David Chuen Chun LAM
林銓振
PhD in Materials
University of California, Santa Barbara, 1991

Professor
Department of Mechanical and Aerospace Engineering



(852) 2358 7208
medcclam@ust.hk
Room 2559
Personal Web

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ORCID
0000-0002-4688-1435

Scopus ID
24280283500




Research Interest Publications Projects Teaching Assignment RPG Supervision Space used




Research Interest

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Ocular medical devices
Endoluminal medical devices
Big data medical diagnostic
Biosensing
Electric vehicles



Publications

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All Years 148 2022 0 2021 6 2020 1 2019 4 2018 4 2017 5 2016 128

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2021 6

A Novel Indentation Assessment to Measure Corneal Biomechanical Properties in Glaucoma and Ocular Hypertension
Translational Vision Science and Technology, v. 10, (9), August 2021, article number 36
Xu, Yunzhi; Ye, Yiming; Chong, Iok Tong; Chen, Zidong; Xu, Jiangang; Yang, Yangfan; Yu, Keming; Lam, David Chuen Chun; Yu, Minbin Article
Controllable release of pirfenidone by polyvinyl alcohol film embedded soft contact lenses in vitro and in vivo
Drug Delivery, v. 28, (1), January 2021, p. 634-641
Wu, Caiqing; Or, Ping Wai; Chong, Jones Iok Tong; Pathirage don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Wu, Kaili; Yu, Minbin; Lam, David Chuen Chun; Yang, Yangfan Article
Dose–Response Relationship and Threshold Drug Dosage Identification for a Novel Hybrid Mechanical-Thrombolytic System with an Ultra-Low Dose Patch
Cellular and Molecular Bioengineering, 10 June 2021
Qin, Zhen; Chon, Chi Hang; Kwok, Ching Kwong; Woo, Peter Yat Ming; Lam, David Chuen Chun Article
Extended Delivery of Pirfenidone with Novel, Soft Contact Lenses In Vitro and In Vivo
Journal of Ocular Pharmacology and Therapeutics, v. 37, (2), March 2021, p. 75-83
Wu, Caiqing; Or, Ping Wai; Chong, Iok Tong; Pathirage Don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Wu, Kaili; Yu, Minbin; Lam, David Chuen Chun; Yang, Yangfan Article
Wearable dual-element intraocular pressure contact lens sensor
Sensors and Actuators A: Physical, v. 321, April 2021, article number 112580
Pathirage don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Or, Ping Wai; Wei, Yifan; Chong, Iok Tong; Yang, Yangfan; Yu, Minbin; Lam, David Chuen Chun Article
Contact Lens Sensor Human Trial and Conceptual in-vivo Validation of Rate-Based Classification Method for Normal Tension Glaucoma (NTG)
Pan American Health Care Exchanges, PAHCE, v. 2021-May, March 2021, article number 9434865
Pathirage don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Wei, Yifan; Zhang, Yuning; Yu, Minbin; Lam, David Chuen Chun Conference paper

2020 1

Therapeutic Effects of Contact Lens with Continuous Drug Bioavailability on Rabbits
Annual Meeting of the Association-for-Research-in-Vision-and-Ophthalmology (ARVO), Baltimore, MD, 3-7 May 2020
Or, Ping Wai; Wu, Caiqing; Chong, Iok Tong; Pathirage don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Yu, Minbin; Yang, Yangfan; Lam, David Chuen Chun Conference paper

2019 4

Association between long-term orthokeratology responses and corneal biomechanics
Scientific Reports, v. 9, (1), December 2019, article number 12566
Lam, Andrew; Hon, Ying; Leung, Stanley Y.; Shu-Ho, Lu; Chong, Jones Iok Tong; Lam, David Chuen Chun Article
Characterization of Corneal Biomechanical Properties and Determination of Natural Intraocular Pressure Using CID-GAT
Translational Vision Science and Technology, v. 8, (5), September 2019, article number 10
Lu, Shuhao; Chong, Iok Tong; Leung, Stanley Y. Y.; Lam, David Chuen Chun Article
Extended Delivery of Pirfenidone with Novel Soft Contact Lenses
The Annual Meeting of The Association for Research in Vision and Ophthalmology (ARVO 2019), Vancouver, Canada, 28 April - 2 May 2019
Wu, Caiqing; Or, Ping Wai; Chong, Jones Iok Tong; Lee, Ching Hymn Christopher; Pathirage don, Isuru Kaweendra Karunaratne; Yu, Minbin; Lam, David CC; Yang, Yangfan Conference paper
In-Vivo Evaluation of Radio Frequency (rf) Thrombectomy Device in Swine Model for Ischemic Stroke Treatment
10th Asian-Pacific Conference on Biomechanics, AP Biomech 2019, Taipei, Taiwan, 1-3 November 2019
Chon, Chi Hang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David Chuen Chun Conference paper

2018 4

Influence of Short-Term Orthokeratology to Corneal Tangent Modulus: A Randomized Study
Current Eye Research, v. 43, (4), April 2018, p. 474-481
Lam, Andrew K. C.; Leung, Stanley Y. Y.; Hon, Ying; Lu, Shuhao; Wong, Kit Ying; Tiu, Pui Kwan; Lam, David C.C. Article
Model Development and Comparison of Low Hemorrhage-risk Endoluminal Patch Thrombolytic Treatment for Ischemic Stroke
Medical Engineering and Physics, v. 61, November 2018, p. 32-40
Qin, Zhen; Ciucci, Francesco; Chon, Chi Hang; Kwok, Ching Kwong; Lam, David Chuen Chun Article
Comparison of Ocular Biomechanical Machine Learning Classifiers for Glaucoma Diagnosis
Proceedings - 2018 IEEE International Conference on Bioinformatics and Biomedicine, BIBM, January 2019, article number 8621238, p. 2539-2543
Lu, Shuhao; Lee, Ka Yue; Chong, Jones Iok Tong; Lam, Andrew K. C.; Lai, Jimmy S. M.; Lam, David Chuen Chun Conference paper
Histopathological evaluation of the radio frequency (rf)-thrombectomy treated vessel in rabbit model
13th Asian-Australasian Federation of Interventional and Therapeutic Neuroradiology, AAFITN 2018, Sabah, Malaysia, 5-9 March 2018
Chon, Chi Hang; Qin, Zhen; Lam, David Chuen Chun; Kwok, John Ching Kwong Conference paper

2017 5

A Study of the Sound Transmission Mechanisms of a Finite Thickness Opening Without or With an Acoustic Seal
Applied Acoustics, v. 122, July 2017, p. 156-166
Yang, Cheng; Zhang, Xin; Tao, Fuyang; Lam, David Chuen Chun Article
High Myopes have Lower Normalised Corneal Tangent Moduli (Less ‘Stiff’ Corneas) than Low Myopes
Ophthalmic and Physiological Optics, v. 37, (1), January 2017, p. 42-50
Hon, Ying; Chen, Guo Zhen; Lu, Shuhao; Lam, David Chuen Chun; Lam, Andrew K.C. Article
In Vivo Measurement of Regional Corneal Tangent Modulus
SCIENTIFIC REPORTS, v.7, (1), November 2017, article number 14974
Hon, Ying; Chen, Guo Zhen; Lu, Shu Hao; Lam, David Chuen Chun; Lam, Andrew K. C. Article
Mechanical Behavior of Rf-treated Thrombus in Mechanical Thrombectomy
Medical Engineering and Physics, v. 47, 2017, p. 184-189
Chon, Chihang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David Chuen Chun Article
In vivo measurement of regional corneal stiffness
Investigative Ophthalmology & Visual Science, v. 58, (8), June 2017, p. 4330-4330
Lam, Andrew K.C.; Hon, Ying; Lu, Shuhao; Chen, Guozhen; Lam, David Chuen Chun Conference paper

2016 6

Diurnal Variation of Corneal Tangent Modulus in Normal Chinese
Cornea, v. 35, (12), June 2016, p. 1600-1604
Hon, Ying; Wan, Kin; Chen, Guo Zhen; Lu, Shuhao; Lam, David Chuen Chun; Lam, Andrew K.C. Article
Characterization of Thrombus Stiffening in Radio Frequency (rf Mechanical Thrombectomy
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2016), November 2016, p. 355-358
Chon, Chi Hang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David Chuen Chun Conference paper
Corneal stiffness and tangent modulus in low and high myopes
The 10th Asia Cornea and Contact Lens Conference (ACCLC 2016), Hong Kong, 28-29 April 2016
Lam, Andrew K.C.; Hon, Ying; Lam, David Chuen Chun; Lu, Shuhao; Chen, Guozhen Conference paper
In Vitro Examination of the Pressure Effect on Clot Dissolution with Thrombolytic Patch
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS, v. 2016-October, October 2016, article number 7590761, p. 549-552
Qin, Zhen; Chon, Chi Hang; Kwok, John Ching Kwong; Lam, David Chuen Chun Conference paper
IN VITRO TESTING OF THROMBOLYTIC PATCH FOR ISCHEMIC STROKE TREATMENT
5th Annual Scientific Meeting Indonesian Society of Interventional Radiology, Bali, Indonesia, 23-25 March 2016
Qin, Zhen; Chon, Chi Hang; Kwok, John Ching Kwong; Lam, David C C Conference paper
RADIO FREQUENCY (RF) THROMBECTOMY: NEW TREATMENT METHOD FOR ACUTE ISCHEMIC STROKE
5th Annual Scientific Meeting Indonesian Society of Interventional Radiology, Bali, Indonesia, 23-25 March 2016
Chon, Chi Hang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David C C Conference paper

2015 4

Repeatability of a novel corneal indentation device for corneal biomechanical measurement
Ophthalmic and Physiological Optics, v. 35, (4), July 2015, p. 455-461
Lam, Andrew K.C.; Hon, Ying; Leung, Leo K.K.; Lam, David Chuen Chun Article
Feasibility Examination of Isolated Zonal Thrombolysis using Raman Spectroscopy
2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2015), Institute of Electrical and Electronics Engineers (IEEE), 2015, p. 1353-1356
Qin, Zhen; Chon, Chi Hang; Lam, Alexander KN; Kwok, John Ching Kwong; Yuen, Matthew Ming Fai; Lam, David C C Conference paper
In-Vitro Testing of RF-Enabled Low Force Mechanical Thrombectomy for Ischemic Stroke
2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2015), Institute of Electrical and Electronics Engineers (IEEE), 2015, p. 1349-1352
Chon, Chi Hang; Qin, Zhen; Lam, Alexander KN; Kwok, John Ching Kwong; Yuen, Matthew Ming Fai; Lam, David C C Conference paper
Raman Spectroscopy of RF Strengthened Thrombus
37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Milano, Italy, 25-29 August 2015
Chon, Chi Hang; Qin, Zhen; Lam, Alexander KN; Kwok, John Ching Kwong; Yuen, Matthew Ming Fai; Lam, David C C Conference paper

2014 8

Comparative Study of Corneal Tangent Elastic Modulus Measurement Using Corneal Indentation Device
Medical Engineering & Physics, v. 36, (9), September 2014, p. 1115-1121
Ko, Wai Lun; Leung, Ka Kit; Lam, David Chuen Chun Article
Individual-specific tonometry on porcine eyes
Medical Engineering & Physics, v. 36, (1), January 2014, p. 96-101
Leung, Ka Kit; Ko, Wai Lun; Lam, David Chuen Chun Article
Noninvasive Measurement of Scleral Stiffness and Tangent Modulus in Porcine Eyes
Investigative Ophthalmology & Visual Science, v. 55, (6), June 2014, p. 3721-3726
Leung, Ka Kit; Ko, Wai Lun; Ye, Cong; Lam, David Chuen Chun; Leung, Christopher Kai Shun Article
Soft Wearable Contact Lens Sensor for Continuous Intraocular Pressure Monitoring
Medical Engineering & Physics, v. 36, (9), September 2014, p. 1134-1139
Chen, Guo Zhen; Chan, Ion Seng; Leung, Ka Kit; Lam, David Chuen Chun Article
Feasibility of Activity‐Monitoring Using Contact Lens Sensor
Interdisciplinary Medical and Engineering Symposium on the Eye: Tissue Properties, Pathology (IME); The 5th AEARU Advanced Materials Workshop, Hong Kong, 4 June 2014
Chen, Guozhen; Leung, Ka Kit; Lam, David Chuen Chun Conference paper
Response of the Smart Contact Lens Sensor in Human Objects: Correlation Between Ocular Movements, Postural Changes, Aerobic Exercise and Blood Pressure
The 5th AEARU Advanced Materials Workshop, The Hong Kong University of Science and Technology, 4th June 2014
Chen, Guozhen; Chan, Ion Seng; Leung, Ka Kit; Lam, David Chuen Chun Conference paper
Theories and Practices of Biomechanics in Glaucoma: Measurement Methods
The 5th AEARU Advanced Materials Workshop, Hong Kong, China, 4 June 2014
Leung, Ka Kit; Lam, David Chuen Chun Conference paper
Theories and practices of biomechanics in Glaucoma: Theory Overview
The 5th AEARU Advanced Materials Workshop, Hong Kong, China, 4 June 2014
Leung, Ka Kit; Lam, David Chuen Chun Conference paper

2013 9

Capacitive Contact Lens Sensor for Continuous Non-Invasive Intraocular Pressure Monitoring
Sensors and Actuators, A: Physical, v. 203, 2013, p. 112-118
Chen, Guo Zhen; Chan, Ion Seng; Lam, David C C Article
Characterization of Corneal Tangent Modulus in Vivo
Acta ophthalmologica, v. 91, (4), June 2013, p. e263-e269
Ko, Wai Lun; Leung, Ka Kit; Lam, David Chuen Chun; Leung, Christopher Kai Shun Article
A Novel Device for Clinical Measurement of Corneal Elasticity
The Association for Research in Vision and Ophthalmology 2013 Annual Meeting, Washington State Convention Center, USA, 5-9 May 2013
Leung, Christopher Kai Shun; Ye, Cong; Ko, Wai Lun; Leung, Ka Kit; Lam, David Chuen Chun Conference paper
Characterization of Pressure Reduction in Coil-filled Aneurysm under Flow of Human Blood with and without Anti-coagulant
2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 739-742
Lam, Alexander KN; Ko, Wai Lun; Leung, Ka Kit; Kwok, John Ching Kwong; Yuen, Mathew Ming Fai; Lam, David C C Conference paper
Development of Cornea-Specific Tonometry (CST): Porcine Eye Study
The HKUST International Conference on Biomedical Engineering (USTBME 2013), The Hong Kong University of Science and Technology, 10-12 January 2013
Leung, Ka Kit; Ko, Wai Lun; Lam, David Chuen Chun Conference paper
Fabrication and Characterization of Ultralow-k Porous Polyimide as Flexible Substrate
2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, USA, 27 February - 1 March 2013
Ko, H.K.; Dong, Ou; Lam, David Chuen Chun Conference paper
Low Force Capacitive Contact Lens Sensor for Continuous Non-Invasive
The HKUST International Conference on Biomedical Engineering, HKUST, Hong Kong, 10-12 January 2013
Chen, Guozhen; Chan, Ion Seng; Lam, David C C Conference paper
Low-Stress Ultra-Low Dielectric Porous Polymer for High Density Applications: A Review
Proceedings of the IEEE Conference on Nanotechnology, 2013, article number 6721031, p. 34-38
Chong, H.-H Ko J. Y.-T; Lam, David Chuen Chun Conference paper
Performance Analysis of Low Stress Ultra-Low Dielectric Coatings for High Density Substrates
2013 IEEE International Symposium on Advanced Packaging Materials (APM 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 146-153
Ko, Hoi Him; Dong, Ou; Law, Alan; Lam, David Chuen Chun Conference paper

