基本信息教学/Teaching科研/Research出版物/Publication学生/StudentsEnglish Version
基本信息
王晨曦，男，先进焊接与连接国家重点实验室，副教授，博士生导师

日本东京大学博士，博士期间获日本政府文部科学省奖学金和日本21世纪全球优秀人才项目(Global COE)的资助， 2007年国家优秀自费留学生奖学金，美国电化学学会优秀学生研究基金，博士论文获2010年东京大学工学院院长奖，2009-2011年日本学术振兴会(JSPS)外籍特别研究员。多篇论文获国际会议最佳论文奖(Best Paper Award)，杰出论文奖(Outstanding Paper Award)和青年学者论文奖。2011年、2013年和2017年三次获邀在电子封装技术国际会议(ICEPT)上做分会场邀请报告。现主持承担国家自然科学基金等6项课题。

教育经历
1998年--2002年 哈尔滨工业大学 材料学院 焊接系 本科 (英才学院）

2002年--2004年 哈尔滨工业大学 材料学院 焊接系 硕士

2004年--2005年 新加坡国立大学 机械工程系 研究生

2005年2月--9月 东北师范大学 留日本预备学校 日语学习

2005年--2009年 东京大学 精密机械工程系 博士(获日本政府文部省奖学金)

工作经历
时间工作经历
2009年8月 - 2011年7月 东京大学工学系研究科 日本学术振兴会(JSPS)外籍特别研究员
2011年10月 - 2014年12月 东京大学 工学系研究科 主任研究员
2014年12月- 至今 哈尔滨工业大学 材料学院 副教授
2018年4月- 至今 哈尔滨工业大学 材料学院 博士生导师


获奖情况
2003年年获电子封装国际会议大会最佳论文奖(Best Paper Award of ICEPT2003)

2004年获哈尔滨工业大学首届研究生“十佳英才”

2005年获日本文部科学省国费奖学金 (2005-2008年)

2007年获电子封装国际会议大会最佳论文奖(NXP Semiconductor Best Paper Award)

2007年 国家优秀自费留学生奖学金

2010年 博士论文获东京大学工学院院长奖

2009年获日本学术振兴会(JSPS)外籍特别研究员奖励基金(2009-2011)

2010年获电子封装国际会议大会杰出论文奖(JCET Outstanding Paper Award)

2010年合作论文获IEEE-CPMT Japan Symposium青年学者论文奖(Young Award)

2011年获2nd Advanced Welding & Joining Technology Conference最佳报告奖(Best Presentation Award)

2011年获电子封装国际会议大会杰出论文奖(JCET Outstading Paper Award)

2016年 哈尔滨工业大学“优秀专兼职工作者”荣誉称号 (班主任)

2017年 哈尔滨工业大学“优秀专兼职工作者标兵”荣誉称号 (班主任)

2017年获电子封装国际会议大会杰出论文奖(ICEPT Outstanding Paper Award)

2018年获哈尔滨工业大学第六届青年教师研究生课程教学竞赛一等奖

2018年获哈尔滨工业大学百优本科毕业论文奖(指导教师，学生：康秋实)


主要任职
2006年至2007年任东京大学中国留学人员友好联谊会 学术部部长

2011年，2013年，2016年和2017年任国际电子封装技术会议(ICEPT) 分会场主席

美国电气电子工程师学会(IEEE) 会员 (2008年-至今)

美国电化学学会(ECS)会员 (2008年-至今)

全日本中国人博士协会 会员 (2009年-至今)

全日本华人科学技术促进会 理事 (2017年-至今)

广东省电子学会SMT专委会资深专家委员(2018年-至今)

我的新闻

新闻标题祝贺2016级硕士生和2014级本科生顺利毕业！

发表时间2018-07-10

祝贺王源同学硕士顺利毕业！祝贺康秋实、吴斌本科顺利毕业！祝愿你们在未来学习和工作的道路上，不断向前，快乐幸福！



新闻标题关于公布哈尔滨工业大学2018年度遴选通过博士生指导教师名单的通知

发表时间2018-04-27

http://hitgs.hit.edu.cn/2018/0425/c3330a206362/page.htm



新闻标题王晨曦副教授被聘为广东省电子学会SMT专委会资深专家委员

发表时间2017-12-30


新闻标题王晨曦获"优秀专兼职学生工作者标兵"荣誉称号

发表时间2017-12-14

学校表彰学生先进集体、个人和优秀学生工作者

http://news.hit.edu.cn/ed/fb/c1510a191995/page.htm




新闻标题论文入选JSS期刊2017年第7期封面图片

发表时间2017-09-07

本小组的论文入选ECS Journal of Solid State Science and Technology (SCI影响因子: 1.787)期刊2017年第7期的封面图片。
链接： http://jss.ecsdl.org/content/6/7.cover-expansion

论文信息：

Chenxi Wang, Yannan Liu, Yue Li, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Mechanisms for Room-Temperature Fluorine Containing Plasma Activated Bonding”, ECS Journal of Solid State Science and Technology, Vol. 6, No. 7, 2017, pp. P373-P378.





