Ricky Shi-wei LEE 李世瑋



Telephone Number (852) 2358 7203


Email Email
rickylee@ust.hk



Office Room LSK7004

Links Personal Web

Google Scholar 0y5312YAAAAJ

ORCID 0000-0002-7706-522X

Scopus ID 8425908400



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First Name (and Middle Name If Any)
Ricky Shi-wei
LEE
李世瑋




Highest Degree Acquired (e.g. PhD in Engineering Science)
PhD in Aeronautical and Astronautical Engineering, Purdue University




Related Web Titles
Acting Dean, Systems Hub, HKUST (Guangzhou)
Senior Advisor to the Vice-President for Research and Development
Chair Professor, Department of Mechanical and Aerospace Engineering
Executive Director of Shenzhen Platform Development Office
Director of Additive Manufacturing for Microelectronics & Microsystems Laboratory
Director of Electronic Packaging Laboratory
Director of HKUST Foshan Center for Technology and Commercialization
Director of HKUST Foshan Research Institute for Smart Manufacturing
Director of HKUST LED-FPD Technology Research and Development Center at Foshan




Contact Information Telephone Number (852) 2358 7203


Email Email
rickylee@ust.hk



Office Room LSK7004

Links Personal Web

Google Scholar 0y5312YAAAAJ

ORCID 0000-0002-7706-522X

Scopus ID 8425908400



Research Interests Research Interests
Computational modeling
Electronic packaging
Lead-free soldering
Microelectromechanical systems (MEMS)
Optical fibers and light-emitting diode (LED) packaging




Biography Biography
Prof Ricky Lee received his BSc and MSc degrees from National Taiwan University and Virginia Polytechnic Institute & State University, respectively. In 1992, he graduated from Purdue University with a PhD degree in Aeronautical & Astronautical Engineering. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST). During his career of tenure-track faculty at HKUST, Prof Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Prof Lee is Chair Professor of Mechanical and Aerospace Engineering, and Director of Foshan Research Institute for Smart Manufacturing at HKUST. He also has concurrent appointments as Acting Dean of Systems Hub of HKUST Guangzhou campus, Executive Director of Shenzhen Platform Development Office, and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Prof Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. The topics of his R&D interests include wafer level packaging and 3D IC integration, additive manufacturing, LED packaging for solid-state lighting, lead-free soldering and reliability analysis. The research outcomes of Prof Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 4 books and 9 book chapters. Due to his technical contributions, Prof Lee received many honors and awards over the years. In addition to being the recipient of 13 best/outstanding paper awards and 6 major professional society awards, Prof Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging.



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Research Interests Research Interests
Computational modeling
Electronic packaging
Lead-free soldering
Microelectromechanical systems (MEMS)
Optical fibers and light-emitting diode (LED) packaging




Biography Biography
Prof Ricky Lee received his BSc and MSc degrees from National Taiwan University and Virginia Polytechnic Institute & State University, respectively. In 1992, he graduated from Purdue University with a PhD degree in Aeronautical & Astronautical Engineering. After one year of post-doctoral research at Purdue, he joined the Hong Kong University of Science & Technology (HKUST). During his career of tenure-track faculty at HKUST, Prof Lee once was on secondment to serve as Chief Technology Officer of Nano & Advanced Materials Institute (NAMI) for two and a half years. Currently Prof Lee is Chair Professor of Mechanical and Aerospace Engineering, and Director of Foshan Research Institute for Smart Manufacturing at HKUST. He also has concurrent appointments as Acting Dean of Systems Hub of HKUST Guangzhou campus, Executive Director of Shenzhen Platform Development Office, and Director of HKUST LED-FPD Technology R&D Center at Foshan, Guangdong, China. Prof Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. The topics of his R&D interests include wafer level packaging and 3D IC integration, additive manufacturing, LED packaging for solid-state lighting, lead-free soldering and reliability analysis. The research outcomes of Prof Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 4 books and 9 book chapters. Due to his technical contributions, Prof Lee received many honors and awards over the years. In addition to being the recipient of 13 best/outstanding paper awards and 6 major professional society awards, Prof Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging.



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