王凤江

教授

焊接及电子封装系

材料科学与工程学院


个人邮箱：
fjwang@just.edu.cn

办公地点：
B6-203室、焊接楼403A

通讯地址：
江苏省镇江市梦溪路2号

邮政编码：
212003

传真：







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个人简介
1977年2月生，江苏靖江人。
博士，教授，硕士生导师，江苏省青蓝工程中青年学术带头人。系主任。
1998年江苏科技大学焊接设备及工艺专业本科毕业，2001年江苏科技大学材料加工工程专业硕士毕业，2006年获哈尔滨工业大学材料加工工程工学博士学位。2007年3月至2009年9月期间，赴美国密苏里科技大学MatthewJO’Keefe教授研究室作博士后研究员。2009年10月至2010年6月及2020年1月至2021年1月，赴美国亚历桑那州立大学NikChawla教授研究室作博士后研究员和高级访问****。
主要从事钎焊与扩散焊、电子封装材料及其可靠性等领域的研究工作。
研究重点包括以下三方面：
1.表面组装用微互连材料的开发与应用；
2.微互连焊点的可靠性与失效分析；
3.扩散焊与钎焊技术。
在《ScriptaMaterialia》，《JElectronicMater》，《JMaterSci》，《JAlloyCompd》，《金属学报》，《中国有色金属学报》等国内外学术刊物和学术会议上发表论文SCI论文40余篇。美国矿石，金属材料研究学会(TMS)会员。是国际知名期刊JournalofAlloysandCompounds，Intermetallics和国际电子封装知名材料期刊JElectronicMater的特约审稿人。
迄今指导硕士研究生18余人。指导的研究生获国家奖学金4人次，江苏科技大学优秀毕业生3人次，省研究生创新计划4人次。学生就业去向包括博士深造、长江存储、晶科能源、SK海力士、恒电电子等高校或企业。
欢迎焊接及金属材料等专业的优秀学子报考本课题组！




研究方向




教育经历
教育经历：

2001年9月— 2006年6月哈尔滨工业大学
工学博士专业：材料加工工程

1998年9月— 2001年3月江苏科技大学
工学硕士专业：材料加工工程

1994年9月— 1998年7月江苏科技大学
工学学士专业：焊接设备及工艺


出国进修经历：
2007年3月—2009年9月Missouri University of Science & Technology

博士后 合作导师：Matthew O'Keefe
2009年10月—-2010年6月Arizona State University
博士后 合作导师：Nik Chawla
2015年12月—2016年7月University of Texas at Arlington
访问**** 合作导师：Kim Choong Un

2020年1月—-2021年1月Arizona State University
高级访问**** 合作导师：Nik Chawla









课程教学
主要课程：
电子封装可靠性理论与工程（本科生）
微加工工艺（本科生）
电子封装模拟技术（本科生）
专业英语（本科生）

微纳连接技术（研究生）
高等焊接冶金（留学生）











科研项目 [1] 多场耦合混装焊点的可靠性及其失效机制研究(**)，国家自然科学基金面上项目，2019.1.1-2022.12.31，主持
[2] BGA返修焊点随机振动可靠性及其失效机制研究（BK**），江苏省自然科学基金，2012.8.1-2015.7.31，主持
[3] 新型电子制造用喷射/选择焊接系统开发与产业化，常州市“龙城英才计划”第四批领军人才项目，2013年，主持












