西南交通大学机械工程学院导师教师师资介绍简介-秦娜

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个人信息MORE +
秦娜Qin Tina 讲师
教师英文名称： Qin Tina
所在单位： 机械工程学院
学历： 博士研究生毕业
办公地点： 西南交通大学先进设计与制造技术研究所
联系方式： tinaspirit@home.swjtu.edu.cn
学位： 工学博士学位
职称： 讲师
电子邮箱： tinaspirit@home.swjtu.edu.cn
主要任职： Lecturer
毕业院校： 美国堪萨斯州立大学
硕士生导师
学科：机械工程

同专业硕导

科学研究当前位置: 中文主页 >> 科学研究

科学研究
高档数控机床与基础制造装备重大专项中的课题“高档数控机床与基础制造装备专项“国产高档数控机床在典型飞机结构件加工中的示范应用。

论文成果
Guo, D.M, Qin, N., Kang, R.K., Jin, Z.J.. Novel measurement technique on 3D surface topography of polishing pad, Advanced Materials Research, 2008, 53-54: 265-272.
2. Qin, N., Pei, Z.J., Treadwell, C., Guo, D.M.. Physics-based predictive cutting force model in ultrasonic-vibration-assisted grinding for titanium drilling, Journal of Manufacturing Science and Engineering, 2009, 131 (4)：041011-1-041011-9.
3. Qin, N., Pei, Z.J., Fisher, G.R., Liu, J.. Simultaneous double-side grinding of silicon wafers: a review and analysis of experimental investigations, Machining Science and Technology, 2009, 13 (3):285-316.
4. Qin, N., Guo, D.M., Kang, R.K., Huo, F.W.. Effect of Conditioning Parameters on Surface Non-uniformity of Polishing Pad in Chemical Mechanical Planarization, Key Engineering Materials, 2009, 389-390: 498-503.
5. Qin, N., Pei, Z.J., Guo, D.M.. Ultrasonic-vibration-assisted grinding of titanium: cutting force modeling with design of experiments, Proceedings of the ASME International Manufacturing Science & Engineering Conference, 2009, 2: 619-624.
6. Qin, N., Pei, Z.J., and Guo, D.M.. Nanotopography in silicon wafer manufacturing: a literature review, Proceedings of ASME International Manufacturing Science & Engineering Conference, 2009, 1:721-728.
7. Qin, N., Pei, Z.J., Guo, D.M. Cong, W.L.. Effects of tool design on edge chipping in ultrasonic-vibration-assisted grinding, Proceedings of the 2010 ASME International Manufacturing Science and Engineering Conference, 2010, Erie, Pennsylvania, USA.
8. Qin, N., Pei, Z.J.. Four empirical models for pelleting of cellulosic biomass, Proceedings of the 2010 ASME International Manufacturing Science and Engineering Conference MSEC2010, October 12-15, 2010, Erie, Pennsylvania, USA.
9. Qin, N., Cong, W.L., Pei, Z.J., Cong, W.L., Treadwell, C., and Guo, D.M.. 2010, “Ultrasonic-vibration-assisted grinding of brittle materials: a mechanistic model for cutting force,” Proceedings of the ASME 2011 International Manufacturing Science and Engineering Conference, June 13-17, 2011, Corvallis, Oregon, USA.
10. Qin, N., Pei, Z.J., Guo, D.M., Cong, W.L.. UVAG of brittle materials: DoE with a cutting force model, Proceedings of the 2010 Industrial Engineering Research Conference, June 5-9, 2010, Cancún, Mexico.
11. Qin, N., Pei, Z. J.. Fundamental Research on Silicon Wafer Fine Grinding: 2010 Progress Report, 2011 NSF CMMI Grantees Conference, Jan 4-7, in Atlanta, GA.
12. Zhang, M., Song, X.X., Deines, T., Zhang, P.F., Zhang, Q., Cong, W.L., Qin, N., Pei, Z.J.. Ultrasonic-vibration-assisted Pelleting of Switchgrass: Effects of Binder Material, Proceedings of the 2010 Industrial Engineering Research Conference, June 5-9, 2010, Cancún, Mexico.
13. P.F., Zhang, Deines, T., W.L. Cong Cong, W.L., Qin, N., Pei, Z.J., Nottingham, D.. Ultrasonic vibration-assisted pelleting of switchgrass: effects of moisture content on pellet density, spring-back, and durability, Proceedings of the 2010 Flexible Automation and Intelligent Manufacturing International Conference, July 12-14, 2010, Hayward, CA.
14. Cong, W.L., P.F., Zhang, Qin, N., Deines, T., Zhang, M., Pei, Z.J.. Ultrasonic-vibration-assisted pelleting of switchgrass: effects of ultrasonic vibration, The 14th International Manufacturing Conference in China (IMCC2011)，Tianjin, October 13-15, 2011.

