伍荣翔 邮箱：eewurx@uestc.edu.cn
电话：**
系别：集成电路与系统系
职称：教授（研究员等）
教师个人主页：


教师简介
教育背景
2006.09－2011.08 香港科技大学，电子与计算机工程系，博士
2002.09－2006.08 清华大学，数理基础科学班，学士

工作履历
2014.09 - present 电子科技大学，微电子与固体电子学院，副教授
2011.12－2014.08 电子科技大学，微电子与固体电子学院，讲师
2011.09 - 2011.12 香港科技大学，电子与计算机工程系，博士后

学术兼职
IEEE TIE, IEEE TPEL, IEEE EDL, IEEE TED, IEEE TMAG, IEEE TMTT, IEEE MWCL, IEEE ECCE审稿人

Biography:
Rongxiang Wu was born in Chongqing, China. He received the B.Sc. degree in fundamental science (math
and physics) from the Tsinghua University, Beijing, in 2006, and the Ph.D. degree in electronic and computer
engineering from the Hong Kong University of Science and Technology, Hong Kong, in 2011. He is currently an
associate professor of Microelectronics and Solid-State Electronics at the University of Electronic Science and
Technology of China, Chengdu, China. His research interests include on-chip inductors and transformers, power
system-in-package technologies, inductive wireless power transfer, and MEMS micro-speaker.
科学研究
1. 隔离变压器的芯片集成
应用：600V以上功率器件的栅极驱动、数据总线隔离
主要解决问题：集成信号隔离变压器的EMI、Noise、CMTI，集成功率隔离变压器的低频效率和隔离能力


2. 功率电感的芯片集成和封装集成
应用：移动可穿戴电源管理、处理器电源管理
主要解决问题：给定芯片面积下的电感效率


3. 基于先进封装技术的芯片配电设计
主要解决问题：低封装成本和复杂度、低配电网络阻抗


4. 基于硅工艺的微型扬声器
主要解决问题：尺寸、声压级、高频特性


5. 磁感应无线功率传输中的线圈设计
主要解决问题：线圈相互位置扰动对系统的影响、线圈效率


学术成果
Journal Publications:


[1] R. Wu, N. Liao, X. Fang, J. Cai, Q. Wang, and J.K.O. Sin, "A 3D assembled silicon-embedded transformer for 10 MHz, ultra-high-isolation, compact chip-to-chip power transfer," IEEE Electron Device Letters, vol. 38, no. 3, pp. 356-358, 2017.
[2] R. Wu, N. Liao, X. Fang, and J.K.O. Sin, "A novel double-side silicon-embedded transformer for 10-MHz, 1-kV-isolation, compact power transfer applications," IEEE Transactions on Electron Devices, vol. 63, no. 11, pp. 4542-4545, November 2016.
[3] X. Fang, R. Wu, and J.K.O. Sin, "Analytical modeling of ac resistance in thick coil integrated spiral inductors," IEEE Transactions on Electron Devices, vol. 63, no. 2, pp. 760-766, February 2016.
[4] R. Wu, N. Liao, X. Fang, and J.K.O. Sin, "A silicon-embedded transformer for high-efficiency, high-isolation, low-frequency on-chip power transfer," IEEE Transactions on Electron Devices, vol. 62, no. 1, pp. 220-223, January 2015.
[5] X.Fang, R. Wu, L. Peng, and J.K.O. Sin, "A novel integrated power inductor with vertical laminated core for improved L/R ratios," IEEE Electron Device Letters, vol. 35, no. 12, pp. 1287-1289, December 2014.
[6] R. Wu, W. Li, H. Luo, J.K.O. Sin,and C.P. Yue, "Design and characterization of wireless power links for brain-machine interface applications," IEEE Transactions on Power Electronics, vol. 29, no. 10, pp. 5462-5471, October 2014.
[7] L. Peng, R. Wu, X. Fang, Y. Toyoda, M. Akahane, M. Yamaji, H. Sumida, and J.K.O. Sin, "Optimization of monolithic 3D TSV transformers for high-voltage digital isolators," ECS Journal of Solid State Science and Technology, vol. 3, no. 10, pp. Q207-Q211, August 2014.
[8] L. Peng, R. Wu, X. Fang, Y. Toyoda, M. Akahane, M. Yamaji, H. Sumida, and J.K.O. Sin, "A simple low cost monolithic transformer for high-voltage gate driver applications," IEEE Electron Device Letters, vol. 35, no. 1, pp. 108-110, January 2014.
[9] S. Raju, R. Wu, M. Chan, and C.P. Yue, "Modeling of mutual coupling between planar inductors in wireless power applications," IEEE Transactions on Power Electronics, vol. 29, no. 1, pp. 481-490, January 2014. (ESI工程学前1%高被引论文）
[10] L. Peng, R. Wu, X. Fang, Y. Toyoda, M. Akahane, M. Yamaji, H. Sumida, and J.K.O. Sin, "A fully integrated 3D TSV transformer for high-voltage signal transfer applications," ECS Solid State Letters, vol. 2, no. 5, pp. Q29-Q31, February 2013.
[11] X.Fang, R. Wu, L. Peng, and J.K.O. Sin, "A novel silicon-embedded toroidal power inductor with magnetic core," IEEE Electron Device Letters, vol. 34, no. 3, pp. 292-294, February 2013.
[12] R. Wu, J.K.O. Sin, and C.P. Yue, "High-Q backside silicon–embedded inductor for power applications in μH and MHz range," IEEE Transactions on Electron Devices, vol. 60, no. 1, pp. 339-345, January 2013.
[13] R. Wu, S. Raju, M. Chan, J.K.O. Sin and C.P. Yue, "Silicon-embedded coil for high-efficiency wireless power transfer to implantable biomedical ICs," IEEE Electron Device Letters, vol. 34, no. 1, pp. 9-11, January 2013.
[14] R. Wu and J.K.O. Sin, "High efficiency silicon-embedded coreless coupled inductors for power supply on chip applications," IEEE Transactions on Power Electronics, vol. 27, no. 11, pp. 4781-4787, November 2012.
[15] R. Wu, J.K.O. Sin, and S.Y. (R.) Hui, "Novel silicon-embedded coreless transformer for on-chip isolated signal transfer," IEEE Magnetics Letters, vol. 2, pp. **, April 2011.
[16] R. Wu and J.K.O. Sin, "A novel silicon-embedded coreless inductor for high frequency power management applications," IEEE Electron Device Letters, vol. 32, no.1, pp. 60-62, January 2011.


