导师类别 博导
性 别 男
出生年月 1971年10月
联系电话
通讯地址
Email jfan@mst.edu

个人简介
范峻，美国密苏里科技大学(原密苏里大学罗拉分校)电气与计算机工程系(Electrical and Computer Engineering)终身教授，密苏里科技大学电磁兼容(EMC)实验室主任，美国国家科学基金委（NSF）产学联合（Industry/University Cooperative Research Center）电磁兼容研究中心主任，国际电气与电子工程师协会会士(IEEE Fellow)。分别于1994年和1997年获清华大学电子工程学士及硕士学位，于2000年获密苏里大学罗拉分校电气工程博士学位。2000年至2007年任NCR公司高级咨询工程师，2007年加入密苏里科技大学电气与计算机工程系，因在高速电路设计，功率传输网络，及射频干扰方向的出色研究，于2012年评为密苏里科技大学终身教授，2013年选为密苏里科技大学电磁兼容实验室主任，同时担任美国国家科学基金委产学联合电磁兼容研究中心主任。该研究中心在NSF所有75个各学科领域的类似研究中心中排名第四，在电磁兼容的科研和教育领域是世界公认的排名第一的领军机构。研究方向专注于电磁兼容领域包括信号和电源完整性的硬件和基础科研，涉及集成电路、封装、PCB和系统等不同层级，包括专有设计工具和新型实验技术的开发。密苏里科技大学电磁兼容实验室教职工总数约55人，包括6位全职教授，3位客座教授，6位访问科研教授，40位的博士和硕士人员，仪器和设施超过2千万美元，年均科研经费约200万美元。实验室与业界领先的企业，包括英特尔、IBM、思科、苹果、索尼、三星、华为等有长期深入的合作。
范教授在电磁兼容、高速电路设计、功率传输网络等领域是世界著名的专家，他目前担任IEEE电磁兼容学会董事会董事，IEEE Transactions on Electromagnetic Compatibility学报副主编，IEEE EMC杂志副主编，并担任过IEEE电磁兼容会议论文评审主席，IEEE 信号与电源完整性国际会议会议主席，IEEE电磁兼容学会的技术委员会主席、新兴无线技术电磁兼容SC-4 专门委员会创始主席等职位。同时，范教授为IEEE Electromagnetic Compatibility、Microwave Theory and Techniques、Power Electronics、Advanced Packaging等多个顶尖学术杂志担任评审。因其对印刷电路设计中功率传输网络的开创性研究，2009年获IEEE电磁兼容学会技术成就奖，并被选为2016年度IEEE会士，此外，范教授获IEEE国际会议最佳论文等超过30个学术奖项及荣誉以及14项美国专利，在国际顶级学术刊物或会议中发表过超过300篇论文。他指导的研究生也多次在国际会议中获得最佳学生论文等荣誉。
范峻教授开创了高速高密度电子电路和计算机平台（例如智能手机，便携式电脑）中射频干扰这一全新的学科方向，前瞻性的研究帮助智能手机和高性能电脑网络设备解决了射频接收机在复杂系统中受干扰的问题，创立了理论基础和解决方法，培养了一批这个方向的专门人才。同时，范教授积极推动这一学术方向的发展，在IEEE电磁兼容学会创立了新兴无线技术电磁兼容SC-4 特别委员会（现为TC-12技术委员会）并任创始主席。
在集成电路方面，范教授专注于复杂集成高速电路的高性能设计，新型的分装结构研究，集成电路辐射和抗干扰能力的评估、建模及优化设计。范教授在集成电路的电磁兼容，及保障高性能设计的信号和电源完整性方面创建了一套完整的分析和实验方法及仿真模型，可以精确并快速地进行前期设计优化，布局布线评估，及后期的设计验证和查错整改。
另外，范教授根本性地解决了多层复杂电路板电特性的仿真问题，包括对大数量过孔阵列，各种非连续性结构及寄生效应，高密度传输线结构等，直接基于系统结构和频率进行分析，可以为实现设计需求（降低电磁辐射，提高抗干扰能力，实现信号和电源完整性）提供清晰的优化方向，并且在计算速度和稳定性上优于其他商业化的设计工具。
同时，范教授在无线电能传输技术上进行了开拓性的研究，包括无线充电系统的辐射与安全、新型线圈的设计、匹配网络及系统的优化方法、集成电路和模块的开发等。基于范教授在这方面科研成果的产业化取得了可喜的成果，易冲无线作为产业化的实体在短短一年的时间内成为国内无线充电产业的佼佼者，是国际上少数几家能够提供手机无线充电集成电路和方案的公司，多次在中央电视台新闻联播和其它节目中报导。范教授还创造性地提出了同轴布拉格电栅的概念，使用同轴电缆来实现光学中的布拉格传感器，解决了大应力情况下结构变形的测量难题。范教授在美国科学基金委的资助下主导了这项开创性的研究，为基础设施结构健康监测，特别是在重大灾害情况下的测量提供了可能性。

工作经历
Employment Activities:
09/2016 – present Professor, Department of Electrical and Computer Engineering, Missouri
University of Science and Technology, Rolla, MO
09/2014 – present Senior Investigator, Material Research Center, Missouri University of Science
and Technology
11/15/2013 – present Director, NSF I/UCRC Center for Electromagnetic Compatibility (CEMC)
Director, Missouri S&T EMC Laboratory
09/2012 – 08/2016 Associate Professor, Department of Electrical and Computer Engineering,
Missouri University of Science and Technology, Rolla, MO
07/2007 – 08/2012 Assistant Professor, Department of Electrical and Computer Engineering,
Missouri University of Science and Technology, Rolla, MO
12/20/2000 – 06/2007 Consultant Engineer, NCR Corporation, San Diego, CA (6.5 years of work
experience prior to Missouri S&T)
Summer 1999 Intern, MPP Engineering, NCR Corporation, San Diego, CA

教育经历
Education:
08/1997 - 12/2000 Ph.D., December 2000, Department of Electrical and Computer Engineering,
Electromagnetic Compatibility Laboratory, University of Missouri-Rolla.
Area of study: Electromagnetic Compatibility.
09/1994 - 03/1997 Master of Engineering, March 1997, Department of Electronic Engineering,
Tsinghua University, Beijing, P. R. China.
Area of study: Electromagnetic Field and Microwave Technology.
09/1989 - 07/1994 Bachelor of Engineering, July 1994, Department of Electronic Engineering,
Tsinghua University, Beijing, P. R. China.
Area of study: Electronic Techniques and Information Systems.

获奖、荣誉称号
Honors & Awards:
EPEPS Best Poster Paper Award, 25th Conference on Electrical Performance of Electronic Packaging
and Systems (EPEPS 2016), San Diego, CA, October 23-26, 2016.
Symposium Best Paper Award, IEEE Symposium on Electromagnetic Compatibility, Ottawa, Canada,
July 2016.
IEEE Electromagnetic Compatibility Society Certificate of Appreciation, July 2016, citation “For
outstanding service on the Technical Advisory Committee for the 2016 IEEE
International Symposium on EMC”.
IEEE Fellow, Class 2016
Faculty Excellence Award, Missouri University of Science and Technology, 2015, 2012.
Symposium Best Paper Award, IEEE Symposium on Electromagnetic Compatibility and Signal Integrity,
Santa Clara, CA, March 2015.
IEEE Electromagnetic Compatibility Society Certificate of Appreciation, March 2015, citation “For
outstanding service to the IEEE EMC Society by serving as the Technical Program
Chair for the 2015 IEEE Symposium on Electromagnetic Compatibility and Signal
Integrity”.
Commendation on teaching excellence, Missouri University of Science and Technology, for the 2007-
2008, 2012-2013, 2013-2014, and 2015-2016 academic years
Faculty Research Award, Missouri University of Science and Technology, 2014, 2011.
IEEE Electromagnetic Compatibility Society Certificate of Appreciation, August 2014, citation “For
outstanding service to the IEEE EMC Society by serving as the Embedded SI/PI
Conference Chair for the 2014 IEEE International Symposium on EMC”.
IEEE Electromagnetic Compatibility Society Certificate of Appreciation, August 2014, citation “For
outstanding service to the IEEE EMC Society by serving as the Technical Paper Chair
for the 2012 IEEE International Symposium on EMC”.
IEEE Electromagnetic Compatibility Society Certificate of Appreciation, August 2012, citation “For
outstanding service to the IEEE EMC Society by serving as the Technical Paper Chair
for the 2012 IEEE International Symposium on EMC”.