2012 4

Effect of Age-Stiffening Tissues and Intraocular Pressure on Optic Nerve Damages
Molecular & Cellular Biomechanics, v. 9, (2), 2012, p. 157-174
Leung, Ka Kit; Ko, Wai Lun; Lam, David C C Article
Effect of danshen on the zero-stress state of rat'sabdominal aorta
Molecular & cellular biomechanics, v. 9, (4), 2012, p. 295-307
Han, Hui; Lam, David Chi Chuan; Huang, Wei Article
Partial Contact Indentation Tonometry for Measurement of Corneal Properties-Independent Intraocular Pressure
Molecular & Cellular Biomechanics, v. 9, (4), 2012, p. 251-268
Ko, Wai Lun; Leung, Ka Kit; Lam, David C C Article
Effect of age-stiffening of ocular tissues on glaucomatous damage
The 8th International Symposium of Ophthalmology – Hong Kong, Hong Kong, 2012
Leung, Ka Kit; Ko, Wai Lun; Lam, David Chuen Chun Conference paper

2011 4

Silver Nanoparticles as Surface-enhanced Raman Substrate for Quantitative Identification of Label-free Proteins
Materials chemistry and physics, v. 126, (1-2), 2011, Mar, p. 91-96
Dong, Ou; Lam, David Chi Chuan Article
Size-Dependent Behavior of Macromolecular Solids III: The Role of Entanglements
Computer modeling in engineering & sciences, v. 75, May 2011, p. 235-245
Wei, W.; Lam, David C.C. Article
A meshless formulation for the strain gradient elastic materials in fine-scale
ICCES'11, Nanjing, April 2011
Wang, Jun; LAM, David C.C. Conference paper
Relations Between Optical Nerve Damage, Intraocular Pressure and In Vivo Ocular Tissue Properties Monitoring Strategies for Glaucoma Diagnosis and Prevention
ICCES'11, Nanjing, April 2011
Lam, David C C; Leung, Ka Kit; Ko, Wai Lun; Chen, Guo Zhen; Chan, Ion Seng Conference paper

2010 4

Nanostiffening in polymeric nanocomposites
Computers, Materials and Continua, v. 17, (3), 2010, p. 215-232
Wang, Jun; Lam, David Chi Chuan Article
Size-Dependent Behavior of Macromolecular Solids I: Molecular Origin of the Size Effect
Cmes-computer MODELING in engineering & sciences, v. 64, (2), 2010, AUG, p. 213-226
Wei, Wang; Lam, David Chi Chuan Article
Size-Dependent Behavior of Macromolecular Solids II: Higher-Order viscoelastic theory and experiments
CMES - Computer Modeling in Engineering and Sciences, v. 66, (1), 2010, p. 73-99
Lam, David C C; Keung, L.H.; Tong, Pin Article
Nanostiffening in Nanocomposites
International Conference on Computational Engineering Science, Las Vegas, March 2010
Wang, Jun; Lam, David C.C. Conference paper

2009 4

A Single-Axis Low-Cost Accelerometer Fabricated Using Printed-Circuit-Board Techniques
IEEE electron device letters, v. 30, (12), 2009, DEC, p. 1293-1295
Qiao, Dapeng; Pang, Grantham K.H.; Mui, Man-Kit; Lam, David Chi Chuan Article
Model and Analysis of Size-stiffening in Nanoporous Cellular Solids
Journal of materials science, v. 44, (4), 2009, FEB, p. 985-991
Wang, Jun; Lam, David Chi Chuan Article
Investigation of freeze drying process on stabilization of mouse immunoglobulin
Proceedings of The 6th International School and Symposium on Medical Devices and Biosensors (MDBS2009), and the 4th International School and Symposium on Biomedical and Health Engineering (BHE2009), Shenzhen, pp. 32-35
Dai, Jialu; Leung, Stanley Y.Y.; Dong, Ou; Wei, Huang; Lam, David C.C. Conference paper
Time-dependence and Creep and Relaxation Solutions for Viscoelastic Maxwell Beams
International Conference on Computational & Experimental Engineering and Sciences, Phuket, Thailand 2009
Lam, David C.C.; Tong, P. Conference paper

2008 6

Geometric and Compaction Dependence of Printed Polymer-Based RFID Tag Antenna Performance
IEEE transactions on electronics packaging manufacturing, v. 31, (2), 2008, APR, p. 120-125
Leung, Stanley Y.Y.; Lam, David Chi Chuan Article
Properties and microstructures of low-temperature-processable ultralow-dielectric porous polyimide films
Journal of Electronic Materials, v. 37, (7), 2008, JUL, p. 955-961
Ren, Yuxing; Lam, David Chi Chuan Article
A new PCB-based low-cost accelerometer for human motion sensing
Proceedings of the IEEE International Conference on Automation and Logistics, ICAL 2008, 2008, p. 56-60
Qiao, Dapeng; Pang, Grantham K.H.; Kit, Mui Man; Lam, David Chi Chuan Conference paper
Couple stress model of steric stiffening in nanoporous solids
Advanced Materials Research, v. 47, 2008, p. 730-733
Wang, Jun; Ren, Yuxing; Lam, David Chi Chuan Conference paper
Insertion behavior of microneedles for drug delivery
Advanced Materials Research, v. 47, 2008, p. 1442-1445
Shek, K.T.; Lam, David Chi Chuan Conference paper
Puncture depth and the mechanical stability of microneedles
BIODEVICES 2008 - Proceedings of the 1st International Conference on Biomedical Electronics and Devices, v. 2, 2008, p. 291-296
Lam, David C C; Lee, Y.H.; Shek, K.T.; Pang, Grantham K.H. Conference paper

2007 8

Characterizations of Elastic Behaviors of Silicon Nitride Thin Films with Varying Thicknesses
Materials science and engineering a-structural Materials PROPERTIES Microstructure and PROCESSING, v. 467, (1-2), 2007, OCT 15, p. 93-96
Ren, Yuxing; Lam, David Chi Chuan Article
Hygrothermal Delarminations in Lead-free Solder Reflow of Electronic Packages
Journal of Electronic Materials, v. 36, (3), 2007, MAR, p. 226-231
Lam, David Chuen Chun; Wang, Jun Article
Hygrothermal failures from small defects in lead-free solder reflowed electronic packages
IEEE transactions on advanced packaging, v. 30, (4), 2007, NOV, p. 636-640
Lam, David Chi Chuan; Wang, Jun; Yang, Fan Article
Performance of printed polymer-based RFID antenna on curvilinear surface
IEEE transactions on electronics packaging manufacturing, v. 30, (3), 2007, JUL, p. 200-205
Leung, Stanley Yun Yuen; Lam, David Chi Chuan Article
Quantitative Analysis of Resistance Tolerance of Polymer Thick Film Printed Resistors
IEEE Transactions on Components and Packaging Technologies, v. 30, (2), 2007, JUN, p. 269-274
Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Article
Quantitative analysis of resistance variations in nickel-phosphorus (NiP) resistors
IEEE transactions on components and packaging technologies, v. 30, (2), 2007, JUN, p. 264-268
Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Article
Geometric and compaction dependence of printed polymer-based RFID tag antenna performance
2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, 2007, p. 166-172
Leung, Stanley Yun Yuen; Lam, David Chi Chuan Conference paper
Parametric analysis and design of ultra fine assembly of micro dies
2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, 2007, p. 173-178
Leung, Stanley Yun Yuen; Lam, David Chi Chuan Conference paper

2006 6

Development and characterizations of low cost accelerometers
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006, p. 783-787
Mui, Man K.; Lam, David Chuen Chun Conference paper
Low temperature processable ultra-low dielectric porous polyimide for high frequency applications
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006, p. 792-796
Ren, Yuxing; Lam, David Chuen Chun Conference paper
Mechanics Framework for Micron-scale Planar Structures
Advanced Materials Research, v. 9, 2006, p. 173-182
Chong, Arthur C.M.; Yang, Fan; Lam, David C C; Tong, Pin Conference paper
Nanoindentations and theory of strain gradient viscoelasticity
IUTAM Symposium on Size Effects on Material and Structural Behavior at Micron- and Nano-Scales, v. 142, 2006, p. 249-261
Keung, L.H.; Lam, David C C; Tong, Pin Conference paper
Printed polymer based RFID antenna on curvilinear surface
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006, p. 303-308
Leung, Stanley Y.Y.; Tiu, P.K.; Lam, David Chuen Chun Conference paper
Rigid-flex electronics with printed passives
IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, p. 22
Liu, C.K.; Tiu, P.K.; Lam, David Chi Chuan Conference paper

2005 3

Mode I solution for micron-sized crack
Engineering fracture mechanics, v. 72, (12), 2005, AUG, p. 1779-1804
Tong, Pin; Lam, David Chuen Chun; Yang, Fan Article
Experiments on the elastic size dependence of LPCVD silicon nitride
Materials Research Society Symposium Proceedings, v. 875, 2005, p. 85-90
Ren, Yuxing; Lam, David Chuen Chun Conference paper
Realization of a 27-MHz wireless transmitter using embedded passives on a thin organic substrate
Proceedings - Electronic Components and Technology Conference, v. 2, 2005, p. 1704-1710
Lam, Sang; Liu, C.K.; Mui, M.K.; Shek, K.T.; Kok, Chi Wah; Lam, David Chuen Chun Conference paper

2004 6

Size effects of hair-sized structures - Torsion
Key engineering materials, v. 261-263, (Part 1&2), 2004, p. 11-22
Tong, P.; Yang, F.; Lam, DCC; Wang, J. Article
Size-dependent fracture and higher order J-integral for solids characterized by strain gradient elasticity
International journal of fracture, v. 126, (4), 2004, APR, p. 385-398
Lam, David Chuen Chun; Yang, Fan; Wang, Jun Article
The role of water in delamination in electronic packages: degradation of interfacial adhesion
Journal of adhesion science and technology, v. 18, (10), 2004, p. 1103-1121
Leung, Stanley Y.Y.; Lam, David Chuen Chun; Luo, Shijian; Wong, Chingping Article
Inductance Tolerance Analyses and Design-Process Map of Embedded Planar Spiral Inductor
Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 1108-1112
Liu, C.K.; Cheng, P.L.; Leung, Stanley YY; Lam, David C C Conference paper
Investigations in size dependent torsions and fractures
IUTAM SYMPOSIUM ON MULTISCALE MODELING AND CHARACTERIZATION OF ELASTIC-INELASTIC BEHAVIOR OF ENGINEERING MATERIALS, PROCEEDINGS, v. 114, 2004, p. 259-266
Tong, P.; Lam, DCC; Yang, F.; Wang, J. Conference paper
Size effects of hair-sized structures -torsion
Advances in Fracture and Failure Prevention: Proceedings of the Fifth International Conference on Fracture and Strength of Solids (FEOFS2003): Second International Conference on Physics and Chemistry of Fracture and Failure Prevention (2nd ICPCF); Sendai; Japan, 20 October 2003 through 22 October 2003; Code 63333, Volume 261-263, Issue I, 2004, Pages 11-22
Tong, Pin; Yang, Fan; Lam, David Chuen Chun; Wang, Jun Conference paper

2003 5

Embedded Passives: 3-D Integrated Component Printed Circuit Boards
Transactions Hong Kong Institution of Engineers, v. 10, (4), 2003, p. 42-49
Lam, David Chuen Chun Article
Experiments and Theory in Strain Gradient Elasticity
Journal of the Mechanics and Physics of Solids, v. 51, (8), 2003, AUG, p. 1477-1508
Lam, David C C; Yang, Fan; Chong, Arthur C.M.; Wang, Jianxun; Tong, Pin Article
Biomechanics of Orthodontic Tooth Movement
International Symposium on Macro-, Meso-, Micro-, nano- mechanics of materials, 8-10 Dec, pp27
Lam, Garret Chi Yan; Lam, David C C; Tong, Pin Conference paper
Development of High Permeability Core Materials for Embeddable Inductors in Flexible Organic Substrates
Materials Research Society Symposium - Proceedings, v. 769, 2003, p. 343-348
Liu, C.K.; Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Lam, David C C Conference paper
Quantitative Analysis of Resistance Variations in As-Deposited Nickel-Phosphorus (NiP) Embedded Resistors
Proceedings - Electronic Components and Technology Conference, 2003, p. 156-160
Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Conference paper

