wangfujun@tju.edu.cn
未公开
特聘研究员
主动轮齿圈激光涂覆基础科学与关键技术研究

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柔性器件主动可控超声微转印关键基础问题研究

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宝洁日用品生产线运动和力学分析

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激光加工与检测装备研究

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音圈电机直驱的柔性解耦定位系统动力学特性与控制方法

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射频识别芯片热超声键合质量监测相关基础问题研究

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面向激光微细加工的高效精密定位系统设计与控制

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高速精密定位系统动态设计、分析与控制

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微纳器件喷印制造关键基础问题研究

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微器件超声键合质量监测关键技术基础研究

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超声辅助纳米加工系统及其关键技术研究

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润湿、粘附、反射可控功能表面设计与制造

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复杂微细结构激光加工关键技术研究

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三维可控探针纳米加工系统及其关键技术

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基于柔性聚合物薄膜的微结构/器件超声压焊技术研究

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高速精密IC芯片引线键合机设计理论与样机建造

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牙科陶瓷材料旋转超声加工关键技术研究

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基于临床舒适性和力学相容性的超声辅助口腔高速调磨机理及其关键技术

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KDP晶体超精密切削中的跨尺度材料去除机理研究

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重型机床可靠性评价与试验方法研究

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数控机床误差测量、分析与补偿技术

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基于探针刻划技术的三维可控纳米加工方法

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面向纳米压印的精密定位系统设计方法研究

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超声辅助纳米加工系统及其关键技术
压电驱动单臂式高速引线线夹

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压电驱动式高精度引线线夹

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用于集成电路热超声键合设备的高频压电超声换能器

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双弹簧预紧柔性解耦直线电机定位平台

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复频夹心结构超声换能器
压电驱动单臂式高速引线线夹

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压电驱动式高精度引线线夹

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用于集成电路热超声键合设备的高频压电超声换能器

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双弹簧预紧柔性解耦直线电机定位平台

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复频夹心结构超声换能器
Design and control of a novel asymmetrical piezoelectric actuated microgripper for micromanipulation

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Grasping force hysteresis compensation of a piezoelectric-actuated wire clamp with a modified inverse Prandtl-Ishlinskii mode

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Development of a high speed and precision wire clamp with both position and force regulations

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Design and control of a compliant microgripper with a large amplification ratio for high-speed micro manipulation

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Modeling and analyses of helical milling process

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音圈电机驱动的柔性定位平台设计与控制

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Design of high frequency ultrasonic transducers with flexure decoupling flanges for thermosonic bonding

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A flexure-based kinematically decoupled micropositioning stage with a centimeter range dedicated to micro/nano manufacturing

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A general torsional stiffness estimating approach for geared transmission employed in rotary table of machine tools

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Development of a piezo-driven 3-DOF stage with T-shape flexible hinge mechanism

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Design of a piezoelectric-actuated microgripper with a three-stage flexure-based amplification

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Dynamic modeling and control of a novel XY positioning stage for semiconductor packaging

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Note: Decoupling design for high frequency piezoelectric ultrasonic transducers with their clamping connections

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A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

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A new automatic resonance frequency tracking method for piezoelectric ultrasonic transducers used in thermosonic bonding

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A novel quality evaluation method of resistance spot welding based on the electrode displacement signal and Chernoff faces te

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An improved adaptive genetic algorithm for image segmentation and vision alignment used in microelectronic bonding

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Quality assessment for resistance spot welding based on binary image of electrode displacement signal and probabilistic neura

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面向微电子超声键合的精密气浮定位平台特性分析

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Electrical matching of low power piezoelectric ultrasonic transducers for microelectronic bonding

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Predicting film parameter and friction coefficient for helical gears considering surface roughness and load variation

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Robust and precision control for a directly driven XY table

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Design and control of a directly-driven bond head for thermosonic bonding

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Design and control of a high-acceleration precision positioning system with a novel flexible decoupling mechanism

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Development of novel ultrasonic transducers for microelectronics packaging

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The crack control during laser cladding by adding the stainless steel net in the coating

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Online study of cracks during laser cladding process based on acoustic emission technique and finite element analysis

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Design and modeling of a 2-DOF decoupled rotation platform for micro-manipulation

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A novel electromagnetic force method for micro/nano newton force measurement

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Design of a novel asymmetrical piezoelectric actuated microgripper for micromanipulation

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Design and characteristics of a compliant microgripper dedicated to microhandling

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Dynamic analysis of an XY positioning table