IEEE-HKN, 2012.
Symposium Best Paper Award, IEEE International Symposium on Electromagnetic Compatibility, Long
Beach, CA, August 2011
Jun Fan
Position Reference number: ** April 20, 2017
CV-3
IEEE Electromagnetic Compatibility Society Certificate of Appreciation, August 2011, citation “For
outstanding service as the Technical Paper Chair for the 2011 IEEE International
Symposium on EMC”
Symposium Best Paper Award, IEEE International Symposium on Electromagnetic Compatibility, Fort
Lauderdale, FL, July 2010
Symposium Best Poster Paper Award, IEEE International Symposium on Electromagnetic Compatibility,
Fort Lauderdale, FL, July 2010
DesignCon Paper Award, DesignCon 2010, Santa Clara, CA, February 2010
IEEE Electromagnetic Compatibility Society Technical Achievement Award, August 2009, citation
“for significant contributions in the understanding of noise mechanisms and coupling
paths in printed circuit board power distribution networks”
IEEE Electromagnetic Compatibility Society Certificate of Appreciation, August 2009, citation “for
outstanding service to the IEEE EMC Society as a Distinguished Lecturer 2007-2008”
Respected Speakers Bureau, IEEE EMC Society, November 2009 - present
Distinguished Lecturer, IEEE EMC Society, 2007-2008
DesignCon Paper Award, DesignCon 2007, Santa Clara, CA, January 2007
IEEE Senior Member, 2006
Conference Best Paper Award, the 16th Annual Review of Progress in Applied Computational
Electromagnetics, Monterey, CA, March 2000
Dean's Fellowship, University of Missouri-Rolla, 1997-2000
Guanghua Fellowship, Tsinghua University, 1993, 1995
Outstanding Graduate, Tsinghua University, 1994
Outstanding Student Scholarship, Tsinghua University, 1990, 1992
Social Activity Scholarship, Tsinghua University, 1991

社会、学会及学术兼职
Professional Activities:
Director at Large, IEEE EMC Society Board of Directors, from January 1, 2017.
Associate Editor, IEEE Transactions on Electromagnetic Compatibility, from January 10, 2012.
Associate Editor, EMC Magazine, IEEE EMC Society, from January 2012.
Senior Investigator, Material Research Center, Missouri S&T, from September 2014.
Member, ECE Executive Committee, Area Coordinator, Circuits/Electronics, Department of Electrical
and Computer Engineering, Missouri S&T, from August 2014.
Member, Campus Library and Learning Resources Committee, Campus Tenure and Promotion
Committee, Department Scholarship Committee, Department Graduate Committee,
Department of Electrical and Computer Engineering, Missouri S&T
Chair/past Vice Chair/past Secretary, IEEE EMC Society Technical Advisory Committee
Coordinator, IEEE EMC Society Video Distinguished Lecturer Program
Member/past Chair/past Secretary, IEEE EMC Society TC-9 Computational Electromagnetics
Member, IEEE EMC Society TC-10 Signal Integrity, IEEE EMC Society Awards Committee
Past Vice Chair/past Secretary, IEEE Rolla Subsection
Member, Working Group of the IEEE Standard P1597.1, Standard for Validation of Computational
Electromagnetics Computer Modeling and Simulations
Jun Fan
Position Reference number: ** April 20, 2017
CV-2
Technical Paper Chair, IEEE International Symposium on Electromagnetic Compatibility 2011-2012,
2014-2015
Technical Program Chair, 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity
General Chair, IEEE International Conference on Signal and Power Integrity (an embedded conference in
IEEE International Symposium on Electromagnetic Compatibility) 2014, 2017
Technical Program/International Steering Committee/International Advisory Committee Member,
DesignCon 2007- 2015, IEEE EDAPS 2008-2013, 2015, 2017, Asia-Pacific EMC
Symposium 2010-2016, SPI 2015-2016
NSF Panelist, 2011
Reviewer, IEEE Transactions on Electromagnetic Compatibility/Components, Packaging and
Manufacturing Technology/Advanced Packaging/ Power Electronics/ Microwave
Theory and Techniques/Mobile Computing/Electron Devices, IEEE Design & Test of
Computers, IEEE Microwave and Wireless Components Letters, International Journal
of Numerical Modeling, Journal of Electromagnetic Waves and Applications/Progress
in Electromagnetic Research, International Journal of Antenna and Propagation,
various technical conferences.
Invited Speaker/Session Organizer/Panel Organizer/Panelist/Workshop Presenter at various technical
conferences

研究领域
电力电子应用-新能源汽车有线/无线充电/特种电源/无线充电无人机
高速集成电路设计与电磁兼容性研究
电磁学/天线理论/高功率微波器件设计
检测技术与控制系统

科研项目
Research Awards:
a. Sole-PI Awards
[1] Intel Corporation, “CEMC Membership Agreement for Intel Corporation (Oregon)”, $60,000,
Sole-PI, 100%, 02/28/2017.
[2] Google, Inc., “Study of Suitable MIMO OTA Testing Method and Extraction of Additional
Information for De-Sense Debugging and Fix”, $100,000, Sole-PI, 100%, 11/08/2016.
[3] Huawei Technologies Co., LTD, “Optical Module Intra-EMI Research & Development”,
$92,000, Sole-PI, 100%, 06/17/2016.
[4] NSF Div of Industrial Innovation & Partnership, “I/UCRC Phase II: Center for
Electromagnetic Compatibility”, $20,000, Sole-PI, 100%, 05/12/2016.
[5] Cisco Systems Inc, “CEMC: Cisco-PDN”, $60,000, Sole-PI, 100%, 03/14/2016.
[6] Intel Corporation, “CEMC Membership Agreement for Intel Corporation (Oregon)”, $60,000,
Sole-PI, 100%, 02/22/2016.
[7] Cisco Systems Inc, “CEMC Cisco - SERDES”, $60,000, Sole-PI, 100%, 11/19/2015.
[8] Cisco Systems Inc, “CEMC: Cisco-PDN”, $60,000, Sole-PI, 100%, 09/18/2015.
[9] Intel Corp, “CEMC Membership Agreement for Intel Corporation (Oregon)”, $60,000, Sole-PI,
100%, 02/18/2015.
[10] National Science Foundation, “IUCRC Phase II: Center for Electromagnetic Compatibility –
2015 Supplemental Funding Request,” $20,000, Sole-PI, 100%, 02/20/2015.
[11] Cisco Systems, Inc., “CEMC Cisco – Serdes,” $60,000, Sole-PI, 100%, 12/9/2014.
[12] Cisco Systems, Inc., “CEMC: CISCO-PDN,” $60,000, Sole-PI, 100%, 09/03/2014.
[13] National Science Foundation, “Collaborative Research: Phase II: Center for Electromagnetic
Compatibility – An Industry/University Cooperative Research Collaboration,” $459,375, Sole-PI,
100%, 08/07/2014.
[14] IEEE Instrumentation and Measurement Soc, “De-embedding Techniques for Device
Characterization,” $10,000, Sole-PI, 100%, 05/30/2014.
[15] Intel Corp, “CEMC Membership Agreement for Intel Corporation (Oregon)”, $60,000, Sole-PI,
100%, 02/20/2014.
[16] Cisco Systems, Inc., “CEMC Cisco – SERDES,” $60,000, Sole-PI, 100%, 11/11/2013.
[17] Cisco Systems, Inc., “CEMC: CISCO-PDN,” $60,000, Sole-PI, 100%, 06/07/2013.
[18] IBM Personal Systems Group, “CEMC Membership,” $60,000, Sole-PI, 100%, 05/28/2013.
[19] Intel Corp, “CEMC Membership Agreement for Intel Corporation (Oregon)”, $60,000, Sole-PI,
100%, 03/19/2013.
[20] Cisco Systems, Inc., “CEMC CISCO – SERDES,” $60,000, Sole-PI, 100%, 11/14/2012.
[21] Cisco Systems, Inc., “CEMC: CISCO-PDN,” $60,000, Sole-PI, 100%, 09/05/2012.
[22] HABSonic, Inc., “Development of Robust Distributed Ceramic Coaxial Cable Sensors for High
Temperature Harsh Environment Applications,” $40,000, Sole-PI, 100%, 08/22/2012.
[23] IBM Personal Systems Group, “CEMC Membership,” $60,000, Sole-PI, 100%, 04/04/2012.
