一、姓名：肖勇
二、基本情况：
1、出生年月： 1985年1月
2、学 位：博士学位
3、职 称：副教授
4、工作院系：材料科学与工程学院 材料成型与加工工程系
三、教育经历（从大学开始）：
2010/09-2014/07，哈尔滨工业大学，材料加工工程专业，博士
2008/09-2010/07，哈尔滨工业大学，材料加工工程专业，硕士
2004/09-2008/07，三峡大学，材料成型及控制工程专业，学士
四、工作经历：
2016/09-目前， 武汉理工大学，材料学院，副教授、硕士生导师
2015/10-2016/09，武汉理工大学，材料学院，讲师、硕士生导师
2014/10-2015/10，武汉理工大学，材料学院，讲师
五、研究方向：
钎焊材料及技术、特种连接技术
六、在研项目（不多于5项）：
[1]超声辅助低温钎焊超细晶Al合金接头连接机理研究，国家自然科学基金/青年基金（**），2017.01-2019.12，主持。
[2]基于泡沫Ni/Sn复合钎料的超细晶Al合金低温钎焊工艺及连接机理研究，湖北省自然科学基金/青年基金（2016CFB335），2016.01-2017.12，主持。
[3]无铅焊料可靠性能评价研究，企业委托，2017.01-2019.01，项目负责人。
[4]感应线圈导磁体及其对加热的影响机理研究，企业委托（20171h0420），2017.12-2018.10，项目负责人。
[5]紫/青/黄铜管材半自动钎焊工艺研究，企业委托，2017.10-2018.03，项目负责人。
七、代表性论文及著作（不多于10项）：
Yong Xiao,Qiwei Wang, Ziqi Wang, Xian Zeng*, Mingyu Li, Ling Wang, Xiaomeng Zhu. Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer, Ultrasonics Sonochemistry, 2018, Accept. (SCI, IF=4.218)
Xingyi Zhang, Yong Xiao*, Ling Wang, Chao Wan, Qiwei Wang, Hongchao Sheng, Mingyu Li. Ultrasound-induced liquid/solid interfacial reaction between Zn-3Al alloy and Zr-based bulk metallic glasses, Ultrasonics Sonochemistry, 2018, Accept.(SCI, IF=4.218)
Yong Xiao,Yuanqi Zhang, Kai Zhao, Shan Li, Ling Wang, Jue Xiao, Li Liu*, Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders, Ceramics International,2017, 43(16): 14314-14320. (SCI, IF=2.758)
DanLuo, Yong Xiao*, Ling Wang, Li Liu, Xian Zeng, Mingyu Li. Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO2 ceramic exposed in ultrasonic waves, Ceramics International, 2017, 43(10): 7531-7536. (SCI, IF=2.758)
Yong Xiao,Mingyu Li^*, Ling Wang, Shangyu Huang, Xueming Du, Zhiquan Liu^*. Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn-Al/Cu joints. Materials & Design, 2015,73:42-49.(SCI, IF=3.501)
Yong Xiao,Hongjun Ji, Mingyu Li*, Jongmyung Kim. Ultrasound-induced equiaxial flower-like CuZn₅/Al composite microstructure formation in Al/Zn-Al/Cu joint. Materials Science and Engineering A, 2014, 594:135-139.(SCI, IF=2.567)
Yong Xiao, Hongjun Ji, Mingyu Li*, Jongmyung Kim, Hongbae Kim. Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn-Al hypereutectic filler metal. Materials & Design, 2013, 47:717–724. (SCI, IF=3.501)
Yong Xiao,Hongjun Ji, Mingyu Li*, Jongmyung Kim. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials & Design, 2013, 52:740-747. (SCI, IF=3.501)
YuLei, Shangyu Huang, Wei Liu*, Yong Xiao, Jianhua Hu, Xueming Du, Xifan Zou. Dissimilar Cu/Al tube joint by EMF-assisted brazing. The International Journal of Advanced Manufacturing Technology, 2018,1:1-9. (SCI)
Qiwei Wang, Yong Xiao*, Xingyi Zhang, Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder, ICEPT,2017, 18th.(EI)
八、联系方式：
1、Tel: **
2、E-mail:yongxiao@whut.edu.cn
3、工作地址（实验室）：马房山校区东院成型系办公楼（红房子）104室
1. Name: Yong Xiao
2. Brief introduction:
1) Date of birth: 1985-01-
2) Degree: Ph.D
3) Title:AssociateProfessor
4) Working department:
Department of Material shaping and Processing Engineering, School of Materials Science and Engineering
3. Education experience (after entering university):
2010/09-2014/07, Harbin Institute of Technology, Material Processing Engineering, Doctor degree.
