李东玲 博士，高级工程师，硕士生导师。

个人简历（列重要经历，本科及以上学历）
2002.09-2006.06，重庆大学光电工程学院测控技术与仪器专业，学士；
2006.09-2009.06，重庆大学光电工程学院精密仪器及机械专业，硕士；
2012.09-2016.12，重庆大学光电工程学院精密仪器及机械专业，博士。
2009.03留校任职于重庆大学光电工程学院；
2017.09-至今，重庆大学光电工程学院，高级工程师。

研究方向(300字以内)
长期从事新型微纳器件及加工技术的研究，目前的主要研究方向是先进微纳加工技术、新型智能传感器、光电功能薄膜及器件。

承担项目及研究成果(300字以内)
近五年，主持国家重点研发计划子课题1项、国家自然科学基金项目1项、各类横向科研项目4项，作为主研人员参与基金仪器专项、国家863、国际科技合作等国家级项目10余项。发表论文20余篇，申请发明专利5项。

联系方式
Email：lidongling@cqu.edu.cn
电 话：
办公室：重庆大学A区微系统研究中心104
研究室网址：http://msc.coe.cqu.edu.cn/





Dongling Li ， Ph.D, Senior Engineer

Dongling Li is the Senior Engineer of Chongqing University. She received her Ph.D. in Chongqing University in Precision Instruments and Mechanical Engineering. She worked in College of Optoelectronic Engineering of Chongqing University since 2009, when she received her master’s degree. She has published over 20 papers and holds 5 patents.
Research interests
[1]. Advanced Micro/Nano processing technology
[2]. Novel intelligent sensors
[3]. Photoelectric functional films and devices
Publications:
[1]. Mao Du, Dongling Li* and Yufei Liu*, Investigation of plasma activated Si-Si bonded interface by infrared image based on combination of spatial domain and morphology, Micromachines, 2019.
[2]. Dongling Li*, Zhengguo Shang, Zhiyu Wen, Yin She and Shengqiang Wang, Investigation of Au/Si Eutectic Wafer Bonding for MEMS Device, Micromachines, 2017, 158(8): 1-12 .
[3]. Dongling Li*, Zhengguo Shang, Shengqiang Wang, Zhiyu Wen, Low temperature Si/Si wafer direct bonding using a plasma activated method, Journal of Zhejiang University-SCIENCE C (Computers & Electronics), 2013, 14(4):244-251.
[4]. Dongling Li*, Zhiyu Wen, Zhongquan Wen, Xuefeng He, Yinchuan Yang and Zhengguo Shang. Synthesis of the System Modeling and Signal Detecting Circuit of a Novel Vacuum Microelectronic Accelerometer. Sensors, 2009, 9: 4104-4118.

Contact information
Address: Room 104, Micro Reacher Center of Chongqing University, China
Telephone: Ph:+86-
Email: lidongling@cqu.edu.cn
Website: http://msc.coe.cqu.edu.cn/