Jun Fan
Position Reference number: ** April 20, 2017
CV-7
[24] Sony Corporation, “Sony IntraSystem EMI/RFI”, $60,000, Sole-PI, 100%, 03/22/2012.
[25] Sony Corporation, “Sony PDN”, $60,000, Sole-PI, 100%, 03/01/2012.
[26] Cisco Systems, Inc., “CEMC: CISCO-SERDES”, $60,000, Project period January 1, 2012 –
December 31, 2012, Sole-PI, 100%, 01/03/2012.
[27] Cisco Systems, Inc., “CEMC: CISCO-PDN”, $60,000, Project period November 1, 2011 –
October 31, 2012, Sole-PI, 100%, 01/03/2012.
[28] IBM, “Membership Agreement with IBM”, $60,000, Project period 1 year, Sole-PI, 100%,
05/26/2011
[29] Sony Corporation, “CEMC-Sony IntraSystem EMI”, $60,000, Project period 1 year, Sole-PI,
100%, 02/24/2011
[30] Sony Corporation, “ Sony PDN”, $60,000, Project period 1 year, Sole-PI, 100%, 02/24/2011
[31] Apple Computer, Inc., “EMC Consortium Membership”, $60,000, Project period 1 year, Sole-
PI, 100%, 1/31/2011
[32] Intel Corporation, “Estimating RF Interference in Mixed-Signal Mobile Systems”, $80,000,
Project period July 1, 2011 – June 30, 2012, Sole-PI, 100%, 12/07/2010
[33] Cisco Systems, Inc., “EMC Cisco II – Time Domain Character”, $60,000, Project period 1 year,
Sole-PI, 100%, 10/08/2010
[34] Cisco Systems, Inc., “Design and Optimization of Via Impedance for High-Speed Serial Channels
Based on PCB Layout Information”, $60,000, Project period 1 year, Sole-PI, 100%, 08/18/2010
[35] IBM Personal Systems Group, “EMC Consortium Membership”, $60,000, Project period 1 year,
Sole-PI, 100%, 06/09/2010
[36] Sony Corporation, “CEMC-Sony IntraSystem EMI”, $60,000, Project period 1 year, Sole-PI,
100%, 04/21/2010
[37] Sony Corporation, “ Sony PDN”, $60,000, Project period 1 year, Sole-PI, 100%, 04/21/2010
[38] Apple Computer, Inc, “EMC Consortium Membership-SI”, $60,000, Project period 1 year, Sole-
PI, 100%, 12/17/2009
[39] Intel Corporation, “Estimating RF Interference in Mixed Signal Mobile Systems”, $80,000,
Project period July 1, 2010 – June 30, 2011, Sole PI, 100%, 11/09/2009
[40] Intel Corporation, “Estimating RF Interference in Mixed Signal Mobile Systems”, $40,000,
Project period January 1 – June 30, 2010, Sole PI, 100%, 09/10/2009
[41] Intel Corporation, “Estimating RF Interference in Mixed Signal Mobile Systems”, $15,000,
Project period July 1 – December 31, 2009, Sole PI, 100%, 08/12/2009
[42] Intel Corporation, “Estimating RF Interference in Mixed Signal Mobile Systems”, $25,000,
Project period July 1 – December 31, 2009, Sole PI, 100%, 06/22/2009
[43] LG Electronics, Inc, “CEMC Consortium”, $60,000, Project period 1 year, Sole PI, 100%,
06/19/2009
[44] Sony Corporation, “EMC Consortium”, $60,000, Project period 1 year, Sole PI, 100%,
05/01/2009
[45] University of Missouri Research Board, “Digital/RF Packaging Co-Design for Wireless
Devices”, $24,000, Project period February 1, 2008 – January 31, 2009, Sole PI, 100%, January
2008
b. Collaborative Awards – PI
[1] Shenzhen Sunway Communications Co., Ltd., “CEMC Membership Agreement for Sunway”,
$60,000, PI, 35%, 02/24/2017.
[2] Boeing Company, “CEMC Membership Agreement for The Boeing Company”, $60,000, PI,
25%, 12/02/2016.
[3] Huawei Technologies Co., Ltd, “CEMC Membership Agreement for Huawei SI”, $120,000, PI,
25%, 08/05/2016.
[4] Samsung Corporation, “CEMC Membership Agreement for Samsung-RFI”, $60,000, PI, 25%,
04/18/2016.
[5] Shenzhen Sunway Communication Co., Ltd., “CEMC Membership Agreement for Shenzhen
Sunway Communication Co., Ltd.”, $60,000, PI, 25%, 03/17/2016.
Jun Fan
Position Reference number: ** April 20, 2017
CV-8
[6] IBM Personal Systems Group, “CEMC Membership Agreement for IBM Personal Systems
Group”, $60,000, PI, 25%, 03/17/2016.
[7] Computer Simulation Tech of America, Inc., “CEMC Associate Membership Agreement for
CST America”, $30,000, PI, 25%, 03/17/2016.
[8] Sony EMCS Corporation, “CEMC Membership Agreement for Sony EMCS-RFI”, $60,000, PI,
50%, 02/11/2016.
[9] Huawei Device (Dongguan) Co., Ltd, “CEMC Membership Agreement for Huawei Device Co.,
Ltd”, $60,000, PI, 25%, 01/19/2016.
[10] Shenzhen Sunway Communication Co., Ltd., “CEMC Membership Agreement for Sunway”,
$60,000, PI, 25%, 04/01/2015.
[11] Samsung Corporation, “CEMC Membership Agreement for Samsung-RFI”, $60,000, PI, 25%,
04/01/2015.
[12] Sony EMCS Corporation, “CEMC Membership Agreement for Sony EMCS-RFI”, $60,000, PI,
50%, 04/01/2015.
[13] Computer Simulation Tech of America, Inc., “CEMC Associate Membership Agreement for
CST America”, $30,000, PI, 25%, 03/18/2015.
[14] Microsoft Mobile (China) Investment Co., Ltd., “CEMC Membership Agreement for Microsoft
Mobile (China) Investment Co., Ltd”, $60,000, PI, 25%, 02/12/2015.
[15] IBM Personal Systems Group, “CEMC Membership Agreement for IBM,” $60,000, PI, 25%,
02/20/2015.
[16] Computer Simulation Tech of America, “CEMC Associate Membership Agreement,” $30,000,
PI, 25%, 05/05/2014.
[17] National Science Foundation, “Center for Electromagnetic Compatibility Research – Participant
Support, $8,000, PI, 50%, 04/01/2014.
[18] IBM Personal Systems Group, “CEMC Membership for IBM Person Sys Group,” $60,000, PI,
25%, 04/09/2014.
[19] Samsung Corporation, “CEMC Membership for Samsung-RFI,” $60,000, PI, 25%, 04/28/2014.
[20] Shenzhen Sunway Communications Co., Ltd, “CEMC Membership Agreement for Sunway,”
$60,000, PI, 25%, 03/12/2014.
[21] Nokia (China) Investment Co., Ltd., “CEMC Membership Agreement for Nokia (China)”,
$60,000, PI, 25%, 02/11/2014.
[22] Cisco Systems, Inc., “CEMC Membership Application for Cisco 4 - EMC,” $60,000, PI, 25%,
08/27/2013.
[23] National Science Foundation, “I/UCRC FRP: Collaborative Research: Exploring Statistical
Analysis Methodologies in Selected EMC/SI Applications,” $133,272, PI, 50%, 07/16/2013.
[24] Samsung Corporation, “CEMC Membership for Samsung-RFI,” $60,000, PI, 20%, 05/06/2013.
[25] Computer Simulation Tech of America, “CEMC Associate Membership Agreement for CST
America,” $30,000, PI, 34%, 04/11/2013.
[26] Cisco Systems, Inc., “CEMC Membership Application for Cisco-Material 2,” $60,000, PI, 34%,
04/12/2013.
[27] Shenzhen Sunway Communications Co., Ltd, “CEMC Membership Agreement for Sunway,”
$60,000, PI, 20%, 04/12/2013.
[28] IBM Personal Systems Group, “CEMC Project 2,” $60,000, PI, 20%, 03/12/2013.
[29] Samsung Corporation, “Samsung - RFI,” $60,000, PI, 20%, 05/16/2012.
[30] IBM Personal Systems Group, “CEMC Membership – IBM Project 2,” $60,000, PI, 20%,
04/12/2012.