专利成果

科研团队

教学随笔

论文著作 期刊



2020年
Qingfeng Wang, Yu Ding, Fengjiang Wang*. Effect of nano ZnO addition on wettability and interfacial structure of Sn-based Pb-free solders on Aluminum. Materiali in Tehnologije (Materials and Technology), 2020, 54: 79-83(IF = 0.84)
2019年
Fengjiang Wang*, Guo Xu, Kai Qi, Di Feng.Interfacial behavior and shear strength of Al-25Si-4Cu-1Mg joints by transient liquid phase bonding with Cu as interlayer.Materials Science and Technology, 2019, submitted.
Qingfeng Wang, Hong Chen,Fengjiang Wang*. Effect of trace Zn addition on the interfacial evolution in Sn-10Bi/Cu solder joints during aging. Materials, 2019, 12(24): 4240 (IF = 2.972)
Kaipeng Wang, Fengjiang Wang*,Ying Huang, Kai Qi. Comprehensive properties of a novel quaternary Sn-Bi-Sb-Ag solder: wettability, interfacial structure and mechanical properties. Metals, 2019, 9(7): 791(IF = 2.259)
Dandan Feng, Fengjiang Wang*, Dongyang Li, Bin Wu, Luting Liu, Mingfang Wu.Atomic migration in Sn-58Bi solder from the interaction between electromigration and thermomigration. Materials Research Express, 2019, 6: 046301 (IF = 1.220)
Fengjiang Wang*, Yu Ding, Luting Liu, Ying Huang, Mingfang Wu.Wettability, interfacial behavior and joint properties of Sn-15Bi solder. Journal of Electronic Materials, 2019, 48(10): 6835-6848(IF = 1.64)
Fengjiang Wang*, Hong Chen, Ying Huang, Luting Liu, Zhijie Zhang.Recent progress on development of Sn-Bi based low-temperature Pb-free solders. Journal of Materials Science: Materials in Electronics, 2019,30: 3222-3243(IF = 2.324，ESI高被引)
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behaviors in Cu/molten Sn–58Bi/Cu solder joints under coupling with thermal and current stressing. Electronic Materials Letters, 2019, 15: 36-48 (IF= 2.882)

