yunhui@tju.edu.cn
未公开
教授
高温电力电子封装用新型绿色芯片粘接材料的电迁移行为及理论研究

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LGA封装器件力学与热学仿真分析

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极端环境下高功率半导体激光器可靠性与失效机理研究

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原位面内双轴疲劳试验系统的研制与应用

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大功率半导体激光器芯片连接热循环和电脉冲疲劳失效机理

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三维封装高密度大功率IGBT无铅化模块中关键性问题研究

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高性能电磁性元器件激光烧结一体化制造技术

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新型热界面材料封装大功率LED的恶劣环境可靠性研究

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微型原位拉扭疲劳试验机的研制与冠脉支架疲劳失效机理研究

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XXX

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车用电机驱动控制碳化硅电源模块的高密度封装原理研究

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第三代半导体高密度封装工艺与关键材料

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高温电力电子封装用新型绿色芯片粘接材料的电迁移行为及理论研究

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车用电机驱动控制碳化硅电源模块的高密度封装原理研究

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高功率半导体激光器贴片层界面失效机理研究

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新能源汽车用高集成小型化IGBT模块研发

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新能源车用电机驱动控制碳化硅功率模块的高密度封装技术

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电子封装可靠性

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基于烧结平面互联的新型高压碳化硅功率模块封装技术与失效机制研究

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纳米银低温烧结与应力分析技术

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低温烧结铜的芯片互连机制与可靠性

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XXXX机理研究

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SiC器件封装用低成本、高导热互连材料与可靠工艺

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电机控制器碳化硅功率模块的开发与测试

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大尺寸ASIC纳米银导热材料可靠性研究项目

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商用车高可靠性电力电子集成系统开发--车用多功能IGBT芯片及集成组件开发

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电动汽车用大功率IGBT模块的无铅化高温封装技术研究
一种功率电子器件双面粘接结构

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一种低温烧结的锡掺杂纳米银焊膏的制备方法

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电流烧结技术实现铜-铜粘接的方法及其装置

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一种功率电子器件双面粘接结构及制备方法

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一种贫氧低温烧结纳米银焊膏的装置及方法

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管道弯头多轴棘轮应变测试系统及方法

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直管多轴棘轮应变测试系统及方法

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一次性烧结多个不同厚度芯片的装置

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一种无压烧结连接大功率GTO模块的方法

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一种在线测量IGBT模块瞬态热阻的方法和装置

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无压低温烧结纳米银焊膏封装大功率IGBT器件的方法

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一种无压烧结连接大功率GTO模块的方法

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一种高频低磁损软磁复合材料的制备方法

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一种IGBT芯片与直接覆铜基板的快速烧结连接方法及装置

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纳米银焊膏粘接大面积芯片的加压辅助烧结模块及方法

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一种功率半导体模块三维封装的结构和方法

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一种提高纳米银浆与化学镀镍金基板连接强度的方法

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Methods and apparatus for connecting planar power electronics devices

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一种功率半导体模块三维封装的结构和方法

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一种基于快速烧结纳米银焊膏无压互连技术的1200V/50AIGBT功率模块

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一种纳米银焊膏低压烧结混合功率模块方法

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一种采用纳米银焊膏的烧结式IGBT模块及制备方法

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一种基于覆铜陶瓷基板均匀电流辅助烧结纳米银焊膏温度场的方法

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一种改善银电化学迁移的Ag-Si纳米焊膏的制备方法

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一种高温环境下耐银电迁移的Ag-SiO2纳米焊膏的制备方法

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一种基于纳米银焊膏双面互连碳化硅MOS器件的模块化封装方法

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采用低温烧结纳米银的双面互连硅基IGBT模块的方法

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一种纳米银焊膏连接裸铜DBC的功率模块制作方法

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一种高温环境下耐Ag迁移的Ag-Pd纳米焊膏的制备方法

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一种可控气氛的压力辅助烧结大面积纳米银焊膏 的装置及方法

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高功率密度COB封装白光LED模块及其封装方法

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三维缺陷重构原位试验装置

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一种软磁复合材料及其制备方法

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一种纳米银焊膏连接裸铜衬底或敷铜基板的烧结方法

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一种利用双脉冲技术测试IGBT动态开关特性的测 试方法及装置

