姓名： 张平
正高级 男 桂林电子科技大学机电工程学院 邮箱:pingzhang@guet.edu.cn





研究领域电子系统热控制理论及技术、界面接触传热测量及其调控、电子设备结构设计及热管理技术、热防护手段及节能技术;功率电子封装;;
个人简介

张平，男，工学博士（后），****，博士生导师。广西****基金获得者（2019），中国复合材料学会高级会员（2018），中国复合材料学会导热复合材料专业委员会委员（2019），广西高校高水平创新团队带头人及卓越****（2018），中国热管理产业技术创新战略联盟副理事长（2017），桂林电子科技大学首批“英才计划”人选（2017）。


本人2013年毕业于南京理工大学能源与动力工程学院工程热物理专业（师从宣益民院士），主要从事电子系统热控制理论及技术、界面接触传热测量及其调控、热防护手段及节能技术的理论与实验研究。具有多年电子设备结构设计及热管理行业从业经历，曾在安徽省半导体照明工程中心挂职副主任一职18个月。主持及负责国家自然科学基金青年基金、面上项目以及广西自然科学基金****基金、面上项目等省部级以上课题近10项。迄今发表SCI/EI论文近60篇，其中第一作者或通讯作者发表SCI/EI论文近40余篇。所发表的国际杂志论文大多在本学科领域公认的权威刊物上，包括Small、Compos Part A–Appl S、Int J Heat Mass Tran、Appl Therm Eng、Phys Chem Chem Phys、Materials & Design、J Mater Sci、 Exp. Therm. Fluid Sci、Macromol. Mater. Eng、Sensors 等；申报发明专利52项，其中授权发明专利近20项。2018年作为主要完成人获国防技术发明一等奖1项。


本课题组热忱欢迎工程热物理、材料、机械、化学、数学等相关学科专业，有志于电子散热、节能减排技术且具有创新思维的勤奋考生报考。




教育背景

工作经历

2020/1-迄今 桂林电子科技大学 ****二档
2018/1--2019/12 桂林电子科技大学 教授（校聘）/博导
2017/2--2017/12 桂林电子科技大学 副教授
2013/10--2017/2 桂林电子科技大学 副教授（校聘）
2011/7--2013/1 安徽省半导体照明工程中心 副主任（挂职）
2010/2--2012/7 安徽莱德电子技术有限公司 技术顾问
2009/5--2013/10 南京理工大学工程热物理专业 博士生（师从宣益民院士）
2006/1--2009/4 桂林电子科技大学机械制造及其自动化专业 硕士生
2002/7--2005/10 中国电子科技集团公司第41研究所（青岛） 技术员




主要荣誉

1. 2020年中组部“西部之光”访问****；
2. 2019年获广西****基金；
3. 2018年获广西高等学校高水平创新团队“先进电子系统热管理技术研究团队”及卓越****；
4. 2017入选桂林电子科技大学首批“英才计划”人选；
5. 2018 国防技术发明一等奖（排名五）：高功率密度军用电子设备热控制方法与技术；
6. 2020年度桂林电子科技大学优秀共产党员；
7. 2019、2020年度桂林电子科技大学优秀研究生学位论文指导教师；
8. 2019年桂林电子科技大学首届优秀研究生导师团队负责人。






学术活动

1）2013.11 至今以下等国际期刊的审稿人：
“Advanced Functional Materials” (IF = 16.836)
“IEEE Transactions on Power Electronics” (IF = 7.224)
“ACS Applied Materials & Interfaces”(IF = 8.456)
“International Journal of Heat and Mass Transfer” (IF = 4.346)
“Applied Thermal Engineering” (IF = 4.026)
“Composites Science and Technology” (IF =6.309)
“Scientific Reports” (IF = 4.011)
“Energy Technology” (IF = 3.163)
“Measurement” (IF=2.791)
“Measurement Science and Technology” (IF=1.861)
“Experimental Thermal and Fluid Science” (IF = 3.493)
“Canadian Journal of Physics” (IF = 1.016)
科学通报
实验流体力学
…


2）以下基金项目的评审专家：
1. 波兰国家科学中心项目评审专家 (National Science Center, Poland)；
2. 南非国家研究基金评审专家 (NRF，South Africa)；
3. 国家自然科学基金项目评审专家；
4. 广西自治区科技厅科技项目评审专家。






