| 姜营玺,景栋,张华炜,周秉文,孟令刚,张丹宁,张兴国.铝铜微叠层复合材料制备和组织性能研究[J].,2021,61(1):39-45 |
| 铝铜微叠层复合材料制备和组织性能研究 |
| Preparation, microstructure and properties study of Al-Cu micro laminated composite |
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| DOI：10.7511/dllgxb202101006 |
| 中文关键词:铝铜微叠层复合材料真空热压显微组织显微硬度导电率导热系数 |
| 英文关键词:Al-Cu micro laminated compositevacuum hot pressingmicrostructuremicrohardnesselectric conductivitythermal conductivity |
| 基金项目:国家自然科学基金资助项目(51971049);国家重点研发计划变革性技术关键科学问题项目(2018YFA0702903). |
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| 中文摘要: |
| 通过真空热压法制备出铝铜金属间化合物微叠层复合材料,研究了保温时间、热压温度等工艺参数对成形过程的影响.采用SEM 对结合界面进行显微形貌观察,利用EPMA 表征界面处元素分布,确定出扩散层的数量和种类;通过显微硬度测试分析结合界面处的硬度分布.另外,分析了不同工艺条件下铝铜微叠层复合材料的导电率和导热系数.结果表明:随热压温度升高,铝铜微叠层复合材料结合界面处扩散层析出相种类逐渐变多、厚度逐渐增加,同时导致复合材料导电率呈现出先升后降,而导热系数则保持单调下降的态势.显微硬度的测试结果呈现由Cu层和Al层向扩散层急剧增大的规律,且在扩散层中部硬度达到最大值.最终确定热压温度570℃、保温时间4h为较优的制备工艺,获得的铝铜微叠层复合材料导电率为55.75%(IACS),导热系数为258.3W/(m·K). |
| 英文摘要: |
| Al-Cu intermetallic compound micro laminated composite is prepared by vacuum hot pressing method. The effects of holding time, hot pressing temperature and other process parameters of the forming process are studied. SEM is used to observe the micro morphology of the bonding interface, EPMA is used to characterize the distribution of elements at the interface, and the number and type of diffusion layer are determined. The hardness distribution at the bonding interface is analyzed by microhardness test. In addition, the electric conductivity and thermal conductivity of Al Cu micro laminated composite under different processing conditions are analyzed. The results show that with the increase of hot pressing temperature, the type and thickness of diffusion layer at the bonding interface of Al-Cu micro laminated composite gradually increase, and the electric conductivity of the composite increases first and then decreases, while the thermal conductivity of the composite keeps a monotonous decline. The results of microhardness test show that the microhardness increases sharply from Cu layer and Al layer to diffusion layer, and the hardness reaches the maximum in the middle of diffusion layer. Finally, the optimal preparation process is determined as the hot pressing temperature of 570 ℃ and the holding time of 4 h, the electric conductivity of the Al Cu micro laminated composite is 55.75% (IACS) and the thermal conductivity is 258.3 W/(m·K). |
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