姓 名
刘生发
性 别
男
民 族
汉族
出生年月
1963.08.10

职 称
教授
职 务
系主任
联系电话
**

单位名称
武汉理工大学材料学院金属材料系
Email
liusfa@163.com

实验室网址


研究方向
1. 电子封装材料及成型工艺
2. 高性能轻合金材料及成型工艺
3. 高强韧金属结构材料

教育背景
2001/09-2004/12 武汉理工大学车辆工程专业 工学博士
1986/09-1989/07 武汉汽车工业大学金属材料专业 工学硕士
1982/09-1986/07 武汉汽车工业大学金属材料专业 工学学士

工作经历
2008/10 教授
2002/09 副教授
1997/05 讲师

项目情况
1. 超细晶Al-Mg合金中溶质Mg原子调控韧性和强度的机制，国家自然科学基金联合基金项目，2019-2021(No. U**)
2. 基于材料微结构和演化规律的镍基单晶冷却叶片服役强度寿命评估模型与技术研究，国家自然科学基金重大国际合作研究项目，2013-2017 (No. **)
3. 锡铋银焊料薄带双辊快速凝固制备工艺参数及其组织性能调控，汕尾市栢林电子封装材料有限公司，2017-2018
4. 脆性焊料薄带制备关键技术研究，汕尾市栢林电子封装材料有限公司，2016 -2017

代表性
学术成果
[1] Shengfa Liu, Dongxiao Zhang, Jieran Xiong, et al. Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology. Journal of Alloys and Compounds, 2019, 781: 873-882.
[2] Shengfa Liu Tianjie Song ·Wenyong Xiong. et al. Effects of Ag on the microstructure and shear strength of rapidly solidifed Sn-58Bi solder Journal of Materials Science: Materials in Electronics, 23 February 2019, https://doi.org/10.1007/s10854-019-00981-2
[2] Shengfa Liu, WenYong Xiong, Jieran Xiong, et al. Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging, Journal of Electronic Materials, 2018, 47(9): 5588-5594.
[3] Shengfa Liu, Zhebing Hu, Jieran Xiong,, et al. Effects of forming processes on the microstructure and solderability of Sn-3.5Ag eutectic solder ribbons as well as the mechanical properties of Solder Joints. Journal of Electronic Materials, 2017, 46(11): 6373-6380.
[4] Lanxin Zhu, ShengFa Liu,* WenYong Xiong, et al. Preparation, Microstructure and Properties of Environmentally Friendly Sn-58Bi Eutectic Solder Ribbon for Electronic Package. Journal of Residuals Science & Technology, 2017, 14(1): 281-286.
[5] Shengfa Liu，Yang Chen，Hui Han，Grain refinement of AZ91D magnesium alloy by a new Mg–50%Al₄C₃ master alloy，Journal of Alloys and Compounds，2015，624: 266-269.
[6] Han Hui, Liu Shengfa, Wang Shuoli, et al. Fabrication of a new Mg-50%Al₄C₃-6%Ce master alloy and its refinement mechanism on AZ91D alloy. Rare Metal Materials and Engineering, 2013, 42(1): 28-31.
[7] Shengfa Liu, Yuan Zhang, Hui Han. Role of manganese on the grain refining efficiency of AZ91D magnesium alloy refined by Al₄C₃.Journal of Alloys and Compounds, 2010, 491: 325-329.
[8] Shengfa Liu, Yuan Zhang, Hui Han. Effect of Mg-TiB2 master alloy on the grain refinement of AZ91D magnesium alloy. Journal of Alloys and Compounds, 2009, 487: 202-205.
[9] Liu Shengfa, Liu Linyan, Kang Liugen. Refinement Role of Electromagnetic Stirring and Strontium in AZ91 Magnesium Alloy [J]. Journal of Alloys and Compounds, 2008, 450(1-2): 546-550.
[10] S.F. Liu, B. Li, X.H. Wang, W. Su, H. Han. Refinement effect of cerium, calcium and strontium in AZ91 magnesium alloy [J]. Journal of materials processing technology, 2009, 209: 3999-4004.



Prof. Liu Shengfa
Address: 122 Luoshi Road,Wuhan,Hubei, P.R.China.
Email： liusfa@163.com Tel: +86-**
EDUCATION
2001/09-2004/12

Major in vehicle engineering, Wuhan university of technology
Doctor of engineering.

1986/09-1989/07

Major in metal materials, Wuhan university of automobile technology
Master of engineering

1982/09-1986/07
Major in metal materials, Wuhan university of automobile technology
Bachelor of engineering

WORK EXPERIENCE
2008/10
Professor


2002/09
Associate professor


1997/05
Lecturer


RESEARCH PROJECT
1. Mechanism of controlling the toughness and strength of solute Mg atom in ultrafine al-mg alloy, national natural science foundation of China joint fund project, 2019-2021(No.U**)
2. Research on service strength and life evaluation model and technology of nickel-based single crystal cooling blade based on material microstructure and evolution law, major international cooperative research project of national natural science foundation of China, 2013-2017 (No.**)
3. Process parameters and microstructure performance control of rapid solidification of tin, bismuth and silver solder strip with double rollers, Shanwei Bolin Electronic Packaging Materials co., LTD., 2017-2018
4. Key technology research on the preparation of brittle solder thin strip, Shanwei Bolin Electronic Packaging Materials co., LTD., 2016-2017

SELECTED PUBLICATION
1. Liu Shengfa, Wu Xingwen. The experimental textbook of material structure control and performance test, wuhan university of technology press, 2011.7
2. Wu Xingwen, Liu Shengfa. The experimental textbook of metallographic analysis technology, wuhan university of technology press, 2010.12
PATENT
1. Mn-Cu alloy austempering nodular iron automobile rear axle spiral bevel gear and its preparation method, authorized date: 2009.7.22. Authorized patent number: ZL7.8
2. Preparation method of Mg-Al series alloy composite grain refiner, authorization date: 2009.7.1. Authorized patent number: ZL1.7
3. Preparation method of magnesium and magnesium alloy composite grain refiner, authorized date: July 22, 2009. Authorized patent number: ZL0.2
4. A Mg-Al-C-Ce refiner for magnesium and magnesium alloys and its preparation method, authorized date: June 29, 2011. Authorized patent number: ZL4.1


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