教学信息

《电子设备热管理》、《工程传热学》、《热工基础》、《数控技术》、《传感器技术》、《电子工程材料》










部分论文(*通讯作者)

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A44.Mengjun Chen, Qiang Li*, Ping Zhang*. Experimental investigation of high temperature thermal contact resistance of thin disk samples using infrared camera in vacuum condition. International Journal of Heat and Mass Transfer, 2020, 157: 119749 https://doi.org/10.1016/j.ijheatmasstransfer.2020.119749 Q1 Top
A43.Ping Zhang, Peipei Yang, Zhiheng Zheng*, Wei Yu. Effect of monolayer graphene on the performance of near-field radiative thermal rectifier between doped silicon and vanadium dioxide. International Journal of Heat and Mass Transfer, 2020, 155: 119707 https://doi.org/10.1016/j.ijheatmasstransfer.2020.119707 Q1 Top
A42. Ting Liang, Man Zhou, Ping Zhang*, Daoguo Yang. Multilayer in-plane graphene/hexagonal boron nitride heterostructures: Insights into the interfacial thermal transport properties. International Journal of Heat and Mass Transfer, 2020, 151: 119395. Q1 Top
A41. Lipei Yan, Ping Zhang*, Hui Xu, Wei Ma, Jiang Sheng, Dehao Xu. Visualization of thermo-hydrodynamic behavior in flat-plate pulsating heat pipe with HFE-347，Journal of Thermal Science
A40. Jiao Li, Ping Zhang*, Hong He, Bo Shi*. Enhanced the thermal conductivity of flexible copper foil by introducing graphene. Materials & Design. 2020, 187: 108373. Q1 Top
A38. Bo Shi, Han Zhang, Ping Zhang, Lipei Yan. Performance test of an ultra-thin flat heat pipe with a 0.2mm thick vapor chamber. Journal of Micromechanics and Microengineering. 2019, 29(11): 115019.
C8-SCI会议. Ting Liang, Ping Zhang*, Peng Yuan, Man Zhou, Siping Zhai. Interfacial Thermal Conductance and Thermal Rectification across In-plane Graphene/h-BN Heterostructures with Different Bonding Types. 6th ASME International Conference of Micro/Nanoscale Heat and Mass Transfer, Sweetland Hotel, Dalian, China, July 9-10, 2019
A37. 宣益民,李强,张平. 高温条件下的固-固界面接触热阻测试方法与系统/ Measurement method and instrument of thermal contact resistance at high temperature. 中国科学:技术科学. SCIENTIA SINICA Technologica, 2019,49(05),491-500 DOI:10.1360/SST-2019-0074
A36. Ruifeng Li, Daoguo Yang*, Ping Zhang*, Fanfan Niu, Miao Cai, G. Q Zhang. Effects of High-temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound. Journal of Electronic Packaging. 2020.
A35. Peng Yuan, Ping Zhang*, Ting Liang, Siping Zhai, Daoguo Yang. Effects of functionalization on thermal and mechanical properties of graphene/polyethylene glycol composite phase change materials. Applied Surface Science. 2019, 485: 402-412. Q2
A34. Yaoqi Xian, Ping Zhang*, Siping Zhai, Peipei Yang, Zhiheng Zheng. Re-estimation of thermal contact resistance considering near-field thermal radiation effect . Applied Thermal Engineering. 2019, 157: 113601. DOI: 10.1016/j.applthermaleng.
A33. Hui Xu, Ping Zhang*, Lipei Yan, Dehao Xu, Wei Ma, Liyan Wang. Thermal Characteristic and Analysis of Microchannel Structure Flat Plate Pulsating Heat Pipe with Silver Nanofluid. IEEE Access. 2019, 7(1):51724-51734. DOI: 10.1109/ACCESS.2019.**
A32. Jiao Li, Ping Zhang*, Hong He, Siping Zhai, Yaoqi Xian, Wei Ma, Liyan Wang. Enhanced thermal transport properties of epoxy resin-based carbon nanocomposites thermal interface materials. ES Energy & Environment. 2019, 4:41-47.
A31. Ruifeng Li, Daoguo Yang*, Ping Zhang*, Fanfan Niu, Miao Cai, G. Q Zhang. Effects of High-Temperature Storage on Elasticity Modulus of Epoxy Molding Compound. Materials. 2019, 12(4), 684. DOI:10.3390/ma**.
A30. Ping Zhang*, Xianmeng Wei, Lipei Yan, Hui Xu, Tao Yang. Review of recent developments on pump assisted two-phase flow cooling technology. Applied Thermal Engineering. 2019, 150: 811-823. DOI: 10.1016/j.applthermaleng.2018.12.169.