2002 10

Call for papers: Optical Ethernet
The Journal of Optical Networking, v. 1, (4), 2002, p. 164-165
Lam, David Chuen Chun; Tsang, Danny Hin Kwok Article
Couple Stress Based Strain Gradient Theory for Elasticity
International Journal of Solids and Structures, v. 39, (10), 2002, MAY, p. 2731-2743
Yang, Fan; Chong, Arthur C.M.; Lam, David C C; Tong, Pin Article
Development of Low Temperature Processable Core Material for Embedded Inductor
POLYTRONIC 2002: 2ND INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, CONFERENCE PROCEEDINGS, 2002, p. 104-109
Liu, C.K.; Cheng, P.L.; Law, Y.W.; Chong, Jones Ioktong; Lam, David C C Conference paper
Effect of Copper Oxide on the Adhesion Behavior of Epoxy Molding Compound-Copper Interface
Proceedings - Electronic Components and Technology Conference, 2002, p. 1665-1670
Chung, Paular Wai Kwan; Yuen, Matthew Ming Fai; Chan, Philip Ching Ho; Ho, Nick K; Lam, David C C Conference paper
Experimental Investigation and Quantitative Analysis of Resistance Variations and Control in Printed Thick Film Resistors
Proceedings - Electronic Components and Technology Conference, 2002, p. 1704-1708
Cheng, P.L.; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Conference paper
Low Temperature Processing and Electrical Properties of Embedded Ferrite-cored Inductor
Proceedings - Electronic Components and Technology Conference, 2002, p. 490-494
Liu, C.K.; Law, T.W.; Cheng, P.L.; Chong, Jones Ioktong; Lam, David C C Conference paper
Novel Low Temperature BaTiO₃ Film Capacitors
Proceedings - Electronic Components and Technology Conference, 2002, p. 1714-1717
Law, T.W.; Liu, C.K.; Cheng, P.L.; Chong, Jones Ioktong; Lam, David C C Conference paper
Phase transformation of thin wires in tension
IUTAM SYMPOSIUM ON MECHANICS OF MARTENSITIC PHASE TRANSFORMATION IN SOLIDS, v. 101, 2002, p. 221-232
Tong, P.; Lam, DCC; Sun, QP Conference paper
Quantitative Analysis of Resistance of Printed Resistors
POLYTRONIC 2002: 2ND INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, CONFERENCE PROCEEDINGS, 2002, p. 205-210
Cheng, P.L.; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Conference paper
The Role of Water in Delamination in Electronics Packages: Water Evaporation from Epoxy
IEEE Transactions on Components and Packaging Technologies, v. 25, (4), 2002, DEC, p. 708-713
Lam, David C C; Chong, Jones Ioktong; Tong, Pin Conference paper

2001 5

A CAD/CAM system for process planning and optimization in LOM (Laminated Object Manufacturing)
IIE Transactions, v. 33, (4), 2001, APR, p. 345-355
Pang, Anthony; Joneja, Ajay; Lam, David Chuen Chun; Yuen, Matthew Ming Fai Article
Characterization and Modeling of Specific Strain Gradient Modulus of Epoxy
Journal of Materials Research, v. 16, (2), 2001, FEB, p. 558-563
Lam, David C C; Chong, Arthur C.M. Article
Model and Experiments on Strain Gradient Hardening in Metallic Glass
Materials Science and Engineering A, v. 318, (1-2), 2001, NOV, p. 313-319
Lam, David C C; Chong, Arthur C.M. Article
Torsion and Bending of Micron-Scaled Structures
Journal of Materials Research, v. 16, (4), 2001, APR, p. 1052-1058
Chong, Arthur C.M.; Yang, Fan; Lam, David C C; Tong, Pin Article
Experimental investigation of time dependent degradation of coupling agent bonded interfaces
Proceedings - Electronic Components and Technology Conference, 2001, p. 1333-1337
Leung, Stanley Y.Y.; Lam, David Chuen Chun; Wong, Chingping Conference paper

2000 11

A CAD/CAM system for vector-based layered manufacturing systems
International Journal of Computer Integrated Manufacturing, v. 13, (5), September 2000, p. 388-400
Joneja, Ajay; Pang, Anthony; Lam, David Chuen Chun; Yuen, Matthew Ming Fai Article
Deformation prediction of the laminated object modeling composite laminates
Journal of materials processing technology, v. 103, (2), 2000, JUN 15, p. 261-266
Mak, C.K.Y.; Lam, David Chuen Chun; Yuen, Matthew Ming Fai; Joneja, Ajay Article
Effect of Cross-Link Density on Strain Gradient Plasticity in Epoxy
Materials Science and Engineering A, v. 281, (1-2), 2000, APR 15, p. 156-161
Lam, David C C; Chong, Arthur C.M. Article
Measurement of Interfacial Fracture Toughness for Microelectronic Packages
Journal of Electronics Manufacturing, v. 10, (2), 2000, JUN, p. 139-145
Yeung, Dickson T.S.; Yuen, Matthew Ming Fai; Lam, David C C; Chan, Philip Ching Ho Article
Parametric Analysis of Steam Driven Delamination in Electronics Packages
IEEE Transactions on Electronics Packaging Manufacturing, v. 23, (3), 2000, JUL, p. 208-213
Lam, David C C; Chong, Jones Ioktong; Tong, Pin Article
Specimen design for mixed mode interfacial fracture properties measurement in electronic packages
Journal of electronic packaging, v. 122, (1), 2000, MAR, p. 67-72
Yeung, Dickson T.S.; Lam, David Chuen Chun; Yuen, Matthew Ming Fai Article
Synthesis and characterization of low temperature degradable polymers
Journal of materials science letters, v. 19, (23), 2000, DEC, p. 2109-2111
Wang, Dayang; Lam, David Chuen Chun Article
Energy Based Failure Criterion for Interfacial Delamination
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904155, p. 201-205
Chung, Paular Wai Kwan; Chan, S.K.; Yuen, Matthew Ming Fai; Lam, David Chuen Chun; Teng, Annette Conference paper
Influence of chemistry and applied stress on reliability of polymer and substrate interfaces
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, p. 581-585
Leung, Stanley Y.Y.; Luo, Shijian; Lam, David Chuen Chun; Wong, Chingping Conference paper
Measurement of Water Evaporation Rate for Popcorning
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 2000, p. 131-134
Chong, Jones Ioktong; Lam, David C C; Tong, Pin Conference paper
Measurement of Water Evaporation Rate from Epoxy
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904196, p. 440-443
Chong, Jones Ioktong; Lam, David Chuen Chun; Tong, Pin Conference paper

1999 7

Chemical kinetic model of interfacial degradation of adhesive joints
IEEE transactions on components and packaging technologies, v. 22, (2), 1999, JUN, p. 215-220
Lam, David Chuen Chun; Yang, Fan; Tong, Pin Article
Densification model for powder compacts
Journal of materials science, v. 34, (23), 1999, DEC, p. 5879-5884
Lam, David Chuen Chun Article
Effect of Solder Reflow Temperature Profile on Popcorning
American Society of Mechanical Engineers, EEP, v. 26, 1999, p. 1053-1058
Chong, Jones Ioktong; Lam, David C C; Tong, Pin Article
Indentation Model and Strain Gradient Plasticity Law for Glassy Polymers
Journal of Materials Research, v. 14, (9), 1999, SEP, p. 3784-3788
Lam, David C C; Chong, Arthur C.M. Article
Strain Gradient Plasticity Effect in Indentation Hardness of Polymers
Journal of Materials Research, v. 14, (10), 1999, OCT, p. 4103-4110
Chong, Arthur C.M.; Lam, David C C Article
Effect of Solder Reflow Temperature Profile on Popcorning
American Society of Mechanical Engineers, EEP, v. 26, 1999, p. 1/-
Chong, Jones Ioktong; Lam, David C C; Tong, Pin Conference paper
Global Collaborative Electronic Packaging Education
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, p. 907-911
Tong, Pin; Lam, David C C; Yuen, Matthew Ming Fai; Kim, Jang Kyo; Lee, Ricky S W; Lee, Steve Han Keung; Chan, Philip Ching Ho Conference paper

1998 3

Packing model for bimodal particle packing with aligned fibers
Journal of materials processing technology, v. 79, (1-3), 1998, JUL 1, p. 170-176
Lam, David Chuen Chun Article
Chemical kinetic model of interfacial degradation of adhesive joints
3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, p. 44-48
Lam, DCC; Yang, F.; Tong, P. Conference paper
Influence of Defect Size on Popcorning
International Conference on Solid-State and Integrated Circuit Technology Proceedings, 1998, p. 550-553
Lam, David C C; Chong, Jones Ioktong; Yuen, Matthew Ming Fai; Tong, Pin Conference paper

1997 2

Characteristic grain size: Part II measuring principles
Journal of Central South University of Technology (English Edition), v. 4, (2), 1997, p. 118-119
Shunhua, Cao; Lam, David Chuen Chun Article
Structural reliability of direct-chip-attaches bonded with anisotropic conductive film
Materials Research Society Symposium - Proceedings, v. 445, 1997, p. 297-306
Lam, David Chuen Chun; Shen, Chihkang; Xie, J.F.; Karim, Zaheed S.; Tong, Pin Conference paper

1996 1

Microstructural and chemical stability of Y-ZrO₂ reinforced β″-alumina in molten sodium sulfide and sulfur
Journal of Materials Science, v. 31, (18), 1996, p. 4939-4944
Lam, David Chuen Chun; Kusakari, K. Article

1995 1

Microstructure and Mechanical Properties Relations for Green Bodies Compacted from Spray Dried Granules
Journal of materials science, v. 30, (21), 1995, NOV 1, p. 5495-5501
Lam, David Chuen Chun; Kusakari, K. Article

1994 4

Effects of Binder and Compaction Pressure on Strength and Fracture Origins in Bodies Pressed From Granules
Journal of the Ceramic Society of Japan, v. 102, (11), November 1994, p. 1010-1015
Lam, David Chuen Chun Article
Mechanical Properties of Partially Dense Alumina Produced From Powder Compacts
Journal of the American Ceramic Society, v. 77, (8), August 1994, p. 2113-2117
Lam, David Chuen Chun; Lange, Fred F.; Evans, Anthony G. Article
Microstructural Observations on Constrained Densification of Alumina Powder Containing a Periodic Array of Sapphire Fibers
Journal of the American Ceramic Society, v. 77, (7), 1994, p. 1976-1978
Lam, David Chuen Chun; Lange, Fred F. Article
Packing of Particles (Part 3), Effect of Particle Size Distribution Shape On Composite Packing Density in Bimodal Mixtures
Journal of the Ceramic Society of Japan, v. 102, (2), February 1994, p. 133-138
Lam, David Chuen Chun; Nakagawa, Mitsuo Article

1993 4

Packing of Particles (Part 1), Packing Behavior of Monosized Spheres In Cylinders
Journal of the Ceramic Society of Japan, v. 101, (10), October 1993, p. 1187-1198
Lam, David Chuen Chun; Nakagawa, Mitsuo Article
Packing of Particles (Part 2), Effect of Extra Pore Volume on Packing Density of Mixtures of Monosized Spheres
Journal of the Ceramic Society of Japan, v. 101, (10), October 1993, p. 1234-1238
Lam, David Chuen Chun; Nakagawa, Mitsuo Article
Packing of particles (Part 2). Effect of extra pore volume on packing density of mixtures of monosized spheres
Journal of the Ceramic Society of Japan. International ed., Volume 101, Issue 11, November 1993, Pages 1204-1208
Lam, David Chuen Chun; Nakagawa, Mitsuo Article
Packing of particles (part I) -packing behavior of monosized spheres in cylinders
Journal of the Ceramic Society of Japan. International ed.\gVolume 101, Issue 10, October 1993, Pages 1155-1156
Lam, David Chuen Chun; Nakagawa, Mitsuo Article

1991 1

Powder Processing of Ceramic matrix Composites
Materials Science and Engineering A, v. 144, (1-2), 1 October 1991, Pages 143-152
Lange, Friederike F.; Lam, David Chuen Chun; Sudre, Olivier H.; Flinn, Brian D.; Folsom, Craig A.; Velamakanni, Bhaskar V.; Zok, Frank W.; Evans, Anthony G. Article

1989 2

Densification Behavior of Al2O3 Powder Containing ZrO2 Inclusions
Processing Science of Advanced Ceramics Symposium, Mater. Res. Soc., 1989, Pittsburgh, PA, USA, p. 363-368
Sudre, Olivier; Lam, David Chuen Chun; Lange, Fred F. Conference paper
Powder Processing and Densification of Ceramic Composites
Processing Science of Advanced Ceramics Symposium, Mater. Res. Soc., 1989, Pittsburgh, PA, USA, p. 309-318
Lange, Fred F.; Lam, David C C; Sudre, Olivier Conference paper


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Article 5

A Novel Indentation Assessment to Measure Corneal Biomechanical Properties in Glaucoma and Ocular Hypertension
Translational Vision Science and Technology, v. 10, (9), August 2021, article number 36
Xu, Yunzhi; Ye, Yiming; Chong, Iok Tong; Chen, Zidong; Xu, Jiangang; Yang, Yangfan; Yu, Keming; Lam, David Chuen Chun; Yu, Minbin
Controllable release of pirfenidone by polyvinyl alcohol film embedded soft contact lenses in vitro and in vivo
Drug Delivery, v. 28, (1), January 2021, p. 634-641
Wu, Caiqing; Or, Ping Wai; Chong, Jones Iok Tong; Pathirage don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Wu, Kaili; Yu, Minbin; Lam, David Chuen Chun; Yang, Yangfan
Dose–Response Relationship and Threshold Drug Dosage Identification for a Novel Hybrid Mechanical-Thrombolytic System with an Ultra-Low Dose Patch
Cellular and Molecular Bioengineering, 10 June 2021
Qin, Zhen; Chon, Chi Hang; Kwok, Ching Kwong; Woo, Peter Yat Ming; Lam, David Chuen Chun
Extended Delivery of Pirfenidone with Novel, Soft Contact Lenses In Vitro and In Vivo
Journal of Ocular Pharmacology and Therapeutics, v. 37, (2), March 2021, p. 75-83
Wu, Caiqing; Or, Ping Wai; Chong, Iok Tong; Pathirage Don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Wu, Kaili; Yu, Minbin; Lam, David Chuen Chun; Yang, Yangfan
Wearable dual-element intraocular pressure contact lens sensor
Sensors and Actuators A: Physical, v. 321, April 2021, article number 112580
Pathirage don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Or, Ping Wai; Wei, Yifan; Chong, Iok Tong; Yang, Yangfan; Yu, Minbin; Lam, David Chuen Chun

Conference paper 1

Contact Lens Sensor Human Trial and Conceptual in-vivo Validation of Rate-Based Classification Method for Normal Tension Glaucoma (NTG)
Pan American Health Care Exchanges, PAHCE, v. 2021-May, March 2021, article number 9434865
Pathirage don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Wei, Yifan; Zhang, Yuning; Yu, Minbin; Lam, David Chuen Chun


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Conference paper 1

Therapeutic Effects of Contact Lens with Continuous Drug Bioavailability on Rabbits
Annual Meeting of the Association-for-Research-in-Vision-and-Ophthalmology (ARVO), Baltimore, MD, 3-7 May 2020
Or, Ping Wai; Wu, Caiqing; Chong, Iok Tong; Pathirage don, Isuru Kaweendra Karunaratne; Lee, Ching Hymn Christopher; Yu, Minbin; Yang, Yangfan; Lam, David Chuen Chun


