王同庆
技术职务:助理研究员
办公电话: **
通讯地址:清华大学李兆基科技大楼A634
电子邮件:wtq@tsinghua.edu.cn





教育背景
工作履历
科研工作
论文与专利
奖励与荣誉

2006/09-2012/01,清华大学，博士
2002/09-2006/06,吉林大学，学士


2014/01-至今, 清华大学机械工程系，助理研究员
2012/01-2013/12,清华大学精密仪器系，博士后


纳米摩擦学，化学机械平坦化


1. Cheng J, Pan JS, Wang TQ, Lu XC. Micro-galvanic corrosion of Cu-Ru couple in Potassium Periodate (KIO4) solution. Corrosion science, 2018, 137:184-193.
2. Rao C, Wang TQ, Peng YR, Cheng J, Sung Kyu Lim, Lu XC. Residual stress and pop-out simulation for TSVs and contacts in via-middle process. IEEE Transactions on Semiconductor Manufacturing, 2017, 37(3):333-339
3. Wang TQ, Zhao DW, He YY, Lu XC. Effect of slurry injection position on material removal in chemical mechanical planarization. International Journal of Advanced Manufacturing Technology, 2013, 67(9-12).
4. Wang TQ, Lu XC, Zhao DW, He YY, Luo JB. Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer. Microelectronic Engineering, 2013, 112.
5. Wang TQ, Lu XC. Numerical and experimental investigation on multi-zone chemical mechanical planarization. Microelectronic Engineering, 2011, 88(11).


2018年获天津市“中青年科技创新领军人才”