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一种利用表面活性剂制备具有核壳结构的软磁复合材料

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电流烧结技术实现铜-铜粘接的方法及其装置

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铜-铝异种金属快速连接方法

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一种功率半导体芯片正面铝层金属化方法

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实现多磁导率连续变化环形磁芯电感的装置及方法

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一种用于银焊膏连接的表面贴装装置及方法

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一种贫氧低温烧结纳米银焊膏的装置

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Hetero-Magnetic Coupled Inductor (HMCI) for High Frequency Interleaved Multiphase DC/DC Converters

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Efficient layout design automation for multi-chip SiC modules targeting small footprint and low parasitic

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Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints

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Additive Manufacturing of Spiral Windings for a Pot-Core Constant-Flux Inductor

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Rapid sintering of nano-Ag paste at low current to bond large area (>100？mm2) power chips for electronics packaging

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A (Permalloy plus NiZn Ferrite) Moldable Magnetic Composite for Heterogeneous Integration of Power Electronics

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Low-temperature Silver Sintering for Bonding 3D Power Modules

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Doping low-cost SiOx (1.2 < x < 1.6) nanoparticles to inhibit electrochemical migration of sintered silver at high temperatu

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Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications

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Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers

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Pressureless Silver Sintering on Nickel for Power Module Packaging

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Bonding performance of sintered nanosilver joints on bare copper substrates with different grain structures

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An explanation of sintered silver bonding formation on bare copper substrate in air

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一种基于多阶段遗传算法的功率模块自动化布局方法

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Improvement of Low Temperature Large-Area Sintering Silver Process for Aerospace Power Module Substrate Bonding

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Processing and Characterization of Die-attach on Uncoated Copper by Pressure-less Silver Sintering and Low-pressure-assisted

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A Method for Improving the Thermal Shock Fatigue Failure Resistance of IGBT Modules

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Reliability Design for Planar Multi-chip SiC Modules Based on Electro-thermo-mechanical Simulation

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Modeling of Intergranular Mechanical Fatigue of a Sintered Nanosilver Die Attachment for Power Electronics

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Pressureless sintering multi-scale Ag paste by a commercial vacuum reflowing furnace for massive production of power modules

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Continuously Variable Multi-Permeability Inductor for Improving the Efficiency of High-Frequency DC-DC Converter

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Die-attach on nickel substrate by pressureless sintering a trimodal silver paste

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Design and Characterizations of a Planar Multichip Half-Bridge Power Module by Pressureless Sintering of Nanosilver Paste

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Die-attach on Copper by Pressureless Silver Sintering in Formic Acid

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Tailoring a Silver Paste for Additive Manufacturing of Co-Fired Ferrite Magnetic Components

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Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging

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Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste

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Effect of Oxygen Partial Pressure on Silver Migration of Low-Temperature Sintered Nanosilver Die-Attach Material

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A novel multiscale silver paste for die bonding on bare copper by low-temperature pressure-free sintering in air

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Effect of Sintering Temperature on Magnetic Core-Loss Properties of a NiCuZn Ferrite for High-Frequency Power Converters

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Bending ratcheting behavior of pressurized straight Z2CND18.12N stainless steel pipe

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Creep properties of low-temperature sintered nano-silver lap shear joints

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How to determine surface roughness of copper substrate for robust pressureless sintered silver in air

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Additive Manufacturing of Toroid Inductor for Power Electronics Applications

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Pressureless Silver Sintering on Nickel for Power Module Packaging

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Silver Paste Pressureless Sintering on Bare Copper Substrates for Large Area Chip Bonding in High Power Electronic Packaging

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High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force

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Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver

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Effect of As-Pinted Bondline Thickness on Assembling High Power Laser Diodes by Sintering of Nanosilver Paste

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Double-sided joining IGBT devices by pressureless sintering of nanosilver paste

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Application of Nano Silver Sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes

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A Fast Universal Power Module Layout Method

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Packaging of high-temperature planar power modules interconnected by low-temperature sintering of nanosilver paste

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Roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding

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Mechanical property evaluation of nano-silver paste sintered joint using lap-shear test

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Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250 degrees C and 400 degrees C in Dry Air

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Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates

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Hygrothermal Effects on the Tensile Properties of Anisotropic Conductive Films

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Low-Pre ssure-Assisted Large-Area (> 800 mm(2)) Sintered-Silver Bonding for High-Power Electronic Packaging

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Electric-current-assisted sintering of nanosilver paste for copper bonding

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In situ X-ray observation and simulation of ratcheting-fatigue interactions in solder joints

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Magnetic properties of FeNi3/NiZn-ferrite nanocomposite prepared by hydrothermal method for application in high frequency