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Article 2

Association between long-term orthokeratology responses and corneal biomechanics
Scientific Reports, v. 9, (1), December 2019, article number 12566
Lam, Andrew; Hon, Ying; Leung, Stanley Y.; Shu-Ho, Lu; Chong, Jones Iok Tong; Lam, David Chuen Chun
Characterization of Corneal Biomechanical Properties and Determination of Natural Intraocular Pressure Using CID-GAT
Translational Vision Science and Technology, v. 8, (5), September 2019, article number 10
Lu, Shuhao; Chong, Iok Tong; Leung, Stanley Y. Y.; Lam, David Chuen Chun

Conference paper 2

Extended Delivery of Pirfenidone with Novel Soft Contact Lenses
The Annual Meeting of The Association for Research in Vision and Ophthalmology (ARVO 2019), Vancouver, Canada, 28 April - 2 May 2019
Wu, Caiqing; Or, Ping Wai; Chong, Jones Iok Tong; Lee, Ching Hymn Christopher; Pathirage don, Isuru Kaweendra Karunaratne; Yu, Minbin; Lam, David CC; Yang, Yangfan
In-Vivo Evaluation of Radio Frequency (rf) Thrombectomy Device in Swine Model for Ischemic Stroke Treatment
10th Asian-Pacific Conference on Biomechanics, AP Biomech 2019, Taipei, Taiwan, 1-3 November 2019
Chon, Chi Hang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David Chuen Chun


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Article 2

Influence of Short-Term Orthokeratology to Corneal Tangent Modulus: A Randomized Study
Current Eye Research, v. 43, (4), April 2018, p. 474-481
Lam, Andrew K. C.; Leung, Stanley Y. Y.; Hon, Ying; Lu, Shuhao; Wong, Kit Ying; Tiu, Pui Kwan; Lam, David C.C.
Model Development and Comparison of Low Hemorrhage-risk Endoluminal Patch Thrombolytic Treatment for Ischemic Stroke
Medical Engineering and Physics, v. 61, November 2018, p. 32-40
Qin, Zhen; Ciucci, Francesco; Chon, Chi Hang; Kwok, Ching Kwong; Lam, David Chuen Chun

Conference paper 2

Comparison of Ocular Biomechanical Machine Learning Classifiers for Glaucoma Diagnosis
Proceedings - 2018 IEEE International Conference on Bioinformatics and Biomedicine, BIBM, January 2019, article number 8621238, p. 2539-2543
Lu, Shuhao; Lee, Ka Yue; Chong, Jones Iok Tong; Lam, Andrew K. C.; Lai, Jimmy S. M.; Lam, David Chuen Chun
Histopathological evaluation of the radio frequency (rf)-thrombectomy treated vessel in rabbit model
13th Asian-Australasian Federation of Interventional and Therapeutic Neuroradiology, AAFITN 2018, Sabah, Malaysia, 5-9 March 2018
Chon, Chi Hang; Qin, Zhen; Lam, David Chuen Chun; Kwok, John Ching Kwong


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Article 4

A Study of the Sound Transmission Mechanisms of a Finite Thickness Opening Without or With an Acoustic Seal
Applied Acoustics, v. 122, July 2017, p. 156-166
Yang, Cheng; Zhang, Xin; Tao, Fuyang; Lam, David Chuen Chun
High Myopes have Lower Normalised Corneal Tangent Moduli (Less ‘Stiff’ Corneas) than Low Myopes
Ophthalmic and Physiological Optics, v. 37, (1), January 2017, p. 42-50
Hon, Ying; Chen, Guo Zhen; Lu, Shuhao; Lam, David Chuen Chun; Lam, Andrew K.C.
In Vivo Measurement of Regional Corneal Tangent Modulus
SCIENTIFIC REPORTS, v.7, (1), November 2017, article number 14974
Hon, Ying; Chen, Guo Zhen; Lu, Shu Hao; Lam, David Chuen Chun; Lam, Andrew K. C.
Mechanical Behavior of Rf-treated Thrombus in Mechanical Thrombectomy
Medical Engineering and Physics, v. 47, 2017, p. 184-189
Chon, Chihang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David Chuen Chun

Conference paper 1

In vivo measurement of regional corneal stiffness
Investigative Ophthalmology & Visual Science, v. 58, (8), June 2017, p. 4330-4330
Lam, Andrew K.C.; Hon, Ying; Lu, Shuhao; Chen, Guozhen; Lam, David Chuen Chun


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Article 1

Diurnal Variation of Corneal Tangent Modulus in Normal Chinese
Cornea, v. 35, (12), June 2016, p. 1600-1604
Hon, Ying; Wan, Kin; Chen, Guo Zhen; Lu, Shuhao; Lam, David Chuen Chun; Lam, Andrew K.C.

Conference paper 5

Characterization of Thrombus Stiffening in Radio Frequency (rf Mechanical Thrombectomy
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2016), November 2016, p. 355-358
Chon, Chi Hang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David Chuen Chun
Corneal stiffness and tangent modulus in low and high myopes
The 10th Asia Cornea and Contact Lens Conference (ACCLC 2016), Hong Kong, 28-29 April 2016
Lam, Andrew K.C.; Hon, Ying; Lam, David Chuen Chun; Lu, Shuhao; Chen, Guozhen
In Vitro Examination of the Pressure Effect on Clot Dissolution with Thrombolytic Patch
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS, v. 2016-October, October 2016, article number 7590761, p. 549-552
Qin, Zhen; Chon, Chi Hang; Kwok, John Ching Kwong; Lam, David Chuen Chun
IN VITRO TESTING OF THROMBOLYTIC PATCH FOR ISCHEMIC STROKE TREATMENT
5th Annual Scientific Meeting Indonesian Society of Interventional Radiology, Bali, Indonesia, 23-25 March 2016
Qin, Zhen; Chon, Chi Hang; Kwok, John Ching Kwong; Lam, David C C
RADIO FREQUENCY (RF) THROMBECTOMY: NEW TREATMENT METHOD FOR ACUTE ISCHEMIC STROKE
5th Annual Scientific Meeting Indonesian Society of Interventional Radiology, Bali, Indonesia, 23-25 March 2016
Chon, Chi Hang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David C C


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Article 1

Repeatability of a novel corneal indentation device for corneal biomechanical measurement
Ophthalmic and Physiological Optics, v. 35, (4), July 2015, p. 455-461
Lam, Andrew K.C.; Hon, Ying; Leung, Leo K.K.; Lam, David Chuen Chun

Conference paper 3

Feasibility Examination of Isolated Zonal Thrombolysis using Raman Spectroscopy
2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2015), Institute of Electrical and Electronics Engineers (IEEE), 2015, p. 1353-1356
Qin, Zhen; Chon, Chi Hang; Lam, Alexander KN; Kwok, John Ching Kwong; Yuen, Matthew Ming Fai; Lam, David C C
In-Vitro Testing of RF-Enabled Low Force Mechanical Thrombectomy for Ischemic Stroke
2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2015), Institute of Electrical and Electronics Engineers (IEEE), 2015, p. 1349-1352
Chon, Chi Hang; Qin, Zhen; Lam, Alexander KN; Kwok, John Ching Kwong; Yuen, Matthew Ming Fai; Lam, David C C
Raman Spectroscopy of RF Strengthened Thrombus
37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Milano, Italy, 25-29 August 2015
Chon, Chi Hang; Qin, Zhen; Lam, Alexander KN; Kwok, John Ching Kwong; Yuen, Matthew Ming Fai; Lam, David C C


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Article 4

Comparative Study of Corneal Tangent Elastic Modulus Measurement Using Corneal Indentation Device
Medical Engineering & Physics, v. 36, (9), September 2014, p. 1115-1121
Ko, Wai Lun; Leung, Ka Kit; Lam, David Chuen Chun
Individual-specific tonometry on porcine eyes
Medical Engineering & Physics, v. 36, (1), January 2014, p. 96-101
Leung, Ka Kit; Ko, Wai Lun; Lam, David Chuen Chun
Noninvasive Measurement of Scleral Stiffness and Tangent Modulus in Porcine Eyes
Investigative Ophthalmology & Visual Science, v. 55, (6), June 2014, p. 3721-3726
Leung, Ka Kit; Ko, Wai Lun; Ye, Cong; Lam, David Chuen Chun; Leung, Christopher Kai Shun
Soft Wearable Contact Lens Sensor for Continuous Intraocular Pressure Monitoring
Medical Engineering & Physics, v. 36, (9), September 2014, p. 1134-1139
Chen, Guo Zhen; Chan, Ion Seng; Leung, Ka Kit; Lam, David Chuen Chun

Conference paper 4

Feasibility of Activity‐Monitoring Using Contact Lens Sensor
Interdisciplinary Medical and Engineering Symposium on the Eye: Tissue Properties, Pathology (IME); The 5th AEARU Advanced Materials Workshop, Hong Kong, 4 June 2014
Chen, Guozhen; Leung, Ka Kit; Lam, David Chuen Chun
Response of the Smart Contact Lens Sensor in Human Objects: Correlation Between Ocular Movements, Postural Changes, Aerobic Exercise and Blood Pressure
The 5th AEARU Advanced Materials Workshop, The Hong Kong University of Science and Technology, 4th June 2014
Chen, Guozhen; Chan, Ion Seng; Leung, Ka Kit; Lam, David Chuen Chun
Theories and Practices of Biomechanics in Glaucoma: Measurement Methods
The 5th AEARU Advanced Materials Workshop, Hong Kong, China, 4 June 2014
Leung, Ka Kit; Lam, David Chuen Chun
Theories and practices of biomechanics in Glaucoma: Theory Overview
The 5th AEARU Advanced Materials Workshop, Hong Kong, China, 4 June 2014
Leung, Ka Kit; Lam, David Chuen Chun


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Article 2

Capacitive Contact Lens Sensor for Continuous Non-Invasive Intraocular Pressure Monitoring
Sensors and Actuators, A: Physical, v. 203, 2013, p. 112-118
Chen, Guo Zhen; Chan, Ion Seng; Lam, David C C
Characterization of Corneal Tangent Modulus in Vivo
Acta ophthalmologica, v. 91, (4), June 2013, p. e263-e269
Ko, Wai Lun; Leung, Ka Kit; Lam, David Chuen Chun; Leung, Christopher Kai Shun

Conference paper 7

A Novel Device for Clinical Measurement of Corneal Elasticity
The Association for Research in Vision and Ophthalmology 2013 Annual Meeting, Washington State Convention Center, USA, 5-9 May 2013
Leung, Christopher Kai Shun; Ye, Cong; Ko, Wai Lun; Leung, Ka Kit; Lam, David Chuen Chun
Characterization of Pressure Reduction in Coil-filled Aneurysm under Flow of Human Blood with and without Anti-coagulant
2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 739-742
Lam, Alexander KN; Ko, Wai Lun; Leung, Ka Kit; Kwok, John Ching Kwong; Yuen, Mathew Ming Fai; Lam, David C C
Development of Cornea-Specific Tonometry (CST): Porcine Eye Study
The HKUST International Conference on Biomedical Engineering (USTBME 2013), The Hong Kong University of Science and Technology, 10-12 January 2013
Leung, Ka Kit; Ko, Wai Lun; Lam, David Chuen Chun
Fabrication and Characterization of Ultralow-k Porous Polyimide as Flexible Substrate
2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, USA, 27 February - 1 March 2013
Ko, H.K.; Dong, Ou; Lam, David Chuen Chun
Low Force Capacitive Contact Lens Sensor for Continuous Non-Invasive
The HKUST International Conference on Biomedical Engineering, HKUST, Hong Kong, 10-12 January 2013
Chen, Guozhen; Chan, Ion Seng; Lam, David C C
Low-Stress Ultra-Low Dielectric Porous Polymer for High Density Applications: A Review
Proceedings of the IEEE Conference on Nanotechnology, 2013, article number 6721031, p. 34-38
Chong, H.-H Ko J. Y.-T; Lam, David Chuen Chun
Performance Analysis of Low Stress Ultra-Low Dielectric Coatings for High Density Substrates
2013 IEEE International Symposium on Advanced Packaging Materials (APM 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 146-153
Ko, Hoi Him; Dong, Ou; Law, Alan; Lam, David Chuen Chun


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Article 3

Effect of Age-Stiffening Tissues and Intraocular Pressure on Optic Nerve Damages
Molecular & Cellular Biomechanics, v. 9, (2), 2012, p. 157-174
Leung, Ka Kit; Ko, Wai Lun; Lam, David C C
Effect of danshen on the zero-stress state of rat'sabdominal aorta
Molecular & cellular biomechanics, v. 9, (4), 2012, p. 295-307
Han, Hui; Lam, David Chi Chuan; Huang, Wei
Partial Contact Indentation Tonometry for Measurement of Corneal Properties-Independent Intraocular Pressure
Molecular & Cellular Biomechanics, v. 9, (4), 2012, p. 251-268
Ko, Wai Lun; Leung, Ka Kit; Lam, David C C

Conference paper 1

Effect of age-stiffening of ocular tissues on glaucomatous damage
The 8th International Symposium of Ophthalmology – Hong Kong, Hong Kong, 2012
Leung, Ka Kit; Ko, Wai Lun; Lam, David Chuen Chun


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Article 2

Silver Nanoparticles as Surface-enhanced Raman Substrate for Quantitative Identification of Label-free Proteins
Materials chemistry and physics, v. 126, (1-2), 2011, Mar, p. 91-96
Dong, Ou; Lam, David Chi Chuan
Size-Dependent Behavior of Macromolecular Solids III: The Role of Entanglements
Computer modeling in engineering & sciences, v. 75, May 2011, p. 235-245
Wei, W.; Lam, David C.C.

Conference paper 2

A meshless formulation for the strain gradient elastic materials in fine-scale
ICCES'11, Nanjing, April 2011
Wang, Jun; LAM, David C.C.
Relations Between Optical Nerve Damage, Intraocular Pressure and In Vivo Ocular Tissue Properties Monitoring Strategies for Glaucoma Diagnosis and Prevention
ICCES'11, Nanjing, April 2011
Lam, David C C; Leung, Ka Kit; Ko, Wai Lun; Chen, Guo Zhen; Chan, Ion Seng


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Article 3

Nanostiffening in polymeric nanocomposites
Computers, Materials and Continua, v. 17, (3), 2010, p. 215-232
Wang, Jun; Lam, David Chi Chuan
Size-Dependent Behavior of Macromolecular Solids I: Molecular Origin of the Size Effect
Cmes-computer MODELING in engineering & sciences, v. 64, (2), 2010, AUG, p. 213-226
Wei, Wang; Lam, David Chi Chuan
Size-Dependent Behavior of Macromolecular Solids II: Higher-Order viscoelastic theory and experiments
CMES - Computer Modeling in Engineering and Sciences, v. 66, (1), 2010, p. 73-99
Lam, David C C; Keung, L.H.; Tong, Pin

Conference paper 1

Nanostiffening in Nanocomposites
International Conference on Computational Engineering Science, Las Vegas, March 2010
Wang, Jun; Lam, David C.C.


