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南昌大学材料科学与工程学院导师教师师资介绍简介-郭锐副教授

本站小编 Free考研考试/2021-05-03


教育及研修背景:
1995-1999,长春光学精密机械学院(现为长春理工大学),无机非金属材料,学士学位;
1999-2002,长春理工大学,材料学,硕士学位;
2002-2005,中国科学院理化技术研究所,物理化学,博士学位;
2006-2008,南昌大学,材料科学与工程,博士后
2016-2017,得克萨斯大学阿灵顿分校,物理系,访问****

主要研究兴趣:
光转换功能材料的探索和研究,包括材料合成、相图研究、结构分析、光谱分析和光学性能研究。

主要研究课题:
-La2CaB8O16:Eu3+,Bi3+红色荧光粉的双格位取代形成机制及其发光性能研究
-白光LED用红色荧光粉La2SrB10O19:Eu3+的研制;
-核壳结合五氧化二锑干粉的工业化生产技术与应用研究
-ZnO纳米材料补偿共掺杂机制及其光电器件构筑研究

发表论文与专利:
[1] Rui Guo, Songling Tang, Shaobin Zhong, Lan Luo, Baochang Cheng, Yuhua Xiong. Photoluminescence properties of Sr2MgB2O6:Eu3+ red phosphor under near-UV excitation. Solid State Sciences, 2015, 50: 65-68.
[2] Baochang Cheng, Jie Zhao, Xiao, Li Cai, Qiangsheng Rui Guo, Yanhe Xiao, Shuijin Lei. PMMA interlayer-modulated memory effects by space charge polarization in resistive switching based on CuSCN-nanopyramids/ZnO-nanorods p-n heterojunction. Scientific Reports, 2015, DOI: 10.1038/srep17859.
[3] Jie Zhao, Baochang Cheng, Yanhe Xiao, Rui Guo, Shuijin Lei. Ultrahigh performance negative thermal-resistance switching based on individual ZnO:K, Cl micro/nanowires for multibit nonvolatile resistance random access memory dual-written/erased repeatedly by temperature or bias. Journal of Materials Chemistry C, 2015, 3(47): 12220-12229.
[4] Jianping Zheng, Baochang Cheng, Fuzhang Wu, Xiaohui Su, Yanhe Xiao, Rui Guo, Shuijin Lei. Modulation of surface trap induced resistive switching by electrode annealing in individual PbS micro/nanowire-based devices for resistance random access memory. ACS Applied Materials and Interfaces, 2014, 6(23): 20812-20818.
[5] Synthesis and luminescent properties of a new phosphor, La2CaB8O16:RE3+(RE = Eu, Tb). J. Alloys Compd., 2013, 550: 459-462.
[6] A new red emitting phosphor:La2SrB10O19:Eu3+. J. Lumin., 2013,138: 170-173.
[7] Rui Guo, Songling Tang, Baochang Cheng, Dunqiang Tan, Yuhua Xiong. Synthesis and photoluminescence properties of a new green emitting phosphor La2SrB10O19:Tb3+. Optical Materials, 35 (2013) 1609-1611.
[8] 一种白光LED用的硼酸盐基红色荧光粉及其制备方法.专利申请号:7.4.
[9] 一种制备材料芯片的正交组合掩膜方法说明书. 专利号: 9. X.
[10] 一种去除硬质合金件表面涂层的方法.专利公开号: CNA






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