代岩伟 博士/讲师
联系方式: ywdai@bjut.edu.cn
地址：北京工业大学西校区基础楼
工作经历
2019.07至今 北京工业大学机械工程与应用电子技术学院 讲师
2018.06~2020.06北京工业大学机械工程与应用电子技术学院 师资博士后
教育经历
2013.09 ~ 2018.01 清华大学航天航空学院工程力学系 力学 博士
2011.09 ~ 2013.07 中国农业大学理学院应用力学系 固体力学 硕士
2007.09 ~ 2011.07 武汉理工大学理学院工程结构与力学系 工程力学 本科
研究方向及学术兼职
研究方向为电子封装技术与可靠性、断裂力学及蠕变力学，主要包括电子封装技术中的关键力学问题、先进封装材料物理力学性能测试与表征、高温蠕变裂纹及切口断裂理论及高温结构完整性评估方法等方面。担任Engineering Fracture Mechanics, Nuclear Engineering and Technology等五份国际期刊的审稿人。
主持的科研项目
1)2020.01-2022.12 SiC器件烧结纳米银焊层蠕变断裂机理及寿命预测模型研究，国家自然科学基金青年项目（批准号：**）。
2)2020.01-2022.12 SiC器件封装用 CNT 增强烧结纳米银焊层高温疲劳断裂机理研究，北京市自然科学基金青年项目（批准号：**）。
3)2020.01-2022.12基于微结构的烧结纳米银高温疲劳损伤机理研究，北京市教育委员会科技计划一般项目（批准号：KM4）。
4)2019.06-2020.06中国博士后基金面上项目一项（编号：2019M650403）。
5)2019.10-2020.06朝阳区博士后经费资助项目一项（编号：2019ZZ-47）。
代表性期刊论文（*表示通讯作者）
1.Dai YW, Liu YH, Qin F, Chao YJ, Chen HF. Constraint modified time dependent failure assessment diagram (TDFAD) based on C(t)-A₂(t) theory for creep crack. International Journal of Mechanical Sciences, 2020, 165, 105193.
2.Dai YW, Liu YH, Qin F, Chao YJ, Qian GA. C(t) dominance of the mixed I/II creep crack: Part II. Extensive creep. Theoretical and Applied Fracture Mechanics, 2020, 106, 102489.
3.Qin F, Zhang M, Dai YW*,Chen P, An T, He HW, Zhang H, Zheng JT. Optimization of TSV interconnects and BEOLlayers under annealing process through fractureevaluation. Fatigue & Fracture of Engineering Materials & Structures. 2020;1–12. DOI:10.1111/ffe.13206.
4.Qin F, Zhao S, Dai YW*,YangMK, Xiang M, Yu DQ. Study of warpage evolution and control for six-side molded WLCSP in different packaging processes. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2020, DOI:10.1109/TCPMT.2020.**.
5.Dai YW, Liu YH, Qin F, Chao YJ, Berto F. Estimation of stress field for sharp V-notch in power-law creeping solids: An asymptotic viewpoint. International Journal of Solids and Structures, 2019, 180-181, 189-204.
6.Dai YW, Liu YH, Qin F, Qian GA, Chao YJ. C (t) dominance of the mixed I/II creep crack: Part I. Transient creep. Theoretical and Applied Fracture Mechanics, 2019, 103, 102314.
7.Dai YW, Liu YH, Qin F, Chao YJ. A unified method to solve higher order asymptotic crack-tip fields of mode I, mode II and mixed mode I/II crack in power-law creeping solids. Engineering Fracture Mechanics, 2019, 218, 106610.
8.Dai YW, Zhang M, Qin F, Chen P, An T. Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading. Engineering Fracture Mechanics, 2019, 209, 274-300.
9.Dai YW, Liu YH, Qin F, Chao YJ. Notch stress intensity factor and C-integral evaluation for sharp V-notch in power-law creeping solids. Engineering Fracture Mechanics, 2019, 222, 106709.
10.Dai YW, Liu YH, Chen HF. Numerical investigations on the effects of T-stress in mode I creep crack. International Journal of Computational Methods, 2018, 16(08), **.
11.Dai YW, Liu YH, Chao YJ. Higher order asymptotic analysis of crack tip fields under mode II creeping conditions.International Journal of Solids and Structures,2017, 125, 89-107.
12.Dai YW, Liu DH, Liu YH. Mismatch constraint effect of creep crack with modified boundary layer model. Journal of Applied Mechanics-Transactions of the ASME,2016, 83(3), 031008.
13.Dai YW, Liu YH, Chen HF, Liu DH. The interacting effect for collinear cracks near mismatching bimaterial interface under elastic creep. Journal of Pressure Vessel Technology-Transactions of theASME, 2016, 138(4), 041404.
代表性会议论文
1.代岩伟,刘应华,秦飞.蠕变V型切口尖端场理论的研究进展，北京力学学会第26届学术年会,2020年1月, 北京.（邀请报告）
2.代岩伟.混合I/II蠕变裂纹尖端场约束效应表征的严格理论解与经验解,2019 损伤与断裂力学及其工程应用研讨会,2019年11月,成都.
3.Dai YW, Liu YH, Chao YJ. Mismatch effect on the mode II type crack tip field in power-law creeping materials. ASME Pressure Vessels and Piping Conference 2018, Prague, Czech.
4.DaiYW, LiuYH, Chao YJ. Theoretical analysis and engineering implications for the high order term solutions of the mode II type creep crack, ASME Pressure Vessels & Piping Conference 2017, Hawaii, USA.
5.DaiYW,LiuYH, Chen HF. Constraint effect of the mixed mode crack under transient and extensive creep regime, the 14th International Conference on Fracture, 2017, Rhodes, Greece.
6.DaiYW,LiuYH. T-stress and mismatch constraint for a blunted creep crack, the 24th International Congress of Theoretical and Applied Mechanics, 2016, Montréal, Canada.
7.DaiYW,LiuYH, Chen HF. Mismatch constraint effect for bimaterialinterfacial creep crack, Applied Mechanics and Materials, 2017, 853, 286-290.