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Article 2

A Single-Axis Low-Cost Accelerometer Fabricated Using Printed-Circuit-Board Techniques
IEEE electron device letters, v. 30, (12), 2009, DEC, p. 1293-1295
Qiao, Dapeng; Pang, Grantham K.H.; Mui, Man-Kit; Lam, David Chi Chuan
Model and Analysis of Size-stiffening in Nanoporous Cellular Solids
Journal of materials science, v. 44, (4), 2009, FEB, p. 985-991
Wang, Jun; Lam, David Chi Chuan

Conference paper 2

Investigation of freeze drying process on stabilization of mouse immunoglobulin
Proceedings of The 6th International School and Symposium on Medical Devices and Biosensors (MDBS2009), and the 4th International School and Symposium on Biomedical and Health Engineering (BHE2009), Shenzhen, pp. 32-35
Dai, Jialu; Leung, Stanley Y.Y.; Dong, Ou; Wei, Huang; Lam, David C.C.
Time-dependence and Creep and Relaxation Solutions for Viscoelastic Maxwell Beams
International Conference on Computational & Experimental Engineering and Sciences, Phuket, Thailand 2009
Lam, David C.C.; Tong, P.


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Article 2

Geometric and Compaction Dependence of Printed Polymer-Based RFID Tag Antenna Performance
IEEE transactions on electronics packaging manufacturing, v. 31, (2), 2008, APR, p. 120-125
Leung, Stanley Y.Y.; Lam, David Chi Chuan
Properties and microstructures of low-temperature-processable ultralow-dielectric porous polyimide films
Journal of Electronic Materials, v. 37, (7), 2008, JUL, p. 955-961
Ren, Yuxing; Lam, David Chi Chuan

Conference paper 4

A new PCB-based low-cost accelerometer for human motion sensing
Proceedings of the IEEE International Conference on Automation and Logistics, ICAL 2008, 2008, p. 56-60
Qiao, Dapeng; Pang, Grantham K.H.; Kit, Mui Man; Lam, David Chi Chuan
Couple stress model of steric stiffening in nanoporous solids
Advanced Materials Research, v. 47, 2008, p. 730-733
Wang, Jun; Ren, Yuxing; Lam, David Chi Chuan
Insertion behavior of microneedles for drug delivery
Advanced Materials Research, v. 47, 2008, p. 1442-1445
Shek, K.T.; Lam, David Chi Chuan
Puncture depth and the mechanical stability of microneedles
BIODEVICES 2008 - Proceedings of the 1st International Conference on Biomedical Electronics and Devices, v. 2, 2008, p. 291-296
Lam, David C C; Lee, Y.H.; Shek, K.T.; Pang, Grantham K.H.


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Article 6

Characterizations of Elastic Behaviors of Silicon Nitride Thin Films with Varying Thicknesses
Materials science and engineering a-structural Materials PROPERTIES Microstructure and PROCESSING, v. 467, (1-2), 2007, OCT 15, p. 93-96
Ren, Yuxing; Lam, David Chi Chuan
Hygrothermal Delarminations in Lead-free Solder Reflow of Electronic Packages
Journal of Electronic Materials, v. 36, (3), 2007, MAR, p. 226-231
Lam, David Chuen Chun; Wang, Jun
Hygrothermal failures from small defects in lead-free solder reflowed electronic packages
IEEE transactions on advanced packaging, v. 30, (4), 2007, NOV, p. 636-640
Lam, David Chi Chuan; Wang, Jun; Yang, Fan
Performance of printed polymer-based RFID antenna on curvilinear surface
IEEE transactions on electronics packaging manufacturing, v. 30, (3), 2007, JUL, p. 200-205
Leung, Stanley Yun Yuen; Lam, David Chi Chuan
Quantitative Analysis of Resistance Tolerance of Polymer Thick Film Printed Resistors
IEEE Transactions on Components and Packaging Technologies, v. 30, (2), 2007, JUN, p. 269-274
Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C
Quantitative analysis of resistance variations in nickel-phosphorus (NiP) resistors
IEEE transactions on components and packaging technologies, v. 30, (2), 2007, JUN, p. 264-268
Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C

Conference paper 2

Geometric and compaction dependence of printed polymer-based RFID tag antenna performance
2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, 2007, p. 166-172
Leung, Stanley Yun Yuen; Lam, David Chi Chuan
Parametric analysis and design of ultra fine assembly of micro dies
2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, 2007, p. 173-178
Leung, Stanley Yun Yuen; Lam, David Chi Chuan


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Conference paper 6

Development and characterizations of low cost accelerometers
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006, p. 783-787
Mui, Man K.; Lam, David Chuen Chun
Low temperature processable ultra-low dielectric porous polyimide for high frequency applications
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006, p. 792-796
Ren, Yuxing; Lam, David Chuen Chun
Mechanics Framework for Micron-scale Planar Structures
Advanced Materials Research, v. 9, 2006, p. 173-182
Chong, Arthur C.M.; Yang, Fan; Lam, David C C; Tong, Pin
Nanoindentations and theory of strain gradient viscoelasticity
IUTAM Symposium on Size Effects on Material and Structural Behavior at Micron- and Nano-Scales, v. 142, 2006, p. 249-261
Keung, L.H.; Lam, David C C; Tong, Pin
Printed polymer based RFID antenna on curvilinear surface
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006, p. 303-308
Leung, Stanley Y.Y.; Tiu, P.K.; Lam, David Chuen Chun
Rigid-flex electronics with printed passives
IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, p. 22
Liu, C.K.; Tiu, P.K.; Lam, David Chi Chuan


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Article 1

Mode I solution for micron-sized crack
Engineering fracture mechanics, v. 72, (12), 2005, AUG, p. 1779-1804
Tong, Pin; Lam, David Chuen Chun; Yang, Fan

Conference paper 2

Experiments on the elastic size dependence of LPCVD silicon nitride
Materials Research Society Symposium Proceedings, v. 875, 2005, p. 85-90
Ren, Yuxing; Lam, David Chuen Chun
Realization of a 27-MHz wireless transmitter using embedded passives on a thin organic substrate
Proceedings - Electronic Components and Technology Conference, v. 2, 2005, p. 1704-1710
Lam, Sang; Liu, C.K.; Mui, M.K.; Shek, K.T.; Kok, Chi Wah; Lam, David Chuen Chun


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Article 3

Size effects of hair-sized structures - Torsion
Key engineering materials, v. 261-263, (Part 1&2), 2004, p. 11-22
Tong, P.; Yang, F.; Lam, DCC; Wang, J.
Size-dependent fracture and higher order J-integral for solids characterized by strain gradient elasticity
International journal of fracture, v. 126, (4), 2004, APR, p. 385-398
Lam, David Chuen Chun; Yang, Fan; Wang, Jun
The role of water in delamination in electronic packages: degradation of interfacial adhesion
Journal of adhesion science and technology, v. 18, (10), 2004, p. 1103-1121
Leung, Stanley Y.Y.; Lam, David Chuen Chun; Luo, Shijian; Wong, Chingping

Conference paper 3

Inductance Tolerance Analyses and Design-Process Map of Embedded Planar Spiral Inductor
Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 1108-1112
Liu, C.K.; Cheng, P.L.; Leung, Stanley YY; Lam, David C C
Investigations in size dependent torsions and fractures
IUTAM SYMPOSIUM ON MULTISCALE MODELING AND CHARACTERIZATION OF ELASTIC-INELASTIC BEHAVIOR OF ENGINEERING MATERIALS, PROCEEDINGS, v. 114, 2004, p. 259-266
Tong, P.; Lam, DCC; Yang, F.; Wang, J.
Size effects of hair-sized structures -torsion
Advances in Fracture and Failure Prevention: Proceedings of the Fifth International Conference on Fracture and Strength of Solids (FEOFS2003): Second International Conference on Physics and Chemistry of Fracture and Failure Prevention (2nd ICPCF); Sendai; Japan, 20 October 2003 through 22 October 2003; Code 63333, Volume 261-263, Issue I, 2004, Pages 11-22
Tong, Pin; Yang, Fan; Lam, David Chuen Chun; Wang, Jun


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Article 2

Embedded Passives: 3-D Integrated Component Printed Circuit Boards
Transactions Hong Kong Institution of Engineers, v. 10, (4), 2003, p. 42-49
Lam, David Chuen Chun
Experiments and Theory in Strain Gradient Elasticity
Journal of the Mechanics and Physics of Solids, v. 51, (8), 2003, AUG, p. 1477-1508
Lam, David C C; Yang, Fan; Chong, Arthur C.M.; Wang, Jianxun; Tong, Pin

Conference paper 3

Biomechanics of Orthodontic Tooth Movement
International Symposium on Macro-, Meso-, Micro-, nano- mechanics of materials, 8-10 Dec, pp27
Lam, Garret Chi Yan; Lam, David C C; Tong, Pin
Development of High Permeability Core Materials for Embeddable Inductors in Flexible Organic Substrates
Materials Research Society Symposium - Proceedings, v. 769, 2003, p. 343-348
Liu, C.K.; Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Lam, David C C
Quantitative Analysis of Resistance Variations in As-Deposited Nickel-Phosphorus (NiP) Embedded Resistors
Proceedings - Electronic Components and Technology Conference, 2003, p. 156-160
Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C


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Article 2

Call for papers: Optical Ethernet
The Journal of Optical Networking, v. 1, (4), 2002, p. 164-165
Lam, David Chuen Chun; Tsang, Danny Hin Kwok
Couple Stress Based Strain Gradient Theory for Elasticity
International Journal of Solids and Structures, v. 39, (10), 2002, MAY, p. 2731-2743
Yang, Fan; Chong, Arthur C.M.; Lam, David C C; Tong, Pin

Conference paper 8

Development of Low Temperature Processable Core Material for Embedded Inductor
POLYTRONIC 2002: 2ND INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, CONFERENCE PROCEEDINGS, 2002, p. 104-109
Liu, C.K.; Cheng, P.L.; Law, Y.W.; Chong, Jones Ioktong; Lam, David C C
Effect of Copper Oxide on the Adhesion Behavior of Epoxy Molding Compound-Copper Interface
Proceedings - Electronic Components and Technology Conference, 2002, p. 1665-1670
Chung, Paular Wai Kwan; Yuen, Matthew Ming Fai; Chan, Philip Ching Ho; Ho, Nick K; Lam, David C C
Experimental Investigation and Quantitative Analysis of Resistance Variations and Control in Printed Thick Film Resistors
Proceedings - Electronic Components and Technology Conference, 2002, p. 1704-1708
Cheng, P.L.; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C
Low Temperature Processing and Electrical Properties of Embedded Ferrite-cored Inductor
Proceedings - Electronic Components and Technology Conference, 2002, p. 490-494
Liu, C.K.; Law, T.W.; Cheng, P.L.; Chong, Jones Ioktong; Lam, David C C
Novel Low Temperature BaTiO₃ Film Capacitors
Proceedings - Electronic Components and Technology Conference, 2002, p. 1714-1717
Law, T.W.; Liu, C.K.; Cheng, P.L.; Chong, Jones Ioktong; Lam, David C C
Phase transformation of thin wires in tension
IUTAM SYMPOSIUM ON MECHANICS OF MARTENSITIC PHASE TRANSFORMATION IN SOLIDS, v. 101, 2002, p. 221-232
Tong, P.; Lam, DCC; Sun, QP
Quantitative Analysis of Resistance of Printed Resistors
POLYTRONIC 2002: 2ND INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, CONFERENCE PROCEEDINGS, 2002, p. 205-210
Cheng, P.L.; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C
The Role of Water in Delamination in Electronics Packages: Water Evaporation from Epoxy
IEEE Transactions on Components and Packaging Technologies, v. 25, (4), 2002, DEC, p. 708-713
Lam, David C C; Chong, Jones Ioktong; Tong, Pin


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Article 4

A CAD/CAM system for process planning and optimization in LOM (Laminated Object Manufacturing)
IIE Transactions, v. 33, (4), 2001, APR, p. 345-355
Pang, Anthony; Joneja, Ajay; Lam, David Chuen Chun; Yuen, Matthew Ming Fai
Characterization and Modeling of Specific Strain Gradient Modulus of Epoxy
Journal of Materials Research, v. 16, (2), 2001, FEB, p. 558-563
Lam, David C C; Chong, Arthur C.M.
Model and Experiments on Strain Gradient Hardening in Metallic Glass
Materials Science and Engineering A, v. 318, (1-2), 2001, NOV, p. 313-319
Lam, David C C; Chong, Arthur C.M.
Torsion and Bending of Micron-Scaled Structures
Journal of Materials Research, v. 16, (4), 2001, APR, p. 1052-1058
Chong, Arthur C.M.; Yang, Fan; Lam, David C C; Tong, Pin

Conference paper 1

Experimental investigation of time dependent degradation of coupling agent bonded interfaces
Proceedings - Electronic Components and Technology Conference, 2001, p. 1333-1337
Leung, Stanley Y.Y.; Lam, David Chuen Chun; Wong, Chingping


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Article 7

A CAD/CAM system for vector-based layered manufacturing systems
International Journal of Computer Integrated Manufacturing, v. 13, (5), September 2000, p. 388-400
Joneja, Ajay; Pang, Anthony; Lam, David Chuen Chun; Yuen, Matthew Ming Fai
Deformation prediction of the laminated object modeling composite laminates
Journal of materials processing technology, v. 103, (2), 2000, JUN 15, p. 261-266
Mak, C.K.Y.; Lam, David Chuen Chun; Yuen, Matthew Ming Fai; Joneja, Ajay
Effect of Cross-Link Density on Strain Gradient Plasticity in Epoxy
Materials Science and Engineering A, v. 281, (1-2), 2000, APR 15, p. 156-161
Lam, David C C; Chong, Arthur C.M.
Measurement of Interfacial Fracture Toughness for Microelectronic Packages
Journal of Electronics Manufacturing, v. 10, (2), 2000, JUN, p. 139-145
Yeung, Dickson T.S.; Yuen, Matthew Ming Fai; Lam, David C C; Chan, Philip Ching Ho
Parametric Analysis of Steam Driven Delamination in Electronics Packages
IEEE Transactions on Electronics Packaging Manufacturing, v. 23, (3), 2000, JUL, p. 208-213
Lam, David C C; Chong, Jones Ioktong; Tong, Pin
Specimen design for mixed mode interfacial fracture properties measurement in electronic packages
Journal of electronic packaging, v. 122, (1), 2000, MAR, p. 67-72
Yeung, Dickson T.S.; Lam, David Chuen Chun; Yuen, Matthew Ming Fai
Synthesis and characterization of low temperature degradable polymers
Journal of materials science letters, v. 19, (23), 2000, DEC, p. 2109-2111
Wang, Dayang; Lam, David Chuen Chun