Guo, D.M, Qin, N., Kang, R.K., Jin, Z.J.. Novel measurement technique on 3D surface topography of polishing pad, Advanced Materials Research, 2008, 53-54: 265-272.
2. Qin, N., Pei, Z.J., Treadwell, C., Guo, D.M.. Physics-based predictive cutting force model in ultrasonic-vibration-assisted grinding for titanium drilling, Journal of Manufacturing Science and Engineering, 2009, 131 (4)：041011-1-041011-9.
3. Qin, N., Pei, Z.J., Fisher, G.R., Liu, J.. Simultaneous double-side grinding of silicon wafers: a review and analysis of experimental investigations, Machining Science and Technology, 2009, 13 (3):285-316.
4. Qin, N., Guo, D.M., Kang, R.K., Huo, F.W.. Effect of Conditioning Parameters on Surface Non-uniformity of Polishing Pad in Chemical Mechanical Planarization, Key Engineering Materials, 2009, 389-390: 498-503.
5. Qin, N., Pei, Z.J., Guo, D.M.. Ultrasonic-vibration-assisted grinding of titanium: cutting force modeling with design of experiments, Proceedings of the ASME International Manufacturing Science & Engineering Conference, 2009, 2: 619-624.
6. Qin, N., Pei, Z.J., and Guo, D.M.. Nanotopography in silicon wafer manufacturing: a literature review, Proceedings of ASME International Manufacturing Science & Engineering Conference, 2009, 1:721-728.
7. Qin, N., Pei, Z.J., Guo, D.M. Cong, W.L.. Effects of tool design on edge chipping in ultrasonic-vibration-assisted grinding, Proceedings of the 2010 ASME International Manufacturing Science and Engineering Conference, 2010, Erie, Pennsylvania, USA.
8. Qin, N., Pei, Z.J.. Four empirical models for pelleting of cellulosic biomass, Proceedings of the 2010 ASME International Manufacturing Science and Engineering Conference MSEC2010, October 12-15, 2010, Erie, Pennsylvania, USA.
9. Qin, N., Cong, W.L., Pei, Z.J., Cong, W.L., Treadwell, C., and Guo, D.M.. 2010, “Ultrasonic-vibration-assisted grinding of brittle materials: a mechanistic model for cutting force,” Proceedings of the ASME 2011 International Manufacturing Science and Engineering Conference, June 13-17, 2011, Corvallis, Oregon, USA.
10. Qin, N., Pei, Z.J., Guo, D.M., Cong, W.L.. UVAG of brittle materials: DoE with a cutting force model, Proceedings of the 2010 Industrial Engineering Research Conference, June 5-9, 2010, Cancún, Mexico.
11. Qin, N., Pei, Z. J.. Fundamental Research on Silicon Wafer Fine Grinding: 2010 Progress Report, 2011 NSF CMMI Grantees Conference, Jan 4-7, in Atlanta, GA.
12. Zhang, M., Song, X.X., Deines, T., Zhang, P.F., Zhang, Q., Cong, W.L., Qin, N., Pei, Z.J.. Ultrasonic-vibration-assisted Pelleting of Switchgrass: Effects of Binder Material, Proceedings of the 2010 Industrial Engineering Research Conference, June 5-9, 2010, Cancún, Mexico.
13. P.F., Zhang, Deines, T., W.L. Cong Cong, W.L., Qin, N., Pei, Z.J., Nottingham, D.. Ultrasonic vibration-assisted pelleting of switchgrass: effects of moisture content on pellet density, spring-back, and durability, Proceedings of the 2010 Flexible Automation and Intelligent Manufacturing International Conference, July 12-14, 2010, Hayward, CA.
14. Cong, W.L., P.F., Zhang, Qin, N., Deines, T., Zhang, M., Pei, Z.J.. Ultrasonic-vibration-assisted pelleting of switchgrass: effects of ultrasonic vibration, The 14th International Manufacturing Conference in China (IMCC2011)，Tianjin, October 13-15, 2011.