[31] IBM Personal Systems Group, “CEMC Second Membership”, $60,000, Project period April 1,
2011 – March 31, 2012, PI, 20%, 06/06/2011
[32] National Science Foundation, “Novel Coaxial Cable Bragg Grating Sensors for Large Strain
Measurement in SHM,” $280,000, Project period August 1, 2011 – July 31, 2014, PI, 50%,
2/23/2011
Jun Fan
Position Reference number: ** April 20, 2017
CV-9
[33] Apple Computer Inc., “EMC Consortium Membership”, $60,000, Project period 1 year, PI,
20%, 12/31/2008
[34] Sony Corporation, “EMC Consortium”, $25,000, Project period 1 year, PI, 20% , 11/24/2008
[35] Apple-SI, “EMC Consortium Membership”, $50,000, Project period 1 year, PI, 20%, 07/16/2008
[36] LG Electronics Inc, “EMC Consortium Membership”, $60,000, Project period 1 year, PI, 20%,
06/16/2008
[37] Intel Corp., “EMC Consortium Membership”, $87,500, Project period 1 year, PI, 20%,
03/07/2008
[38] Intel Corp., “EMC Consortium Membership”, $12,500, Project period 1 year, PI, 20%,
08/31/2007
c. Collaborative Awards – Co-PI
[1] ASUStek Computer, Inc., “CEMC Membership Agreement for ASUStek Computer Inc”,
$60,000, Co-PI, 30%, 01/10/2017.
[2] Laird Technologies, “CEMC Membership Agreement for Laird”, $60,000, Co-PI, 30%,
12/08/2016.
[3] Lexmark International, Inc., “CEMC Membership for Lexmark International, Inc.”, $60,000,
Co-PI, 25%, 10/18/2016.
[4] UTC Aerospace Systems, “CEMC Membership for UTC Aerospace System”, $60,000, Co-PI,
25%, 09/23/2016.
[5] Cisco Systems Inc., “CEMC Membership Agreement for Cisco-Material 2”, $60,000, Co-PI,
25%, 09/23/2016.
[6] Robert Bosch GmbH, “CEMC Membership Agreement for Bosch”, $76,000, Co-PI, 25%,
08/12/2016.
[7] Cisco Systems Inc., “CEMC Membership Agreement for Cisco 4-EMC”, $60,000, Co-PI, 25%,
07/25/2016.
[8] Intel GMBH LE340, “CEMC Membership Agreement for Intel-Germany”, $60,000, Co-PI, 25%,
06/02/2016.
[9] ESDEMC Technology LLC, “CEMC Associate Membership Agreement for ESDEMC
Technology LLC”, $30,000, Co-PI, 22.5%, 06/30/2016.
[10] Intel-India, “CEMC Membership Agreement for Intel-India”, $60,000, Co-PI, 25%, 05/12/2016.
[11] Samsung Corporation, “CEMC Membership Agreement for Samsung-ESD”, $60,000, Co-PI,
25%, 05/09/2016.
[12] Juniper Networks, Inc., “CEMC Membership Agreement for Juniper Networks, Inc.”, $60,000,
Co-PI, 25%, 04/19/2016.
[13] Huawei Device Dongguan Co., LTD, “CEMC Membership Agreement for Huawei Device 2”,
$60,000, Co-PI, 25%, 04/08/2016.
[14] Sony EMCS Corporation, “CEMC Membership Agreement for Sony EMCS”, $60,000, Co-PI,
25%, 02/16/2016.
[15] NXP Semiconductor, Inc., “CEMC Membership Agreement for NXP Semiconductor, Inc.”,
$60,000, Co-PI, 25%, 01/21/2016.
[16] Laird Technologies, “CEMC Membership Agreement for Laird”, $60,000, Co-PI, 22.50%,
12/24/2015.
[17] Cisco Systems Inc., “CEMC Membership Agreement for Cisco 4-EMC”, $30,000, Co-PI, 25%,
10/26/2015.
[18] Cisco Systems Inc., “CEMC Membership Agreement for Cisco 4-EMC”, $15,000, Co-PI, 25%,
10/12/2015.
[19] Cisco Systems Inc., “CEMC Membership Agreement for Cisco-Material 2”, $60,000, Co-PI,
22.50%, 09/28/2015.
[20] UTC Aerospace Systems, “CEMC Membership for UTC Aerospace Systems (formerly Hamilton
Sunstrand)”, $60,000, Co-PI, 22.50%, 09/16/2015.
[21] API, “CEMC Membership Agreement for API”, $60,000, Co-PI, 25%, 07/17/2015.
[22] Robert Bosch GmbH, “CEMC Membership Agreement for Robert Bosch GmbH”, $76,000, Co-
PI, 25%, 07/21/2015.
Jun Fan
Position Reference number: ** April 20, 2017
CV-10
[23] Cisco Systems Inc., “CEMC Membership Agreement for Cisco 4-EMC”, $5,000, Co-PI, 25%,
06/26/2015.
[24] Cisco Systems Inc., “CEMC Membership Agreement for Cisco 4-EMC”, $30,000, Co-PI, 25%,
05/28/2015.
[25] Cisco Systems Inc., “CEMC Membership Agreement for Cisco 4-EMC”, $60,000, Co-PI, 25%,
05/28/2015.
[26] Panasonic Corporation, “CEMC Membership Agreement for Panasonic,” $60,000, Co-PI, 25%,
04/28/2015.
[27] Deere & Company, “CEMC Membership Agreement for Deere & Company,” $60,000, Co-PI,
25%, 04/23/2015.
[28] Sony EMCS Corporation, “CEMC Membership Agreement for Sony EMCS”, $60,000, Co-PI,
25%, 03/19/2015.
[29] Samsung Corporation, “CEMC Membership Agreement for Samsung-ESD”, $60,000, Co-PI,
25%, 03/19/2015.
[30] Freescale Semiconductor, Inc., “CEMC Membership Agreement for Freescale”, $60,000, Co-PI,
25%, 02/03/2015.
[31] Laird Technologies, “CEMC Membership Agreement for Laird,” $60,000, Co-PI, 20%,
01/07/2015.
[32] Cisco Systems, Inc., “CEMC Membership Application for Cisco 4-EMC,” $60,000, Co-PI, 25%,
10/8/2014.
[33] Cisco Systems, Inc., “CEMC Membership Agreement for Cisco-Materials 2,” $60,000, Co-PI,
25%, 09/15/2014.
[34] Hamilton Sunstrand Corp, “CEMC Membership Agreement for Hamilton Sunstrand,” $60,000,
Co-PI, 33.33%, 08/18/2014.
[35] API, “CEMC Membership Agreement for API,” $60,000, Co-PI, 33.33%, 08/05/2014.
[36] Robert Bosch GMBH, “CEMC Membership Agreement for Bosch,” $76,000, Co-PI, 33.33%,
08/20/2014.
[37] Huawei Technologies Co., Ltd., “CEMC Membership Agreement for Huawei,” $60,000, Co-PI,
33.33%, 06/03/2014.
[38] Intel Corporation, “CEMC Membership Agreement for Intel – Germany,” $60,000, Co-PI,
33.33%, 06/18/2014.
[39] Panasonic Corporation, “CEMC Membership Agreement for Panasonic,” $60,000, Co-PI,
33.33%, 05/14/2014.
[40] Deere & Company, “CEMC Membership Agreement for Deere & Company,” $60,000, Co-PI,
25%, 04/01/2014.
[41] Altera Corporation, “CEMC Membership Agreement for Altera,” $60,000, Co-PI, 25%,
03/11/2014.
[42] Samsung Corporation, “CEMC Membership Agreement for Samsung ESD,” $60,000, Co-PI,
25%, 02/14/2014.
[43] Sony EMCS, “CEMC Membership Agreement for Sony EMCS,” $60,000, Co-PI, 25%,
02/20/2014.
[44] Freescale Semiconductor, Inc., “CEMC Membership Agreement for Freescale”, $60,000, Co-PI,
25%, 01/21/2014.
[45] Huawei Technologies Co., Inc., “CEMC Membership Agreement for Huawei- Third,” $60,000,
Co-PI, 25%, 01/29/2014.
[46] Laird Technologies, “CEMC Membership Agreement for Laird,” $60,000, Co-PI, 25%,
12/04/2013.
[47] Huawei Technologies Co., Inc., “CEMC Membership Agreement for Huawei - Second,”
$60,000, Co-PI, 25%, 12/11/2013.
[48] Robert Bosch GMBH, “CEMC Membership Agreement for Bosch,” $76,000, Co-PI, 33.33%,
09/06/2013.