2018年
Fengjiang Wang*, Luting Liu, Dongyang Li, Mingfang Wu. Electromigration behaviors in Sn-58Bi solder joints under different current densities and temperatures. Journal of Materials Science: Materials in Electronics, 2018, 29: 21157-21169 (IF = 2.324)
Shuang Tian, Jian Zhou, Feng Xue, RuiHua Cao, Fengjiang Wang. Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding. Journal of Materials Science: Materials in Electronics, 2018, 29: 13688-16400 (IF = 2.324)
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behavior and joint strength of Sn-Bi solder with solid solution compositions. Journal of Materials Science: Materials in Electronics, 2018, 29: 11409-11420 (IF = 2.324)
Fengjiang Wang*, Luting Liu, Mingfang Wu, Dongyang Li. Interfacial evolution in Sn–58Bi solder joints during liquid electromigration. Journal of Materials Science: Materials in Electronics, 2018, 29: 8895-8903 (IF = 2.324)
2017年
Fengjiang Wang*, Dongyang Li, Shuang Tian. Electromigration Reliability of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints. Microelectronics Reliability, 2017, 73: 106-115 (IF = 1.236)
Fengjiang Wang*, Dongyang Li, Jiheng Wang, Xiaojing Wang, Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system, Journal of Materials Science: Materials in Electronics, 2017, 28: 1631-1643 (IF = 2.324)
Fengjiang Wang*, Lili Zhou. Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint. Journal of Electronic Materials, 2017, 46: 6204-6213 (IF = 1.566)
Fengjiang Wang*,Ying Huang, Zhijie Zhang, Chao Yan. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints. Materials, 2017, 10: 920 (IF = 2.467)
Fengjiang Wang*, LutingLiu, Lili Zhou, Jiheng Wang, Mingfang Wu, Xiaojing Wang. Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration. Materials Transactions, 2017, 58: 1593-1600 (IF = 0.675)
Fengjiang Wang*, Dongyang Li, Zhijie Zhang, Mingfang Wu, Chao Yan. Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier. Journal of Materials Science: Materials in Electronics, 2017, 28: 19051-19060 (IF = 2.324)
Shuang Tian, Saiping Li, Jiang Zhou, Feng Xue, Ruihua Cao and Fengjiang Wang. Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solderjoints. Journal of Materials Science: Materials in Electronics, 2017, 28: 16120-16132 (IF = 2.324)
2016年
Fengjiang Wang*, Lili Zhou, Xiaojing Wang, Peng He, Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging, Journal of Alloys and Compounds, 2016, 688: 639-648 (IF = 3.779)
Fengjiang Wang*, Ying Huang. Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test, Materials Science & Engineering A, 2016, 668: 224-233 (IF = 3.414)
Shuang Tian, Fengjiang Wang*, Xiaojing Wang, Dongyang Li, Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing, Materials Letters, 2016, 172: 153-156 (IF = 2.687)
Fengjiang Wang, Matthew O’Keefe and Brandon Brinkmeyer. Microstructural evolution and tensile properties of SnAgCu mixed with Sn-Pb solder alloys. Journal of Alloys and Compounds,2009, 477: 267-273
Fengjiang Wang, et al. Intermetallic compound formation at Sn-3.0Ag-0.5Cu- 1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions. Journal of Alloys and Compounds, 2007, 438: 110-115.
Wang, HQ; Wang, FJ; Gao, F, et al. Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. Journal of Alloys and Compounds, 2007, 433: 302-305.
Fengjiang Wang, Feng Gao, Xin Ma, Yiyu Qian. Depressing effect of 0.2 wt% Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging. Journal of Electronic Materials, 2006, 35(10): 1818-1824.
Fengjiang Wang, Xin Ma and Yiyu Qian.Improvementof microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition. Scripta Materialia, 2005,53: 699-702.
Fengjiang Wang, Xin Ma and Yiyu Qian. Rate-dependent indentation behavior of solder alloys. Journal of Materials Science, 2005, 40: 1923-1928.
Fengjiang Wang, Xin Ma andYiyuQian.Indentationrate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball grid array (BGA) solder joint. Materials Science Forums, 2005, 502: 399-404.
Xin Ma, Fengjiang Wang, Yiyu Qianand Fusahito Yoshida. Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface. Materials letters, 2003, 57: 3361-3365.
王凤江,钱乙余, 马鑫.微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能参数.中国有色金属学报, 2005, 15(5):688-693.
王凤江, 钱乙余, 马鑫.纳米压痕法测量SnAgCu无铅钎料BGA焊点的力学性能参数. 金属学报, 2005, 41(7): 775-779.
会议文章
Fengjiang Wang, Dongyang Li. The influence of adding different Sn-based solder coating into Sn-58Bi/Cu interface on the growth of intermetallic compound. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Ying Huang. The shear strength and fracture mode of Sn-xBi (x=0, 2.5, 5, 15)/Cu solder joints. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Zhiping Xiao. Electromigration behavior of liquid Sn-58Bi/Cu joints through minor Zn alloying substrates. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Matthew O’Keefe.Modeling of Pb-free BGA solder joint fatigue life during random vibration. TMS2010, Feb 14-18, 2010, Seattle, WA, USA.
Fengjiang Wang, Matthew O’Keefe. Effect of Surface Finish, Package Size, and Rework on Pb-free Solder Ball Grid Arrays during Thermal Cycling. TMS2009, Feb 15-19, San Francisco, CA, USA.
Fengjiang Wang, Matthew O’Keefe. Numerical and Experimental Analysis of Ball Grid Array Packages during Random Vibration. TMS2008, Mar 9-13, New Orleans, LA, USA.
Matthew O’Keefe,Fengjiang Wangand Brandon Brinkmeyer. Effect of Incorporating Eutectic Sn-Pb Solder on the Microstructure and Tensile Properties of SAC 305 Pb-free Solder. 2008 International Materials Research Conference, June, 9-12, 2008, Chongqing, China.
H.Q. Wang,F.J. Wang, X. Ma, J. Liu and Y.Y. Qian. Study on reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. The 6th International Conference on Electronics Packaging Technology, August 31-September 1, 2005, Shenzhen, China.
FengjiangWang, Xin Ma and Yiyu Qian. Indentation rate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball Grid Array (BGA) solder joint. IPC/Soldertec 2nd international conference on lead-free electronics, June 22-23, 2004, Amsterdam, Netherlands.
F.J. Wang, X. Ma, Y.Y. Qian and F. Yoshida. A study on intermetallic compound layer development at Pb-free solder/Cu joint interfaces. Proceeding of the International Conference on Designing of Interfacial Structures in Advanced Materials and their Joints, Osaka Japan, 2002: 478-483.
王凤江,钱乙余.无铅钎料/Cu界面间金属学行为研究.钎焊及特种连接会议论文集,2002
专利
王凤江. 一种用于减少锡铋焊点金属间化合物形成的方法. 国家发明专利, 1.0
王凤江. 一种凸点下金属化层构件及制备方法. 国家发明专利, 7.7
吴建雄, 吴建新, 马鑫, 王凤江. 具有抗氧化能力的无铅焊料. 国家发明专利, 专利号ZL 03 1 10895.4
吴建雄, 吴建新, 王凤江, 刘军, 王宏芹. 波峰焊用无铅软钎焊料合金. 国家发明专利, 专利号ZL 03 1 11446.6




获奖动态
1、环境友好型复合钎料创制及应用，中国机械工业科学技术一等奖，2015年
2、钎缝缺陷产生诱因及防控技术，河南省科技进步二等奖，2019年，排名第三
3、国家标准：软钎剂试验方法 第2部分：沸点法，2019年，排名第三








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