钟毅
系别：微电子与集成电路系
职称：助理教授
邮箱：zhongyi@xmu.edu.cn
联系方式：
办公地点：海韵园科研二212


个人简历:
学历：
南昌航空大学工学学士，焊接技术与工程专业
大连理工大学工学博士，材料学专业



研究方向：
集成电路封装、微纳器件制造、功率电子封装



主讲课程：


学术兼职：


成果奖励：
大连市自然科学学术成果(论文著作)一等奖（第二完成人）（2016年）



课题项目：
有限晶粒Sn基微焊点组织遗传性及晶粒生长调控原位研究，国家自然科学基金联合基金项目，2018.01 – 2020.12，参与
温度梯度对微尺度焊点液-固界面反应与凝固行为的影响及调控机制，国家自然科学基金面上项目，2017.01 – 2020.12，参与


代表作：
[1] Y. Zhong, N. Zhao*, W. Dong, Y.P. Wang & H.T. Ma. In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross-interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient. Materials Chemistry and Physics, 2018, 216, 130-135.
[2] Y. Zhong, N. Zhao*, C.Y. Liu, W. Dong, Y.Y. Qiao, Y.P. Wang & H.T. Ma. Continuous epitaxial growth of extremely strong Cu₆Sn₅ textures at liquid-Sn/(111)Cu interface under temperature gradient. Applied Physics Letters, 2017, 111, 223502.
[3] N. Zhao*, Y. Zhong, W. Dong, M.L. Huang, H.T. Ma & C.P. Wong. Formation of highly preferred orientation of β?Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect. Applied Physics Letters, 2017, 110, 093504.
[4] Y. Zhong, N. Zhao*, H.T. Ma, W. Dong & M.L. Huang. Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition. Journal of Alloys and Compounds, 2017, 695, 1436-1443.
[5] Y. Zhong, N. Zhao*, W. Dong, H.T. Ma, M.L. Huang, L.Q. Yin & C.P. Wong. Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compounds in Cu/Sn/Ni ultrafine interconnects undergoing TLP bonding. Journal of Materials Research, 2017, 32, 3128-3136.
[6] Y. Zhong, M. L. Huang, H.T. Ma, W. Dong, Y.P. Wang & N. Zhao*. In situ study on Cu–Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient. Journal of Materials Research, 2016, 31(5), 609-617.
[7] N. Zhao*, Y. Zhong, M.L. Huang, W. Dong, H.T. Ma & Y.P. Wang. In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient. Journal of Alloys and Compounds, 2016, 682, 1-6.
[8] N. Zhao*, Y. Zhong, M.L. Huang, H.T. Ma & W. Dong. Dissolution and precipitation kinetics of Cu₆Sn₅ intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient. Intermetallics, 2016, 79, 28-34.
[9] N. Zhao*, Y. Zhong, M.L. Huang, H.T. Ma & W. Dong. Growth kinetics of Cu₆Sn₅ intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient. Scientific Reports, 2015, 5, 13491.
[10] Y. Zhong, A. Liu, S. Robertson, S. Liang, C. Liu, Z. Zhou & C.Q. Liu*. Quasi-ambient Bonding Semiconductor Components for Power Electronics Integration. The IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, USA, 2020.
[11] Y. Zhong, W. Dong, M.L. Huang, H.T. Ma, N. Zhao* & C.P. Wong. Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging application by imposing temperature gradient. The IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, USA, 2017.
[12] Y. Zhong, N. Zhao*, W. Dong, H.T. Ma, Y.P. Wang & C.P. Wong. Formation of preferred orientation of Cu₆Sn₅ grains in Cu/Sn/Cu interconnects by soldering under temperature gradient. The IEEE 18th International Conference on Electronic Packaging Technology (ICEPT), Harbin, China, 2017.
[13] Y. Zhong, M.L. Huang, J.F. Deng, H.T. Ma, W. Dong & N. Zhao*. Study on precipitation and dissolution of interfacial Cu₆Sn₅ during thermomigration. China Semiconductor Technology International Conference, CSTIC 2016, Shanghai, China, 2016.
[14] N. Zhao*, Y. Zhong, M.L. Huang, H.T. Ma & W. Dong. Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient. The IEEE 17th International Conference on Electronic Packaging Technology (ICEPT), Wuhan, China, 2016.
[15] Y. Zhong, M.L. Huang, H.T. Ma & N. Zhao*. Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint. The IEEE 16th International Conference on Electronic Packaging Technology (ICEPT), Changsha, China, 2015.