016.** (EI)
28. YX Wang, X Long*, Y Yao* (2016). Theoretical study of thermomigration effect on thepancake void propagation at the current crowdingzone of solder joints. 17th International Conference on Electronic Packaging Technology (ICEPT 2016), IEEE, Wuhan, August 17-19, 2016, DOI: 10.1109/ICEPT.2016.** (EI)
29. X Long*, HC Guo (2016). Fire resistance study of concrete in the application of tunnel-like structures. Procedia Engineering V. 166, pp. 13-18. (EI)
30. X Long*, KH Tan, CK Lee (2013). Analytical model on the bond stress-slip relationship between steel reinforcement and concrete for RC beam-column joints. Applied Mechanics and Materials V. 275-277, pp. 1212-1218. (EI)



社会兼职 Social Appointments
· Computer Modeling in Engineering & Sciences副主编
· 中国力学学会会员
· IEEE会员
· IEEE电子封装协会青年协会成员
· Quarterly Franklin Membership (Membership ID#YB95091)
· Member of the editorial board of Insight-Civil Engineering
(http://insight.piscomed.com/index.php/ICE/about/editorialTeam)
· 技术委员会委员 (TPC member)：2nd International Conference on Material Strength and Applied Mechanics (MSAM2019), 2019 International Conference on Material Engineering and Materials Science (MEMS2019)
· 学术会议分会场主席 (Chair)：The 21st International Conference on Electronic Packaging Technology (ICEPT, Packaging Design & Modeling，2020)，The 3rd International Conference on Modeling in Mechanics and Materials (马来西亚，2020), The 13th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (哈尔滨，2019), 全国损伤与断裂力学及其工程应用研讨会 (成都，2019)，The 3rd International conference on Damage Mechanics (上海，2018)
· 《辽宁石油化工大学学报》特约编委
· 国际刊物审稿人：ASM Handbooks (Volume 11A: Analysis and Prevention of Component and Equipment Failures), International Journal of Mechanical Sciences (Q2, IF=3.570), Mechanics of Materials (Mechanics Q2, IF=2.958), Materials Science & Engineering: A (Q2, IF=3.414), Scientific Reports (Q3, IF=4.011), Engineering Structures (Engineering Q2, IF= 3.084), International Journal of Applied Mechanics (Q3, IF=1.468) , Journal of Manufacturing Processes (Q3, IF=2.809), Materials Letters (Q3, IF= 3.019), Transactions on Components, Packaging and Manufacturing Technology (Q4, IF=1.660) , Thin-Walled Structures (Q3, IF=2.881), Structural Concrete (Q4, IF= 1.885), Computers and Concrete (Q4, IF=1.637), Journal of Nanoscience and Nanotechnology (Q4, IF= 1.354), Journal of Mechanics of Materials and Structures (Q4, IF=1.061), Transactions of the Canadian Society for Mechanical Engineering (Q4, IF=0.248), Philosophical Magazine Letters (Q4, IF=1.117), Physica Scripta (Q4, IF=1.902)





English Version