中国科学院深圳先进技术研究院导师教师师资介绍简介-刘志权
本站小编 Free考研考试/2021-06-06
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招生信息
教育经历
工作经历
教授课程
出版信息
科研活动
基本信息
刘志权男博导中国科学院深圳先进技术研究院
电子邮件： zqliu@siat.ac.cn
通信地址： 深圳市南山区西丽深圳大学城学苑大道1068号
邮政编码： 518055
研究领域
长期从事与性能相关的材料结构及功能的显微组织表征和原位制备研究，目前研究重点为微电子材料和封装结构的组织性能及服役可靠性。主要针对微电子材料及其互连界面和封装结构，进行材料微观结构与性能演化方面的应用基础研究。包括材料和界面结构的静态表征，以及在热，电，力作用下化合物转变和缺陷演化的动态过程，以从微观角度探讨材料和界面失效的相关机理，为提高微电子材料性能和互连界面可靠性提供理论依据和解决途径。
招生信息
欢迎材料学、材料加工工程、物理化学、材料化学、微电子等相关专业，具有进取精神且动手能力强的优秀学生加盟。
招生专业
085600-材料与化工070304-物理化学0703J1-纳米科学与技术
招生方向
微电子封装材料金属互连结构失效机理与可靠性评价
教育经历
1996-09--2000-04大连海事大学研究生，工学博士1993-09--1996-07大连铁道学院研究生，工学硕士1989-09--1993-07吉林工业大学本科，工学学士
工作经历
2000年4月博士毕业后赴日本留学，2006年12月回国工作加盟中国科学院，任研究员、课题组长、博士生导师工作至今。
工作简历
2019-03~现在,中国科学院深圳先进技术研究院,研究员2006-12~2019-03,中国科学院金属研究所,研究员2002-07~2006-12,日本国立材料科学研究所（NIMS, Japan）,特别研究员2000-09~2002-06,日本冈山理科大学（Okayama University of Science, Japan）,博士后1996-07~2000-09,大连铁道学院,助教，讲师
社会兼职
2015-08-15-今,国家集成电路标准化总体工作组, 成员
2012-08-15-今,中国电子学会电子制造与封装技术分会, 理事
教授课程
透射电子显微学及其在材料科学中的应用
出版信息
截至2019年底在包括Nature，Science，ACS Catalyst，Phys. Rev. Lett.，Acta Mater.，Nanotechnology等国际杂志上发表期刊论文150余篇，SCI收录130余篇（JCR1区60余篇），第一作者/通讯作者80余篇，被他人引用3000余次。另发表EI收录国际会议论文40余篇，在国际会议上做邀请报告10余次。获授权中国发明专利19项、日本发明专利1项及美国发明专利1项，另申请受理中国发明专利17项。
发表论文
（1）热电耦合作用下功率器件引脚开裂的机理,The open-pin failure of power device under the combined effect of thermo-migration and electro-migration,科学通报,2020,通讯作者（2）The effect of finish layer on the interfacial cracking failure of Au-Si bonding,Engineering Failure Analysis,2020,通讯作者（3）Al中间层和Ni(V)过渡层对Co/Al/Cu三明治结构靶材背板组件焊接残余应力的影响,Effects of Al interlayer and Ni(V) transition layer on the welding residual stress of Co/Al/Cu sandwich target assembly,金属学报,2020,通讯作者（4）Failure mechanism of SnAgCu/SnPb mixed soldering process in ball grid array structure,J. Electron. Mater.,2020,通讯作者（5）The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering,Microelectron.Reliab.,2020,通讯作者（6）Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder,Mater. Charact.,2020,通讯作者（7）Influence of external interface normal stress on the growth of Cu-Sn IMC during aging,Acta Metall. Sin.-Eng. Lett.,2020,通讯作者（8）Focused ion beam preparation of microbeams for in-situ mechanical analysis of electroplated nanotwinned copper with probe type indenters,J. Microsc.,2020,通讯作者（9）Evolution and growth mechanism of Cu2(In,Sn) formed between In-48Sn solder and polycrystalline Cu during long-time liquid-state aging,J. Electron. Mater.,2020,通讯作者（10）3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste,Scripta Mater.,2020,第3作者（11）Gradient growth of fcc and bcc phase within FexNi1-x (50（12）Inhibition of intermetallic compounds growth at Sn-58Bi/Cu interface bearing CuZnAl memory particles (2-6um),J. Mater. Sci.: Mater. Electron.,2020,第2作者（13）Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state,J. Mater. Sci.: Mater. Electron.,2020,通讯作者（14）Effect of applied magnetic field on the electroplating and magnetic properties of amorphous FeNiPGd thin film,J. Magn. Magn. Mater.,2020,通讯作者（15）Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling,Microelectron. Reliab.,2019,通讯作者（16）High thermally conducting polymer-based films with magnetic field-assisted vertically aligned hexagonal boron nitride for flexible electronic encapsulation,ACS Appl. Mater. Inter.,2019,通讯作者（17）Optimal design of sputtering target assembly using finite element method and Taguchi method,Acta Metall. Sin.