2008/09-2010/07, Harbin Institute of Technology, Material Processing Engineering, Master degree.
2004/09-2008/07, China Three Gorges University, Material Shaping and Control Engineering, Bachelor degree.
4. Working experience:
2014/10-2016/09, School of Materials Science and Engineering, Wuhan University of Technology, Associate Professor.
2014/10-2016/09, School of Materials Science and Engineering, Wuhan University of Technology, Assistant Professor.
5. Research field (no more than 3):
1) Brazing materials and technology
2) Special materials joining technology
6. Research project (no more than 5):
[1]Study on the bonding mechanism of ultrasound-assisted low-temperature soldering of ultrafine grained Al alloy, National Nature Science Foundation of China (No. **), 2017.01-2019.12.(P.I.)
[2]Study on the metallurgicbonding mechanism betweenNi-foam/Sn liquid/solid composite solders andAl substrates, Nature Science Foundation of Hubei Province (2016CFB335), 2016.01-2017.12.(P.I.)
[3] Study on the reliability of Pb-free solder, Enterprise Research Project (20151h0275),2017.01-2019.01. (P.I.)
[4] Study on the induction coil magnet and its heating mechanism, Enterprise Research Project (20151h0275), 2017.12-2018.10. (P.I.)
[5] High-speedbrazing of thick wall copper/brass/bronze dissimilar tubes, Enterprise Research Project (20171h0420), 2017.10-2018.03.(P.I.)
7. Representative papers and works (no more than 10)：
Yong Xiao,Qiwei Wang, Ziqi Wang, Xian Zeng*, Mingyu Li, Ling Wang, Xiaomeng Zhu. Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer, Ultrasonics Sonochemistry, 2018, Accept. (SCI, IF=4.218)
Xingyi Zhang, Yong Xiao*, Ling Wang, Chao Wan, Qiwei Wang, Hongchao Sheng, Mingyu Li. Ultrasound-induced liquid/solid interfacial reaction between Zn-3Al alloy and Zr-based bulk metallic glasses, Ultrasonics Sonochemistry, 2018, Accept.(SCI, IF=4.218)
Yong Xiao,Yuanqi Zhang, Kai Zhao, Shan Li, Ling Wang, Jue Xiao, Li Liu*, Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders, Ceramics International, 2017, 43(16): 14314-14320. (SCI, IF=2.758)
Dan Luo, Yong Xiao*, Ling Wang, Li Liu, Xian Zeng, Mingyu Li. Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO2 ceramic exposed in ultrasonic waves, Ceramics International, 2017, 43(10): 7531-7536. (SCI, IF=2.758)
Yong Xiao,Mingyu Li^*, Ling Wang, Shangyu Huang, Xueming Du, Zhiquan Liu^*. Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn-Al/Cu joints. Materials & Design, 2015,73:42-49. (SCI, IF=3.501)
Yong Xiao,Hongjun Ji, Mingyu Li*, Jongmyung Kim. Ultrasound-induced equiaxial flower-like CuZn₅/Al composite microstructure formation in Al/Zn-Al/Cu joint. Materials Science and Engineering A, 2014, 594:135-139. (SCI, IF=2.567)
Yong Xiao, Hongjun Ji, Mingyu Li*, Jongmyung Kim, Hongbae Kim. Microstructure and joint properties of ultrasonically brazed Al alloy joints using a Zn-Al hypereutectic filler metal. Materials & Design, 2013, 47:717–724. (SCI, IF=3.501)
Yong Xiao,Hongjun Ji, Mingyu Li*, Jongmyung Kim. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials & Design, 2013, 52:740-747. (SCI, IF=3.501)
YuLei, Shangyu Huang, Wei Liu*, Yong Xiao, Jianhua Hu, Xueming Du, Xifan Zou. Dissimilar Cu/Al tube joint by EMF-assisted brazing. The International Journal of Advanced Manufacturing Technology, 2018,1:1-9. (SCI)
Qiwei Wang, Yong Xiao*, Xingyi Zhang, Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder, ICEPT,2017, 18th. (EI)
8. Contact information：
1) Tel：**
2) E-mail：yongxiao@whut.edu.cn
3) Location of office：Room 104, The red house in Eastern Campus.

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