姓 名
刘俐
性 别
女
民 族
汉
出生年月
1989.5

职 称
副教授
职 务
无
联系电话
**

单位名称
武汉理工大学材料科学与工程学院
材料成型加工系
Email
l.liu@whut.edu.cn

实验室网址
https://www.researchgate.net/profile/Li-Liu-83/research

研究方向
1. 微电子封装材料与器件
2. 先进复合功能涂层设计与合成
3. 先进表征测试技术

教育背景
2012.10-2016.10 英国拉夫堡大学（Loughborough University） 机械电子制造工程（博士全奖），导师：Prof. Changqing Liu
2008.09-2012.07 华中科技大学 材料科学与工程（电子封装方向） 学士，导师：吴丰顺教授

工作经历
2020.09-至今 副教授/硕导 武汉理工大学材料科学与工程学院
2016.10-2020.09 讲师/硕导 武汉理工大学材料科学与工程学院
2014.01-2014.12 研究助理 英国拉夫堡大学机械电子制造工程学院，合作教授: Prof. Changqing Liu

项目情况
（1）国家自然科学基金青年项目，2021/01-2023/12，主持
（2）中央高校基本科研业务项目，2021/01-2022/12，主持
（3）国家大坝研究中心开放基金项目，2021/01-2022/12，主持
（4）湖北省自然科学基金青年项目，2018/01-2019/12，主持
（5）国家重点实验室开放基金项目，2018/01-2019/12，主持

代表性学术
成果
[1] Bang Jiang, Qiaoxin Zhang, Lin Shi, Zhiwen Chen, Li Liu*, Chundong Zhu*. Microstructure evolution and shear property of Cu-In transient liquid phase sintering joints. Frontier in Materials, 2021, online, DOI: 10.3389/fmats.2021.658464 (Invited paper)
[2] Chengjiong Tuo, Zhenhua Yao, Wei Liu, Shengfa Liu, Li Liu*, Zhiwen Chen*, Shangyu Huang, Xueqiang Cao. Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics. Journal of Materials Processing Technology. 2021, 292: 117056.
[3] Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu*, Li Liu*, A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages, Journal of Electronic Packaging, 2021, 143: 011001.
[4] Li Liu, Juan Peng, Xueming Du, Hao Zheng, Zhiwen Chen*, Pan Gong, Yong Xiao, Xueqiang Cao*. Synthesis, composition, morphology, and wettability of electroless coatings with varying microstructure, Thin Solid Films, 2020, 706: 138080.
[5] Shengfa Liu, Dongxiao Zhang*, Jieran Xiong, Chen Chen, Tianjie Song, Li Liu*, Shangyu Huang, Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology, Journal of Alloys and Compound, 2019, 781: 873-882.
[6] Li Liu, Han Zhang, Hao Zheng, Juan Peng, Pan Gong, Xuanguo Wang, Zhiwen Chen, Xueqiang Cao. Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn–Al solder interconnects. Journal of Alloys and Compound, 2019, 804: 42-48.
[7] Li Liu, Zhiwen Chen^*, Zhaoxia Zhou, Guang Chen, Fengshun Wu, Changqing Liu^*, Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects, Journal of Alloys and Compounds, 2017, 722: 746~752.
[8] Zhiwen Chen, Changqing Liu, Bing An, Yiping Wu, Li Liu*, Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing, Journal of Materials Science: Materials in Electronics, 2017, 28(23): 17461~17467.
[9] Yong Xiao, Yuanqi Zhang, Kai Zhao, Shan Li, Ling Wang, Li Liu*, Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders, Ceramics International, 2017, 43: 14314-14320.
[10] Li Liu, Zhiwen Chen, Changqing Liu*, Yiping Wu, Bing An, Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending, Intermetallics, 2016, 76: 10-17.

Associate Professor Dr. Li Liu
Address: Department of Material shaping and Processing Engineering, School of Materials Science and Engineering, Wuhan University of Technology, No.122 Luoshi Road, Wuhan, 430070, P.R. China.
Email：l.liu@whut.edu.cn Tel: +86-**






EDUCATION
2012/10-2016/10
Loughborough University (UK)
Mechanical, Electronic Manufacturing and Engineering (Ph.D.)

2016/09-2012/07
Huazhong University of Science and Technology (China)
Material Science and Engineering (B.S.)

WORK EXPERIENCE
2020/09-Now
Associate Professor
Wuhan University of Technology, P.R. China

2016.10-2020.9
Assistant Professor
Wuhan University of Technology, P.R. China

2014.01-2014.12
Research Assistant
Loughborough University, United Kingdom

RESEARCH PROJECT
(1) National Nature Science Foundation, 2021/01-2023/12, PI.
(2) Fundamental Research Funds for the Central Universities, 2021/01-2022/12, PI.
(3) National Dam Research Center Open Fund Project, 2021/01-2022/12, PI.
(4) Natural Science Foundation of Hubei Province, 2018/01-2019/12, PI.
(5) State Key Laboratory Open Fund Project, 2018/01-2019/12, PI.
SELECTED PUBLICATION
[1] Bang Jiang, Qiaoxin Zhang, Lin Shi, Zhiwen Chen, Li Liu*, Chundong Zhu*. Microstructure evolution and shear property of Cu-In transient liquid phase sintering joints. Frontier in Materials, 2021, online, DOI: 10.3389/fmats.2021.658464 (Invited paper)
[2] Chengjiong Tuo, Zhenhua Yao, Wei Liu, Shengfa Liu, Li Liu*, Zhiwen Chen*, Shangyu Huang, Xueqiang Cao. Fabrication and characteristics of Cu@Ag composite solder preform by electromagnetic compaction for power electronics. Journal of Materials Processing Technology. 2021, 292: 117056.
[3] Zhiwen Chen, Zhao Zhang, Fang Dong, Sheng Liu*, Li Liu*, A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages, Journal of Electronic Packaging, 2021, 143: 011001.
[4] Li Liu, Juan Peng, Xueming Du, Hao Zheng, Zhiwen Chen*, Pan Gong, Yong Xiao, Xueqiang Cao*. Synthesis, composition, morphology, and wettability of electroless coatings with varying microstructure, Thin Solid Films, 2020, 706: 138080.
[5] Shengfa Liu, Dongxiao Zhang*, Jieran Xiong, Chen Chen, Tianjie Song, Li Liu*, Shangyu Huang, Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology, Journal of Alloys and Compound, 2019, 781: 873-882.
[6] Li Liu, Han Zhang, Hao Zheng, Juan Peng, Pan Gong, Xuanguo Wang, Zhiwen Chen, Xueqiang Cao. Influence of crystalline structure on diffusion barrier property of electroless Ni–Fe–P coatings in Zn–Al solder interconnects. Journal of Alloys and Compound, 2019, 804: 42-48.
[7] Li Liu, Zhiwen Chen^*, Zhaoxia Zhou, Guang Chen, Fengshun Wu, Changqing Liu^*, Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects, Journal of Alloys and Compounds, 2017, 722: 746~752.
[8] Zhiwen Chen, Changqing Liu, Bing An, Yiping Wu, Li Liu*, Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageing, Journal of Materials Science: Materials in Electronics, 2017, 28(23): 17461~17467.
[9] Yong Xiao, Yuanqi Zhang, Kai Zhao, Shan Li, Ling Wang, Li Liu*, Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders, Ceramics International, 2017, 43: 14314-14320.
[10] Li Liu, Zhiwen Chen, Changqing Liu*, Yiping Wu, Bing An, Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bending, Intermetallics, 2016, 76: 10-17.

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