[49] API, “CEMC Membership Agreement for API,” $60,000, Co-PI, 33.33%, 08/14/2013.
[50] Deere & Company, “CEMC Membership Agreement for Deere & Company,” $60,000, Co-PI,
33.33%, 07/02/2013.
Jun Fan
Position Reference number: ** April 20, 2017
CV-11
[51] Panasonic Corporation, “CEMC Membership Agreement for Panasonic,” $60,000, Co-PI, 20%,
07/01/2013.
[52] Hamilton Sunstrand Corp, “CEMC Membership Agreement for Hamilton Sunstrand,” $60,000,
Co-PI, 33.33%, 06/12/2013.
[53] Intel Corporation, “CEMC Membership Agreement for Intel,” $60,000, Co-PI, 16.6%,
06/12/2013.
[54] Altera Corporation, “Altera Corp,” $60,000, Co-PI, 20%, 04/12/2013.
[55] Cisco Systems, Inc., “CEMC: CISCO Membership – Materials,” $30,000, Co-PI, 20%,
04/19/2013.
[56] Sony EMCS Corporation, “CEMC Membership Agreement for Sony EMCS,” $60,000, Co-PI,
20%, 04/12/2013.
[57] Samsung Corporation, “Samsung ESD Circuit Measurement,” $60,000, Co-PI, 33%,
03/18/2013.
[58] Deere & Company, “CEMC Membership Agreement for Deere & Company,” $60,000, Co-PI,
16.66%, 01/29/2013.
[59] Freescale Semiconductor, Inc., “Center for Electromagnetic Compatibility”, $60,000, Co-PI,
20%, 01/29/2013.
[60] Laird Technologies, “Study of Noise Suppression Sheet Materials for CEMC App (CEMC
Membership),” $60,000, Co-PI, 16.66%, 12/05/2012.
[61] Huawei Technologies Co., Inc., “CEMC Membership Agreement for Huawei - Third,” $60,000,
Co-PI, 20%, 12/26/2012.
[62] Cisco Systems, Inc., “CEMC: CISCO Membership – Materials,” $30,000, Co-PI, 16.6%,
10/29/2012.
[63] Huawei Technologies Co., Inc., “CEMC Membership: Second,” $60,000, Co-PI, 16.6%,
10/29/2012.
[64] Hamilton Sunstrand Corp, “CEMC Membership Agreement with Hamilton Sunstrand
Corporation,” $60,000, Co-PI, 20%, 09/27/2012.
[65] Intel Mobile Communications GmbH, “CEMC Membership Agreement for Intel,” $60,000, Co-
PI, 16.6%, 09/10/2012.
[66] Robert Bosch GMBH, “CEMC Consortium Membership,” $76,000, Co-PI, 20%, 09/20/2012.
[67] LG Electronics, “Center for Electromagnetic Compatibility,” $60,000, Co-PI, 20%, 06/06/2012.
[68] Panasonic Corp, “Center for Electromagnetic Compatibility,” $60,000, Co-PI, 16.6%,
06/06/2012.
[69] Huawei Technologies Co., LTD, “Center for Electromagnetic Compatibility,” $60,000, Co-PI,
20%, 06/06/2012.
[70] Nvidia Corporation, “Center for Electromagnetic Compatibility,” $60,000, Co-PI,16.6%,
06/20/2012.
[71] Altera Corporation, “CEMC Altera Group,” $60,000, Co-PI, 20%, 05/16/2012.
[72] Samsung Corporation, “Samsung ESD Circuit Measurement,” $60,000, Co-PI, 33.33%,
04/12/2012.
[73] Sony Corporation, “CEMC Sony ESD,” $60,000, Co-PI, 20%, 03/12/2012.
[74] American Society of Heating and Air-Conditioning Engineers, Inc (ASHRAE), “The Effect of
Humidity on Static Electricity Induced Reliability Issues of ICT Equipment,” $200,000, Co-PI,
20%, 03/08/2012.
[75] Freescale Semiconductor, Inc., “Center for Electromagnetic Compatibility”, $60,000, Co-PI,
20%, 02/07/2012.
[76] Laird Technologies, “Study of Noise Suppression Sheet Materials for CEMC App,” $60,000, Co-
PI, 16.66%, 02/01/2012.
[77] Cisco Systems, Inc., “CISCO Systems, Inc. CEMC Membership - Materials”, $60,000, Project
period November 1, 2011 – October 31, 2012, Co-PI, 16.6%, 01/23/2012.
[78] Deere and Company, “Deere and Company Membership Renewal”, $60,000, Project period
December 10, 2011 – December 9, 2012, Co-PI, 16.6%, 01/23/2012.
[79] Robert Bosch BMVH, “CEMC Robert Bosch GMVH”, $76,000, Project period September 16,
2011 – September 15, 2012, Co-PI, 20%, 12/6/2011
Jun Fan
Position Reference number: ** April 20, 2017
CV-12
[80] Arc Technologies, “Award from ARC Technologies,” $60,000, Project period September 1, 2011
– August 31, 2012, Co-PI, 16.66%, 11/21/2011.
[81] Huawei, “CEMC Membership – Second for HAUWEI Technologies Co., Ltd.”, $60,000, Project
period October 1, 2011 – September 30, 2012, Co-PI, 16.6%, 09/26/2011.
[82] Robert Bosch BMVH, “Additional Funding for CEMC Agreement with Robert Bosch BMVH”,
$2,000, expires on 09/15/2012, Co-PI, 20%, 8/29/2011
[83] API, “CEMC Membership Agreement with API”, $76,000, Project period June 1, 2011 – May 31,
2012, Co-PI, 20%, 08/26/2011.
[84] Nvidia Corporation, “CEMC Membership Agreement with NVIDIA Corporation”, $60,000,
Project period July 20, 2011 – July 19, 2012, Co-PI, 16.6%, 08/25/2011.
[85] Samsung Corporation, “CEMC Membership #2 for Samsung”, $60,000, Project period June 10,
2011 – June 9, 2012, Co-PI, 20%, 06/20/2011.
