李芬^1,,,
王国建^{1, 2},
田宏¹,
刘泳良¹,
于艳春¹,
吕薇¹,
刘燕文¹
1.中国科学院空天信息创新研究院 北京 100190
2.中国科学院大学 北京 100049
基金项目:国家自然科学基金(61771454)

详细信息

作者简介:李芬：女，1986年生，硕士，工程师，研究方向为微波真空电子器件及关键工艺技术
王国建：男，1980年生，硕士，副研究员，研究方向为微波真空电子器件及关键工艺技术
田宏：女，1972年生，实验师，研究方向为电子发射
刘泳良：男，1987年生，硕士，助理研究员，研究方向为微波真空电子器件及关键工艺技术
于艳春：男，1976年生，学士，工程师，研究方向为化学表面处理
吕薇：女，1981年生，硕士，高级工程师，研究方向尾微波真空电子器件及关键工艺技术
刘燕文：男，1964年生，博士，副研究员，研究方向为电子发射

通讯作者:李芬　lifen@aircas.ac.cn

中图分类号:TB741

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被引次数:0

出版历程

收稿日期:2020-09-30
修回日期:2021-03-24
网络出版日期:2021-04-15
刊出日期:2021-09-16

Evaporation Characteristics of Oxygen Free Copper for Microwave Vacuum Electron Devices

Fen LI^1,,,
Guojian WANG^{1, 2},
Hong TIAN¹,
Yongliang LIU¹,
Yanchun YU¹,
Wei Lü¹,
Yanwen LIU¹
1. Aerospace Information Research Institute, Chinese Academy of science, Beijing 100190, China
2. University of Chinese Academy of Sciences, Beijing 100049, China
Funds:The National Natural Science Foundation of China(61771454)


摘要
摘要:作为微波真空电子器件的常用材料之一，无氧铜材料的蒸发特性会对微波真空电子器件的电性能产生影响。该文利用超高真空测试设备，研究了处理工艺对无氧铜材料的蒸发性能的影响，采用X射线测厚仪测试了蒸发的铜膜厚度，用扫描电镜(SEM)观测了无氧铜材料的表面形貌。结果表明表面宏观形貌粗糙度对无氧铜材料的蒸发性能影响不大，但处理工艺对蒸发性能影响很大；无氧铜材料经过酸洗后，会大大增加蒸发量；无氧铜材料经过烧氢处理，可降低蒸发量，而经过去油清洗并烧氢处理的无氧铜的蒸发量极低。对无氧铜材料进行了表面分析，发现无氧铜材料的真空蒸发性能与材料的表面形貌状态有关，当表面微观形貌比较光滑、无孔洞等缺陷时，无氧铜材料的真空蒸发量就少。
关键词:微波真空电子器件/
无氧铜/
蒸发/
酸洗/
烧氢
Abstract:As one of the commonly used materials for microwave vacuum electronic devices, the evaporation characteristics of oxygen free copper materials will affect the electrical properties of microwave vacuum electronic devices. In this paper, the effect of treatment process on the evaporation performance of oxygen free copper is studied by using ultra-high vacuum testing equipment. The thickness of evaporated copper film is measured by X-ray thickness gauge. And the surface morphology of oxygen free copper is observed by Scanning Electron Microscope (SEM). The results show that the macro-appearance surface roughness has little effect on the evaporation performance of oxygen free copper materials, but the treatment process has a great influence on the evaporation performance. The evaporation capacity of oxygen free copper will be increased after acid pickling and the evaporation capacity of oxygen free copper materials can be reduced by calcination in hydrogen. The evaporation capacity of oxygen free copper treated by deoiling cleaning and calcination in hydrogen is very low. The surface of oxygen free copper is analyzed. It is found that the vacuum evaporation performance of oxygen free copper material is related to the surface morphology of the material. The microscopic surface is smooth without oxidation and holes, and the vacuum evaporation of oxygen free copper material is less.
Key words:Microwave vacuum electron devices/
Oxygen free copper/
Evaporation/
Acid pickling/
Calcination in hydrogen



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