话题: thermalstress更多
An anisotropic thermal-stress model for through-silicon via
1.IntroductionByprovidingadditionalverticalinterconnectionresources,through-siliconviatechnologyprovidesanattractiverouteto“MorethanMoore”[1],resultin ...中科院半导体研究所 本站小编 Free考研考试 2022-01-01