Academic Staff List | Prof. King-Ning TU
Prof. King-Ning TU
PhD Harvard University, USA
B.S National Taiwan University, Taiwan
Chair Professor Office: AEB-008
Phone: +(852)-3442-2740
Fax: +(852)-3442-0892
Email: kntu@cityu.edu.hk


Professor TU King-Ning is the Chair Professor of Materials and Electrical Engineering of the City University of Hong Kong. Professor Tu received his BSc degree from National Taiwan University, MSc degree from Brown University, and PhD degree on applied physics from Harvard University in 1968. Professor Tu has been the TSMC Chair Professor and E. Sun Scholar of National Chiao Tung University, Taiwan. Professor Tu is a world leader in the science of thin films, especially in its applications in microelectronic devices, packaging and reliability. His recent work is on predicting failure in modern microelectronics based on entropy production.
Research ExpertiseThin Film Materials Science
Kinetics in Nanoscale Materials
Reliability Science in Microelectronic Devices
Professional Experience04/19 – 03/22 E. Sun Scholar at National Chiao Tung University, sponsored by Ministry of Education, Taiwan
07/16 – Now TSMC Chair Professor, National Chiao Tung Uni., Hsinchu, Taiwan
07/98 – 06/04 Chair, Dept. of Materials Science & Engineering, UCLA
07/93 – 06/16 Professor, Dept. of Materials Science & Engineering and Dept. of Electrical Engineering, UCLA
09/02 – 10/02 Tan Kah Kee visiting professorship in School of Materials Engineering, Nanyang Technology University, Singapore
07/88 – 06/93 Adjunct Professor, Dept. of Materials Science, Cornell University, Ithaca
12/68 – 06/93 IBM T.J. Watson Research Center, Yorktown Heights, New York
09/85 – 10/87: 3rd Level Manager of Materials Science Department
09/78 – 08/85: 2nd Level Manager of Thin Film Science Department
09/72 – 08/78: 1st Level manager of Kinetics and Diffusion Group
HonorsIEEE Division of Components, Packaging, and Manufacturing Technology Award, 2017
Materials Research Society - Fellow, 2014
TMS John Bardeen Award, 2011
TMS-EMPM Division Distinguished Scientist/Engineer Award, 2006
Member of Academia Sinica, ROC, 2002
Humboldt Research Award for Senior US scientists, 1996
Acta/Scripta Metallurgical Lecturer, 1990 - 1992
Churchill College - Overseas Fellow, 1990
The Metallurgical Society - Fellow, 1988
Materials Research Society - President, 1981
The Metallurgical Society - Application to Practice Award, 1981
American Physical Society - Fellow, 1981
Selected Publications from >500 Publications
(citation over >28,000, h-index: 89)Authored a reference book on “Understanding the reliability technology based on entropy production, and other researches” to be published by Index of Science, UK, in 2021.
Co-authored with Prof. Hung-Ming Chen and Prof. Chih Chen a textbook on “Electronic Packaging Science and Engineering” to be published by Wiley in 2021.
Co-authored with Prof. A. M. Gusak a textbook on “Kinetics in Nanoscale Materials”, published by Wiley in 2014
Published a textbook on “Electronic Thin Film Reliability” by Cambridge University Press in 2011, which has been translated into Korean in 2016 (ISBN 978-89-6421-277-6)
Published a reference book on “Solder Joint Technology” which was published by Spring in 2007
Co-authored (with J. W. Mayer and L. C. Feldman) a textbook on “Electronic Thin Film Science,” published by Macmillan in 1992
Tu, K. N., & Gusak, A. M. (2019). A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production. Journal of Applied Physics, 126(7), 075109.
Tu, K. N., Liu, Y., & Li, M. (2017). Effect of Joule heating and current crowding on electromigration in mobile technology. Applied Physics Reviews, 4(1), 011101.
Hsiao, H. Y., Liu, C. M., Lin, H. W., Liu, T. C., Lu, C. L., Huang, Y. S., Chen, C., & Tu, K. N. (2012). Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper. Science, 336(6084), 1007–1010.
Chen, K. C., Wu, W. W., Liao, C. N., Chen, L. J., & Tu, K. N. (2008). Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper. Science, 321(5892), 1066–1069.
Tu, K. N. (2003). Recent advances on electromigration in very-large-scale-integration of interconnects. Journal of Applied Physics, 94(9), 5451–5473.
Tu, K. N. (1994). Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions. Physical Review B, 49(3), 2030–2034.
G?sele, U., & Tu, K. N. (1982). Growth kinetics of planar binary diffusion couples: ’’Thin‐film case’’ versus ’’bulk cases’’. Journal of Applied Physics, 53(4), 3252–3260.
Poate, J. M., Tu, K. N., & Mayer, J. W. (1978). Thin Films: Interdiffusion and Reactions (Electrochemical Society). Wiley.
Mayer, J. W., Poate, J. M., & Tu, K. N. (1975). Thin Films and Solid-Phase Reactions. Science, 190(4211), 228–234.
Tu, K. N., & Turnbull, D. (1967). Morphology of cellular precipitation of tin from lead-tin bicrystals-II. Acta Metallurgica, 15(8), 1317-1323.