A29. Hongbo Qin*, Tianfeng Kuang, Xinghe Luan, Wangyun Li, Jing Xiao, Ping Zhang*, Daoguo Yang, Guoqi Zhang. Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals. Crystals. 2018, 8(11): 428.
A28. Ting Liang, Ping Zhang*, Peng Yuan, Siping Zhai, Daoguo Yang. A molecular dynamics study on the thermal conductivities of single- and multi-layer two-dimensional borophene. Nano Futures. 2019. DOI:10.1088/2399-1984/aafc8c
A27. Wei Ma, Siping Zhai, Zhang Ping*, Yaoqi Xian, Lina Zhang, Rui Shi, Jiang Sheng, Bo Liu, and Zonglin Wu. Research Progresses of Flash Evaporation in Aerospace Applications. International Journal of Aerospace Engineering. 2018, (2018):1-15.
A26. Peng Yuan, Ping Zhang*, Ting Liang, Siping Zhai, Daoguo Yang. Effects of functionalization on energy storage properties and thermal conductivity of graphene/n-octadecane composite phase change materials. Journal of Materials Science. 2019, 54(2): 1488-1501. DOI:10.1007/s10853-018-2883-2
A25. Siping Zhai, Ping Zhang*, Yaoqi Xian, Peng Yuan, Daoguo Yang. Modeling and analysis of effective thermal conductivity for polymer composites with sheet-like nanoparticles. Journal of Materials Science. 2019, 54(1): 356-369. DOI: 10.1007/s10853-018-2816-0
C8. Ping Zhang*, Yaoqi Xian, Peng Yuan, Siping Zhai. MEASUREMENT AND ANALYSIS OF EFFECTIVE THERMAL CONTACT RESISTANCE AT VARIABLE CLAMPING PRESSURES. 16th International Heat Transfer Conference Digital Library. Begel House Inc., 2018 IHTC16-23131 DOI: 10.1615/IHTC16.tpm.023131 pages 8735-8743
A24. Ting Liang, Ping Zhang*, Peng Yuan, Siping Zhai. In-plane thermal transport in black phosphorene/graphene heterostructures: a molecular dynamics study. Physical Chemistry Chemical Physics. 2018, 20, 21151-21162 DOI: 10.1039/C8CP02831A
A23. Mengjun Chen, Ping Zhang, Qiang Li*. Design and heat transfer analysis of a compound multi-layer insulations for use in high temperature cylinder thermal protection systems. Science China Technological Sciences. 2018, 61(7):994-1002.
D9. Wei Yu, Changqing Liu, Lin Qiu, Ping Zhang, Weigang Ma, Yanan Yue, Huaqing Xie and LeighAnn Sarah Larkin. Advanced Thermal Interface Materials for Thermal Management. Engineered Science. 2018, 2, 95-97. DOI: 10.30919/es8d710. Editorial
A22. Ping Zhang*, Xiong Jiang, Peng Yuan, HaidongYan, Daoguo Yang. Silver Nanopaste: Synthesis, Reinforcements and Application. International Journal of Heat and Mass Transfer, 2018, 127: 1048-1069.
A21. Jianhua Zeng, Jiao Li, Peng Yuan, Ping Zhang*. Theoretical prediction of heat transport in few-layer graphene/epoxy composites, Macromolecular Research. 2018, 26(11): 978-983. DOI 10.1007/s13233-018-6136-7.
A20. Yaoqi Xian, Ping Zhang*, Siping Zhai, Peng Yuan, Daoguo Yang. Experimental Characterization Methods for Thermal Contact Resistance: A Review, Applied Thermal Engineering. 2018, 130:1530-1548.
A19. Ping Zhang*, Peng Yuan, Xiong Jiang, Siping Zhai, Jianhua Zeng, Yaoqi Xian, Hongbo Qin and Daoguo Yang. A Theoretical Review on Interfacial Thermal Transport at the Nanoscale, Small, 2018, 14(2):**
A18. Siping Zhai, Ping Zhang*, Yaoqi Xian, Jianhua Zeng, Bo Shi. Effective Thermal Conductivity of Polymer Composites: Theoretical Models and Simulation Models, International Journal of Heat and Mass Transfer. 2018, 117:358-374
A17. Huiling Duan, Liangliang Tang, Yuan Zheng, Ping Zhang*. Optical and thermal enhancement of plasmonic nanofluid based on core/shell nanoparticles, Plasmonics, 2018, 13(4): 1135-1141.
A16. Ping Zhang*, Jianhua Zeng, Siping Zhai, Yaoqi Xian, Daoguo Yang and Qiang Li*. Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials, Macromolecular Materials and Engineering, 2017, 302(9): **.