新闻标题论文获电子封装国际会议(ICEPT2017)大会杰出论文奖(Outstanding Paper Award)

发表时间2017-08-22


新闻标题王晨曦副教授在第十八届电子封装技术国际会议(ICEPT2017)上做特邀报告(Invited Session Keynote Speaker)

发表时间2017-8-22

报告题目：Room-Temperature Wafer Direct Bonding Using a One-Step Fluorinated Plasma Surface Activation




新闻标题祝贺2015级硕士生和2013级本科生顺利毕业！

发表时间2017-07-04

祝贺刘艳南、孙亚汝（合作指导）、张悦（合作指导）三名硕士生顺利毕业！祝贺戚晓云、袁志天2名本科生顺利毕业！祝愿我的学生在未来学习和工作的道路上，鹏程万里，再创辉煌！



新闻标题王晨曦副教授在第十一届材料学院研究生模拟国际学术会议上做“半导体晶圆室温直接键合”的大会特邀报告

发表时间2017-01-10

http://today.hit.edu.cn/news/2017/01-04/**RL0.htm


新闻标题祝贺2012级本科生顺利毕业！

发表时间2016-7-2

祝贺付英杰、曾小润、刘洋、许继开4名2012级本科生顺利毕业！祝愿我的学生在未来的道路上，学业有成，一帆风顺！



新闻标题王晨曦副教授参加在芬兰赫尔辛基举行的第68次国际焊接年会(IIW)并做报告

发表时间2015-08-26

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新闻标题课题“水蒸气辅助等离子体活化室温键合及其机理研究” 获国家自然科学基金资助

发表时间2015-08-26

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讲授课程
微纳加工工艺 (Micro-nanofabrication Technologies)（本科生必修课，36学时）

简介：微纳加工涉及材料在微米、纳米等多尺度的加工技术，广泛应用于物理、化学、材料、电子、机械和生物等各种学科，是焊接/电子封装技术专业的主干课程。本课程通过课堂教学及项目研究等环节使学生熟练掌握各种典型微纳加工技术的基本原理与方法，培训学生将所学的微纳加工知识应用于先进的电子/机械/生物医疗等制造领域，锻炼学生能利用文献检索获取微纳加工技术发展的趋势和最新动态，培养主动学习的意识。课程主要内容包括：传统光学曝光技术、电子束曝光技术、聚焦离子束曝光技术、扫描探针加工技术、微纳米尺度的复制技术、各种沉积法与刻蚀法图形转移技术、间接纳米加工技术与自组装纳米加工技术。

专业英语训练 (Professional English Training) （本科生选修课，双语，16学时）

简介: 专业英语训练是电子封装技术专业的基础课程，是国际化人才培养的重要一环。通过课堂学习使学生认识到科技英语的重要性和实用性；对于科技英语中的基本特点、分体风格及一般格式有所了解；对于电子制造领域的专业中英文词汇有一定了解，能较熟练地进行科技领域的文献查阅及翻译工作；了解英文科技口头报告的幻灯片制作和演讲方法，能较熟练的用英文作口头报告，激发学生对本专业学习的兴趣与自觉性。

微纳连接技术 (Micro-and Nano-joining Technologies)（研究生选修课，双语，16学时）

简介：本课程将从材料加工和电子制造领域出发，使学生掌握微电子制造中的微纳连接技术方法和基础理论。了解最先进的微连接方法的原理、过程控制及界面冶金行为，明确激光超声无钎剂软钎焊方法氧化膜去除的原理、超声键合过程中超声对界面原子扩散的促进作用；通过钎料与材料之间界面电子结构，掌握润湿性和可钎焊性的基本原理；通过微连接界面微观组织的演变，了解微连接接头界面行为的尺寸效应；通过钎料合金中元素的迁移、界面间的相互影响，掌握微互连接头中的扩散动力学；掌握含有限晶粒的微连接接头的力学行为、裂纹尖端物理及扩展行为、力学行为的尺寸效应；掌握微互连接头中电迁移和锡须产生的基本原理、失效模式及最新研究进展；了解电子制造领域最前沿的纳米互连技术及发展趋势。

创新创业训练
创新研修课

半导体晶圆室温连接 （Room-Temperature Semiconductor Wafer Bonding） （16学时）

简介：微电子、微机电系统(MEMS)和微纳流控芯片的进步正在悄然地改变人类的生活。连接（又被称为“键合”）是整合多元复杂微纳系统不可替代的重要环节。为了尽可能减小高温连接过程所引发的诸多问题，无需加热的室温键合（~25℃）技术被视为下一代制造工艺的备选。本课程以半导体制造中的晶圆键合为例介绍室温连接的基本原理和工艺流程，并说明如何利用该技术推动半导体工业的进步。与微纳流控芯片开发实例相结合，讲授室温连接技术在化学、医疗和能源等领域的最新进展，引导学生把握科技前沿，开拓学生视野，培养快速吸收新知识的能力和创造力。

创新创业教育类课程

道法自然--仿生智能材料中的创新（16学时）

简介：向自然学习，自古以来就是人类设计与发明灵感的源泉。自然界的生物经过45亿年的进化，达到了适应自然环境近乎完美的程度。仿生学是模仿生物系统特征的科学，近年来随着材料科学的进步，发展十分迅速。本课程将以仿生智能材料的发展及应用为主要内容，重点讲授仿生智能材料概论、自然界中生物体特殊的表面性能、仿生自修复材料和微纳米流控芯片实验室等方面的研究进展。课程以推进学生对大自然的深入了解，启发学生对前沿交叉学科的兴趣，具备良好的系统观和整体观为目标，涉及物理、化学、材料、电子和机械等多领域交叉，开拓学生视野，提高学生的科学和工程素养，培养学生快速吸收新知识、独立思考和创新实践能力，为学生今后在科研中开展创新工作奠定基础。


