话题: cleaning更多
Optimization of cleaning process parameters to remove abrasive particles in post-Cu CMP cleaning
1.IntroductionCMPisthemostwidelyusedtechniqueofplanarization[1–4].Tomanufacturesemiconductordevicesofhighquality,itisimportanttoguaranteethecleanlines ...中科院半导体研究所 本站小编 Free考研考试 2022-01-01