Conference paper 4

Energy Based Failure Criterion for Interfacial Delamination
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904155, p. 201-205
Chung, Paular Wai Kwan; Chan, S.K.; Yuen, Matthew Ming Fai; Lam, David Chuen Chun; Teng, Annette
Influence of chemistry and applied stress on reliability of polymer and substrate interfaces
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, p. 581-585
Leung, Stanley Y.Y.; Luo, Shijian; Lam, David Chuen Chun; Wong, Chingping
Measurement of Water Evaporation Rate for Popcorning
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 2000, p. 131-134
Chong, Jones Ioktong; Lam, David C C; Tong, Pin
Measurement of Water Evaporation Rate from Epoxy
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904196, p. 440-443
Chong, Jones Ioktong; Lam, David Chuen Chun; Tong, Pin


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Article 5

Chemical kinetic model of interfacial degradation of adhesive joints
IEEE transactions on components and packaging technologies, v. 22, (2), 1999, JUN, p. 215-220
Lam, David Chuen Chun; Yang, Fan; Tong, Pin
Densification model for powder compacts
Journal of materials science, v. 34, (23), 1999, DEC, p. 5879-5884
Lam, David Chuen Chun
Effect of Solder Reflow Temperature Profile on Popcorning
American Society of Mechanical Engineers, EEP, v. 26, 1999, p. 1053-1058
Chong, Jones Ioktong; Lam, David C C; Tong, Pin
Indentation Model and Strain Gradient Plasticity Law for Glassy Polymers
Journal of Materials Research, v. 14, (9), 1999, SEP, p. 3784-3788
Lam, David C C; Chong, Arthur C.M.
Strain Gradient Plasticity Effect in Indentation Hardness of Polymers
Journal of Materials Research, v. 14, (10), 1999, OCT, p. 4103-4110
Chong, Arthur C.M.; Lam, David C C

Conference paper 2

Effect of Solder Reflow Temperature Profile on Popcorning
American Society of Mechanical Engineers, EEP, v. 26, 1999, p. 1/-
Chong, Jones Ioktong; Lam, David C C; Tong, Pin
Global Collaborative Electronic Packaging Education
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, p. 907-911
Tong, Pin; Lam, David C C; Yuen, Matthew Ming Fai; Kim, Jang Kyo; Lee, Ricky S W; Lee, Steve Han Keung; Chan, Philip Ching Ho


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Article 1

Packing model for bimodal particle packing with aligned fibers
Journal of materials processing technology, v. 79, (1-3), 1998, JUL 1, p. 170-176
Lam, David Chuen Chun

Conference paper 2

Chemical kinetic model of interfacial degradation of adhesive joints
3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, p. 44-48
Lam, DCC; Yang, F.; Tong, P.
Influence of Defect Size on Popcorning
International Conference on Solid-State and Integrated Circuit Technology Proceedings, 1998, p. 550-553
Lam, David C C; Chong, Jones Ioktong; Yuen, Matthew Ming Fai; Tong, Pin


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Article 1

Characteristic grain size: Part II measuring principles
Journal of Central South University of Technology (English Edition), v. 4, (2), 1997, p. 118-119
Shunhua, Cao; Lam, David Chuen Chun

Conference paper 1

Structural reliability of direct-chip-attaches bonded with anisotropic conductive film
Materials Research Society Symposium - Proceedings, v. 445, 1997, p. 297-306
Lam, David Chuen Chun; Shen, Chihkang; Xie, J.F.; Karim, Zaheed S.; Tong, Pin


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Article 1

Microstructural and chemical stability of Y-ZrO₂ reinforced β″-alumina in molten sodium sulfide and sulfur
Journal of Materials Science, v. 31, (18), 1996, p. 4939-4944
Lam, David Chuen Chun; Kusakari, K.


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Article 1

Microstructure and Mechanical Properties Relations for Green Bodies Compacted from Spray Dried Granules
Journal of materials science, v. 30, (21), 1995, NOV 1, p. 5495-5501
Lam, David Chuen Chun; Kusakari, K.


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Article 4

Effects of Binder and Compaction Pressure on Strength and Fracture Origins in Bodies Pressed From Granules
Journal of the Ceramic Society of Japan, v. 102, (11), November 1994, p. 1010-1015
Lam, David Chuen Chun
Mechanical Properties of Partially Dense Alumina Produced From Powder Compacts
Journal of the American Ceramic Society, v. 77, (8), August 1994, p. 2113-2117
Lam, David Chuen Chun; Lange, Fred F.; Evans, Anthony G.
Microstructural Observations on Constrained Densification of Alumina Powder Containing a Periodic Array of Sapphire Fibers
Journal of the American Ceramic Society, v. 77, (7), 1994, p. 1976-1978
Lam, David Chuen Chun; Lange, Fred F.
Packing of Particles (Part 3), Effect of Particle Size Distribution Shape On Composite Packing Density in Bimodal Mixtures
Journal of the Ceramic Society of Japan, v. 102, (2), February 1994, p. 133-138
Lam, David Chuen Chun; Nakagawa, Mitsuo


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Article 4

Packing of Particles (Part 1), Packing Behavior of Monosized Spheres In Cylinders
Journal of the Ceramic Society of Japan, v. 101, (10), October 1993, p. 1187-1198
Lam, David Chuen Chun; Nakagawa, Mitsuo
Packing of Particles (Part 2), Effect of Extra Pore Volume on Packing Density of Mixtures of Monosized Spheres
Journal of the Ceramic Society of Japan, v. 101, (10), October 1993, p. 1234-1238
Lam, David Chuen Chun; Nakagawa, Mitsuo
Packing of particles (Part 2). Effect of extra pore volume on packing density of mixtures of monosized spheres
Journal of the Ceramic Society of Japan. International ed., Volume 101, Issue 11, November 1993, Pages 1204-1208
Lam, David Chuen Chun; Nakagawa, Mitsuo
Packing of particles (part I) -packing behavior of monosized spheres in cylinders
Journal of the Ceramic Society of Japan. International ed.\gVolume 101, Issue 10, October 1993, Pages 1155-1156
Lam, David Chuen Chun; Nakagawa, Mitsuo


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Article 1

Powder Processing of Ceramic matrix Composites
Materials Science and Engineering A, v. 144, (1-2), 1 October 1991, Pages 143-152
Lange, Friederike F.; Lam, David Chuen Chun; Sudre, Olivier H.; Flinn, Brian D.; Folsom, Craig A.; Velamakanni, Bhaskar V.; Zok, Frank W.; Evans, Anthony G.


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Conference paper 2

Densification Behavior of Al2O3 Powder Containing ZrO2 Inclusions
Processing Science of Advanced Ceramics Symposium, Mater. Res. Soc., 1989, Pittsburgh, PA, USA, p. 363-368
Sudre, Olivier; Lam, David Chuen Chun; Lange, Fred F.
Powder Processing and Densification of Ceramic Composites
Processing Science of Advanced Ceramics Symposium, Mater. Res. Soc., 1989, Pittsburgh, PA, USA, p. 309-318
Lange, Fred F.; Lam, David C C; Sudre, Olivier


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2016 6

Diurnal Variation of Corneal Tangent Modulus in Normal Chinese
Cornea, v. 35, (12), June 2016, p. 1600-1604
Hon, Ying; Wan, Kin; Chen, Guo Zhen; Lu, Shuhao; Lam, David Chuen Chun; Lam, Andrew K.C. Article
Characterization of Thrombus Stiffening in Radio Frequency (rf Mechanical Thrombectomy
2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2016), November 2016, p. 355-358
Chon, Chi Hang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David Chuen Chun Conference paper
Corneal stiffness and tangent modulus in low and high myopes
The 10th Asia Cornea and Contact Lens Conference (ACCLC 2016), Hong Kong, 28-29 April 2016
Lam, Andrew K.C.; Hon, Ying; Lam, David Chuen Chun; Lu, Shuhao; Chen, Guozhen Conference paper
In Vitro Examination of the Pressure Effect on Clot Dissolution with Thrombolytic Patch
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS, v. 2016-October, October 2016, article number 7590761, p. 549-552
Qin, Zhen; Chon, Chi Hang; Kwok, John Ching Kwong; Lam, David Chuen Chun Conference paper
IN VITRO TESTING OF THROMBOLYTIC PATCH FOR ISCHEMIC STROKE TREATMENT
5th Annual Scientific Meeting Indonesian Society of Interventional Radiology, Bali, Indonesia, 23-25 March 2016
Qin, Zhen; Chon, Chi Hang; Kwok, John Ching Kwong; Lam, David C C Conference paper
RADIO FREQUENCY (RF) THROMBECTOMY: NEW TREATMENT METHOD FOR ACUTE ISCHEMIC STROKE
5th Annual Scientific Meeting Indonesian Society of Interventional Radiology, Bali, Indonesia, 23-25 March 2016
Chon, Chi Hang; Qin, Zhen; Kwok, John Ching Kwong; Lam, David C C Conference paper

2015 4

Repeatability of a novel corneal indentation device for corneal biomechanical measurement
Ophthalmic and Physiological Optics, v. 35, (4), July 2015, p. 455-461
Lam, Andrew K.C.; Hon, Ying; Leung, Leo K.K.; Lam, David Chuen Chun Article
Feasibility Examination of Isolated Zonal Thrombolysis using Raman Spectroscopy
2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2015), Institute of Electrical and Electronics Engineers (IEEE), 2015, p. 1353-1356
Qin, Zhen; Chon, Chi Hang; Lam, Alexander KN; Kwok, John Ching Kwong; Yuen, Matthew Ming Fai; Lam, David C C Conference paper
In-Vitro Testing of RF-Enabled Low Force Mechanical Thrombectomy for Ischemic Stroke
2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2015), Institute of Electrical and Electronics Engineers (IEEE), 2015, p. 1349-1352
Chon, Chi Hang; Qin, Zhen; Lam, Alexander KN; Kwok, John Ching Kwong; Yuen, Matthew Ming Fai; Lam, David C C Conference paper
Raman Spectroscopy of RF Strengthened Thrombus
37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, Milano, Italy, 25-29 August 2015
Chon, Chi Hang; Qin, Zhen; Lam, Alexander KN; Kwok, John Ching Kwong; Yuen, Matthew Ming Fai; Lam, David C C Conference paper

2014 8

Comparative Study of Corneal Tangent Elastic Modulus Measurement Using Corneal Indentation Device
Medical Engineering & Physics, v. 36, (9), September 2014, p. 1115-1121
Ko, Wai Lun; Leung, Ka Kit; Lam, David Chuen Chun Article
Individual-specific tonometry on porcine eyes
Medical Engineering & Physics, v. 36, (1), January 2014, p. 96-101
Leung, Ka Kit; Ko, Wai Lun; Lam, David Chuen Chun Article
Noninvasive Measurement of Scleral Stiffness and Tangent Modulus in Porcine Eyes
Investigative Ophthalmology & Visual Science, v. 55, (6), June 2014, p. 3721-3726
Leung, Ka Kit; Ko, Wai Lun; Ye, Cong; Lam, David Chuen Chun; Leung, Christopher Kai Shun Article
Soft Wearable Contact Lens Sensor for Continuous Intraocular Pressure Monitoring
Medical Engineering & Physics, v. 36, (9), September 2014, p. 1134-1139
Chen, Guo Zhen; Chan, Ion Seng; Leung, Ka Kit; Lam, David Chuen Chun Article
Feasibility of Activity‐Monitoring Using Contact Lens Sensor
Interdisciplinary Medical and Engineering Symposium on the Eye: Tissue Properties, Pathology (IME); The 5th AEARU Advanced Materials Workshop, Hong Kong, 4 June 2014
Chen, Guozhen; Leung, Ka Kit; Lam, David Chuen Chun Conference paper
Response of the Smart Contact Lens Sensor in Human Objects: Correlation Between Ocular Movements, Postural Changes, Aerobic Exercise and Blood Pressure
The 5th AEARU Advanced Materials Workshop, The Hong Kong University of Science and Technology, 4th June 2014
Chen, Guozhen; Chan, Ion Seng; Leung, Ka Kit; Lam, David Chuen Chun Conference paper
Theories and Practices of Biomechanics in Glaucoma: Measurement Methods
The 5th AEARU Advanced Materials Workshop, Hong Kong, China, 4 June 2014
Leung, Ka Kit; Lam, David Chuen Chun Conference paper
Theories and practices of biomechanics in Glaucoma: Theory Overview
The 5th AEARU Advanced Materials Workshop, Hong Kong, China, 4 June 2014
Leung, Ka Kit; Lam, David Chuen Chun Conference paper

2013 9

Capacitive Contact Lens Sensor for Continuous Non-Invasive Intraocular Pressure Monitoring
Sensors and Actuators, A: Physical, v. 203, 2013, p. 112-118
Chen, Guo Zhen; Chan, Ion Seng; Lam, David C C Article
Characterization of Corneal Tangent Modulus in Vivo
Acta ophthalmologica, v. 91, (4), June 2013, p. e263-e269
Ko, Wai Lun; Leung, Ka Kit; Lam, David Chuen Chun; Leung, Christopher Kai Shun Article
A Novel Device for Clinical Measurement of Corneal Elasticity
The Association for Research in Vision and Ophthalmology 2013 Annual Meeting, Washington State Convention Center, USA, 5-9 May 2013
Leung, Christopher Kai Shun; Ye, Cong; Ko, Wai Lun; Leung, Ka Kit; Lam, David Chuen Chun Conference paper
Characterization of Pressure Reduction in Coil-filled Aneurysm under Flow of Human Blood with and without Anti-coagulant
2013 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 739-742
Lam, Alexander KN; Ko, Wai Lun; Leung, Ka Kit; Kwok, John Ching Kwong; Yuen, Mathew Ming Fai; Lam, David C C Conference paper
Development of Cornea-Specific Tonometry (CST): Porcine Eye Study
The HKUST International Conference on Biomedical Engineering (USTBME 2013), The Hong Kong University of Science and Technology, 10-12 January 2013
Leung, Ka Kit; Ko, Wai Lun; Lam, David Chuen Chun Conference paper
Fabrication and Characterization of Ultralow-k Porous Polyimide as Flexible Substrate
2013 IEEE International Symposium on Advanced Packaging Materials, Irvine, CA, USA, 27 February - 1 March 2013
Ko, H.K.; Dong, Ou; Lam, David Chuen Chun Conference paper
Low Force Capacitive Contact Lens Sensor for Continuous Non-Invasive
The HKUST International Conference on Biomedical Engineering, HKUST, Hong Kong, 10-12 January 2013
Chen, Guozhen; Chan, Ion Seng; Lam, David C C Conference paper
Low-Stress Ultra-Low Dielectric Porous Polymer for High Density Applications: A Review
Proceedings of the IEEE Conference on Nanotechnology, 2013, article number 6721031, p. 34-38
Chong, H.-H Ko J. Y.-T; Lam, David Chuen Chun Conference paper
Performance Analysis of Low Stress Ultra-Low Dielectric Coatings for High Density Substrates
2013 IEEE International Symposium on Advanced Packaging Materials (APM 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 146-153
Ko, Hoi Him; Dong, Ou; Law, Alan; Lam, David Chuen Chun Conference paper