[86] LG Electronics, “CEMC Consortium Membership with LG Electronics”, $60,000, Project period
August 1, 2011 – July 31, 2012, Co-PI, 20%, 06/13/2011
[87] Panasonic Corporation, “CEMC Membership Agreement with Panasonic”, $60,000, Project
period 1 year, Co-PI, 16.7%, 05/25/2011
[88] Altera, “CEMC Membership Agreement with Altera”, $60,000, Project period 1 year, Co-PI,
20%, 05/25/2011
[89] Freescale Semiconductor, Inc, “Center for Electromagnetic Compatibility”, $120,000, Project
period 2 years, Co-PI, 20%, 05/20/2011
[90] Huawei Technologies Co., Ltd, “CEMC Membership”, $60,000, Project period 1 year, Co-PI,
20%, 05/18/2011
[91] Sony Corporation, “CEMC Sony ESD”, $60,000, Project period 1 year, Co-PI, 20%, 03/03/2011
[92] Laird Technologies, “CEMC Membership,” $60,000, Project period 1 year, Co-PI, 16.66%,
02/08/2011
[93] Arc Technologies, “CEMC Membership,” $60,000, Project period 1 year, Co-PI, 16.66%,
02/08/2011
[94] Deere & Co, “Center for Electromagnetic Compatibility Lab”, $60,000, Project period 1 year, Co-
PI, 16.6%, 11/30/2010
[95] Robert Bosch BMVH, “CEMC Consortium Membership”, $76,000, Project period 1 year, Co-PI,
20%, 11/17/2010
[96] Apple Computer, Inc., “Apple - EMC”, $60,000, Project period 1 year, Co-PI, 20%, 10/08/2010
[97] API, “CEMC Consortium Membership”, $76,000, Project period 1 year, Co-PI, 16.60%,
10/20/2010
[98] Cisco Systems, Inc., “EMC Consortium Membership”, $70,000, Project period 1 year, Co-PI,
16.60%, 10/08/2010
[99] Panasonic Corp, “CEMC Consortium Membership”, $60,000, Project period 1 year, Co-PI,
16.60%, 08/19/2010
[100] Altera Corporation, “Center for Electromagnetic Compatibility”, $60,000, Project period 1 year,
Co-PI, 20%, 06/21/2010
[101] Laird Technologies, “Study of Noise Suppression Sheet Materials for EMC App”, $60,000,
Project period 1 year, Co-PI, 16.6%, 05/27/2010
[102] Samsung Corporation, “CEMC Samsung”, $50,000, Project period 1 year, Co-PI, 20%,
04/14/2010
[103] Sony Corporation, “CEMC Sony ESD”, $60,000, Project period 1 year, Co-PI, 20%, 04/21/2010
[104] General Dynamics, “Improvised Explosive Device (IED) Defeat Effort”, -$20,489, Co-PI, 14%,
04/05/2010, adjustment
[105] Apple Computer, “EMC Membership Agreement with Apple”, $60,000, Project period 1 year,
Co-PI, 20%, 01/28/2010
[106] Robert Bosch, “EMC Consortium Membership”, $76,000, Project period 1 year, Co-PI, 20%,
12/17/2009
[107] Deere and Company, “Center for EMC”, $60,000, Project period 1 year, Co-PI, 16.6%,
11/02/2009
[108] Arc Technologies, “Membership Agreement with Arc Technologies”, $60,000, Project period 1
year, Co-PI, 16.6%, 10/29/2009
Jun Fan
Position Reference number: ** April 20, 2017
CV-13
[109] Cisco Systems, Inc, “EMC Consortium Membership-Cisco (Material)”, $60,000, Project period 1
year, Co-PI, 16.6%, 10/29/2009
[110] Cisco Systems, Inc, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI,
20%, 10/15/2009
[111] IBM Research System Group, “Center for EMC”, $33,000, Project period 1 year, Co-PI, 20%,
08/31/2009
[112] Altera Corporation, “Center for EMC”, $60,000, Project period 1 year, Co-PI, 20%, 08/13/2009
[113] General Dynamics Ordnance & Tactical System, “Improvised Explosive Device (IED) Defeat
Effort”, $915,358, Project period 1 year, Co-PI, 14%, 08/25/2009
[114] Cisco Systems, Inc, “EMC Consortium”, $50,000, Project period 1 year, Co-PI, 20%, 06/25/2009
[115] IBM Personal System, “Center for Electromagnetic Compatibility”, $60,000, Project period 1
year, Co-PI, 20%, 05/06/2009
[116] Freescale Semiconductor, Inc, “EMC Consortium Membership”, $60,000, Project period 1 year,
Co-PI, 20%, 04/17/2009
[117] Apple Computer, Inc, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI,
20%, 03/04/2009
[118] Cisco Systems Inc, “EMC Consortium Membership”, $35,000, Project period 1 year, Co-PI, 20%,
03/26/2009
[119] Cisco Systems Inc, “EMC Consortium membership”, $25,000, Project period 1 year, Co-PI, 20%,
03/18/2009
[120] Deere and Company, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI,
20% , 02/02/2009
[121] Sony Corporation, “EMC Consortium”, $60,000, Project period 1 year, Co-PI, 20% , 02/18/2009
[122] Robert Bosch BMVH, “EMC Consortium Membership”, $76,000, Project period 1 year, Co-PI,
20% , 11/18/2008
[123] Laird Technologies, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI,
16.66%, 11/17/2008
[124] FreeScale Semiconductor, Inc, “EMC Consortium Membership”, $60,000, Project period 1 year,
Co-PI, 20% , 10/20/2008
[125] Samsung, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI, 20% ,
07/09/2008
[126] Robert Bosch BMVH, “EMC Consortium Membership”, $31,500, Project period 1 year, Co-PI,
20% , 07/31/2008
[127] Laird Technologies, “EMC Consortium Membership”, $35,000, Project period 1 year, Co-PI,
16.7%, 07/31/2008
[128] Altera, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI, 20%, 07/09/2008
[129] Cisco, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI, 20%, 07/22/2008
[130] Huawei Techn Co., “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI,
20%, 07/09/2008
[131] IBM, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI, 20%, 07/09/2008
[132] Research in Motion Limited, “EMC Consortium Membership”, $60,000, Project period 1 year,
Co-PI, 20%, 07/09/2008
[133] General Dynamics, “Improvised Explosive Device (IED) Defeat Effort,” $1,103,675, Project
period 1 year, Co-PI, 14%, 07/30/2008
[134] Apple Computer, Inc, “EMC Consortium Membership”, $12,500, Project period 1 year, Co-PI,
20%, 06/16/2008
[135] NVIDIA Corp, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI, 20%,
06/25/2008
[136] NEC Corp, “EMC Consortium Membership”, $60,000, Project period 1 year, Co-PI, 20%,
06/10/2008
[137] Cisco Systems, “EMC Consortium Membership”, $50,000, Project period 1 year, Co-PI, 20%,
06/25/2008
[138] Cisco Systems, “EMC Consortium Membership”, $25,000, Project period 1 year, Co-PI, 20%,
06/16/2008
Jun Fan
Position Reference number: ** April 20, 2017
CV-14
[139] Cisco Systems, “EMC Consortium Membership”, $25,000, Project period 1 year, Co-PI, 20%,
06/16/2008
[140] Sony Corp, “EMC Consortium Membership”, $50,000, Project period 1 year, Co-PI, 20%,
05/28/2008
[141] IBM Personal Systems, “EMC Consortium Membership”, $50,000, Project period 1 year, Co-PI,
20%, 05/28/2008
[142] General Motors, “EMC Consortium Membership’, $50,000, Project period 1 year, Co-PI, 20%,
05/28/2008
[143] Apple Computer, Inc, “EMC Consortium Membership”, $12,500, Project period 1 year, Co-PI,
20%, 04/21/2008
[144] Huawei Techn Co, “EMC Consortium”, $50,000, Project period 1 year, Co-PI, 20%, 03/07/2008
[145] Cisco Sys Inc, “EMC Consortium”, $50,000, Project period 1 year, Co-PI, 20%, 03/07/2008
[146] Texas Instruments, “EMC Consortium”, $25,000, Project period 1 year, Co-PI, 20%, 03/07/2008
[147] Robert Bosch BMVH, “EMC Consortium Membership”, $63,000, Project period 1 year, Co-PI,
20% , 02/08/2008
[148] Apple Computer, Inc., “EMC Consortium Membership”, $12,500, Project period 1 year, Co-PI,
20%, 02/08/2008
[149] Cisco Systems Inc II, “EMC Consortium Membership-2”, $12,500, Project period 1 year, Co-PI,
20%, 12/12/2007
[150] General Dynamics, “Improvised Explosive Device (IED) Defeat Effort”, $701,500, Project
period 1 year, Co-PI, 14% , 12/31/2007
[151] Zuken Technology LTD, “EMC Consortium Membership”, $25,000, Project period 1 year, Co-
PI, 20% , 11/13/2007
[152] NSF, “Electromagnetic compatibility center – An Industry/University Cooperative Research
Collaboration”, $10,000, Project period 1 year, Co-PI, 20% , 10/18/2007

出版专著和教材
Publications
Highlights:
• Total publications: 83 refereed journal papers, 213 refereed conference papers
• 9 symposium/conference best paper awards, 6 symposium/conference student paper awards
• Scopus H-Index: 22 (19 if excluding self-citations)
Lectures and Presentations (since 2007):
[1] “Wireless EMC and Wireless OTA Measurement,” Panel organizer and panelist at the 2016 IEEE
International Symposium on Electromagnetic Compatibility, Ottawa, Canada, July 25-29, 2016.
[2] “Ask The Experts – SIPI Panel,” panelist at the 2016 IEEE International Symposium on
Electromagnetic Compatibility, Ottawa, Canada, July 25-29, 2016.
[3] “Signal Integrity,” Clayton R. Paul Global University at the 2016 IEEE International Symposium
on Electromagnetic Compatibility, Ottawa, Canada, July 25-29, 2016.
[4] “Practical DkDf Extraction Methodology Based on Differential Trace Measurement Considering
Causality and Surface Roughness,” invited talk at the 2016 APAC IIA Interconnect Workshop,
Taipei, May 15, 2016.
[5] “A New Eigenvalue-Based Delta-L Algorithm for PCB Trace Loss per Inch Measurement,”
invited talk at the 2016 APAC IIA Interconnect Workshop, Taipei, May 16, 2016.
[6] “Effective Material Characterization for High-Speed Printed Circuit Boards,” invited talk at 2016
Huawei Electromagnetic Technology and Protection Conference, Shenzhen, May 17, 2016.
[7] “Receiver Desensitization due to Radio-Frequency Interference and LCD Modulation,”
presentation in the workshop EMC in Wireless Devices at the 7th Asia-Pacific International
Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition,
Shenzhen, China, May 18-21, 2016.
