Refereed conference paper presented and published in conference proceedings
香港中文大学研究人员 ( 现职)
| 汪正平教授 (电子工程学系) |
全文
| 数位物件识别号 (DOI) http://dx.doi.org/10.1109/ECTC.2012.6249074 |
引用次数
Scopushttp://aims.cuhk.edu.hk/converis/portal/Publication/3Scopus source URL
其它资讯
摘要Nanocomposites have attracted tremendous interest for advanced electronic packaging applications due to their superior electrical, thermal and optical properties. The dispersion of nanometer sized fillers in a polymer matrix, however, is very challenging in the preparation of these nanocomposites, because the nanoparticles have a strong tendency to aggregate. An objective and accurate dispersion analysis method is needed to evaluate the dispersion quality and improve the production of nanocomposites. In the present study, we utilize the microscopic observation and image analysis techniques to quantify the dispersion quality of various important nanocomposites for electronic packaging. We have demonstrated that this method is useful in the preparation of polymer nanocomposites including underfill materials, high-K composites and electrically conductive adhesives. ? 2012 IEEE.
着者Li Z., Gao Y., Moon K.-S., Tannenbaum A., Wong C.P.
会议名称2012 IEEE 62nd Electronic Components and Technology Conference, ECTC 2012
会议开始日29.05.2012
会议完结日01.06.2012
会议地点San Diego, CA
会议国家美国
详细描述organized by IEEE,
出版年份2012
月份10
日期4
页次1752 - 1757
国际标準书号9781467http://aims.cuhk.edu.hk/converis/portal/Publication/319669
国际标準期刊号0569-550http://aims.cuhk.edu.hk/converis/portal/Publication/3
语言英式英语
