上海交通大学 高速电子系统设计与电磁兼容研究教育部重点实验室， 上海 200240
出版日期:2018-10-18发布日期:2018-10-18通讯作者:毛军发，男，教授，博士生导师，电话（Tel.）: 021-34204309; E-mail:jfmao@sjtu.edu.cn.李晓春，女，教授，博士生导师，电话（Tel.）: 021-34205350; E-mail:lixc@sjtu.edu.cn.作者简介:唐旻（1980-），男，上海市人，副教授，主要研究方向为高速集成电路与系统级封装设计. E-MAIL: tm222@sjtu.edu.cn基金资助:国家自然科学基金资助项目(61674105，61522113，61771311)Modeling and Characterization of Interconnects with Carbon Nanotubes for Integrated Circuits
TANG Min，WU Linsheng, LI Xiaochun,MAO JunfaKey Laboratory of Ministry of Education of Design and Electromagnetic Compatibility of High Speed Electronic Systems, Shanghai Jiao Tong University, Shanghai 200240, China
Online:2018-10-18Published:2018-10-18摘要/Abstract
摘要： 近年来，基于碳基材料的纳米尺度互连方案得到了人们的广泛关注，为下一代集成电路的互连技术提供了一种全新的解决途径.基于国内外在碳纳米互连建模和特性研究方面的进展，并结合本课题组取得的相关成果，对集成电路碳纳米管互连的等效电路建模、时延特性以及热特性进行了系统的分析，并与传统铜互连进行了全面比较.最后对具有实用前景的碳纳米异质互连技术进行了简要介绍和展望.
关键词: 碳纳米管, 石墨烯纳米带, 集成电路, 互连线, 过孔结构
Abstract: In recent years, the nano-scale interconnection scheme based on carbon-based materials has attracted widespread attention and provided a new solution for the interconnect technology of next-generation integrated circuits. Based on the progress made by domestic and foreign researchers in the modeling and characterization of carbon-based interconnections, combined with the related results achieved by our group, the equivalent circuit modeling, as well as the time-delay and thermal characteristics of carbon nanotube (CNT) interconnects in integrated circuit are studied. A systematic comparison is made between the CNT interconnects and traditional copper ones. Finally, a brief introduction of carbon-based heterogeneous interconnect technology and some prospects are given.
Key words: carbon nanotube (CNT), graphene nanoribbon, integrated circuit, interconnect, via structure
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