2012 4

Effect of Age-Stiffening Tissues and Intraocular Pressure on Optic Nerve Damages
Molecular & Cellular Biomechanics, v. 9, (2), 2012, p. 157-174
Leung, Ka Kit; Ko, Wai Lun; Lam, David C C Article
Effect of danshen on the zero-stress state of rat'sabdominal aorta
Molecular & cellular biomechanics, v. 9, (4), 2012, p. 295-307
Han, Hui; Lam, David Chi Chuan; Huang, Wei Article
Partial Contact Indentation Tonometry for Measurement of Corneal Properties-Independent Intraocular Pressure
Molecular & Cellular Biomechanics, v. 9, (4), 2012, p. 251-268
Ko, Wai Lun; Leung, Ka Kit; Lam, David C C Article
Effect of age-stiffening of ocular tissues on glaucomatous damage
The 8th International Symposium of Ophthalmology – Hong Kong, Hong Kong, 2012
Leung, Ka Kit; Ko, Wai Lun; Lam, David Chuen Chun Conference paper

2011 4

Silver Nanoparticles as Surface-enhanced Raman Substrate for Quantitative Identification of Label-free Proteins
Materials chemistry and physics, v. 126, (1-2), 2011, Mar, p. 91-96
Dong, Ou; Lam, David Chi Chuan Article
Size-Dependent Behavior of Macromolecular Solids III: The Role of Entanglements
Computer modeling in engineering & sciences, v. 75, May 2011, p. 235-245
Wei, W.; Lam, David C.C. Article
A meshless formulation for the strain gradient elastic materials in fine-scale
ICCES'11, Nanjing, April 2011
Wang, Jun; LAM, David C.C. Conference paper
Relations Between Optical Nerve Damage, Intraocular Pressure and In Vivo Ocular Tissue Properties Monitoring Strategies for Glaucoma Diagnosis and Prevention
ICCES'11, Nanjing, April 2011
Lam, David C C; Leung, Ka Kit; Ko, Wai Lun; Chen, Guo Zhen; Chan, Ion Seng Conference paper

2010 4

Nanostiffening in polymeric nanocomposites
Computers, Materials and Continua, v. 17, (3), 2010, p. 215-232
Wang, Jun; Lam, David Chi Chuan Article
Size-Dependent Behavior of Macromolecular Solids I: Molecular Origin of the Size Effect
Cmes-computer MODELING in engineering & sciences, v. 64, (2), 2010, AUG, p. 213-226
Wei, Wang; Lam, David Chi Chuan Article
Size-Dependent Behavior of Macromolecular Solids II: Higher-Order viscoelastic theory and experiments
CMES - Computer Modeling in Engineering and Sciences, v. 66, (1), 2010, p. 73-99
Lam, David C C; Keung, L.H.; Tong, Pin Article
Nanostiffening in Nanocomposites
International Conference on Computational Engineering Science, Las Vegas, March 2010
Wang, Jun; Lam, David C.C. Conference paper

2009 4

A Single-Axis Low-Cost Accelerometer Fabricated Using Printed-Circuit-Board Techniques
IEEE electron device letters, v. 30, (12), 2009, DEC, p. 1293-1295
Qiao, Dapeng; Pang, Grantham K.H.; Mui, Man-Kit; Lam, David Chi Chuan Article
Model and Analysis of Size-stiffening in Nanoporous Cellular Solids
Journal of materials science, v. 44, (4), 2009, FEB, p. 985-991
Wang, Jun; Lam, David Chi Chuan Article
Investigation of freeze drying process on stabilization of mouse immunoglobulin
Proceedings of The 6th International School and Symposium on Medical Devices and Biosensors (MDBS2009), and the 4th International School and Symposium on Biomedical and Health Engineering (BHE2009), Shenzhen, pp. 32-35
Dai, Jialu; Leung, Stanley Y.Y.; Dong, Ou; Wei, Huang; Lam, David C.C. Conference paper
Time-dependence and Creep and Relaxation Solutions for Viscoelastic Maxwell Beams
International Conference on Computational & Experimental Engineering and Sciences, Phuket, Thailand 2009
Lam, David C.C.; Tong, P. Conference paper

2008 6

Geometric and Compaction Dependence of Printed Polymer-Based RFID Tag Antenna Performance
IEEE transactions on electronics packaging manufacturing, v. 31, (2), 2008, APR, p. 120-125
Leung, Stanley Y.Y.; Lam, David Chi Chuan Article
Properties and microstructures of low-temperature-processable ultralow-dielectric porous polyimide films
Journal of Electronic Materials, v. 37, (7), 2008, JUL, p. 955-961
Ren, Yuxing; Lam, David Chi Chuan Article
A new PCB-based low-cost accelerometer for human motion sensing
Proceedings of the IEEE International Conference on Automation and Logistics, ICAL 2008, 2008, p. 56-60
Qiao, Dapeng; Pang, Grantham K.H.; Kit, Mui Man; Lam, David Chi Chuan Conference paper
Couple stress model of steric stiffening in nanoporous solids
Advanced Materials Research, v. 47, 2008, p. 730-733
Wang, Jun; Ren, Yuxing; Lam, David Chi Chuan Conference paper
Insertion behavior of microneedles for drug delivery
Advanced Materials Research, v. 47, 2008, p. 1442-1445
Shek, K.T.; Lam, David Chi Chuan Conference paper
Puncture depth and the mechanical stability of microneedles
BIODEVICES 2008 - Proceedings of the 1st International Conference on Biomedical Electronics and Devices, v. 2, 2008, p. 291-296
Lam, David C C; Lee, Y.H.; Shek, K.T.; Pang, Grantham K.H. Conference paper

2007 8

Characterizations of Elastic Behaviors of Silicon Nitride Thin Films with Varying Thicknesses
Materials science and engineering a-structural Materials PROPERTIES Microstructure and PROCESSING, v. 467, (1-2), 2007, OCT 15, p. 93-96
Ren, Yuxing; Lam, David Chi Chuan Article
Hygrothermal Delarminations in Lead-free Solder Reflow of Electronic Packages
Journal of Electronic Materials, v. 36, (3), 2007, MAR, p. 226-231
Lam, David Chuen Chun; Wang, Jun Article
Hygrothermal failures from small defects in lead-free solder reflowed electronic packages
IEEE transactions on advanced packaging, v. 30, (4), 2007, NOV, p. 636-640
Lam, David Chi Chuan; Wang, Jun; Yang, Fan Article
Performance of printed polymer-based RFID antenna on curvilinear surface
IEEE transactions on electronics packaging manufacturing, v. 30, (3), 2007, JUL, p. 200-205
Leung, Stanley Yun Yuen; Lam, David Chi Chuan Article
Quantitative Analysis of Resistance Tolerance of Polymer Thick Film Printed Resistors
IEEE Transactions on Components and Packaging Technologies, v. 30, (2), 2007, JUN, p. 269-274
Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Article
Quantitative analysis of resistance variations in nickel-phosphorus (NiP) resistors
IEEE transactions on components and packaging technologies, v. 30, (2), 2007, JUN, p. 264-268
Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Article
Geometric and compaction dependence of printed polymer-based RFID tag antenna performance
2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, 2007, p. 166-172
Leung, Stanley Yun Yuen; Lam, David Chi Chuan Conference paper
Parametric analysis and design of ultra fine assembly of micro dies
2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, 2007, p. 173-178
Leung, Stanley Yun Yuen; Lam, David Chi Chuan Conference paper

2006 6

Development and characterizations of low cost accelerometers
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006, p. 783-787
Mui, Man K.; Lam, David Chuen Chun Conference paper
Low temperature processable ultra-low dielectric porous polyimide for high frequency applications
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006, p. 792-796
Ren, Yuxing; Lam, David Chuen Chun Conference paper
Mechanics Framework for Micron-scale Planar Structures
Advanced Materials Research, v. 9, 2006, p. 173-182
Chong, Arthur C.M.; Yang, Fan; Lam, David C C; Tong, Pin Conference paper
Nanoindentations and theory of strain gradient viscoelasticity
IUTAM Symposium on Size Effects on Material and Structural Behavior at Micron- and Nano-Scales, v. 142, 2006, p. 249-261
Keung, L.H.; Lam, David C C; Tong, Pin Conference paper
Printed polymer based RFID antenna on curvilinear surface
2006 International Conference on Electronic Materials and Packaging, EMAP, 2006, p. 303-308
Leung, Stanley Y.Y.; Tiu, P.K.; Lam, David Chuen Chun Conference paper
Rigid-flex electronics with printed passives
IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, p. 22
Liu, C.K.; Tiu, P.K.; Lam, David Chi Chuan Conference paper

2005 3

Mode I solution for micron-sized crack
Engineering fracture mechanics, v. 72, (12), 2005, AUG, p. 1779-1804
Tong, Pin; Lam, David Chuen Chun; Yang, Fan Article
Experiments on the elastic size dependence of LPCVD silicon nitride
Materials Research Society Symposium Proceedings, v. 875, 2005, p. 85-90
Ren, Yuxing; Lam, David Chuen Chun Conference paper
Realization of a 27-MHz wireless transmitter using embedded passives on a thin organic substrate
Proceedings - Electronic Components and Technology Conference, v. 2, 2005, p. 1704-1710
Lam, Sang; Liu, C.K.; Mui, M.K.; Shek, K.T.; Kok, Chi Wah; Lam, David Chuen Chun Conference paper

2004 6

Size effects of hair-sized structures - Torsion
Key engineering materials, v. 261-263, (Part 1&2), 2004, p. 11-22
Tong, P.; Yang, F.; Lam, DCC; Wang, J. Article
Size-dependent fracture and higher order J-integral for solids characterized by strain gradient elasticity
International journal of fracture, v. 126, (4), 2004, APR, p. 385-398
Lam, David Chuen Chun; Yang, Fan; Wang, Jun Article
The role of water in delamination in electronic packages: degradation of interfacial adhesion
Journal of adhesion science and technology, v. 18, (10), 2004, p. 1103-1121
Leung, Stanley Y.Y.; Lam, David Chuen Chun; Luo, Shijian; Wong, Chingping Article
Inductance Tolerance Analyses and Design-Process Map of Embedded Planar Spiral Inductor
Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 1108-1112
Liu, C.K.; Cheng, P.L.; Leung, Stanley YY; Lam, David C C Conference paper
Investigations in size dependent torsions and fractures
IUTAM SYMPOSIUM ON MULTISCALE MODELING AND CHARACTERIZATION OF ELASTIC-INELASTIC BEHAVIOR OF ENGINEERING MATERIALS, PROCEEDINGS, v. 114, 2004, p. 259-266
Tong, P.; Lam, DCC; Yang, F.; Wang, J. Conference paper
Size effects of hair-sized structures -torsion
Advances in Fracture and Failure Prevention: Proceedings of the Fifth International Conference on Fracture and Strength of Solids (FEOFS2003): Second International Conference on Physics and Chemistry of Fracture and Failure Prevention (2nd ICPCF); Sendai; Japan, 20 October 2003 through 22 October 2003; Code 63333, Volume 261-263, Issue I, 2004, Pages 11-22
Tong, Pin; Yang, Fan; Lam, David Chuen Chun; Wang, Jun Conference paper

2003 5

Embedded Passives: 3-D Integrated Component Printed Circuit Boards
Transactions Hong Kong Institution of Engineers, v. 10, (4), 2003, p. 42-49
Lam, David Chuen Chun Article
Experiments and Theory in Strain Gradient Elasticity
Journal of the Mechanics and Physics of Solids, v. 51, (8), 2003, AUG, p. 1477-1508
Lam, David C C; Yang, Fan; Chong, Arthur C.M.; Wang, Jianxun; Tong, Pin Article
Biomechanics of Orthodontic Tooth Movement
International Symposium on Macro-, Meso-, Micro-, nano- mechanics of materials, 8-10 Dec, pp27
Lam, Garret Chi Yan; Lam, David C C; Tong, Pin Conference paper
Development of High Permeability Core Materials for Embeddable Inductors in Flexible Organic Substrates
Materials Research Society Symposium - Proceedings, v. 769, 2003, p. 343-348
Liu, C.K.; Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Lam, David C C Conference paper
Quantitative Analysis of Resistance Variations in As-Deposited Nickel-Phosphorus (NiP) Embedded Resistors
Proceedings - Electronic Components and Technology Conference, 2003, p. 156-160
Cheng, P.L.; Leung, Stanley YY; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Conference paper