科技创新项目

半导体晶圆键合缺陷的红外无损检测系统的设计与开发（2016年大一年度科技创新项目校一等奖，指导教师）

手机贴膜过程中灰尘颗粒对气泡形成的影响（2017年大一年度科技创新项目校一等奖，指导教师）

晶圆键合红外无损检测系统的设计与研发（2017年第七届“祖光杯”创新创业大赛铜奖，指导教师）

多功能紫外光自动活化晶圆装置（2017年第七届“祖光杯”创新创业大赛铜奖，指导教师）

适用于芯片热管制备的真空紫外光自动键合装置及方法（2018年第八届“祖光杯”创新创业大赛银奖，指导教师）

面向三维封装的紫外光表面活化低温键合装置的开发（2018年大学生创新创业训练计划项目校一等奖，指导教师）

适用于芯片热管制备的真空紫外光自动键合装置及方法（2018年第四届黑龙江省互联网+大学生创新创业大赛“二等奖，指导教师）

所在团队
王春青 教授链接地址：http://homepage.hit.edu.cn/wangchunqing

田艳红 教授链接地址：http://homepage.hit.edu.cn/tinatian

研究领域
1. 半导体晶圆室温键合

2. 基于表面活化法的异质材料键合

3. 微纳米流控器件的开发和制造

4. 生物医学材料的连接

期刊论文 Journal Papers


*通讯作者(Corresponding Author)

SCI检索期刊论文
38. Jikai Xu, Chenxi Wang*, Daoyuan Li, Ji Cheng, Yiping Wang, Chunjin Hang, and Yanhong Tian, “Fabrication of SiC/Si, SiC/SiO₂, and SiC/glass Heterostructures via VUV/O3 Activated Direct Bonding at Low Temperature”, Ceramics International, Vol. 45, 2019, 4094-4098.

37. Chenxi Wang*, Jikai Xu, Shu Guo, Qiushi Kang, Yuan Wang, Yiping Wang, and Yanhong Tian, “A Facile Method for Direct Bonding of Single-Crystalline SiC to Si, SiO₂, and Glass Using VUV Irradation”, Applied Surface Science, Vol. 471, 2019, pp. 196-204.

36. Chunjin Hang, He Zhang, Yanhong Tian*, Chenxi Wang, Yuan Huang, Zhen Zheng, and Chunqing Wang, “A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package”, Applied Science, Vol. 8, 2188, 2018.
35. Jikai Xu, Chenxi Wang*, Bin Wu, Yanhong Tian*, and Xiaoyun Qi, “Defect-Free Direct Bonding for High-Performance Glass-On-LiNbO3”, Journal of The Electrochemical Society, Vol. 165, No.14, 2018, pp. B727-B729.

34. Jikai Xu, Chenxi Wang*, Yanhong Tian*, Bin Wu, Shang Wang, and He Zhang, “Glass-on-LiNbO₃ Heterostructure Formed via a Two-Step Plasma Activated Low-Temperature Direct Bonding Method”, Applied Surface Science, Vol. 459, 2018, pp. 621-629.

33. Shang Wang, Yanhong Tian*, Chenxi Wang, and Chunjin Hang, “Ag NW Networks Enhanced by Ni Electroplating for Flexible Transparent Electrodes”, Journal of The Electrochemical Society, Vol. 165, No. 9, 2018, pp. D328-D330.

32. Jikai Xu, Chenxi Wang*, Te Wang, Yannan Liu, and Yanhong Tian, “Direct Bonding of Silicon and Quartz Glass Using VUV/O₃ Activation and a Multistep Low-Temperature Annealing Process”, Applied Surface Science, Vol. 453, 2018, pp. 416-422.

31. Jiayun Feng, Chunjin Hang, Yanhong Tian*, Chenxi Wang, and Baolei Liu, “Effect of Electric Current on Grain Orientation and Mechanical Properties of Cu-Sn Intermetallic Compounds Joints”, Journal of Alloys and Compounds, 753, 2018, pp. 203-211.

30. Chenxi Wang*, Xiaoyun Qi, Yuan Wang, Bin Wu, and Yanhong Tian, “Room-Temperature Direct Heterogeneous Bonding of Glass and Polystyrene Substrates”, Journal of The Electrochemical Society, Vol. 165, No. 8, 2018, pp. B3091-B3097.

29. Chenxi Wang*, Daoyuan Li, Shang Wang, Boyan Huang*, and Yanhong Tian, “A Self-Contained Temperature Sensing Approach for Ultrafast Microwelding”, Journal of The Electrochemical Society, Vol. 165, No. 5, 2018, pp. B220-B222.

28. Jikai Xu, Chenxi Wang*, Te Wang, Yuan Wang, Qiushi Kang, Yannan Liu, and Yanhong Tian, “Mechanisms for Low-Temperature Direct Bonding of Si/Si and Quartz/Quartz via VUV/O3 Activation”, RSC Advances, Vol. 8, 2018, pp. 11528-11535.

27. Chenxi Wang*, Te Wang, Kazuma Mawatari, and Takehiko Kitamori*, “Evaporation Driven Micro/Nanofluidic Pumping Device”, Journal of The Electrochemical Society, Vol. 165, No. 5, 2018, pp. B184-B186.

26. Chenxi Wang*, Jikai Xu, Xiaoyun Qi, Yannan Liu, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Direct Homo/Heterogeneous Bonding of Silicon and Glass Using Vacuum Ultraviolet Irradiation in Air”, Journal of The Electrochemical Society, Vol. 165, No. 4, 2018, pp. H3093-H3098.

25. Shang Wang, Yanhong Tian*, Chunjin Hang, and Chenxi Wang, “Cohesively Enhanced Electrical Conductivity and Thermal Stability of Silver Nanowire Networks by Nickel Ion Bridge Joining”, Scientific Reports, Vol. 8, 5260, 2018.

24. Jiayun Feng, Chunjin Hang, Yanhong Tian*, Baolei Liu, and Chenxi Wang, “Growth Kinetics of Cu6Sn5 Intermetallic Compound in Cu-Liquid Sn Interfacial Reaction Enhanced by Electric Current”, Scientific Reports, Vol. 8, 1775, 2018.