A15. Ping Zhang, Tengfei Cui, Qiang Li*. Effect of Surface Roughness on Thermal Contact Resistance of Aluminum Alloy, Applied Thermal Engineering 2017, 121: 992-998.
D8. 张平, 陈孟君, 李强. 高温热物性测试系统的热防护设计(Design of thermal protection structures for high temperature thermophysical property testing system). 工程热物理学报, 2017, 38 (11):1-5.
A14. Ping Zhang, Rongzhuan Wei, Jianhua Zeng, Miao Cai, Jing Xiao, Daoguo Yang*. Thermal Properties of Silver Nanoparticle Sintering Bonding Past for High Power LED Packaging. Journal of Nanomaterials, 2016 (2016).
A13. Miao Cai, Daoguo Yang, Kunmiao Tian, Wenbin Chen, Xianping Chen, Ping Zhang, Xuejun Fan, Guoqi Zhang. A hybrid prediction method on luminous flux maintenance of high-power LED lamps. Applied Thermal Engineering, 2016, 95: 482-490.
A12. Miao Cai, Daoguo Yang, Jianna Zheng, Jianlin Huang, Dongjing Liu, Jing Xiao, Ping Zhang, Guoqi Zhang, Xianping Chen. Effects of stress-loading test methods on the degradation of light-emitting diode modules, Microelectronics Reliability, 64卷, pp 635-639, 2016/9.
A11. Xiao Jing, Wei Qi-qin, Yang Dao-Guo, Zhang Ping, He Ning, Zhang Guoqi, Ren Tian-Ling, Chen Xianping. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide with Enhanced Field Confinement, IEEE Electron Device Letters, pp(99), p 1, 2016/2/24.
A10. Ping Zhang*, Jianhua Zeng, Xianping Chen, Miao Cai, Jing Xiao, DaoGuo Yang. An experimental investigation of a 100-W high-power light-emitting diode array using vapor chamber–based plate. Advances in Mechanical Engineering, 2015, 7(11): **20074.
A9. Weijie Liang, Ping Zhang*, Xianping Chen*, Miao Cai, DaoGuo Yang. Genetic Algorithm (GA)-Based Inclinometer Layout Optimization, Sensors, 2015, 15(4), 9136-9155
A8. Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, DaoGuo Yang. A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Microelectronics Reliability, 2015/8, 55(9–10), pp 1877-1881.
A7. Miao Cai, Daoguo Yang, Kunmiao Tian, Ping Zhang, Xianping Chen, Lilin Liu, Guoqi Zhang. Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method, Microelectronics Reliability, 2015/8, 55(9–10), pp 1784-1789.
A6. Ning Yang, Xianping Chen, Tianling Ren, Ping Zhang, Daoguo Yang, Carbon nanotube based biosensors. Sensors and Actuators B: Chemical, 2015, 207: 690-715.
A5. Tengfei Cui, Qiang Li, Yimin Xuan, Ping Zhang. Preparation and thermal properties of the graphene–polyolefin adhesive composites: Application in thermal interface materials. Microelectronics Reliability, 2015, 55(12): 2569-2574.
A4. Ping Zhang, Qiang Li, Yimin Xuan. Thermal contact resistance of epoxy composites incorporated with multi-walled carbon nanotubes, Composites Part A: Applied Science and Manufacturing. 2014, 57: 1-7
A3. Ping Zhang, Qiang Li, Yimin Xuan. A high-precision instrumentation to measure thermal contact resistance using reversible heat flux, Experimental Thermal and Fluid Science. 2014, 54(4):204-211
A2. Tengfei Cui, Qiang Li, Yimin Xuan, Ping Zhang. Multiscale Modeling and Simulation of Thermal Contact Resistance in electronic packaging, International Journal of Thermal Sciences, 2014, 83: 16-24.
C5. Ping Zhang, Qiang Li, Yimin Xuan. Enhanced thermal conductivity of epoxy composites with hybrid carbon-based functional materials and nano-copper particles, The 15th International Heat Transfer Conference (IHTC-15), Kyoto. 2014
D6. 崔腾飞, 李强, 宣益民, 张平. 高斯表面的多尺度方法模拟接触热阻. 工程热物理学报, 2014(12):2466-2470.
A1. Ping Zhang*, Bo Shi, Yimin Xuan, Qiang Li. A high-precision method to measure thermal conductivity of solids using reversible heat flux, Measurement Science and Technology. 2013, 24(9): 095004
D5. 张平, 宣益民, 李强. 界面接触热阻的研究进展/ Development on thermal contact resistance, 化工学报, 63(2):335-349, 2012






