不同Cu/Sn比与IMC-Cu复合微焊点形成速度的相关性

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本站小编 Free考研考试/2024-10-07

作者:孙凤莲,李文鹏,潘振
Authors:\n\tSUN Feng-lian, LI Wen-peng, PAN Zhen\n
摘要:摘要:为了研究不同Cu/Sn比对复合微焊点IMC-Cu界面生长行为的影响，采用瞬态液相连接技术与热压焊相结合的方法，以泡沫铜、纯Sn和Cu基板为原料，制备IMC-Cu复合微焊点研究不同Cu/Sn比对复合微焊点IMC生长行为影响。结果表明:Cu/Sn比对复合焊点中IMC生长行为影响显著。随着焊点中Sn含量的减少，IMC的生长速度增加。降低复合微焊点中Sn含量有利于反应界面处Cu₃Sn的生长；获得全Cu₃Sn-Cu复合微焊点的时间随焊点中Sn含量降低而减少。在相同焊接条件下，Sn质量分数为20%的微焊点在焊接25min时率先生成全Cu3Sn接头，较Sn质量分数为40%时焊接时间缩短了20%。当ω(Sn)在20%~40%范围内，随焊点中Sn含量减少，Cu₃Sn的生长速度增加，获得全Cu₃Sn-Cu复合微焊点的时间缩短。
Abstract:Abstract:In order to study the effect of different Cu/Sn ratios on the IMC-Cu interface behavior of composite micro solder joints, this article uses a combination of Transient Liquid Phase Welding and pressure,using foamed copper, pure Sn and Cu substrates as raw materials to prepare IMC-Cu composite micro solder joints.The effect of different Cu/Sn ratio on the growth behavior of composite micro solder joint IMC was studied.The results show that the ratio of Cu/Sn has a significant effect on the growth behavior of IMC in composite solder joints.As the Cu content in the solder joint increases, the growth rate of the overall thickness of the IMC increases.Reducing the Sn content in the composite micro solder joint is beneficial to the growth of Cu₃Sn at the reaction interface.The time to obtain all Cu₃Sn-Cu composite micro solder joints decreases with the decrease of Sn content in the solder joints.Under the same welding conditions.When the bonding time is 25 minutes, the full Cu₃Sn joint is formed first when the Sn content in the composite micro solder joint is 20%, which is 20% shorter than the bonding time when the Sn content is 40%.When the Sn content is in the range of 20%-40%, with the decrease of the Sn content in the solder joints, the growth rate of Cu₃Sn increases, and the time to obtain all Cu₃Sn-Cu composite micro solder joints is shortened.

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不同Cu/Sn比与IMC-Cu复合微焊点形成速度的相关性

本站小编 Free考研考试/2024-10-07

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