Conference Publications:
[1] N. Liao and R. Wu, “A novel partly interleaved double-side silicon-embedded transformer for high-efficiency isolated power transfer applications,” IEEE International Conference on Electron Devices and Solid State Circuits（EDSSC), Hsinchu, Taiwan, 2017.
[2] R. Wu, N. Liao, X. Fang, and J.K.O. Sin, "A novel silicon-embedded transformer for system-in-package power isolation," 5th International Workshop on Power Supply on Chip (PwrSoC), Madrid, Spain, October 2016.
[3] R. Wu, J. Chen, N. Liao, and X. Fang, "On-chip transformers with shielding structures for high dV/dt immunity isolated gate drive," 8th IEEE Energy Conversion Congress & Exposition (ECCE), Milwaukee, USA, September 2016.
[4] S. Chen, Y. Li, and R. Wu, "Inductance to dc resistance ratio optimization of on-chip closed-core spiral power inductors," 12th IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC), Hong Kong, China, August 2016.
[5] R. Wu, N. Liao, X. Fang, and J.K.O. Sin, "A novel 3D transformer for ultra-compact signal isolation," 27th IEEE International Symposium on Power Semiconductor Devices & IC’s (ISPSD), Hong Kong, China, May 2015, pp. 297-300.
[6] J. Zhou, R. Wu, J. Billoué and G. Gartier, "Backside silicon-embedded inductor using porous silicon layer for substrate effect suppression," 10th IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC), Chengdu, China, June 2014.
[7] Y. Luo and R. Wu, "Specific absorption rate study for wireless power links in brain-machine interface applications," 10th IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC), Chengdu, China, June 2014.
[8] R. Wu, W. Li, Y. Ren, H. Luo, and G. Zhang, "Backside silicon-embedded inductor using magnetic layer for shielding and inductance enhancement," 9th IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC), Hong Kong, June 2013.
[9] L. Peng, R. Wu, X. Fang, Y. Toyoda, M. Akahane, M. Yamaji, H. Sumida, and J.K.O. Sin, "A novel 3D TSV transformer technology for digital isolator gate driver applications," 25th IEEE International Symposium on Power Semiconductor Devices & IC’s (ISPSD), Kanazawa, Japan, May 2013, pp. 69-72.
[10] S. Raju, R. Wu, M. Chan, and C.P. Yue, "Modeling of mutual inductance for planar inductors used in inductive link applications," 8th IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC), Bangkok, Thailand, December 2012.
[11] R. Wu, X. Fang, L. Peng, and J.K.O. Sin, "Backside embedded inductors for PowerSoC applications," 3rd International Workshop on Power-Supply-on-Chip (PwrSoC), San Francisco, USA, November 2012.
[12] X. Fang, R. Wu, L. Peng, and J.K.O. Sin, "A new embedded inductor for ZVS dc-dc converter applications," 24th IEEE International Symposium on Power Semiconductor Devices & IC’s (ISPSD), Bruges, Belgium, June 2012, pp. 53-56.
[13] R. Wu, S. Raju, M. Chan, J.K.O. Sin and C.P. Yue, "Wireless power link design using silicon-embedded inductors for brain-machine interface," 2012 International Symposium on VLSI Design, Automation and Test (VLSI-DAT), Hsinchu, Taiwan, April 2012, pp.1-4.
[14] R. Wu and J.K.O. Sin, "Novel silicon-embedded coreless coupled inductors for high efficiency on-chip dc-dc conversion," 3rd IEEE Energy Conversion Congress & Exposition (ECCE), Phoenix, USA, September 2011, pp. 1827-1831.
[15] R. Wu, J.K.O. Sin, and S.Y. (R.) Hui, "A novel silicon-embedded coreless transformer for isolated dc-dc converter application," 23rd IEEE International Symposium on Power Semiconductor Devices & IC’s (ISPSD), San Diego, USA, May 2011, pp. 352-355.
[16] R. Wu, Y. Su, J.K.O. Sin, and S.Y. (R.) Hui, "Characterization of monolithic coreless transformers for power supply-on-chip applications," 1st International Workshop on Power-Supply-on-Chip (PwrSoC), Cork, Ireland, September 2008.
[17] Y. Onishi, H. Wang, H.P.E. Xu, W.T. Ng, R. Wu and J.K.O. Sin, "SJ-FINFET: a new low voltage lateral superjunction MOSFET," 20th IEEE International Symposium on Power Semiconductor Devices & IC’s (ISPSD), Orlando, USA, May 2008, pp.111-114.
[18] J. Zhang, R. Wu, M. Gao, J. Huang, Y. Wang, Z. Yu, Y. Ashizawa, and H. Oka, "Atomistic simulation of plasma enhanced chemical vapor deposited SiCOH dielectrics," 8th International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Shanghai, China, October 2006, pp. 1447-1449.




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