基本资料

姓名： 秦明 性别： 男
学历： 研究生 生日： 1967.10
职称： 教授 职务：

电话： Email： mqin@seu.edu.cn

研究方向

微电子机械系统（MEMS）流量、风速、气压等传感器；MEMS工艺、封装；MEMS器件的驱动与测量技术。
MEMS嵌入式微系统、片上集成与封装技术等。

个人简历

教育简历：
1991.3~1997.10：东南大学电子工程系硕士和博士研究生学习，获微电子与固体电子学硕士和博士学位；
工作简历：
1998.4~2000.10: 香港科技大学电子与电机工程系，访问****。
1997.11~：东南大学电子科学与工程学院教授，博士生导师。

研究成果

Piezoresistive temperature sensors fabricated by a surface micromachining CMOS MEMS process
作者: Cai, Chunhua; Tan, Junyan; Hua, Di; 等.
SCIENTIFIC REPORTS 卷: 8 文献号: 17065 出版年: NOV 20 2018
Octagon-Shaped 2-D Micromachined Thermal Wind Sensor for High-Accurate Applications
作者: Ye, Yizhou; Yi, Zhenxiang; Gao, Shixuan; 等.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 卷: 27 期: 4 页: 739-747 出版年: AUG 2018
A 2D Wind Sensor Using the Delta P Thermal Feedback Control
作者: Wang, Shang; Yi, Zhenxiang; Qin, Ming; 等.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 卷: 27 期: 3 页: 377-379 出版年: JUN 2018
EIGHT-TRIGRAM-INSPIRED MEMS THERMAL WIND SENSOR WITH IMPROVED ACCURACY
作者: Ye, Yizhou; Yi, Zhenxiang; Qin, Ming; 等.
会议: 31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS) 会议地点: Belfast, NORTH IRELAND 会议日期: JAN 21-25, 2018
会议赞助商: IEEE
2018 IEEE MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) 丛书: Proceedings IEEE Micro Electro Mechanical Systems 页: 836-839 出版年: 2018
Effect of Insulation Trenches on Micromachined Silicon Thermal Wind Sensors
作者: Ye, Yizhou; Yi, Zhenxiang; Gao, Shixuan; 等.
IEEE SENSORS JOURNAL 卷: 17 期: 24 页: 8324-8331 出版年: DEC 15 2017
Modelling and characterization of a robust, low-power and wide-range thermal wind sensor
作者: Zhu, Yanqing; Qin, Ming; Ye, Yizhou; 等.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 卷: 23 期: 12 页: 5571-5585 出版年: DEC 2017
DRIE Trenches and Full-Bridges for Improving Sensitivity of 2-D Micromachined Silicon Thermal Wind Sensor
作者: Ye, Yizhou; Yi, Zhenxiang; Gao, Shixuan; 等.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 卷: 26 期: 5 页: 1073-1081 出版年: OCT 2017
Experiment of the MEMS Wind Sensor Based on Temperature-Balanced Mode
作者: Yi, Zhenxiang; Qin, Ming; Huang, Qing-An
IEEE SENSORS JOURNAL 卷: 17 期: 8 页: 2316-2317 出版年: APR 15 2017
DRIE TRENCHES AND FULL-BRIDGES DESIGN FOR SENSITIVITY IMPROVEMENT OF MEMS SILICON THERMAL WIND SENSOR
作者: Ye, Yizhou; Yi, Zhenxiang; Qin, Ming; 等.
会议: 30th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) 会议地点: Las Vegas, NV 会议日期: JAN 22-26, 2017
会议赞助商: IEEE
30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017) 丛书: Proceedings IEEE Micro Electro Mechanical Systems 页: 985-988 出版年: 2017
Sensitivity Improvement of a 2D MEMS Thermal Wind Sensor for Low-Power Applications
作者: Zhu, Yanqing; Qin, Ming; Huang, Jianqiu; 等.
IEEE SENSORS JOURNAL 卷: 16 期: 11 特刊: SI 页: 4300-4308 出版年: JUN 1 2016
Temperature Effects on the Wind Direction Measurement of 2D Solid Thermal Wind Sensors
作者: Chen, Bei; Zhu, Yan-Qing; Yi, Zhenxiang; 等.
SENSORS 卷: 15 期: 12 页: 29871-29881 出版年: DEC 2015
Modeling of Temperature Effects on Micromachined Silicon Thermal Wind Sensors
作者: Huang, Qing-An; Chen, Bei; Zhu, Yan-Qing; 等.
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 卷: 24 期: 6 页: 2033-2039 出版年: DEC 2015
Design and implementation of novel thin film position-sensitive detectors (TFPSDs) based on photoconductive effect
作者: Zhu, Yan-qing; Shan, Yuan-yuan; Qin, Ming
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 卷: 21 期: 9 特刊: SI 页: 1975-1986 出版年: SEP 2015
Development of a self-packaged 2D MEMS thermal wind sensor for low power applications
作者: Zhu, Yan-qing; Chen, Bei; Qin, Ming; 等.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING 卷: 25 期: 8 文献号: 085011 出版年: AUG 2015