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Copyright ? 2019 西南交通大学. All Rights Reserved.蜀ICP备**号
地址：中国四川省成都市高新区西部园区西南交通大学
川公网安备061号
技术支持：信息化与网络管理处
访问量：次

个人信息MORE +
秦娜Qin Tina 讲师
教师英文名称： Qin Tina
所在单位： 机械工程学院
学历： 博士研究生毕业
办公地点： 西南交通大学先进设计与制造技术研究所
联系方式： tinaspirit@home.swjtu.edu.cn
学位： 工学博士学位
职称： 讲师
电子邮箱： tinaspirit@home.swjtu.edu.cn
主要任职： Lecturer
毕业院校： 美国堪萨斯州立大学
硕士生导师
学科：机械工程

同专业硕导

论文成果当前位置: 中文主页 >> 科学研究 >> 论文成果

Guo, D.M, Qin, N., Kang, R.K., Jin, Z.J.. Novel measurement technique on 3D surface topography of polishing pad, Advanced Materials Research, 2008, 53-54: 265-272.
2. Qin, N., Pei, Z.J., Treadwell, C., Guo, D.M.. Physics-based predictive cutting force model in ultrasonic-vibration-assisted grinding for titanium drilling, Journal of Manufacturing Science and Engineering, 2009, 131 (4)：041011-1-041011-9.
3. Qin, N., Pei, Z.J., Fisher, G.R., Liu, J.. Simultaneous double-side grinding of silicon wafers: a review and analysis of experimental investigations, Machining Science and Technology, 2009, 13 (3):285-316.
4. Qin, N., Guo, D.M., Kang, R.K., Huo, F.W.. Effect of Conditioning Parameters on Surface Non-uniformity of Polishing Pad in Chemical Mechanical Planarization, Key Engineering Materials, 2009, 389-390: 498-503.
5. Qin, N., Pei, Z.J., Guo, D.M.. Ultrasonic-vibration-assisted grinding of titanium: cutting force modeling with design of experiments, Proceedings of the ASME International Manufacturing Science & Engineering Conference, 2009, 2: 619-624.
6. Qin, N., Pei, Z.J., and Guo, D.M.. Nanotopography in silicon wafer manufacturing: a literature review, Proceedings of ASME International Manufacturing Science & Engineering Conference, 2009, 1:721-728.
7. Qin, N., Pei, Z.J., Guo, D.M. Cong, W.L.. Effects of tool design on edge chipping in ultrasonic-vibration-assisted grinding, Proceedings of the 2010 ASME International Manufacturing Science and Engineering Conference, 2010, Erie, Pennsylvania, USA.
8. Qin, N., Pei, Z.J.. Four empirical models for pelleting of cellulosic biomass, Proceedings of the 2010 ASME International Manufacturing Science and Engineering Conference MSEC2010, October 12-15, 2010, Erie, Pennsylvania, USA.
9. Qin, N., Cong, W.L., Pei, Z.J., Cong, W.L., Treadwell, C., and Guo, D.M.. 2010, “Ultrasonic-vibration-assisted grinding of brittle materials: a mechanistic model for cutting force,” Proceedings of the ASME 2011 International Manufacturing Science and Engineering Conference, June 13-17, 2011, Corvallis, Oregon, USA.
10. Qin, N., Pei, Z.J., Guo, D.M., Cong, W.L.. UVAG of brittle materials: DoE with a cutting force model, Proceedings of the 2010 Industrial Engineering Research Conference, June 5-9, 2010, Cancún, Mexico.
11. Qin, N., Pei, Z. J.. Fundamental Research on Silicon Wafer Fine Grinding: 2010 Progress Report, 2011 NSF CMMI Grantees Conference, Jan 4-7, in Atlanta, GA.
12. Zhang, M., Song, X.X., Deines, T., Zhang, P.F., Zhang, Q., Cong, W.L., Qin, N., Pei, Z.J.. Ultrasonic-vibration-assisted Pelleting of Switchgrass: Effects of Binder Material, Proceedings of the 2010 Industrial Engineering Research Conference, June 5-9, 2010, Cancún, Mexico.
13. P.F., Zhang, Deines, T., W.L. Cong Cong, W.L., Qin, N., Pei, Z.J., Nottingham, D.. Ultrasonic vibration-assisted pelleting of switchgrass: effects of moisture content on pellet density, spring-back, and durability, Proceedings of the 2010 Flexible Automation and Intelligent Manufacturing International Conference, July 12-14, 2010, Hayward, CA.
14. Cong, W.L., P.F., Zhang, Qin, N., Deines, T., Zhang, M., Pei, Z.J.. Ultrasonic-vibration-assisted pelleting of switchgrass: effects of ultrasonic vibration, The 14th International Manufacturing Conference in China (IMCC2011)，Tianjin, October 13-15, 2011.

