Dr. LIU Yingxia (劉影夏博士)
BS (Peking University), PhD (UCLA)
Assistant Professor
Contact Information
| Office: | P6624 YEUNG |
|---|---|
| Phone: | 34424728 |
| Fax: | 34420173 |
| Email: | yingxliu@cityu.edu.hk |
Research Interests
- 3D IC packaging
- Electromigration
- Electrochemical migration
- Low-temperature assembly
Dr. Liu’s primary research interest is in reliability studies of advanced packaging technologies, such as Fan Out Packaging, and 2.5D/3D IC Packaging. Her recent research also extends to the development of interconnect and packaging technology for flexible electronics.
Education:
2012 BS in Chemistry, Peking University, China
2016 PhD in Material Science and Engineering, UCLA, USA.
Her PhD thesis is about the reliability studies on the scaling effect of solder joints in 3D IC.
Education:
2012 BS in Chemistry, Peking University, China
2016 PhD in Material Science and Engineering, UCLA, USA.
Her PhD thesis is about the reliability studies on the scaling effect of solder joints in 3D IC.
Previous Experience
- Sep 2018 - Oct 2021, Associate Professor, Beijing Institute of Technology, Beijing, China. Research in the development of low-melting-point solder for advanced packaging technology.
- Nov 2016 - Aug 2018, Quality and Reliability R & D Engineer, Intel, San Jose, USA . Research in the reliability studies of Intel’s 2.5D IC packaging technology, EMIB (Embedded Multi-Die Interconnect Bridge).
Publications
Journal
- Liu, Y*. , Pu, L. , Yang, Y*. , He, Q. , Zhou, Z. , Tan, C. , Zhao, X. , Zhang, Q. & Tu, K. N. (2020). A high entropy alloy as very low melting point solder for advanced electronic packaging. Materials Today Advances. 7. 100101 .
- Wu, R. , Zhao, X. & Liu, Y*. (2020). Atomic insights of Cu nanoparticles melting and sintering behavior in Cu-Cu direct bonding. Materials & Design. 197. 109204 .
- Pu, L. , Liu, Y*. , Yang, Y. , He, Q. , Zhou, Z. , Zhao, X. , Tan, C. & Tu, K. N. (2020). Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation. Materials Letters. 127891 .
- Liu, Y*. & Tu, K. N. (2020). Low melting point solders based on Sn, Bi, and In elements. Materials Today Advances. 8. 100115 .
- Liu, Y*. , Shi, X. , Ren, H. , Cai, J. , Zhao, X. , Tan, C. & Tu, K. N. (2020). Surface diffusion controlled reaction in small size microbumps. Materials Letters. 284. 129036 .
- Liu, Y*. , Pu, L. , Gusak, A. , Zhao, X. , Tan, C. & Tu, K. N. (2020). Ultra-thin intermetallic compound formation in micro-bump technology by the control of interfacial reaction kinetics between SnBiInZn solder and Cu. Materialia. 100791 .
- Tu, K. N*. & Liu, Y. (2019). Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology. Materials Science and Engineering: R: Reports. 136. 1 - 12.
- Tu, K. N*. , Liu, Y. & Li, M. (2017). Effect of Joule heating and current crowding on electromigration in mobile technology. Applied Physics Reviews. 4. 011101 .
- Liu, Y. , Chen, Y. T. , Gu, S. , Kim, D. W. & Tu, K. N*. (2016). Fracture reliability concern of (Au,Ni)Sn4 phase in 3D integrated circuit microbumps using Ni/Au surface finishing. Scripta Materialia. 119. 9 - 12.
- Liu, Y. , Chu, Y. C. & Tu, K. N*. (2016). Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter. Acta Materialia. 117. 146 - 152.
- Liu, Y. , Tamura, N. , Kim, D. W. , Gu, S. & Tu, K. N*. (2015). A metastable phase of tin in 3D integrated circuit solder microbumps. Scripta Materialia. 102. 39 - 42.
- Liu, Y. , Li, M. , Kim, D. W. , Gu, S. & Tu, K. N*. (2015). Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5 D integrated circuits. Journal of Applied Physics. 118. 135304 .