-Eng. Lett.,2019,通讯作者（18）Effects of alloy elements on the interfacial microstructure and shear strength of Sn-Ag-Cu solder,Acta Metall.Sin.,2019,通讯作者（19）Highly conductive Ag paste for recoverable wiring and reliable bonding used in stretchable electronics,ACS Appl. Mater. Inter.,2019,第8作者（20）Structure and properties of Sn-Cu lead-free solders in electronics packaging,Sci. Technol. Adv. Mater.,2019,第3作者（21）Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding,J. Mater. Sci.: Mater. Electron.,2019,通讯作者（22）Reliability issues of lead-free solder joints of electronic device in service,Sci. Technol. Adv. Mater.,2019,第3作者（23）Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles,J. Mater. Sci.: Mater. Electron.,2019,第3作者（24）Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder,J. Mater. Sci.: Mater. Electron.,2019,第3作者（25）Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package,J. Mater. Sci. Technol.,2018,通讯作者（26）The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage,J. Alloy. Compd.,2018,通讯作者（27）The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles,Mater. Charact.,2018,通讯作者（28）The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging,J. Alloy. Compd.,2018,通讯作者（29）Electrodeposition and growth mechanism of preferentially orientated nanotwinned copper on silicon wafer substrate,J. Mater. Sci. Technol.,2018,通讯作者（30）Intergrowth of C phase withinm phase in a Re-containing Ni-base single crystal superallloy,J. Mater. Sci. Technol.,2018,通讯作者（31）The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding,J. Mater. Sci.: Mater. Electron.,2018,通讯作者（32）Fabrication of Ni-Pcoating film on Diamond/Al composite and its soldering reliability,J. Mater. Sci.: Mater. Electron.,2018,通讯作者（33）Bottom-up electrodepositon of large-scale nanotwinned copper within 3D through silicon via,Materials,2018,通讯作者（34）Flexible and self-assembly anistropic FeCo nanochain-polymer composite films for highly stretchable magnetic device,Compos. Sci. Technol.,2018,通讯作者（35）A superior interfacial reliability of Fe-Ni UBM during high temperature storage,J. Mater. Sci.: Mater. Electron.,2017,通讯作者（36）Synthesis of variously shaped magnetic FeCo nanoparticles and the growth mechanism of FeCo nanocubes,Cryst. Eng. Comm.,2017,通讯作者（37）In situ transformation from P phasetom phase in rhenium-containing single crystal superalloy during thermal exposure,Philol. Mag. Lett.,2017,通讯作者（38）Failure mechanisms of SAC/Fe-Ni solder joints during thermal cycling,J. Electron. Mater.,2017,通讯作者（39）Effects of platinum group metals addition on the precipitation of topologically close-packed phase in Ni-base single crystal superalloys,J. Alloy. Compd.,2016,通讯作者（40）In situ TEM investigation on the precipitation behavior of ? phase in Ni-base single crystal superalloys,Acta Mater.,2016,通讯作者（41）Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn-Al/Cu joints,Material. Design,2015,通讯作者（42）Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing,J. Appl. Phys,2014,通讯作者（43）Carbon-coated Li4Ti5O12 anode materials synthesized using H2TiO3 as Ti source,J. Mater. Sci. Technol.,2014,通讯作者（44）Effect of Fe content on the interfacial reliability of SnAgCu/Fe-Ni solder joint,J. Mater. Sci. Technol.,2014,通讯作者（45）In situ investigation on the precipitation of topologically close-packed phase in Ni-base single crystal superalloy,J. Alloy. Compd.,2014,通讯作者（46）Precise Cr-marker investigation on the reactive interface in eutectic SnIn solder joint,Mater. Lett.,2014,通讯作者（47）Phase identification on the intermetallic compound formed between eutectic SnIn solder and single crystalline Cu substrate,J. Alloy. Compd.,2014,通讯作者（48）Growth mechanism of duplex structural Cu2(In,Sn) compound on single crystalline Cu substrate,J. Alloy. Compd.,2014,通讯作者（49）Phase transformation between Cu(In,Sn)2 and Cu2(In,Sn) compounds formed on single crystalline Cu substrate during solid state aging,J. Appl. Phys.,2014,通讯作者（50）Highly efficient dehydrogenation of primary aliphatic alcohols catalyzed by Cu nanoparticles dispersed on rod-shaped La2O2CO3,ACS Catal.,2013,通讯作者（51）Fabrication of nanocrystalline SnO2 using electron stimulated oxidation,Nanotechnology,2013,通讯作者（52）The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy,J. Alloy. Compd.,2013,通讯作者（53）Microstructure