[8] “Challenges and Opportunities for EMI Design and Mitigation,” Plenary Talk at the 7th Asia-
Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and
Technical Exhibition, Shenzhen, China, May 18-21, 2016.
[9] “Trends and Challenges of High-Speed Designs – Moving toward 56 Gb/s,” invited talk at the
2016 International Workshop EMC Research and Application: Challenges and Opportunities at
Zhejiang University, Hangzhou, China, May 23, 2016.
[10] “Application of Computational Electromagnetics in High Speed Designs,” Plenary Talk at 2016
IEEE International Conference on Wireless Information Technology and Systems (ICWITS) and
Applied Computational Electromagnetics (ACES), Honolulu, HI, March 13-17, 2016.
[11] “Power Distribution Network Design for High-Speed Printed Circuit Boards,” Respected Speaker
Bureau talk at the Southeastern Michigan IEEE EMC Chapter, Dearborn, MI, October 15, 2015.
[12] “Trends and Challenges of High-Speed Designs,” invited talk at Huawei Engineering Innovation
Day, Shenzhen, China, August 29, 2015.
[13] “Introduction to Radio-Frequency Interference,” invited talk at University of Electronic Science
and Technology of China, Chengdu, Sichuan, China, June 29, 2015.
[14] “Electromagnetic Compatibility and Printed Circuit Board Design,” invited talk at Zhejiang
University, Hangzhou, Zhejiang, China, June 27, 2015.
[15] “EMI Fundamentals, Debugging Techniques, and Case Studies,” invited talk at North Valley
Research Inc., Jinan, Shandong, China, June 25, 2015.
[16] “Effective Material Characterization for High-Speed Printed Circuit Boards,” invited talk in Intel
Interconnect Workshop 2015, Taipei, Taiwan, May 29, 2015.
Jun Fan
Position Reference number: ** April 20, 2017
CV-16
[17] “RF Desensitization in Wireless Devices,” presentation in the workshop Distinguished Lectures of
EMC Society at the 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility,
Taipei, Taiwan, May 25-29, 2015.
[18] “RF Desensitization in Wireless Devices,” presentation in the workshop Product EMC Challenges
for Emerging Wireless Technologies at the 2015 IEEE Symposium on Electromagnetic
Compatibility and Signal Integrity, Santa Clara, CA, March 15-20, 2015.
[19] “Electrical Characterization of High Frequency Interconnects at Bandwidths up to 50 GHz,”
panelist in the 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity,
Santa Clara, CA, March 15-20, 2015.
[20] “Ask the Experts,” panelist in the 2015 IEEE Symposium on Electromagnetic Compatibility and
Signal Integrity, Santa Clara, CA, March 15-20, 2015.
[21] “Introduction to Signal Integrity”, Clayton R. Paul Global University at the 2015 IEEE
Symposium on Electromagnetic Compatibility and Signal Integrity, Santa Clara, CA, March 15-
20, 2015.
[22] “SI and EMI are Related: Get Used to It”, panelist at the 2015 DesignCon, Santa Clara, CA,
January 27-30, 2015.
[23] “Estimating RF Interference Levels in Mixed Digital/RF Designs,” invited talk at Huazhong
University of Science and Technology, Wuhan, China, December 19, 2014.
[24] “Advanced De-Embedding Techniques for High Frequency Measurements in Digital
Applications,” invited talk at National Taiwan University, Taipei, Taiwan, October 24, 2014.
[25] “Accurate and Efficient Channel Characterization Based on an Innovative Calibration Method,”
invited speaker at Intel Electrical Characterization Seminar, Taipei, Taiwan, October 23, 2014
[26] “Signal Integrity,” presentation in the tutorial Fundamentals of EMC at the 2014 IEEE
International Symposium on Electromagnetic Compatibility, Raleigh, NC, August 4, 2014.
[27] “EMC for Wireless Devices,” Clayton R. Paul Global University at the 2014 IEEE International
Symposium on Electromagnetic Compatibility, Raleigh, NC, August 7, 2014.
[28] “Modeling Power Supply Induced Jitter in a Single-Ended Buffer,” seminar at the Department of
Computer Science and Electrical Engineering, University of Missouri- Kansas City, April 18,
2014.
[29] “SI and EMI are Related: Get Used to It”, panelist at the 2014 DesignCon, Santa Clara, CA,
January 28-31, 2014.
[30] “Applying Different IC Radiated-Emission Models to Analyze Far-Field Radiation of a Test
PCB”, invited presentation in the special session Tacking EMC in Real IC Chips at the 9th
International Workshop on the Electromagnetic Compatibility of Integrated Circuits, Nara Japan,
December 15-18, 2013.
[31] “Estimating RF Interference Levels in Mixed Digital/RF Designs,” presentation in the tutorial
Recent Developments in EMC for Emerging Wireless Technologies at the 2013 IEEE International
Symposium on Electromagnetic Compatibility, Denver, CO, August 5-9, 2013.
[32] “Introduction to High-Speed Digital Circuit Design and Signal Integrity,” invited one day lecture
at Beijing University of Chemical Technology, July 19, 2013
[33] “Transfer Functions of Power and Ground Fluctuations to Jitter at a Single-Ended Buffer,”
presentation in the workshop Power and Signal Integrity Co-Design for High-Speed Circuits at the
2013 Asia-Pacific International Symposium and Exhibition on Electromagnetic Compatibility,
Melbourne, Australia, May 23, 2013
[34] “How to Write a Technical Paper,” IEEE GOLD Webinar, May 2, 2013.
[35] Panelist, Radiation Testing in Wireless Communication: Challenges and Solutions, at the 2013
IEEE International Wireless Symposium, Beijing, China, April 14-18, 2013.
[36] “RF Interference Control in Mixed Digital/RF Designs,” invited tutorial presentation at the 2012
IEEE Electrical Design of Advanced Packaging and Systems Symposium, Taipei, Taiwan,
December 9, 2012.
[37] “Transfer Functions of Power and Ground Fluctuations to Jitter at a Single-Ended Buffer”, invited
talk at Shanghai JiaoTong University, Shanghai, and Zhejiang University, Hangzhou, China,
September 2012.
[38] “Measurement-Based IC Noise Modeling for RF Interference,” invited talk at the Huazhong
University of Science and Technology, Wuhan, China, September 2012.
Jun Fan
Position Reference number: ** April 20, 2017
CV-17
[39] “How to Write a Technical Paper,” invited presentation in the GOLD special session at the 2012
IEEE International Symposium on Electromagnetic Compatibility, Pittsburgh, PA, August 6,
2012.
[40] “How To Achieve High-Speed, High-Performance, and High-EM-Reliability in Hardware
Designs,” invited talk at the Third Research Institute of the Ministry of Public Security of P.R.C,
Shanghai, China, May 2012.
[41] “Measurement-Based IC Noise Modeling for RF Interference,” invited tutorial presentation in the
2011 IEEE Electrical Design of Advanced Package & Systems Symposium, Hangzhou, China,
December 12-14, 2011.
[42] “High-Speed Connector and Cable Design – Signal Integrity and Electromagnetic Interference
Considerations,” invited talk at the 11th International Session on Electro-Mechanical Devices,
Akita, Japan, November 17-18, 2011.
[43] “Fundamentals, Challenges, and Future Directions of Electromagnetic Compatibility (EMC)
Design in High-Speed Digital Systems,” invited talk at Akita University, Department of Electrical
and Electronic Engineering, Akita, Japan, November 18, 2011.
[44] “Characterization of IC Radiated Emissions for Intra-System EMI Analysis,” invited talk at the
University of Illinois at Urbana-Champaign, Department of Electrical and Computer Engineering,
October 18, 2011.
[45] “Intra-System EMI: Characterization and Modeling,” presentation in the workshop of EMC and
Wireless Devices in the 2011 IEEE International Symposium on Electromagnetic Compatibility,
Long Beach, CA, August 14-19, 2011.
[46] “Source Reconstruction for IC radiated Emissions from Measurements,” invited talk in the EMC
Webinar to Support Japan Earthquake and Tsunami Relief, April, 2011.
[47] “Source Reconstruction for IC radiated Emissions from Measurements,” invited talk to the IEEE
EMC Society Singapore Chapter, December 10, 2010.
[48] “EMC Fundamentals,” invited tutorial presentation in the 2010 IEEE Electrical Design of
Advanced Package & Systems Symposium, Singapore, December 7-9, 2010.
[49] “High-Speed Signal Link Path and Jitter: Models and Analysis,” presentation in the workshop of
Fundamentals of Signal Integrity in the 2010 IEEE International Symposium on Electromagnetic
Compatibility, Fort Lauderdale, FL, July 25-30, 2010.