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Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate

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A Phase-Leg IGBT Module Using DBC Substrate Without Ag Finish by Pressureless Sintering of nanosilver Paste

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Reliability of pressureless sintered nanosilver for attaching IGBT devices

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采用纳米银焊膏烧结互连技术的中高压IGBT模块及其性能表征

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电力电子中高频软磁材料的研究进展

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宽禁带电力电子器件关键封装材料研究进展

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大功率IGBT模块瞬态热阻的测试方法与装置

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烧结工艺对纳米银焊膏微观结构的影响

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纳米银焊膏封装大功率COB LED模块的性能研究

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纳米银焊膏烧结大功率LED模块的高 温可靠性研究

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A Multichip Phase-Leg IGBT Module Using Nanosilver Paste by Pressureless Sintering in Formic Acid Atmosphere

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Effects of sintering temperature on properties of toroid cores using NiZnCu ferrites for power applications at >1？MHz

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Pressureless sintering of nanosilver paste as die attachment on substrates with ENIG finish for semiconductor applications

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Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling

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Pressureless sintering multi-scale Ag paste by a commercial vacuum reflowing furnace for massive production of power modules

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Characterizations of a Proposed 3300-V press-pack IGBT module using nanosilver paste for high-voltage applications

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Electrochemical Migration of Sintered Nanosilver Under Chloride-Containing Thin Electrolyte Layer for Power Electronic Packa

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Evolution of curvature under thermal-cycling in sandwich assembly bonded by sintered nano-silver paste

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Mechanism of migration of sintered nanosilver at high temperatures in dry air for electronic packaging

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Thermo-mechanical reliability of double-sided IGBT assembly bonded by sintered nanosilver

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Characterization and reliability of sintered nanosilver joints by a rapid curren-assisted method for power electronic packaging

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Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nano-silver paste

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Low-temperature sintering of nanoscale silver paste for double-sided attaching 9*9 mm2 chip

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Effect of DC bias and spacing on migration of sintered nanosilver at high temperatures for power electronic packaging

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Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilver

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Transient thermal impedance measurements on low-temperature-sintered nanoscale silver joints

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Effect of joint sizes of low-temperature sintered nano-silver on thermal residual curvature of sandwiched assembly

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Pressure-assisted low-temperature sintering of nanosilver paste for 5*5 mm2 chip attachment

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Simplification of low-temperature sintering nanosilver for power electronics packaging

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Dependence of electrochemical migration of sintered nanosilver on chloride

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Applying viscoplastic constitutive models to predict ratcheting behavior of sintered nanosilver lap-shear join

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Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging

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An improved way to measure thermal impedance of insulated gate bipolar transistor (IGBT) module for power electronic packagin

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Measurements of electrical resistance and temperature distribution during current assisted sintering of nanosilver die-attach

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纳米银焊膏双面连接IGBT封装形式的强度及可靠性

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Migration of sintered nanosilver on alumina and aluminum nitride substrates at high temperatures in dry air for electronic pa

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Characterizations of nanosilver joints by rapid sintering at low temperature for power electronic packaging

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Multiaxial ratcheting-fatigue interaction on acrylonitrile-butadiene-styrene terpolymer (ABS)

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Pressureless sintering of nanosilver paste at low temperature to join large area (≥100 mm2) power chips for electronic packag

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Reliability comparison between SAC305 joint and sintered nanosilver at high temperatures for power electronic packaging

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Dependence of electrochemical migration of sintered nanosilver on chloride

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Electrical method to measure the transient thermal impedance of insulated gate bipolar transistor module

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Experimental study on multi-step creep properties of rat skins

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Electrochemical migration of sintered nanosilver under chloride-containing thin electrolyte layer for power electronic packag

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Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions

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Parametric study on pressureless sintering of nanosilver paste to bond large-area (>100 mm2) power chips at low temperatures

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Bonding 1200 V, 150 A IGBT chips (13.5 mm × 13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power

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Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures

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A Multichip Phase-Leg IGBT Module Bonded by Pressureless Sintering of Nanosilver Paste

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Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling

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Novel interface material used in high power electronic die-attaching on bare Cu substrates

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Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

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Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Pa

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Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au di

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Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

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Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips

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Three-Dimensional Visualization of the Crack-Growth Behavior of Nano-Silver Joints During Shear Creep

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Effects of Die-Attach Material and Ambient Temperature on Properties of High-Power COB Blue LED Module

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Rapid sintering nanosilver joint by pulse current for power electronics packaging