王锋伟

副教授

焊接及电子封装系

材料科学与工程学院




个人邮箱：
fwwang@just.edu.cn

办公地点：
焊接楼403A

通讯地址：
江苏省镇江市梦溪路2号

邮政编码：
212003

传真：








个人简介

王锋伟，男，2014年获中国科学技术大学博士学位，主要从事电子材料与器件的开发与应用。目前主持国家自然科学基金1项，江苏省自然科学基金1项，江苏省双创计划1项。作为核心技术人员参与国家科技重大专项02《卷带式高密度超薄柔性封装基板工艺研发与产业化》，国家科技部863计划项目《基于高性能基板的第三代半导体封装技术研究》。另外还参与了多项国家973、国家自然科学基金及企业产品开发项目。获江苏省科技进步二等奖1项，苏州市科技进步一等奖1项。




研究方向
1.电子材料的开发与应用
2. 电子器件的设计与仿真



教育经历
2019-至今 江苏科技大学 材料科学与工程学院 副教授
2017-2019江苏科技大学 材料科学与工程学院 讲师
2014-2017中国兵器工业集团 中国北方工业 高级工程师/博士后
2009-2014 中国科学技术大学 化学与材料学院 博士
2005-2009南京工业大学 材料科学与工程学院 学士




课程教学
《微加工工艺》
《微加工原理与工艺》
《薄膜材料与工艺》
《电子封装制造课程设计》






科研团队

获奖动态 2. 江苏省科技进步二等奖
1. 苏州市科技进步一等奖




科研项目 9.江苏省“双创计划”，主持
8.国家自然科学基金“碳化MOF剥离制备的可控性GNRs增强埋入式电容介电性能的机理研究”，主持
7.江苏省自然科学基金“MOF-GNRs结构与性能优化提升埋入式电容复合薄膜介电性能的研究”，主持
6.江苏省科技厅重大科技成果转化专项“卷带式高密度超薄柔性封装基板工艺研发与产业化”，参与
5.广州市南沙区科技计划“嵌入式电阻电容技术的开发”，参与
4.广州市产学研协同创新重大专项（对外科技合作专题）“无源元器件嵌入式MEMS功能组件基板研发与产业化”，参与
3.广东省重大专项“高密度超薄柔性封装基板研发与产业化”，参与
2.国家科技部863计划项目“基于高性能基板的第三代半导体封装技术研究”，参与
1.国家科技重大专项02“卷带式高密度超薄柔性封装基板工艺研发与产业化”，参与



专利成果 12.一种高铜厚型印制电路板的制备方法，专利号：8.9，发明授权
11.一种PCB埋入线路的制造方法，专利号：0.3，发明授权
10.一种高导热绝缘复合材料的制备方法，专利号：1.5，发明授权
9.一种埋容电路板的制备方法，专利号：2.0，发明授权
8.一种埋入式电容的制造方法，专利号：0.4，发明授权
7.一种电阻铜箔的制造方法，专利号：0.0，发明授权
6. 一种化学镀用挂具，专利号：7.6，实用新型
5.一种化学镀用挂具，专利号：7.4，发明授权
4.一种埋入式电阻铜箔的制造方法，专利号：5.X，发明授权
3.Electroplating Device for Printed Circuit Board, PCT/CN2015/093471
2.印刷电路板用电镀装置，专利号：1.5，发明授权
1.一种可调的卷对卷镀镍装置，专利号：0.8，发明授权









