丁桂甫 / 教授
电子邮箱：gfding@sjtu.edu.cn
办公电话：
办公地点：综合实验楼2-307室

个人简介
学术研究
授课教学
1987年毕业于复旦大学化学系，理学硕士。
长期从事MEMS/NEMS技术创新和应用研究，先后承担并完成了二十多项国家和省部级科研课题，包括国家863计划项目、自然科学基金课题，973子课题，预研，教育部重大培育和上海市科委发展基金课题等。
先后在国内外专业期刊和学术会议上发表学术论文200多篇，其中SCI收录论文150篇，在MEMS领域主流期刊Journal of Micromechanics and Microengineering上发表研究论文23篇，是近十年中国大陆****在该刊论文发表数最多的个人。
先后申请专利一百多项，获得专利授权六十多项。
先后培养研究生七十多位，其中，博士研究生20名，硕士研究生54名。
2004年获 得上海市育才奖，2007年获上海市技术发明一等奖，2008年获得国家技术发明二等奖，2016年获得上海市技术发明一等奖。
招收具有电子科学与技术、材料、物理、机械、化学等背景的全日制研究生和博士后。
EDUCATION
? Sep, 1984–Aug, 1987.M. S. in Chemistry, Fudan University, Sep, 1980–Aug, 1984. B. S.in Chemistry, Fudan University,
ACADEMIC POSITIONS
? 2014-present, Professor, Department of Micro/Nano Electronic, Shanghai Jiao Tong University
? 2001-2013, Professor, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University
PUBLICATIONS
I have authored and co-authored over 200 journal papers and have 23 papers published in Journal of Micromechanics and Microengineering and become the author who has the most papers published in this journal in mainland China.
RESEARCH PROGRAMS
I have earned funding from the National Natural Science Foundation of China, Chinese Ministry of Science and Technology, Chinese Department of Ministry of Industry and Information Technology, Chinese Ministry of Education, Shanghai local government, Samsung Corporation and several other companies.
AWARDS and HONORS
? Shanghai Technical Invention Award, entitled MEMS sensors and actuators based on multi-element compatible integrated manufacturing, 1st inventor, 2016.
? Chinese National Technical Invention Award, entitled Non-Silicon MEMS and its application, 3rdinventor, 2008.
? Shanghai Technical Invention Award, entitled Non-Silicon MEMS and its application, 2ndinventor, 2007.
? Shanghai Cultivating Talents Award, 2004.
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研究方向：
1、 微纳集成制造创新工艺方法研究
a) 多元兼容集成制造技术
b) 适度集成UV-LIGA工艺
c) 基于TSV的3D集成技术
d) 一维纳米材料器件集成方法
2、 高性能微纳器件与系统的设计制造
a) 高度集成的非硅MEMS惯性开关
b) 超高热流密度散热器
c) 高性能植入/介入式微器件
d) 航空发动机用高温传感器
RESEARCH INTERESTS
1. Innovative micro/nano integration manufacturing technologies，such as highly compatible integrated manufacturing, TSV,UV-LIGA.
2. Development of high performance MEMS/NEMS devices, such as microchannel heat sinks, MEMS inertial switches, implantable microneedle electrodes and thin film high temperature sensors.
主要论文：
?“Patterning of CVD diamond film for MEMS applications”，Diamond and Related Materials，Vol. 14, No. 9, SEP 2005, p 1543-1548.
?“A MEMS inertia switch with bridge-type elastic fixed electrode for long duration contact”, IEEE Transactions on Electron Devices, SEP 2008, 55 (9): 2492-2497.
?“Fabrication of Ni-matrix carbon nanotube field emitters using composite electroplating and micromachining”Carbon, DEC 2009, 47(15): 3466-3471.
?Development of a novel MEMS inertial switch with a compliant stationary electrode, IEEE Sensors Journal. 2009, 9 (7): 801-808.
?“A novel meandered coplanar waveguide for RF microelectromechanical systems”, Journal of Micromechanics and Microengineering, AUG 2007, 17 (8): 1628-1631.
?“Design, simulation and characterization of an inertia micro-switch fabricated by non-silicon surface micromachining”, Journal of Micromechanics and Microengineering, AUG 2007, 17 (8): 1598-1640.
“Preparing of a high speed bistable electromagnetic RF MEMS switch”, Sensors & Actuators: A. Physical. 2007,134:532-537.
?“A Micro-tensile method for measuring mechanicis properties of MEMS materials”, Journal of Micromechanics and Microengineering, AUG 2008, 18(6): 065002（7pp）.
?“Development of a shock acceleration microswitch with enhanced-contact and low off-axis sensitivity”, IEEE Proceedings, 15th Int. Conf. on Solid-State Sensors, Actuators and Microsystems (Transducers’09), Denver, Colorado, USA, 2009: 1940-1943.
[10]“Design and contact dynamics simulation of an inertia micro-switch based on non-silicon substrate”, IEEE Proceedings, 3rd Int. Conf. on Nano/Micro Engineered and Molecular Systems, Sanya, CHINA, NEMS 2008: 19-22.
“Micromechanical characterization of electroplated permalloy films for MEMS”, Microsystems Technologies, JUN 2006, 6: 065002（7pp）.
“Fabrication of a MEMS inertia switch on quartz substrate and evaluation of its threshold acceleration”, Microelectronics Journal, 2008, 39 (9): 1112-1119.
“New micromachined interdigital coplanar waveguide”, Microwave and Optical Technology Letters. 2007, 49(5):1007-1010.
“Design and analysis of the micromechanical structure for an electromagnetic bi-stable RF MEMS switch”, Asia-Pacific Microwave Conference Proceedings, Suzhou, China. 2005:99-102.
“Experimental investigation of heat transfer performance for a novel microchannel heat sink”, Journal of Micromechanics and Microengineering, AUG 2008, 18(3): 035021(8pp).
“Highly efficient manifold microchannel heatsink”, Electronics Letters, 2007, 42(18): 978-980.
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