[50] “PCB-level PDN design strategies and directions,” presentation in the workshop of Power
Distribution Network Design for High-Speed Digital Circuits in the 2010 Asia-Pacific Symposium
on Electromagnetic Compatibility, Beijing, China, April 12-16, 2010.
[51] “EMI Design for High-Speed Circuits: Fundamentals, Source Identification, and Coupling
Modeling,” invited presentation in NEC EMIStream Forum 2010, Santa Clara, CA, February 4,
2010.
[52] “EMI Fundamentals,” invited presentation in the tutorial session of Packaging & EMI in the 2009
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Shenzhen,
China, December 2, 2009.
[53] “High-Speed Signal Link Path and Jitter: Models and Analysis,” presentation in the workshop of
Fundamentals of Signal Integrity in the 2009 IEEE International Symposium on Electromagnetic
Compatibility, Austin, TX, August 21, 2009.
[54] “Fast Estimation of Noise Coupling for RFI Applications,” invited lecture in the 2009 1st IEEE
EMC Society Sendai Chapter Colloqium, Sendai, Japan, July 28, 2009.
[55] “Power Distribution Network Design in High-Speed PCBs for Noise Reduction and Radiation
Mitigation,” Invited presentation in Cybernet/NEC/GigaHz/Oak-Mitsui private seminar,
Akihabara, Japan, July 27, 2009.
[56] “Power Distribution Network Design in High-Speed PCBs,” invited lecture in the tutorial session
of Fundamental EMC Designs for High-Speed Printed Circuit Boards in the 2009 International
Symposium on Electromagnetic Compatibility, Kyoto, Japan, July 24, 2009.
[57] “Via and Via Array Modeling on Crosstalk,” invited presentation in the Third Central
Pennsylvania Symposium on Signal Integrity, Harrisburg, PA, April 14, 2009.
[58] “Power Distribution Network Design in High-Speed PCBs for Noise Reduction and Radiation
Mitigation,” invited presentation in NEC private seminar “Successful EMI & PI Co-Design”,
Santa Clara, CA, February 5, 2009.
Jun Fan
Position Reference number: ** April 20, 2017
CV-18
[59] “Fundamentals of Link-Path Analysis and Jitter,” presentation in the workshop of Fundamentals
of Signal Integrity in the 2008 IEEE International Symposium on Electromagnetic Compatibility,
Detroit, MI, August 22, 2008.
[60] “Modeling Arbitrarily-Shaped Power/Ground Planes Using Cavity Model and Segmentation
Technique,” Computer demonstration in the EMC Demonstrations and Experiments in the 2008
IEEE International Symposium on Electromagnetic Compatibility, Detroit, MI, August 19, 2008.
[61] “Limitations of Simulation Techniques and Proper Model Validation for High-Speed Printed
Circuit Board Modeling,” presentation in the workshop of Limitations of Simulation Techniques
and Proper Model Validation for Both Signal Integrity and EMC in the 2007 IEEE International
Symposium on Electromagnetic Compatibility, Hawaii, HI, July 8, 2007.
[62] IEEE EMC Distinguished lecturer talks
a. “Power Distribution Network Design and Embedded Capacitance For High-Speed Digital
Circuits,” Santa Clara, CA, October 14, 2008.
b. “Effects of Vias on High-Speed Signals,” Denver, CO, July 15, 2008.
c. “Effects of Vias on High-Speed Signals,” Portland, OR, May 21, 2008.
d. “Power Distribution Network Design for High-Speed Printed Circuit Boards,” Tokyo,
Japan, May 15, 2008.
e. “Effects of Vias on High-Speed Signals,” Sendai, Japan, May 14, 2008.
f. “Power Distribution Network Design for High-Speed Printed Circuit Boards,” Ottawa,
Canada, October 2, 2007.
g. “Power Distribution Network Design for High-Speed Printed Circuit Boards,” Montreal,
Canada, October 1, 2007.
h. “Power Distribution Network Design for High-Speed Printed Circuit Boards,” Austin,
TX, September 19, 2007.
i. “Power Distribution Network Design for High-Speed Printed Circuit Boards,” Dallas,
TX, September 18, 2007.
j. “Power Distribution Network Design for High-Speed Printed Circuit Boards,”
Huntsville, AL, September 13, 2007.
k. “Power Distribution Network Design for High-Speed Printed Circuit Boards,” Research
Triangle Park, NC, April 3, 2007.
Jun Fan
Position Reference number: **

科研创新
US Patents:
[1] Hai Xiao, Tao Wei, Jun Fan, and Songping Wu, “COAXIAL CABLE BRAGG GRATING
SENSOR,” US 13,437,770, June 2, 2015.
[2] Jun Fan, James L. Knighten, and Norman W. Smith, “PROVIDING AN EMBEDDED
CAPACITOR IN A CIRCUIT BOARD,” US 7,791,896, September 7, 2010.
[3] James L. Knighten, Norman Smith, and Jun Fan, “CROSSING CONDUCTIVE TRACES IN A
PCB,” US 7,652,364, January 26, 2010.
[4] Arthur R. Alexander, Jun Fan, James L. Knighten, and Norman W. Smith, “PROVIDING A
RESISTIVE ELEMENT BETWEEN REFERENCE PLANE LAYERS IN A CIRCUIT BOARD,”
US 7,626,828, December 1, 2009.
[5] Jun Fan, Arthur Ray Alexander, James Knighten, and Norman Smith, “ADJUSTING A
CHARACTERISTIC OF A CONDUCTIVE VIA STUB IN A CIRCUIT BOARD,” US
7,579,925, August 25, 2009.
[6] James L. Knighten, Jun Fan, and Norman W. Smith, “USING A THRU_HOLE VIA TO
IMPROVE CIRCUIT DENSITY IN A PCB,” US 7,456,364, November 25, 2008.
[7] Arthur R. Alexander, James L. Knighten, and Jun Fan, “TAILORING VIA IMPEDANCE ON A
CIRCUIT BOARD,” US 7,435,912, October 14, 2008.
[8] Jun Fan, Arthur Ray Alexander, Norman W. Smith, and James L. Knighten, “PROVIDING
DECOUPLING CAPACITORS IN A CIRCUIT BOARD,” US 7,271,348, September 18, 2007.
[9] Jun Fan, James L. Knighten, Arthur R. Alexander, and Norman W. Smith, “METHOD OF
FORMING A CAPACITOR ASSEMBLY IN A CIRCUIT BOARD,” US 7,216,422, May 15,
2007.
[10] James L. Knighten, Jun Fan, Norman W. Smith, and Arthur R. Alexander, “CIRCUIT BOARD
HAVING SEGMENTS WITH DIFFERENT SIGNAL SPEED CHARACTERISTICS,” US
7,196,906, March 27, 2007.
[11] Arthur R. Alexander, James L. Knighten, and Jun Fan, “ENHANCING SIGNAL PATH
CHARACTERISTICS IN A CIRCUIT BOARD,” US 7,045,719, May 16, 2006.
Jun Fan
Position Reference number: ** April 20, 2017
CV-15
[12] James L. Knighten, and Jun Fan, “PROVIDING SHIELDS FOR SYSTEMS,” US 6,912,135, June
28, 2005.
[13] Jun Fan, James L. Knighten, Arthur R. Alexander, and Norman W. Smith, “REDUCING NOISE
EFFECTS IN CIRCUIT BOARDS,” US 6,844,505, January 18, 2005.
[14] Jun Fan, Arthur R. Alexander, James L. Knighten, and Norman W. Smith, “CHARACTERIZING
MULTI-PORT CASCADED NETWORKS”, US 6,785,625, August 31, 2004.

我的团队
西南科技大学电磁兼容研究中心于2018年1月在西南科技大学国家大学科技园成立。中心响应国家大力发展新能源和集成电路技术的战略目标，结合四川省和地方的产业发展需求，与美国密苏里科技大学、清华四川能源互联网研究院、易冲无线科技有限公司及英特尔公司协同合作，开展相关科学研究和人才培养工作。中心将注重产、学、研结合，并借鉴密苏里科技大学的先进管理经验，建立保障实验室良好运行管理制度和机制。
研究方向：
电力电子应用-新能源汽车有线/无线充电/特种电源/无线充电无人机
高速集成电路设计与电磁兼容性研究
电磁学/天线理论/高功率微波器件设计
检测技术与控制系统