教学随笔

论文著作 20.Fengwei Wang*, Ruohan Xia, Xinxin Li, Jinfang Qin, Hui Shao, Gang Jian, Rui Liu, Fengjiang Wang, Huarong Liu, Improving the Electrical and Mechanical Perfoemancesof Embedded Capacitance Materialsby Introducing Tungsten Disulfide Nanoflakes into the Dielectric Layer,[J] Journal of Materials Science: Materials in Electronics,2020, 31 (10), 7889-7897.
19. Xiaoling Cui, Hong Shao, Yuanrui Song, Song Yang, Fengwei Wang, Huarong Liu, Preparation of Highly Interconnected Porous Polymer Microbeads via Suspension Polymerization of High Internal Phase Emulsions for Fast Removal of Oil Spillage from Aqueous Environments, [J] RSC Advance, 2019, 9, 25730-25738.
18.Fengwei Wang*, Xu Zhou, Weikai Zheng, Gang Jian, Rui Liu, Hui Shao, Improving the Film-Forming Ability of BaTiO3/Epoxy Resin Suspension by Adjusting the Solvent Composition for the Fabrication of Embedded Capacitance Materials,[J] Journal of Materials Science: Materials in Electronics,2019, 30 (8), 7743-7751.
17.Gang Jian, Yong Jiao, Fengwei Wang, Chen Zhang, Chao Yan, Yusong Xu, Orientation Dependence of Magnetoelectric Coefficient in Rhombohedral Pb(Zr0.6Ti0.4)O3-Cubic CoFe2O4Composite, [J] Materials Research Express, 2019, 6, 056101.
16. Weikai Zheng, Hong Chen, Xu Zhou, Rui Liu, Gang Jian, Hui Shao, Fengwei Wang*, Influences of Filler Dispersity in Epoxy Resin on the Electrical and Mechanical Performances of Embedded Capacitance Materials,[J] Journal of Materials Science: Materials in Electronics,2018, 29(20), 17939-17947.
15.Fengwei Wang*, Chengqiang Cui, Shitong Zhang, Jing Wang, Influences of Copper Type on the Electrical and Mechanical Performances of Embedded Capacitance Materials, [J]Journal of Adhesion Science and Technology,2016, 30: 1364-1369.
14. 王锋伟，张仕通，李大树，崔成强，钛酸锶型嵌入式电容材料的开发，第十届全国印制电路学术年会，2016。
13. 张仕通，崔成强，王锋伟，基于聚酰亚胺构筑埋入式电容材料的研究，第十届全国印制电路学术年会，2016。
12.Huarong Liu, Fengwei Wang, Ruikun Wang, Application of Different Anisotropic Particles Prepared by Seeded Polymerization, [C] Abstracts of Papers of the American Chemical Society, 2016, 252:213.
11.Fengwei Wang*, Chengqiang Cui, Jing Wang. Embedded Thin Film Resistors Fabricated by Alkaline Electroless Deposition [J] Journal of Materials Science: Materials in Electronics, 2015, 26：9766-9775.
10. Zhangqi Hu, Jian Wang, Han Guo, Yu Chen, Chengqiang Cui, Fengwei Wang, Jian Cai. Research Status and Perspective of CoF Package Technology for LCD Drive IC [J] Electronics & Packaging, 2015, 15(6): 1-8.
9.Zhangqi Hu, Qian Wang, Han Guo, Yu Chen, Chengqiang Cui, Jian Wang,Fengwei Wang, Jian Cai. Ultra-Thin Chip on Flex bySold-on-Pad (SoP) Techonology [C] 2015 16^thInternational Conference on Electronic Packaging Technology, 2015: 645-650.
8.Yufeng Yang^#, Fengwei Wang^#, Qihao Yang, Yingli Hu, Huan Yan, Yuzhen Chen, Huarong Liu, Guoqing Zhang, Junling Lu, Hailong Jiang, Hangxun Xu. Hollow Metal-Organic Framework Nanospheres via Emulsion-Based Interfacial Synthesis and Their Application in Size-Selective Catalysis [J] ACS Applied Materials & Interfaces,2014, 6: 18163-18171.
7.Fengwei Wang, Huarong Liu, Linling Zhao, Xingyuan Zhang. Facile Fabrication of Polymer-Inorganic Hybrid Particles with Various Morphologies by Combination of Hydrolytic Condensation Process with Radiation Seeded Emulsion Polymerization [J] Colloid and Polymer Science,2014, 292: 1171-1179.
6.Linling Zhao, Huarong Liu, Fengwei Wang, Lai Zeng. Design of Yolk-Shell Fe₃O₄@PMAA Composite Micorspheres for Adsorption of Metal Ions and PH-Controlled Drug Delivery [J] Journal of Materials Chemistry A, 2014, 2: 7065-7074.
5.Fengwei Wang, Huarong Liu, Xingyuan Zhang. Synthesis of Worm-Like Superparamagnetic P(St-AA)@Fe₃O₄/SiO₂Janus Composite Particles [J] Colloid and Polymer Sicence, 2014, 292: 1395-1403.
4.Fengwei Wang, Huarong, Liu, Yang Zhang, Hewen Liu, Xuewu Ge, Xingyuan Zhang. Synthesis of Snowman-Like Polymer-Silica Asymmetric Particles by Combination of Hydrolytic Condensation Process with γ-Ray Radiation Initiated Seeded Emulsion Polumerization [J] Journal of Polymer Science Part A: Polymer Chemistry, 2014, 52, 339-348.(cover image)
3.Ruikun Wang, Huarong Liu, Fengwei Wang. Facile Preparation of Raspberry-Like Superhydrophobic Polystyrene Partilces via Seeded Dispersion Polymerization [J] Langmuir, 2013, 29, 11440-11448.
2.Yang Zhang, Huarong Liu, Fengwei Wang. Facile Fabrication of Snowman-like Janus Particles with Asymmetric Fluorescent Properties via Seeded Emulsion Polymerization [J] Colloid and Polymer Science, 2013, 291: 2993-3003.
1.Fengwei Wang, Huarong Liu, Jinde Zhang, Xiangtian Zhou, Xingyuan Zhang. Synthesis of Snowman-Like Magnetic/Nonmagnetic Nanocomposite Asymmetric Particles Via Seeded Emulsion Polymerization Initiated byγ-Ray Radiation[J] Journal of Polymer Science Part A: Polymer Chemistry, 2012, 50: 4599-4611.











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