23. Chenxi Wang*, Jikai Xu, Xiaorun Zeng, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Low-Temperature Wafer Direct Bonding of Silicon and Quartz Glass by a Two-Step Wet Chemical Surface Cleaning”, Japanese Journal of Applied Physics, Vol. 57, 02BD02, 2018.

22. Chenxi Wang*, Yutaka Kazoe, Kyojiro Morikawa, Hisashi Shimizu, Yuriy Pihosh, Kazuma Mawatari, and Takehiko Kitamori*, “Micro Heat Pipe Device Utilizing Extended Nanofluidics”, RSC Advances, Vol. 7, 2017, pp. 50591-50597.

21. Chenxi Wang*, Yuan Wang, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Room-Temperature Direct Bonding of Silicon and Quartz Glass Wafers”, Applied Physics Letters, Vol. 110, 221602, 2017.

20. Chenxi Wang*, Yannan Liu, Yue Li, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Mechanisms for Room-Temperature Fluorine Containing Plasma Activated Bonding”, ECS Journal of Solid State Science and Technology, Vol. 6, No. 7, 2017, pp. P373-P378. (被选为封面图片)

19. Chenxi Wang*, Xiaofang Gao, Kazuma Mawatari, and Takehiko Kitamori, “Clogging-Free Irreversible Bonding of Polycarbonate Membranes to Glass Microfluidic Devices”, Journal of The Electrochemical Society, Vol. 164, No. 5, 2017, pp. B3087-B3090.

18. Chenxi Wang*, Yannan Liu, and Tadatomo Suga, “A Comparative Study: Void Formation in Silicon Wafer Direct Bonding by Oxygen Plasma Activation with and without Fluorine”, ECS Journal of Solid State Science and Technology, Vol. 6, No. 1, 2017, pp. P7-P13. (被选为封面图片)

17. Ruyu Tian, Yanhong Tian*, Chenxi Wang, and Liyou Zhao, “Mechanical Properties and Fracture Mechanisms of Sn-3.0Ag-0.5Cu Solder Alloys and Joints at Cryogenic Temperatures”, Material Science and Engineering A, Vol. 684, 2017, pp. 697-705.

16. Kyall J. Pocock, Xiaofang Gao, Chenxi Wang, Craig Priest, Clive A. Prestidge, Kazuma Mawatari, Takehiko Kitamori, and Benjamin Thierry* “Low-Temperature Bonding Processes for the　Fabrication of Hybrid Glass-Membrane Organ-on- a-Chip Devices”, Journal of Micro/nanolithography, MEMS and MOEMS, Vol. 15, No. 4, 2016, 044502.

15. Chenxi Wang*, and Tadatomo Suga, “Fluorinated Plasma Treatments Using PTFE Substrates for Room-Temperature Silicon Wafer Direct Bonding”, ECS Journal of Solid State Science and Technology, Vol. 5, No. 7, 2016, pp. P393-395.

14. Baolei Liu, Yanhong Tian*, Chenxi Wang, et al., “Ultrafast Formation of Unidirectional and Reliable Cu3Sn-based Intermetallic Joints Assisted by Electric Current”, Intermetallics, Vol. 80, 2017, pp. 26-32.

13. Baolei Liu, Yanhong Tian*, Jiayun Feng, and Chenxi Wang, “Enhanced Shear Strength of Cu-Sn Intermetallic Interconnects with Interlocking Dendrites Under Fluxless Electric Current-assisted Bonding Process”, Journal of Materials Science, Vol. 52, 2017, pp. 1943-1954

12. Yanhong Tian*, Zhi Jiang, Chenxi Wang, Su Ding, Jiayue Wen, and Zhiquan Liu, “Sintering Mechanism of the Cu-Ag Core-Shell Nanoparticle Paste at Low Temperature in Ambient Air”, RSC Advances, Vol. 6, 2016, pp. 91783-91790.

11. Baolei Liu, Yanhong Tian*, Jingkai Qin, Rong An, Rui Zhang, and Chenxi Wang, “Degradation Behaviors of Micro Ball Array (mBGA) Solder Joints Under The Coupled Effects of Electromigration and Thermal Stress”, Journal of Material Science: Materials in Electronics, Vol. 27, No.11, 2016, pp. 11583-11592.

10. Baolei Liu, Yanhong Tian*, Chenxi Wang, Rong An, and Yang Liu, “Extremely Fast Formation of Cu-Sn Intermetallic Compounds in Cu/Sn/Cu System via a Micro-resistance Spot Welding　Process”, Journal of Alloys and Compounds, No. 687, 2016, pp. 667-673.

9. Zhi Jiang, Yanhong Tian*, Su Ding, Jiayue Wen, and Chenxi Wang, “Facile Synthesis of Cu-Ag Hybrid Nanowires with Strong Surface-Enhanced Roman Scattering Sensitivity”, CrystEngComm , Vol. 18, 2016, pp. 1200-1206.

8. Yan Xu*, Chenxi Wang, Lixiao Li, Nobuhiro Matsumoto, Yiyang Dong, Kihoon Jang, Kazuma Mawatari, Tadatomo Suga, and Takehiko Kitamori*, “Bonding of Glass Nanofluidic Chips at Room Temperature by a One-step Surface Activation Using an O2/CF4 Plasma Treatment”, Lab on a Chip, Vol. 13, 2013, pp. 1048-1052.

7. Yan Xu*, Chenxi Wang, Yiyang Dong, Lixiao Li, Kihoon Jang, Kazuma Mawatari, Yo Tanaka, Tadatomo Suga, and Takehiko Kitamori*, “Low-Temperature Direct Bonding of Glass Nanofluidic Chips Using a Two-step Plasma Surface Activation”, Analytical and Bioanalytical Chemistry, Vol. 402, No. 3, 2012, pp. 1011-1018.