2002 10

Call for papers: Optical Ethernet
The Journal of Optical Networking, v. 1, (4), 2002, p. 164-165
Lam, David Chuen Chun; Tsang, Danny Hin Kwok Article
Couple Stress Based Strain Gradient Theory for Elasticity
International Journal of Solids and Structures, v. 39, (10), 2002, MAY, p. 2731-2743
Yang, Fan; Chong, Arthur C.M.; Lam, David C C; Tong, Pin Article
Development of Low Temperature Processable Core Material for Embedded Inductor
POLYTRONIC 2002: 2ND INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, CONFERENCE PROCEEDINGS, 2002, p. 104-109
Liu, C.K.; Cheng, P.L.; Law, Y.W.; Chong, Jones Ioktong; Lam, David C C Conference paper
Effect of Copper Oxide on the Adhesion Behavior of Epoxy Molding Compound-Copper Interface
Proceedings - Electronic Components and Technology Conference, 2002, p. 1665-1670
Chung, Paular Wai Kwan; Yuen, Matthew Ming Fai; Chan, Philip Ching Ho; Ho, Nick K; Lam, David C C Conference paper
Experimental Investigation and Quantitative Analysis of Resistance Variations and Control in Printed Thick Film Resistors
Proceedings - Electronic Components and Technology Conference, 2002, p. 1704-1708
Cheng, P.L.; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Conference paper
Low Temperature Processing and Electrical Properties of Embedded Ferrite-cored Inductor
Proceedings - Electronic Components and Technology Conference, 2002, p. 490-494
Liu, C.K.; Law, T.W.; Cheng, P.L.; Chong, Jones Ioktong; Lam, David C C Conference paper
Novel Low Temperature BaTiO₃ Film Capacitors
Proceedings - Electronic Components and Technology Conference, 2002, p. 1714-1717
Law, T.W.; Liu, C.K.; Cheng, P.L.; Chong, Jones Ioktong; Lam, David C C Conference paper
Phase transformation of thin wires in tension
IUTAM SYMPOSIUM ON MECHANICS OF MARTENSITIC PHASE TRANSFORMATION IN SOLIDS, v. 101, 2002, p. 221-232
Tong, P.; Lam, DCC; Sun, QP Conference paper
Quantitative Analysis of Resistance of Printed Resistors
POLYTRONIC 2002: 2ND INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS, CONFERENCE PROCEEDINGS, 2002, p. 205-210
Cheng, P.L.; Law, T.W.; Liu, C.K.; Chong, Jones Ioktong; Lam, David C C Conference paper
The Role of Water in Delamination in Electronics Packages: Water Evaporation from Epoxy
IEEE Transactions on Components and Packaging Technologies, v. 25, (4), 2002, DEC, p. 708-713
Lam, David C C; Chong, Jones Ioktong; Tong, Pin Conference paper

2001 5

A CAD/CAM system for process planning and optimization in LOM (Laminated Object Manufacturing)
IIE Transactions, v. 33, (4), 2001, APR, p. 345-355
Pang, Anthony; Joneja, Ajay; Lam, David Chuen Chun; Yuen, Matthew Ming Fai Article
Characterization and Modeling of Specific Strain Gradient Modulus of Epoxy
Journal of Materials Research, v. 16, (2), 2001, FEB, p. 558-563
Lam, David C C; Chong, Arthur C.M. Article
Model and Experiments on Strain Gradient Hardening in Metallic Glass
Materials Science and Engineering A, v. 318, (1-2), 2001, NOV, p. 313-319
Lam, David C C; Chong, Arthur C.M. Article
Torsion and Bending of Micron-Scaled Structures
Journal of Materials Research, v. 16, (4), 2001, APR, p. 1052-1058
Chong, Arthur C.M.; Yang, Fan; Lam, David C C; Tong, Pin Article
Experimental investigation of time dependent degradation of coupling agent bonded interfaces
Proceedings - Electronic Components and Technology Conference, 2001, p. 1333-1337
Leung, Stanley Y.Y.; Lam, David Chuen Chun; Wong, Chingping Conference paper

2000 11

A CAD/CAM system for vector-based layered manufacturing systems
International Journal of Computer Integrated Manufacturing, v. 13, (5), September 2000, p. 388-400
Joneja, Ajay; Pang, Anthony; Lam, David Chuen Chun; Yuen, Matthew Ming Fai Article
Deformation prediction of the laminated object modeling composite laminates
Journal of materials processing technology, v. 103, (2), 2000, JUN 15, p. 261-266
Mak, C.K.Y.; Lam, David Chuen Chun; Yuen, Matthew Ming Fai; Joneja, Ajay Article
Effect of Cross-Link Density on Strain Gradient Plasticity in Epoxy
Materials Science and Engineering A, v. 281, (1-2), 2000, APR 15, p. 156-161
Lam, David C C; Chong, Arthur C.M. Article
Measurement of Interfacial Fracture Toughness for Microelectronic Packages
Journal of Electronics Manufacturing, v. 10, (2), 2000, JUN, p. 139-145
Yeung, Dickson T.S.; Yuen, Matthew Ming Fai; Lam, David C C; Chan, Philip Ching Ho Article
Parametric Analysis of Steam Driven Delamination in Electronics Packages
IEEE Transactions on Electronics Packaging Manufacturing, v. 23, (3), 2000, JUL, p. 208-213
Lam, David C C; Chong, Jones Ioktong; Tong, Pin Article
Specimen design for mixed mode interfacial fracture properties measurement in electronic packages
Journal of electronic packaging, v. 122, (1), 2000, MAR, p. 67-72
Yeung, Dickson T.S.; Lam, David Chuen Chun; Yuen, Matthew Ming Fai Article
Synthesis and characterization of low temperature degradable polymers
Journal of materials science letters, v. 19, (23), 2000, DEC, p. 2109-2111
Wang, Dayang; Lam, David Chuen Chun Article
Energy Based Failure Criterion for Interfacial Delamination
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904155, p. 201-205
Chung, Paular Wai Kwan; Chan, S.K.; Yuen, Matthew Ming Fai; Lam, David Chuen Chun; Teng, Annette Conference paper
Influence of chemistry and applied stress on reliability of polymer and substrate interfaces
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, p. 581-585
Leung, Stanley Y.Y.; Luo, Shijian; Lam, David Chuen Chun; Wong, Chingping Conference paper
Measurement of Water Evaporation Rate for Popcorning
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 2000, p. 131-134
Chong, Jones Ioktong; Lam, David C C; Tong, Pin Conference paper
Measurement of Water Evaporation Rate from Epoxy
International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904196, p. 440-443
Chong, Jones Ioktong; Lam, David Chuen Chun; Tong, Pin Conference paper

1999 7

Chemical kinetic model of interfacial degradation of adhesive joints
IEEE transactions on components and packaging technologies, v. 22, (2), 1999, JUN, p. 215-220
Lam, David Chuen Chun; Yang, Fan; Tong, Pin Article
Densification model for powder compacts
Journal of materials science, v. 34, (23), 1999, DEC, p. 5879-5884
Lam, David Chuen Chun Article
Effect of Solder Reflow Temperature Profile on Popcorning
American Society of Mechanical Engineers, EEP, v. 26, 1999, p. 1053-1058
Chong, Jones Ioktong; Lam, David C C; Tong, Pin Article
Indentation Model and Strain Gradient Plasticity Law for Glassy Polymers
Journal of Materials Research, v. 14, (9), 1999, SEP, p. 3784-3788
Lam, David C C; Chong, Arthur C.M. Article
Strain Gradient Plasticity Effect in Indentation Hardness of Polymers
Journal of Materials Research, v. 14, (10), 1999, OCT, p. 4103-4110
Chong, Arthur C.M.; Lam, David C C Article
Effect of Solder Reflow Temperature Profile on Popcorning
American Society of Mechanical Engineers, EEP, v. 26, 1999, p. 1/-
Chong, Jones Ioktong; Lam, David C C; Tong, Pin Conference paper
Global Collaborative Electronic Packaging Education
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, p. 907-911
Tong, Pin; Lam, David C C; Yuen, Matthew Ming Fai; Kim, Jang Kyo; Lee, Ricky S W; Lee, Steve Han Keung; Chan, Philip Ching Ho Conference paper

1998 3

Packing model for bimodal particle packing with aligned fibers
Journal of materials processing technology, v. 79, (1-3), 1998, JUL 1, p. 170-176
Lam, David Chuen Chun Article
Chemical kinetic model of interfacial degradation of adhesive joints
3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, p. 44-48
Lam, DCC; Yang, F.; Tong, P. Conference paper
Influence of Defect Size on Popcorning
International Conference on Solid-State and Integrated Circuit Technology Proceedings, 1998, p. 550-553
Lam, David C C; Chong, Jones Ioktong; Yuen, Matthew Ming Fai; Tong, Pin Conference paper

1997 2

Characteristic grain size: Part II measuring principles
Journal of Central South University of Technology (English Edition), v. 4, (2), 1997, p. 118-119
Shunhua, Cao; Lam, David Chuen Chun Article
Structural reliability of direct-chip-attaches bonded with anisotropic conductive film
Materials Research Society Symposium - Proceedings, v. 445, 1997, p. 297-306
Lam, David Chuen Chun; Shen, Chihkang; Xie, J.F.; Karim, Zaheed S.; Tong, Pin Conference paper

1996 1

Microstructural and chemical stability of Y-ZrO₂ reinforced β″-alumina in molten sodium sulfide and sulfur
Journal of Materials Science, v. 31, (18), 1996, p. 4939-4944
Lam, David Chuen Chun; Kusakari, K. Article

1995 1

Microstructure and Mechanical Properties Relations for Green Bodies Compacted from Spray Dried Granules
Journal of materials science, v. 30, (21), 1995, NOV 1, p. 5495-5501
Lam, David Chuen Chun; Kusakari, K. Article

1994 4

Effects of Binder and Compaction Pressure on Strength and Fracture Origins in Bodies Pressed From Granules
Journal of the Ceramic Society of Japan, v. 102, (11), November 1994, p. 1010-1015
Lam, David Chuen Chun Article
Mechanical Properties of Partially Dense Alumina Produced From Powder Compacts
Journal of the American Ceramic Society, v. 77, (8), August 1994, p. 2113-2117
Lam, David Chuen Chun; Lange, Fred F.; Evans, Anthony G. Article
Microstructural Observations on Constrained Densification of Alumina Powder Containing a Periodic Array of Sapphire Fibers
Journal of the American Ceramic Society, v. 77, (7), 1994, p. 1976-1978
Lam, David Chuen Chun; Lange, Fred F. Article
Packing of Particles (Part 3), Effect of Particle Size Distribution Shape On Composite Packing Density in Bimodal Mixtures
Journal of the Ceramic Society of Japan, v. 102, (2), February 1994, p. 133-138
Lam, David Chuen Chun; Nakagawa, Mitsuo Article

1993 4

Packing of Particles (Part 1), Packing Behavior of Monosized Spheres In Cylinders
Journal of the Ceramic Society of Japan, v. 101, (10), October 1993, p. 1187-1198
Lam, David Chuen Chun; Nakagawa, Mitsuo Article
Packing of Particles (Part 2), Effect of Extra Pore Volume on Packing Density of Mixtures of Monosized Spheres
Journal of the Ceramic Society of Japan, v. 101, (10), October 1993, p. 1234-1238
Lam, David Chuen Chun; Nakagawa, Mitsuo Article
Packing of particles (Part 2). Effect of extra pore volume on packing density of mixtures of monosized spheres
Journal of the Ceramic Society of Japan. International ed., Volume 101, Issue 11, November 1993, Pages 1204-1208
Lam, David Chuen Chun; Nakagawa, Mitsuo Article
Packing of particles (part I) -packing behavior of monosized spheres in cylinders
Journal of the Ceramic Society of Japan. International ed.\gVolume 101, Issue 10, October 1993, Pages 1155-1156
Lam, David Chuen Chun; Nakagawa, Mitsuo Article

1991 1

Powder Processing of Ceramic matrix Composites
Materials Science and Engineering A, v. 144, (1-2), 1 October 1991, Pages 143-152
Lange, Friederike F.; Lam, David Chuen Chun; Sudre, Olivier H.; Flinn, Brian D.; Folsom, Craig A.; Velamakanni, Bhaskar V.; Zok, Frank W.; Evans, Anthony G. Article

1989 2

Densification Behavior of Al2O3 Powder Containing ZrO2 Inclusions
Processing Science of Advanced Ceramics Symposium, Mater. Res. Soc., 1989, Pittsburgh, PA, USA, p. 363-368
Sudre, Olivier; Lam, David Chuen Chun; Lange, Fred F. Conference paper
Powder Processing and Densification of Ceramic Composites
Processing Science of Advanced Ceramics Symposium, Mater. Res. Soc., 1989, Pittsburgh, PA, USA, p. 309-318
Lange, Fred F.; Lam, David C C; Sudre, Olivier Conference paper


No Publications






Teaching Assignment

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2021-22 Winter 0 2021-22 Fall 3 2020-21 Summer 1 2020-21 Spring 5 2020-21 Winter 0 2020-21 Fall 4

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IBTM5460 Materials in Built Environment
MECH3710 Manufacturing Processes and Systems
UROP2100E Undergraduate Research Opportunities Series 2


UROP1000 Undergraduate Research Opportunities


AESF6910P Advanced Materials Analytics
MECH4900 Final Year Design Project
MECH4980 Final Year Aerospace Design Project
MECH5980 Processes in Manufacturing Systems
MESF6910L Advanced Materials Analytics


IBTM5460 Materials in Built Environment
MECH3710 Manufacturing Processes and Systems
MECH4900 Final Year Design Project
MECH4980 Final Year Aerospace Design Project


No Teaching Assignments


No Teaching Assignments






Research Postgraduate (RPG) Supervision From January 2019 to December 2022 (As of 30 January 2022)

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All Supervisions Current RPGs Graduated RPGs

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Current RPGs

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Doctor of Philosophy KWOK, Kin Nam
Mechanical Engineering( 2019 - )

NG, Yung Yue Adrian
Mechanical Engineering( 2019 - )

ZHANG, Zhe
Mechanical Engineering( 2019 - )

LU, Shuhao
Mechanical Engineering( 2014 - )

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Master of Philosophy LEUNG, Chun Hin
Mechanical Engineering( 2021 - )

CHEUK, Ka Nok
Mechanical Engineering( 2019 - )

LAU, Chi Yin
Mechanical Engineering( 2019 - )

LO, Chak Ho
Mechanical Engineering( 2019 - )

LEE, Ka Yue
Mechanical Engineering( 2017 - )

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Graduated RPGs

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Doctor of Philosophy PATHIRAGE DON, Isuru Kaweendra Karunaratne
Mechanical Engineering( Completed in 2021 )

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Master of Philosophy CHAN, Mei Shan
Mechanical Engineering( Completed in 2019 )

LEE, Ching Hymn Christopher
Mechanical Engineering( Completed in 2019 )









ProjectsFrom January 2020 to December 2022

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All Projects 3

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No Projects.
Development of Wireless Contact Lens Sensor based Intraocular Pressure (IOP) Monitoring System for Clinical Diagnosis


無線隱形眼鏡式臨床眼壓監測系統的開發 Leading


Innovation and Technology Fund


Project Team (HKUST)
LAM David Chuen Chun (Lead)


2019 -




Advanced Stroke Treatment Technology Program Leading


Private Donor (Non-Hong Kong)


Project Team (HKUST)
LAM David Chuen Chun (Lead)


2017 -




Research and development of statistical process-reliability relations on multilayerd flexible substrates Leading


Compass Technology Co. Ltd.


Project Team (HKUST)
LAM David Chuen Chun (Lead)


2006 -