Guo, D.M, Qin, N., Kang, R.K., Jin, Z.J.. Novel measurement technique on 3D surface topography of polishing pad, Advanced Materials Research, 2008, 53-54: 265-272.
2. Qin, N., Pei, Z.J., Treadwell, C., Guo, D.M.. Physics-based predictive cutting force model in ultrasonic-vibration-assisted grinding for titanium drilling, Journal of Manufacturing Science and Engineering, 2009, 131 (4)：041011-1-041011-9.
3. Qin, N., Pei, Z.J., Fisher, G.R., Liu, J.. Simultaneous double-side grinding of silicon wafers: a review and analysis of experimental investigations, Machining Science and Technology, 2009, 13 (3):285-316.
4. Qin, N., Guo, D.M., Kang, R.K., Huo, F.W.. Effect of Conditioning Parameters on Surface Non-uniformity of Polishing Pad in Chemical Mechanical Planarization, Key Engineering Materials, 2009, 389-390: 498-503.
5. Qin, N., Pei, Z.J., Guo, D.M.. Ultrasonic-vibration-assisted grinding of titanium: cutting force modeling with design of experiments, Proceedings of the ASME International Manufacturing Science & Engineering Conference, 2009, 2: 619-624.
6. Qin, N., Pei, Z.J., and Guo, D.M.. Nanotopography in silicon wafer manufacturing: a literature review, Proceedings of ASME International Manufacturing Science & Engineering Conference, 2009, 1:721-728.
7. Qin, N., Pei, Z.J., Guo, D.M. Cong, W.L.. Effects of tool design on edge chipping in ultrasonic-vibration-assisted grinding, Proceedings of the 2010 ASME International Manufacturing Science and Engineering Conference, 2010, Erie, Pennsylvania, USA.
8. Qin, N., Pei, Z.J.. Four empirical models for pelleting of cellulosic biomass, Proceedings of the 2010 ASME International Manufacturing Science and Engineering Conference MSEC2010, October 12-15, 2010, Erie, Pennsylvania, USA.
9. Qin, N., Cong, W.L., Pei, Z.J., Cong, W.L., Treadwell, C., and Guo, D.M.. 2010, “Ultrasonic-vibration-assisted grinding of brittle materials: a mechanistic model for cutting force,” Proceedings of the ASME 2011 International Manufacturing Science and Engineering Conference, June 13-17, 2011, Corvallis, Oregon, USA.
10. Qin, N., Pei, Z.J., Guo, D.M., Cong, W.L.. UVAG of brittle materials: DoE with a cutting force model, Proceedings of the 2010 Industrial Engineering Research Conference, June 5-9, 2010, Cancún, Mexico.
11. Qin, N., Pei, Z. J.. Fundamental Research on Silicon Wafer Fine Grinding: 2010 Progress Report, 2011 NSF CMMI Grantees Conference, Jan 4-7, in Atlanta, GA.
12. Zhang, M., Song, X.X., Deines, T., Zhang, P.F., Zhang, Q., Cong, W.L., Qin, N., Pei, Z.J.. Ultrasonic-vibration-assisted Pelleting of Switchgrass: Effects of Binder Material, Proceedings of the 2010 Industrial Engineering Research Conference, June 5-9, 2010, Cancún, Mexico.
13. P.F., Zhang, Deines, T., W.L. Cong Cong, W.L., Qin, N., Pei, Z.J., Nottingham, D.. Ultrasonic vibration-assisted pelleting of switchgrass: effects of moisture content on pellet density, spring-back, and durability, Proceedings of the 2010 Flexible Automation and Intelligent Manufacturing International Conference, July 12-14, 2010, Hayward, CA.
14. Cong, W.L., P.F., Zhang, Qin, N., Deines, T., Zhang, M., Pei, Z.J.. Ultrasonic-vibration-assisted pelleting of switchgrass: effects of ultrasonic vibration, The 14th International Manufacturing Conference in China (IMCC2011)，Tianjin, October 13-15, 2011.

Copyright ? 2019 西南交通大学. All Rights Reserved.蜀ICP备**号
地址：中国四川省成都市高新区西部园区西南交通大学
川公网安备061号
技术支持：信息化与网络管理处
访问量：次