6. Chenxi Wang* and Tadatomo Suga, “Investigation of Fluorine Containing Plasma Activation for Room-Temperature Bonding of Si-based Materials”, Microelectronics Reliability, Vol. 52, No. 2, 2012, pp. 347-351. (邀请论文 Invited Paper)

5. Ryuichi Kondou*, Chenxi Wang, Akitsu Shigetou, and Tadatomo Suga, “Nanoadhesion Layer Enhanced Si-Si and Si-SiN Wafer Bonding”, Microelectronics Reliability, Vol. 52, No.2, 2012, pp. 342-346.

4. Chenxi Wang* and Tadatomo Suga, “Room-Temperature Direct Bonding Using Fluorine Containing Plasma Activation”, Journal of The Electrochemical Society, Vol. 158, No. 5, 2011, pp. H525-529.

3. Chenxi Wang*, Shingo Taniyama, Ying-Hui Wang, and Tadatomo Suga, “High-Precision Alignment for Low Temperature Wafer Bonding”, Journal of The Electrochemical Society, Vol. 156, No. 3, 2009, pp. H197-201.

2. Chenxi Wang*, Eiji Higurashi, and Tadatomo Suga, “Void-Free Room Temperature Silicon Wafer Direct Bonding Using Sequential Plasma Activation”, Japanese Journal of Applied Physics,　Vol. 47, No. 4, 2008, pp. 2526-2530.

1. Chenxi Wang* and Tadatomo Suga, “Measurement of Alignment Accuracy for Wafer Bonding by Moiré Method”, Japanese Journal of Applied Physics, Vol. 46, No. 4B, 2007, pp. 1989-1993.

EI检索期刊及其他论文

12. 王晨曦*, 王源，田艳红，王春青. 基于广义铺展条件下的倒装焊焊点形态预测. 焊接学报, Vol. 39, No. 2, 2018, pp. 1-4+14.

11. 王晨曦*，王特，许继开，王源，田艳红. 晶圆直接键合及室温键合技术研究进展. 精密成形工程, Vol. 10, No. 1, 2018, pp. 67-73.

10. 田茹玉, 王晨曦, 田艳红*，赵利有. 极限温度下CBGA焊点热冲击疲劳寿命预测. 焊接学报, Vol. 38, No. 10, 2017, pp. 93-97.

9. Chenxi Wang, Yue Li, Yannan Liu, Zhitian Yuan, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Investigation of Thermal Treatment Processes for Dissimilar Wafer Bonding”, ECS Transactions, Vol. 77, No. 5, 2017, pp. 143-152.

8. 黄圆，田艳红*，江智，王晨曦. 脉冲电流快速烧结纳米铜焊膏连接铜镍基板研究. 机械工程学报, Vol. 53, No. 4, 2017, pp. 34-42.

7. 杨东升, 王晨曦，田艳红，王春青. In基钎料焊点高温老化组织性能研究. 电子工艺技术, Vol. 38, No. 2, 2017, pp. 67-70.

6. Boyan Huang, Chenxi Wang, Zheng Zhu, Yi Shen, and Yegui Xiao, “Implementation of Unscented Kalman Filter-based Online State-of-Charge Estimation in LiFePO4 Battery-powered Electric Vehicle Applications”, ECS Transactions, Vol. 75, No. 18, 2017, pp. 3-11.

5. 王晨曦, 安荣, 田艳红，王春青. 镀银的铜引线与PCB焊盘平行微隙焊时的界面行为. 焊接学报, Vol. 37, No. 11, 2016, pp. 55-58.

4. Chenxi Wang, Yannan Liu, and Tadatomo Suga, “A Study of Void Formation in Fluorine Containing Plasma Activated Wafer Bonding”, ECS Transactions, Vol.75, No. 9, 2016, pp. 153-161.

3. 王晨曦*，田艳红，王春青. 基于平行微隙焊的薄膜传感器和外引线的互连工艺. 电子工艺技术, Vol. 37, No. 3, 2016, pp. 125-128.

2. Chenxi Wang* and Tadatomo Suga, “Room-Temperature Bonding Using Fluorine Containing Plasma Activation and Its Bonding Mechanism”, ECS Transactions, Vol. 33, No. 4, 2010, pp.485-494.

1. 王晨曦*, 王春青, 孔令超. Ni/NiCr平行微隙焊接接头的形成机理. 焊接学报, Vol. 25, No. 4, 2004, pp. 99-102.

会议论文 Conference Papers
EI检索的国际会议论文

32. Jikai Xu, Chenxi Wang*, Xiaoyun Qi, Bin Wu, Shicheng Zhou, and Yanhong Tian*, “VUV/O3 Activated Bonder for Low-Temperature Direct Bonding of Si-Based Materials”, The 19th International Conference on Electronic Packaging Technology (ICEPT2018), Aug. 8-11, 2018, Shanghai, China, pp. 1448-1452.

31. Xiaoyun Qi, Chenxi Wang*, Qiushi Kang, Daoyuan Li, Yanhong Tian, and Lingchao Kong, “Room-Temperature Bonding and Debonding of Glass and Polystyrene Substrates Based on VUV/O3 Activated Bonding Method”, The 19th International Conference on Electronic Packaging Technology (ICEPT2018), Aug. 8-11, 2018, Shanghai, China, pp. 1453-1456.