and growth mechanism of tin whisker on RESn3 compounds,Acta Mater.,2013,通讯作者（54）Microstructural study on Kirkendall voids formation in Sn-containing/Cu solder joints during solid-state aging,Microsc.Microanal.,2013,通讯作者（55）Characterization and visible light germicidal efficacy of nitrogen doped TiO2 film crystallized by microwave irradiations,Thin Solid Films,2012,通讯作者（56）Wafer level electrodeposition of Fe-Ni novel UBM films,Acta Metall. Sin.,2012,通讯作者（57）Synthesis of single-crystal TiO2 nanowire using titanium monoxide powder by thermal evaporation,J. Mater. Sci. Technol.,2012,通讯作者（58）Structural ordering and magnetic property of complex perovskite solid solution (1-x)Pb(Fe2/3W1/3)O3–xPb(Mg1/2W1/2)O3,J. Inorg. Mater.,2011,通讯作者（59）In situ investigation on the oxidation behavior of a RESn3 film by transmission electron microscopy,Scripta Mater.,2011,通讯作者（60）Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging,Philosophical Magazine Letters,2011,通讯作者（61）Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(100) interface,Microelectronics Reliability,2011,通讯作者（62）Three-dimensional orientation mapping in the transmission electron microscopy,Science,2011,通讯作者（63）Micro-sized and nano-sized Fe3O4 particles as anode materials for lithium-ion batteries,J. Mater. Sci. Technol.,2011,通讯作者（64）Synthesis of nanorod-shaped cobalt hydroxycarbonate and oxide with the mediation of ethylene glycol,J. Phys. Chem. C,2010,通讯作者（65）Weakening of the Cu/Cu3Sn(100) interface by Bi impurities,J. Electron. Mater.,2010,通讯作者（66）A promising sol-gel route to suppress pyrochlore phase during the synthesis of multiferroic Pb(Fe2/3W1/3)O3 using inorganic salts,J. Alloy. Compd.,2010,通讯作者（67）Crack propagation of single crystal ？-Sn during in-situ TEM straining,J. Electron Microsc.,2010,通讯作者（68）First-principles investigation of Bi segregation at the solder interface of Cu/Cu3Sn(010),J. Mater. Sci. Technol.,2010,通讯作者（69）Low-temperature oxidation of CO catalyzed by Co3O4 nanorods,Nature,2009,第3作者（70） Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates,Acta Mater.,2009,通讯作者（71）TEM observations of the growth of intermetallic compounds at the SnBi/Cu interface,J. Electron. Mater.,2009,通讯作者（72）Interfacial reactions between In-Sn solder and Ni-Fe platings,J. Electron. Mater.,2009,第3作者（73）Current-induced growth of P-rich phase at electroless Nickel/Sn interface,J. Mater. Res.,2009,第4作者（74）Fabrication, characterization, and application of cellular iron nanocrystalline film,Nanotechnology,2008,通讯作者（75）Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints,Scripta Mater.,2008,通讯作者（76）Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu,Scripta Mater.,2008,通讯作者（77）First principles calculation of elastic and lattice constants of orthorhombic Cu3Sn crystal,J. Alloys Compd.,2008,通讯作者（78）Fabrication and investigation of tungsten deposit on top and bottom surfaces of thin film substrate,Jpn. J. Appl. Phys.,2007,通讯作者
发表著作
（1）无铅软钎焊技术基础,Introduction to Lead-Free Soldering,科学出版社,2017-06,第1作者
科研活动
承担及参加包括中国科学院****项目、国家科技重大专项02集成电路封测项目、国家重大基础研究计划973项目、国家重点研发计划重点专项等10余项。与国际同行合作开发的三维透射电镜表征技术(3D-OMiTEM)入选2011年度美国材料学会焦点新闻，并荣获2012年度美国显微学会创新奖。
科研项目
（ 1 ） 重布线/嵌入式圆片级封装技术及高密度凸点技术研发及产业化—封装结构的力电热多场服役行为, 主持,国家级,2011-01--2013-12（ 2 ） 透射电镜内电子材料多场耦合行为的动态观察研究, 主持,部委级,2008-01--2011-12（ 3 ） 三维集成互连材料的服役损伤行为与多场失效特性, 主持,国家级,2010-01--2014-12（ 4 ） 含稀贵金属高温合金的设计与应用的基础研究, 参与,国家级,2011-01--2014-12（ 5 ） 大规格稀有/稀贵金属靶材制造技术, 主持,国家级,2017-07--2020-12（ 6 ） 稀贵金属焊接/装联导电材料制备技术, 主持,国家级,2017-07--2020-12（ 7 ） 共晶Sn-Bi基焊点的组织形貌及典型失效模式研究, 主持,院级,2018-05--2019-04（ 8 ） 车载模块应用高可靠性合金风险评估技术合作项目, 主持,院级,2016-05--2017-04（ 9 ） 高频软磁薄膜功率电感的制备与性能研究项目, 主持,院级,2015-05--2016-04（ 10 ） 高质量NiFe磁性厚膜制备, 主持,院级,2018-10--2019-09（ 11 ） 纳米孪晶Cu力学及RDL力学特性研究, 主持,院级,2019-12--2021-07
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