学术著作

科研项目

高性能热界面材料的固_固界面接触传热影响机制与调控方法研究，国家自然科学基金面上基金（**）
高性能石墨烯基新型热界面材料的固_固界面传热特性及其调控方法研究，国家自然科学基金青年基金（**）
固_固界面接触热阻的调控，广西****基金（2019JJG160011）
××××××××测试装置研制，国防“973”项目子课题
高温×××××××××，国防技术基础项目
基于高导热石墨烯/纳米银低温烧结材料的高功率电子器件互连封装技术研究，广西自然科学基金面上项目（2017JJA160108）
高精度导热系数及界面接触热阻的测试系统设计，广西高校科学技术研究项目（KY2015ZD045）

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专利及知识产权

宣益民, 张平, 李强, 徐德好. 一种导热系数及接触热阻测试装置, 专利号:ZL3.7, 中国发明专利, 2012，2014.4.2授权
宣益民, 张平, 李强, 徐德好. 一种温度传感器高精度标定装置, 专利号:ZL2.7, 中国发明专利, 2012
宣益民, 张平, 李强, 徐德好. 正反双向热流法测定导热系数的方法, 专利号:ZL4.5, 中国发明专利, 2012
宣益民, 张平, 李强, 徐德好. 正反双向热流法测定固-固接触热阻的测试方法, 专利号:ZL0.3, 中国发明专利, 2012，2014.4.16授权
宣益民, 张平, 李强, 徐德好. 一种高精度热界面材料测试方法, 专利号:ZL7.1, 中国发明专利, 2012，2014.4.2授权
宣益民, 张平, 李强, 徐德好. 上下恒温参数辨识法测导热系数的方法, 专利号:ZL3.8, 中国发明专利, 2012
宣益民, 张平, 李强, 徐德好. 上下恒温参数辨识法测热界面材料性能, 专利号:ZL1.8, 中国发明专利, 2012
宣益民, 张平, 李强, 徐德好. 一种上下恒温参数辨识法测固-固接触热阻, 专利号:ZL7.8, 中国发明专利, 2012
宣益民, 张平, 李强. 环氧树脂/纳米铜/碳纳米管热界面复合材料及其制备方法，专利号:ZL0.8, 中国发明专利, 2013
张平，姜雄，冼耀琪，曾建华，蔡苗，杨道国. 金刚石颗粒增强熔融合金热界面材料及其制备方法，专利号：ZL0.8，中国发明专利，2019-06-11
张平，姜雄，袁朋，曾建华，蔡苗，杨道国. 液态金属增强基纳米银焊膏热界面材料及其制备方法，专利号：ZL5.3，中国发明专利，2019-06-11
张平，韦荣转，姜雄，袁朋，曾建华. 一种基于反相微乳液体系制备纳米银焊膏的工艺方法，专利号：ZL6.3，中国发明专利，2019-08-20
张平，韦荣转，姜雄，袁朋，曾建华，蔡苗，杨道国. 一种具有高润湿性能的纳米银焊膏的制备方法，专利号：ZL 7.6，中国发明专利，2020-04-14
张平，韦荣转，姜雄，曾建华，肖经，杨道国. 一种石墨烯-纳米银焊膏的制备方法及其应用，专利号：ZL 1.2，中国发明专利，2019-08-16
张平，白玉潭，马伟，史波，李强，杨道国. 一种多用途复合高温热管. 专利号：ZL 4.5
张平，白玉潭，马伟，史波，杨道国，徐德好. 一种高温热管工质充注装置及方法. 专利号：ZL 7.6
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联系信息E-Mail：pingzhang@guet.edu.cn