30. Jikai Xu, Chenxi Wang*, Xiaoyun Qi, Yongheng Jia, Xiaoliang Ji, Yanhong Tian, and Chunqing Wang, “A Novel Method for Bonding Strength Evaluation”, The 18th International Conference on Electronic Packaging Technology (ICEPT2017), Aug. 16-19, 2017, Harbin, China, pp. 1598-1602. (ICEPT Outstanding Paper Award)

29.Yue Li, Chenxi Wang*, Yuan Wang, Xiaoyun Qi, and Yanhong Tian, “Investigation of Bonding Front Propagation for Wafer Direct Bonding”, The 18th International Conference on Electronic Packaging Technology (ICEPT2017), Aug. 16-19, 2017, Harbin, China, pp. 1603-1606.

28.Yue Zhang, Chenxi Wang*, Zhitian Yuan, Yanhong Tian, Guoliang Fan, and Jason Guo, “Investigation of Moisture Diffusion in Plastic Electronic Packages by Molecular Dynamics”, The 18th International Conference on Electronic Packaging Technology (ICEPT2017), Aug. 16-19, 2017, Harbin, China, pp. 561-564.

27. Yuan Huang, Chunjin Hang, Yanhong Tian*, He Zhang, Chenxi Wang, and Xiuli Wang, “Rapid Sintering of Copper Nanopaste by Pulse Current for Power Electronics Packaging”, The 18th International Conference on Electronic Packaging Technology (ICEPT2017), Aug. 16-19, 2017, Harbin, China, pp. 1626-1630.

26. Chenxi Wang*, Jikai Xu, Xiaorun Zeng, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Low-Temperature Direct Bonding of Silicon to Quartz Glass Wafer via Sequential Wet Chemical Surface Activation”, 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), May 16-18, 2017, Tokyo, Japan, pp. 21.

25. Chenxi Wang*, Jikai Xu, Yannan Liu, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “A Novel Surface Humidity Controlled Bonder for Low-Temperature Wafer Bonding”, The 17th International Conference on Electronic Packaging Technology (ICEPT2016), Aug. 16-19, 2016, Wuhan, China, pp. 893-896.

24. Ruyu Tian, Yanhong Tian*, and Chenxi Wang, “Influence of Low Temperature on Tensile Properties and Fracture Behavior of Sn3Ag0.5Cu Solder Alloy”, The 17th International Conference on Electronic Packaging Technology (ICEPT2016), Aug. 16-19, 2016, Wuhan, China, pp. 116-118.

23. Chenxi Wang*, Yutaka Kazoe, Yuriy Pihosh, Kyojiro Morikawa, Kentaro Kasai, Kazuma Mawatari, and Takehiko Kitamori, “Extended-Nano Heat Pipe Device for Non-electric Cooling”, The 19th International Conference on Miniaturized Systems for Chemistry and Life Science (μTAS2015), Gyeongju, Korea, Oct.25 - 29, 2015, pp.2044-2046.

22. Baolei Liu, Yanhong Tian*, Yang Liu, and Chenxi Wang, “Rapid Formation of Full Cu-In Intermetallic Compounds (IMCs) Joints Under Electronic Current”, 65th Electronic Components and Technology Conference (ECTC2015), San Diego, California, USA, May 26-29, 2015, pp. 1780-1784.

21. Su Ding, Yanhong Tian*, Zhi Jiang, and Chenxi Wang, “Joining of Silver Nanoparticles by Femtosecond Laser Irradiation Method”, 65th Electronic Components and Technology Conference (ECTC2015), San Diego, California, USA, May 26-29, 2015, pp. 1213-1218.

20. Chenxi Wang*, Yutaka Kazoe, Kyojiro Morikawa, Hisashi Shimizu, Kentaro Kasai, Kazuma Mawatari, and Takehiko Kitamori, “Integrated Heat Pipe Device Using Enhanced Capillary Condensation and High Laplace Pressure in Extended Nanospace”, The 18th International Conference on Miniaturized Systems for Chemistry and Life Science (μTAS2014), San Antonio, Texas, USA, Oct.26 - 30, 2014, pp.1341-1343.

19. Kentaro Kasai*, Chenxi Wang, Hisashi Shimizu, Yutaka Kazoe, Kazuma Mawatari, and Takehiko Kitamori, “Enhancement of Capillary Condensation in Extended Nanospace for High-performance Micro Heat Pipe Device”, The 17th International Conference on Miniaturized Systems for Chemistry and Life Science (μTAS2013), Freiburg, Germany, Oct.27 - 31, 2013, pp.1577-1579.

18. Yojiro Hiramatsu*, Chenxi Wang, Hisashi Shimizu, Kazuma Mawatari, and Takehiko Kitamori, “Development of Heat-driven Nanofluidic Pump”, The 17th International Conference on Miniaturized Systems for Chemistry and Life Science (μTAS2013), Freiburg, Germany, Oct.27 - 31, 2013, pp.760-762.

17. Kihoon Jang*, Chenxi Wang, Xu Yan, Takehiko Kitamori, “Development of Fluorine Induced Plasma Activating Room-Temperature Bonding for High-Pressure Micro-Nano Fluidic Devices”, The 16th International Conference on Miniaturized Systems for Chemistry and Life Science (μTAS2012), Okinawa, Japan, Oct.28- Nov.1, 2012, pp. 1237-1239.

16. Keigo Oshigawa*, Chenxi Wang, Masahisa Fujino, and Tadatomo Suga, “Comparison of SAB Method for Room Temperature Bonding of Si Wafers”, 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, Japan, May 22-23, 2012, pp. 113.

15. Chenxi Wang*, Jun Umeda, Yan Xu, Kazuma Mawatari, Takehiko Kitamori and Tadatomo Suga, “Water Vapor Containing Plasma Activation for Room-temperature Bonding”, 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, Japan, May 22-23, 2012, pp. 157.

14. Yan Xu*, Chenxi Wang, Kihong Jang, Lixiao Li, Yiyang Dong, Kazuma Mawatari, Tadatomo Suga, and Takehiko Kitamori, “A Room Temperature Bonding of Glass Nanofludic Chip Utilizing A Surface Activation with Fluorine Containing Plasma Treatment”, The 16th International Conference on Miniaturized Systems for Chemistry and Life Science (μTAS2012), Okinawa, Japan, Oct.28- Nov.1, 2012, pp. 1225-1227.

13.Chenxi Wang* and Tadatomo Suga, “Nanoprecison Aligned Wafer Bonding and Its Outlook”, The 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011), Shanghai, China, Aug. 8-11, 2011, pp. 137-140. (JCET Outstanding Paper Award)

12. Ryuichi Kondou*, Chenxi Wang and Tadatomo Suga, “Room-temperature Si-Si and Si-SiN wafer bonding”, IEEE CPMT Symposium Japan 2010, Tokyo, Japan, August 24-26, 2010, pp. 161-164.(Young Award of IEEE CPMT Symposium Japan 2010)

11. Chenxi Wang* and Chunqing Wang, “Improved Modeling for Solder Joint Geometry and Self-Alignment in Flip Chip Bonding”, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010), Xi’an, China, Aug. 16-19, 2010,pp. 747-752.

10. Chenxi Wang* and Tadatomo Suga, “Novel Room-temperature Fluorine Containing Plasma Activated Bonding and Its Improvements”, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010), Xi’an, China, Aug. 16-19, 2010, pp. 34-39. (JCET Outstanding Paper Award)

9. Ryuichi Kondou*, Chenxi Wang and Tadatomo Suga, “Room-Temperature Si-SiN Wafer Bonding by Nano-adhesion Method”, 60th Electronic Components and Technology Conference (ECTC 2010), Las Vegas, Nevada, USA, June 1-4, 2010, pp. 357-362.

8. Chenxi Wang* and Tadatomo Suga, “A Novel Room-Temperature Wafer Direct Bonding Method by Fluorine Containing Plasma Activation”, 60th Electronic Components and Technology Conference (ECTC 2010), Las Vegas, Nevada, USA, June 1-4, 2010, pp. 303-308.

7. Chenxi Wang* and Tadatomo Suga, “Moiré Method for Nanoprecision Wafer-to-Wafer Alignment: Theory, Simulation and Application”, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), Beijing, China, Aug. 10-13, 2009, pp. 219-224.

6. Chenxi Wang* and Tadatomo Suga, “A Novel Moiré Fringe Assisted Method for Nanoprecision Alignment in Wafer Bonding”, 59th Electronic Components and Technology Conference (ECTC2009), San Diego, California, USA, May 26-29, 2009, pp. 872-878. (Selected as IEEE CPMT Student Travel Award)

5. Chenxi Wang* and Tadatomo Suga, “Wafer-to-Wafer Alignment Using Moire Pattern and its Interests for 3D Integration”, International Conference on Electronics Packaging 2009 (ICEP2009), Kyoto, Japan, Apr. 14-16, 2009, pp. 169-174.

4. Chenxi Wang*, Eiji Higurashi, and Tadatomo Suga, “Room Temperature Si/Si Wafer Direct Bonding in Air”, The 8th International Conference on Electronic Packaging Technology (ICEPT2007), Shanghai, China, Aug. 14-17, 2007, pp. 552-557.(NXP Semiconductor Best Paper Award)

3. Chenxi Wang*, Eiji Higurashi, and Tadatomo Suga, “Silicon Wafer Bonding by Modified Surface Activated Bonding Methods”, Proceedings of 6th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, Tokyo, Jan. 16-18, 2007, pp. 36-41.

2. Chenxi Wang* and Chunqing Wang, “Parallel Gap Bonding Mechanism of Joint Formation for Thin-Film Metallization”, The Fifth International Conference on Electronic Packaging Technology, Shanghai, Oct. 29-31, 2003, pp. 184-186.

1. Chenxi Wang* and Chunqing Wang, “Self-Sensed Inspection of Joint Temperature for Thin-Film Sensors”, The Fifth International Conference on Electronic Packaging Technology, Shanghai, Oct. 29-31, 2003, pp. 422-426. (Best Paper Award of ICEPT 2003)

其他会议论文

14. 平松洋次朗，王晨曦，清水久史，馬渡和真，北森武彦，拡張ナノ空間を利用した熱駆動ナノ流体ポンプの開発，第3回CSJ化学フェスタ2013，東京,　2013 (CSJ Poster Presentation Award 2013 for Excellent Research)

13. 笠井健太郎，王晨曦，清水久史，馬渡和真，北森武彦，拡張ナノピラーにおける水の凝縮速度の評価，第27 回化学とマイクロ？ナノシステム研究会，仙台，2013

12. Yuta Sasaki, Chenxi Wang, Eiji Higurashi, Tadatomo Suga, “Mechanical and Electrical Characteristics of Direct Bonded Ge/Ge Interface”, International Conference on Electronics Packaging 2012 (ICEP2012), Tokyo, Japan, April 17-20, 2012, pp. 254-258.

11. 高小放，馬渡和真, 王晨曦，杉井康彦，北森武彦，Creation of A Cell-based Separation Microdevice Using Renal Tubule Cells，第72回分析化学討論会，鹿児島， 2012年3月19日-20日.

10. Chenxi Wang*, Xu Yan, Kentaro Shirai, Kazuma Mawatari, Tadatomo Suga, and Takehiko Kitamori, “Precise Alignment Technique for Creating Micro/Nanofluidic Devices”, International Symposium on Microchemistry and Microsystems (ISMM 2011), Hsinchu, Taiwan, June 10-13, 2012.

9. Chenxi Wang*, Yan Xu, Yiyang Dong, Kazuma Mawatari, Takehiko Kitamori, and Tadatomo Suga, “A Novel Biocompatible Direct Bonding for Glass Microdevices”, International Conference on Electronics Packaging 2011 (ICEP2011), Nara, Japan, April 13-15, 2011, pp. 631-632.

8. Yan Xu*, Chenxi Wang, Yiyang Dong, Kihoon Jang, Tadatomo Suga, Kazuma Mawatari, Takehiko Kitamori, “Bonding of Glass Nanofluidic Chips at Low Temperature”, International Congress on Analytical Sciences (ICAS2011), Kyoto, Japan, May 22-26, 2011, pp. 23P108.

7. Chenxi Wang* and Tadatomo Suga, “Strategies of Aligned Low-Temperature Wafer Bonding for 3D Integration and MEMS”, International Conference on Electronics Packaging 2010 (ICEP2010), Sapporo, Japan, May 12-14, 2011, pp. 27-31.

6. Chenxi Wang* and Tadatomo Suga, “Moiré Fringe Assisted Alignment for Wafer Bonding and Its Improvement”, WaferBond’09 Conference on Wafer Bonding for Microsystems and Wafer Level Integration, Grenoble, France, Dec. 6-8, 2009, pp. 89-90.

5. Chenxi Wang* and Tadatomo Suga, “Wafer-to-Wafer Alignment Using Moire Pattern and its Interests for 3D Integration”, International Conference on Electronics Packaging 2009 (ICEP2009), Kyoto, Japan, Apr. 14-16, 2009, pp. 169-174.

4. Chenxi Wang* and Tadatomo Suga, “High-Precision Alignment for Wafer Bonding Using Moiré Method”, International Conference on Electronics Packaging 2008 (ICEP2008), Tokyo, Japan, Jun. 10-12, 2008, pp. 21-25.

3. Chenxi Wang*, Eiji Higurashi, and Tadatomo Suga, “Void-free Room Temperature Silicon Wafer Direct Bonding by Sequential Plasma Activated Process”, Extended Abstracts of the 2007 International Conference on Solid State Devices and Materials (SSDM 2007), Tsukuba, Japan, Sep. 18-21,2007, pp. 404-405.

2. Chenxi Wang*, Eiji Higurashi, and Tadatomo Suga, “Room Temperature Wafer Bonding of Silicon and Silicon Dioxide by Sequential Plasma Activation”, International Conference on Electronics Packaging 2007 (ICEP2007), Tokyo, Apr. 18-20, 2007, pp. 33-38.

1. Chenxi Wang* and Tadatomo Suga, “Evaluation of Alignment Accuracy for Wafer Bonding Using Moiré Technique”, Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials (SSDM 2006), Yokohama, Japan, Sep. 14-17, 2006, pp. 488-489.

招生信息
真诚欢迎勤奋上进的同学来本课题组攻读学士、硕士和博士学位！

每年招收博士研究生1~2名：具备材料、物理、化学、电子或焊接等相关专业背景

硕士研究生1~2名，本科生2~3名：焊接、电子封装技术专业或相关专业背景

有意向的同学可随时发邮件到 wangchenxi@hit.edu.cn 咨询

我们一起努力，明天会更加美好！

Try our best together, tomorrow is another day!

一緒に頑張ろう、美しい未来へ。


团队成员
博士生

2017级 许继开(合作指导，硕博连读）

2019级 方慧 (优秀硕士论文)

硕士生：

2017级 戚晓芸(考研成绩电封第一)王特(保研)

2018级 康秋实(保研)


本科生

2015级 厉道远(材院金材十佳，省三好)周诗承(保研)张闰勃

2016级 鲁添(材院金材十佳，省三好)成吉(全国英语竞赛决赛特等奖)

桃李满天

~毕业了也常回母校看看~


已毕业的硕士生：

2015级

刘艳南(优秀硕士论文，英特尔Intel公司)

孙亚汝（合作指导，优秀硕士论文，北京配天技术）

张悦（合作指导，华为海思半导体）
2016级

王源(中国航空工业集团公司济南特种结构研究所)
已毕业的本科生：

2012级本科毕业生

付英杰 (德国亚琛工业大学读研)

曾小润 (上海交通大学读研)→华为海思半导体(上海)

刘洋 (哈工大与南方科技大学联合培养研究生)→大连英特尔Intel公司

许继开(合作指导，本校硕博连读)


2013级本科毕业生:

戚晓芸(本校读研)

袁志天（德国汉诺威莱布尼茨大学读研）

2014级本科毕业生:

康秋实(本校保研，校本科优秀毕业论文)

吴斌（保研，浙江大学）


Personal profile


Chenxi Wang is an Associate Professor at School of Materials Science and Engineering, Harbin Institute of Technology. He received the B.E. and M.E. degrees in material processing engineering from Harbin Institute of Technology in 2002 and 2004 respectively and the Ph.D degree in precision engineering, The University of Tokyo in 2009. From 2009 to 2011, he received postdoctoral fellowship awarded by Japan Society for the Promotion of Science (JSPS) at The University of Tokyo. From 2011 to 2014, he worked as a Senior Researcher at School of Engineering, The University of Tokyo.

His research interests include micro- and nano- bonding technologies, wafer direct bonding, micro/nanofabrication, micro/nanofluidic devices. He has published more than 70 papers in international journals and conferences, and holds 6 China and Japan patents. He received many awards, including the Best Paper Awards of international conferences on electronic packaging technology (ICEPT) in 2003, 2007, 2010, 2011 and 2017, the 2010 Dean Award of School of Engineering, The University of Tokyo, Best Presentation Award of 2nd Advanced Welding & Joining Technology Conference in 2011. He is a member of IEEE and Electrochemical society (ECS).